10M50SAE144C8G - MAX 10 FPGA, 50K LE, 144-EQFP | Intel
N.º da peça: 10M50SAE144C8G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $71.5 | $71,50 |
| 10 | $65.2 | $652,00 |
| 100 | $58.75 | $5.875,00 |
| 500 | $52.4 | $26.200,00 |
| 1.000 | $47.9 | $47.900,00 |
10M50SAE144C8G Visão geral
A MAX 10 FPGA is a single-chip, non-volatile programmable logic device that integrates the optimal set of system components for cost-sensitive and space-constrained designs. It sits within Intel's programmable logic hierarchy as: FPGA -> programmable logic device (PLD) -> MAX 10 family -> low-density non-volatile FPGA. Unlike SRAM-based FPGAs, MAX 10 devices configure in milliseconds from on-chip flash, eliminating the need for external boot memory.
Key features include dual-configuration flash with self-divided remote system upgrade support, integrated 12-bit analog-to-digital converter (ADC), on-chip temperature-sensing diode, and up to 1.4 Mb of user flash memory. The device supports LVCMOS, LVDS, SSTL, and RSDS I/O standards with hot-socketing capability. Per-block RAM is 9 Kbits (M9K) with independent parity/ECC.
Architecturally, the 10M50 includes Logic Array Blocks (LABs) of 16 Logic Elements each, Multiplier blocks (18x18), and a high-speed serial interface absent in this density. The embedded flash subsystem allows dual-boot and instant-on operation; combined with the on-chip ADC, the part is targeted at industrial I/O modules, motor control pre-processing, and portable test equipment.
Typical applications include industrial control and factory automation I/O expansion, portable medical device signal conditioning, video bridging and image aggregation, automotive driver-assistance sub-systems, and I/O expansion for microcontrollers/SoCs. Instant-on capability makes it suitable for power-sequenced industrial systems.
When designing with this device, use Intel Quartus Prime (Standard or Lite) for synthesis, place-and-route, and bitstream generation. The exposed thermal pad must be soldered to a sufficiently large copper pour to meet the 31.6 C/W theta-JA rating.
This page synthesizes authorized distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para 10M50SAE144C8G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M50SAE144C8G (mesmo formato e footprint) — diferindo em Operating Temperature, Logic Elements (LE), Package, MSL Level, ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M50SAE144I7G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M50SCE144C8G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M50DAE144C8G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M40SAE144C8G
✅ Drop-In✓ Em estoque
$195.85 / unidade
Ver ficha técnica →10M25SAE144C8G
✅ Drop-In✓ Em estoque
$32.4 / unidade
Ver ficha técnica →10M50SAE144C8G Classificações máximas e características elétricas
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 50000 |
| Embedded Memory | 1677312 bits (approx. 1.6 Mbit) |
| Maximum User I/Os | 101 |
| Encapsulamento | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | 22 x 22 mm, 0.50 mm pitch |
| Temperatura de operação | 0C to +85C (Commercial, "C8" grade) |
| Process Technology | 55 nm embedded flash CMOS |
| Configuration | Non-volatile, single-chip (on-chip flash) |
| On-chip User Flash | Up to 1.4 Mbit |
| ADC | 12-bit successive-approximation, up to 17 channels |
| I/O Standards | LVCMOS, LVDS, SSTL, RSDS, PCI |
| Hot Socketing | Yes |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Nível MSL | 3 |
Configuração de pinos do 10M50SAE144C8G
| Pino 1 | I/O — General purpose user I/O (bank 8) |
| Pino 2 | I/O — General purpose user I/O (bank 8) |
| Pino 3 | GND — Ground |
| Pino 4 | I/O — General purpose user I/O (bank 8) |
