EPF10K30EQC208-1 - 30K Gates, 147 I/O FLEX 10KE FPGA | Intel
부품 번호: EPF10K30EQC208-1 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.75 | $9,875.00 |
| 1,000 | $17.95 | $17,950.00 |
EPF10K30EQC208-1 개요
An FPGA (Field Programmable Gate Array) is a semiconductor IC built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in-system to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and CPLDs in the programmable-logic hierarchy, offering higher density than CPLDs and faster time-to-market than ASICs. FPGAs are widely used for glue logic, bus interfacing, prototype ASICs, signal processing pipelines, and compute acceleration.
Key features of the EPF10K30EQC208-1 include 0.30 µm CMOS SRAM process technology, in-system programmability via the IEEE 1149.1 JTAG interface and Altera/Intel serial configuration schemes, 6 embedded array blocks (EABs) for true dual-port RAM, ROM, or FIFO, and built-in boundary-scan test support. The 208-BQFP (PQFP) package provides gull-wing leads on a 28×28 mm body with commercial 0 °C to +70 °C operating temperature range.
Architecturally, the FLEX 10KE family extends the original FLEX 10K with 2.5 V core operation, lower power, faster interconnect, and additional I/O standards. Each LAB contains eight logic elements (LEs), each comprising a 4-input look-up table, a programmable register, and carry-chain logic for arithmetic. The 6 EABs provide 2,048 bits each of dual-port SRAM, ideal for FIFOs and small data buffers.
Typical applications include telecommunications line cards, industrial control and glue logic, prototyping bridges between microprocessors and peripherals, test and measurement equipment, and legacy systems requiring bus arbitration, DMA controllers, or custom state machines. Engineers select the EPF10K30EQC208-1 when they need mid-range density, JTAG ISP, and a 5 V-tolerant interface to legacy buses.
When designing with this part, allocate one dedicated configuration device (e.g., EPC2) or use JTAG download for prototyping. Verify I/O bank voltage compatibility before mixing 3.3 V and 5.0 V peripherals, and use Altera/Intel Quartus II or MAX+PLUS II for synthesis, fitting, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE and FLEX 10KA families, and practical design notes drawn from Intel/Altera legacy documentation, providing context beyond the original datasheet alone.
드롭인 대체품: EPF10K30EQC208-1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K30EQC208-1 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Family, Operating Temperature, Total RAM Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K30EQC208-1X
✅ 드롭인✓ 재고 있음
$18.4 / 개
데이터시트 보기 →EPF10K30AQC208-1N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EPF10K100EQC208-1
✅ 드롭인✓ 재고 있음
$220 / 개
데이터시트 보기 →EPF10K50EQC208-1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EPF10K30AQC208-1N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EPF10K30EQC208-1 최대 정격 & 전기적 특성
| Series | FLEX 10KE |
| Family | FLEX 10K |
| Logic Elements / Cells | 1,728 |
| Total Gates | 30,000 (typical), 119,000 (maximum) |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (2,048 bits each) |
| Total RAM Bits | 24,576 |
| User I/Os | 147 |
| Core Voltage | 2.5 V (2.375 V–2.625 V) |
| I/O Voltage | 5.0 V tolerant |
| Process Technology | 0.30 µm CMOS SRAM |
| Internal Frequency | 80 MHz (max) |
| 패키지 | 208-BQFP (PQFP) 28×28 mm |
| 실장 유형 | Surface Mount (Gull-Wing) |
| 동작 온도 | 0 °C to +70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typ) |
| Configuration Interface | JTAG (IEEE 1149.1) + Serial (EPC compatible) |
| RoHS 상태 | Not RoHS compliant (SnPb lead finish on BQFP) |
EPF10K30EQC208-1 핀 구성
| 핀 1 | I/O — User I/O bank 1 |
| 핀 2 | I/O — User I/O bank 1 |
| 핀 3 | I/O — User I/O bank 1 |
| 핀 4 | I/O — User I/O bank 1 |
| 핀 5 | I/O — User I/O bank 1 |
| 핀 6 | VCCINT — Core supply 2.5 V |
| 핀 7 | I/O — User I/O bank 1 |
| 핀 8 | I/O — User I/O bank 1 |
| 핀 9 | I/O — User I/O bank 1 |
| 핀 10 | I/O — User I/O bank 1