| Pino 5 | I/O — General purpose user I/O (bank 8) |
| Pino 6 | I/O — General purpose user I/O (bank 8) |
| Pino 7 | VCCIO8 — I/O supply for bank 8 |
| Pino 8 | I/O — General purpose user I/O (bank 8) |
| Pino 9 | I/O — General purpose user I/O (bank 8) |
| Pino 10 | GND — Ground |
| Pino 11 | I/O — General purpose user I/O (bank 8) |
| Pino 12 | I/O — General purpose user I/O (bank 8) |
| Pino 13 | I/O — General purpose user I/O (bank 7) |
| Pino 14 | I/O — General purpose user I/O (bank 7) |
| Pino 15 | GND — Ground |
| Pino 16 | VCCIO7 — I/O supply for bank 7 |
| Pino 17 | I/O — General purpose user I/O (bank 7) |
| Pino 18 | I/O — General purpose user I/O (bank 7) |
| Pino 19 | I/O — General purpose user I/O (bank 7) |
| Pino 20 | I/O — General purpose user I/O (bank 7) |
| Pino 21 | I/O — General purpose user I/O (bank 7) |
| Pino 22 | I/O — General purpose user I/O (bank 7) |
| Pino 23 | I/O — General purpose user I/O (bank 7) |
| Pino 24 | GND — Ground |
| Pino 25 | I/O — General purpose user I/O (bank 7) |
| Pino 26 | I/O — General purpose user I/O (bank 7) |
| Pino 27 | I/O — General purpose user I/O (bank 6) |
| Pino 28 | I/O — General purpose user I/O (bank 6) |
| Pino 29 | VCCIO6 — I/O supply for bank 6 |
| Pino 30 | GND — Ground |
| Pino 31 | I/O — General purpose user I/O (bank 6) |
| Pino 32 | I/O — General purpose user I/O (bank 6) |
| Pino 33 | I/O — General purpose user I/O (bank 6) |
| Pino 34 | I/O — General purpose user I/O (bank 6) |
| Pino 35 | I/O — General purpose user I/O (bank 6) |
| Pino 36 | I/O — General purpose user I/O (bank 6) |
| Pino 37 | I/O — General purpose user I/O (bank 6) |
| Pino 38 | GND — Ground |
| Pino 39 | I/O — General purpose user I/O (bank 6) |
| Pino 40 | I/O — General purpose user I/O (bank 6) |
| Pino 41 | I/O — General purpose user I/O (bank 5) |
| Pino 42 | I/O — General purpose user I/O (bank 5) |
| Pino 43 | VCCIO5 — I/O supply for bank 5 |
| Pino 44 | GND — Ground |
| Pino 45 | I/O — General purpose user I/O (bank 5) |
| Pino 46 | I/O — General purpose user I/O (bank 5) |
| Pino 47 | I/O — General purpose user I/O (bank 5) |
| Pino 48 | I/O — General purpose user I/O (bank 5) |
| Pino 49 | I/O — General purpose user I/O (bank 5) |
| Pino 50 | I/O — General purpose user I/O (bank 5) |
| Pino 51 | I/O — General purpose user I/O (bank 5) |
| Pino 52 | GND — Ground |
| Pino 53 | I/O — General purpose user I/O (bank 5) |
| Pino 54 | I/O — General purpose user I/O (bank 5) |
| Pino 55 | I/O — General purpose user I/O (bank 4) |
| Pino 56 | I/O — General purpose user I/O (bank 4) |
| Pino 57 | VCCIO4 — I/O supply for bank 4 |
| Pino 58 | GND — Ground |
| Pino 59 | I/O — General purpose user I/O (bank 4) |
| Pino 60 | I/O — General purpose user I/O (bank 4) |
| Pino 61 | I/O — General purpose user I/O (bank 4) |
| Pino 62 | I/O — General purpose user I/O (bank 4) |
| Pino 63 | I/O — General purpose user I/O (bank 4) |
| Pino 64 | I/O — General purpose user I/O (bank 4) |
| Pino 65 | I/O — General purpose user I/O (bank 4) |
| Pino 66 | GND — Ground |
| Pino 67 | I/O — General purpose user I/O (bank 4) |
| Pino 68 | I/O — General purpose user I/O (bank 4) |
| Pino 69 | I/O — General purpose user I/O (bank 3) |
| Pino 70 | I/O — General purpose user I/O (bank 3) |
| Pino 71 | VCCIO3 — I/O supply for bank 3 |
| Pino 72 | GND — Ground |
| Pino 73 | I/O — General purpose user I/O (bank 3) |
| Pino 74 | I/O — General purpose user I/O (bank 3) |
| Pino 75 | I/O — General purpose user I/O (bank 3) |
| Pino 76 | I/O — General purpose user I/O (bank 3) |
| Pino 77 | I/O — General purpose user I/O (bank 3) |
| Pino 78 | I/O — General purpose user I/O (bank 3) |
| Pino 79 | I/O — General purpose user I/O (bank 3) |
| Pino 80 | GND — Ground |
| Pino 81 | I/O — General purpose user I/O (bank 3) |
| Pino 82 | I/O — General purpose user I/O (bank 3) |
| Pino 83 | I/O — General purpose user I/O (bank 2) |
| Pino 84 | I/O — General purpose user I/O (bank 2) |
| Pino 85 | VCCIO2 — I/O supply for bank 2 |
| Pino 86 | GND — Ground |
| Pino 87 | I/O — General purpose user I/O (bank 2) |
| Pino 88 | I/O — General purpose user I/O (bank 2) |
| Pino 89 | I/O — General purpose user I/O (bank 2) |
| Pino 90 | I/O — General purpose user I/O (bank 2) |
| Pino 91 | I/O — General purpose user I/O (bank 2) |
| Pino 92 | I/O — General purpose user I/O (bank 2) |
| Pino 93 | I/O — General purpose user I/O (bank 2) |
| Pino 94 | GND — Ground |
| Pino 95 | I/O — General purpose user I/O (bank 2) |
| Pino 96 | I/O — General purpose user I/O (bank 2) |
| Pino 97 | I/O — General purpose user I/O (bank 1) |
| Pino 98 | I/O — General purpose user I/O (bank 1) |
| Pino 99 | VCCIO1 — I/O supply for bank 1 |
| Pino 100 | GND — Ground |
| Pino 101 | I/O — General purpose user I/O (bank 1) |
| Pino 102 | I/O — General purpose user I/O (bank 1) |
| Pino 103 | I/O — General purpose user I/O (bank 1) |
| Pino 104 | I/O — General purpose user I/O (bank 1) |
| Pino 105 | I/O — General purpose user I/O (bank 1) |
| Pino 106 | I/O — General purpose user I/O (bank 1) |
| Pino 107 | I/O — General purpose user I/O (bank 1) |
| Pino 108 | GND — Ground |
| Pino 109 | I/O — General purpose user I/O (bank 1) |
| Pino 110 | I/O — General purpose user I/O (bank 1) |
| Pino 111 | TCK — JTAG test clock (dedicated) |
| Pino 112 | TMS — JTAG test mode select (dedicated) |
| Pino 113 | TDI — JTAG test data in (dedicated) |
| Pino 114 | TDO — JTAG test data out (dedicated) |
| Pino 115 | nCONFIG — Configuration start input (dedicated, active low) |
| Pino 116 | nSTATUS — Configuration status output (dedicated) |
| Pino 117 | CONFIG_DONE — Configuration complete output (dedicated) |
| Pino 118 | DCLK — Configuration clock (dedicated) |
| Pino 119 | DATA0 — Configuration data input (dedicated) |
| Pino 120 | CRC_ERROR — Configuration CRC error output (dedicated) |
| Pino 121 | DEV_OE — Device-wide output enable (dedicated) |
| Pino 122 | DEV_CLRn — Device-wide clear (dedicated, active low) |
| Pino 123 | VCCA1 — Analog supply for ADC/dedicated analog circuits |
| Pino 124 | VCCA2 — Analog supply for ADC/dedicated analog circuits |
| Pino 125 | ADCIN1 — ADC analog input channel 1 |
| Pino 126 | ADCIN2 — ADC analog input channel 2 |
| Pino 127 | ADCIN3 — ADC analog input channel 3 |
| Pino 128 | ADCIN4 — ADC analog input channel 4 |
| Pino 129 | GND — Ground |
| Pino 130 | VCC — Core supply voltage |
| Pino 131 | VCC — Core supply voltage |
| Pino 132 | GND — Ground |
| Pino 133 | NC — Not connected (per datasheet) |
| Pino 134 | NC — Not connected (per datasheet) |
| Pino 135 | I/O — General purpose user I/O (bank 1B/2B) |
| Pino 136 | I/O — General purpose user I/O (bank 1B/2B) |
| Pino 137 | I/O — General purpose user I/O (bank 1B/2B) |
| Pino 138 | I/O — General purpose user I/O (bank 1B/2B) |
| Pino 139 | VCCIO1B — I/O supply for bank 1B |
| Pino 140 | GND — Ground |
| Pino 141 | I/O — General purpose user I/O (bank 1B/2B) |
| Pino 142 | I/O — General purpose user I/O (bank 1B/2B) |
| Pino 143 | I/O — General purpose user I/O (bank 1B/2B) |
| Pino 144 | EPAD — Exposed thermal pad (must be soldered to ground) |
Aplicações típicas
10M50SAE144C8G é adequado para 6 aplicaçãos: Industrial Control I/O Expansion, Portable Medical Device Signal Conditioning, Video Bridging and Image Aggregation, I/O Expansion for SoCs and Microcontrollers, Test & Measurement Instrumentation, Motor Control Pre-Processing.
Industrial Control I/O Expansion
The 10M50SAE144C8G's 50,000 logic elements and 101 user I/Os make it well-suited as a deterministic I/O expansion coprocessor for industrial PLCs, IPCs, and microcontroller-based controllers. It can be paired with a host MCU over parallel or SPI bridge, offloading high-speed pulse counting, quadrature decoding, and multi-axis stepper pulse generation that exceed the host MCU's bandwidth. Its instant-on non-volatile flash configuration ensures deterministic boot within milliseconds, critical for fail-safe industrial startup. The integrated 12-bit ADC with up to 17 channels also eliminates an external ADC for slow analog monitoring of temperature, pressure, or supply rails. Recommended companion parts: 10M25SAE144C8G (lower-density option), host MCU such as a MAX 10 Cortex-M variant, and an isolated RS-485 transceiver.
Recomendado
Portable Medical Device Signal Conditioning
The 10M50SAE144C8G fits portable medical monitoring designs because of its on-chip 12-bit ADC, low static power, and small 22 x 22 mm EQFP-144 footprint that fits handheld enclosures. The 50K-LE fabric can implement custom digital filters, ECG/EEG feature extraction, and packetization for Bluetooth/USB uplink to a host. On-chip flash and dual-boot remote-update support firmware upgrades in the field without requiring external boot memory. Combined with the integrated temperature-sensing diode, the FPGA can also supervise battery and PCB thermal conditions during long-term patient monitoring. Recommended companion parts: a low-noise analog front-end op-amp and a Bluetooth Low Energy module.
Recomendado
Video Bridging and Image Aggregation
With 1.6 Mbit of embedded SRAM and 101 I/Os, the 10M50SAE144C8G can aggregate multiple image sensor streams (parallel CMOS, MIPI-CSI via serializer, or LVDS), perform pixel-level pre-processing (debayer, gamma, scaling) and forward the result over USB 3.0 or Ethernet to a host processor. The MAX 10 fabric is large enough for two simultaneous 720p60 streams with line buffering in M9K blocks. The instant-on flash configuration means the bridge is ready to forward the first frame within milliseconds of power-up, important for vision-based driver-assistance and machine-vision startup. Recommended companion parts: image sensor serializers and a USB 3.0 controller.
Recomendado
I/O Expansion for SoCs and Microcontrollers
The 10M50SAE144C8G is frequently deployed as a flexible I/O expander alongside application processors in industrial gateways, where the SoC lacks enough GPIO, PWM channels, or special-purpose interfaces. The FPGA maps to the SoC over SPI or a parallel bus, exposing custom peripherals (PWM, quadrature encoder, custom UART, IrDA, LCD timing). Hot-socketing capability means the FPGA can be inserted onto a powered backplane without back-driving the system. Quartus IP libraries include UART, SPI, I2C, and PWM cores that can be stitched into a custom peripheral in days rather than months. Recommended companion parts: a Cortex-A industrial SoM and an SPI flash for SoC boot.
Recomendado
Test & Measurement Instrumentation
Test and measurement front-ends benefit from the 10M50SAE144C8G's deterministic fabric, on-chip ADC, and 101 LVDS-capable I/Os. The device can implement custom trigger logic, pattern generation, and protocol-aware decoding for serial buses (I2C, SPI, UART, CAN, LVDS) without off-the-shelf logic analyzer ASICs. The 12-bit on-chip ADC is sufficient for slow analog measurements like supply-rail health and front-end temperature, while the 50K-LE fabric handles real-time state machines for sequencer control. Combined with the non-volatile flash, instrument designers can ship one board that supports multiple firmware personalities selected at boot. Recommended companion parts: high-speed ADCs and precision references.
Recomendado
Motor Control Pre-Processing
The 10M50SAE144C8G is well-suited to offload real-time motor-control pre-processing from the main MCU: it can implement up to 6-channel PWM generation with dead-time insertion, quadrature encoder decoding, and field-oriented control (FOC) math in logic using the embedded multipliers. The on-chip ADC simultaneously samples phase currents and bus voltage, reducing component count and improving loop determinism. Closed-loop control loop latency is bounded by FPGA fabric delays rather than software interrupts, enabling higher PWM frequencies and quieter operation. The exposed thermal pad supports the elevated power dissipation typical when the device is fully populated with logic. Recommended companion parts: gate drivers and current-sense amplifiers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M50SAE144C8G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M50SAE144I7G | 10M50SCE144C8G | 10M50DAE144C8G | 10M40SAE144C8G | 10M25SAE144C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | EQFP-144 (22x22 mm) | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same |
| Logic Elements | 50000 | 50000 | 50000 | 50000 | 40000 | 25000 |
| Embedded Memory | 1677312 bits | 1677312 bits | 1677312 bits | 1677312 bits | 1290240 bits | 806400 bits |
| Max User I/Os | 101 | 101 | 101 | 101 | 101 | 101 |
| Temperature Grade | 0C to +85C (Commercial, C8) | -40C to +100C (Industrial, I7) | 0C to +85C (Commercial, C8) | 0C to +85C (Commercial, C8) | 0C to +85C (Commercial, C8) | 0C to +85C (Commercial, C8) |
| Configuration Flash | Dual-image (S-suffix) | Dual-image (S-suffix) | Dual-image (S-suffix) | Single-image (D-suffix) | Dual-image (S-suffix) | Dual-image (S-suffix) |
| ADC | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels | 12-bit, up to 17 channels |
Principais diferenciais
- Non-volatile instant-on with on-chip 12-bit ADC (vs 10M40SAE144C8G (40K LE variant))
- Dual-image flash for remote system upgrade (vs 10M50DAE144C8G (single-image flash))
- 50K LE in EQFP-144 with commercial temp grade (vs 10M25SAE144C8G (25K LE variant))
Notas de projeto
Solder the exposed thermal pad (EPAD, pin 144) to a continuous ground copper pour of at least 1 square inch on the top layer with multiple thermal vias stitching the pad to internal ground planes. The EQFP-144 thermal performance depends entirely on this pad; without adequate copper the junction temperature can exceed the 125C limit at elevated ambient. Estimated: at 1 W dissipation in still air with 1 sq-in copper pour, junction temperature rises approximately 25-30C above ambient. Keep high-power external components away from the pad area to avoid thermal coupling.
Decouple every VCC and VCCIO bank pin with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the pin, and add a single 10 uF bulk capacitor near each bank. The MAX 10 has separate VCC (core) and VCCIO1 through VCCIO8 (per-bank I/O) supplies, plus VCCA1/VCCA2 for the ADC analog circuits. Analog supplies should be filtered with a ferrite bead and have their own 10 uF + 0.1 uF local decoupling to minimise ADC crosstalk. Power-up sequencing should follow Intel's MAX 10 Hardware Design Guidelines; in particular VCCA must ramp with or after VCC to avoid latch-up.
Bank I/O voltages (VCCIO1-VCCIO8) can be set independently to support mixed-voltage interfaces (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) without external level shifters. When routing differential pairs (LVDS), keep the P/N traces length-matched within 50 mils and maintain 100-ohm differential impedance with 50-ohm single-ended reference to ground. JTAG chain pins (TCK, TMS, TDI, TDO) should be pulled to known logic levels through 10 kohm resistors if unused, to avoid floating inputs that can corrupt boundary-scan tests.
Do not leave configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, DCLK, DATA0) floating; if not used in the application, tie nCONFIG through 10 kohm to VCC, leave nSTATUS and CONFIG_DONE as outputs, and route DCLK and DATA0 to a JTAG header for in-field reprogramming. Note that the S-suffix part supports dual-boot remote system upgrade, while the D-suffix uses single-image flash and frees more user flash at the cost of field-upgrade safety. Choose density carefully: 10M40/10M25 variants are pin-compatible drop-ins only when your design fits the smaller LE count.
The MAX 10 LVDS I/O can operate at up to 800 Mbps per channel. Maintain 100-ohm differential impedance and keep ground reference continuous under the pair; route over an unbroken reference plane to avoid return-path discontinuities that cause common-mode noise. For ADC inputs, use a 0.1 uF X7R bypass close to the ADCIN pin and a 10 kohm anti-aliasing RC network on each input. Quartus Prime's Pin Planner reports per-pin signal integrity advisories; always run Fitter and Timing Analyzer before tape-out.
Informações de conformidade
RoHS compliant and lead-free per Altera/Intel product page (https://www.altera.com/products/fpga/max/10/10m50-e144/10M50SAE144C8G). Not AEC-Q100 qualified - choose AEC-Q100 variants for automotive. Halogen-free status not explicitly stated in the verified data.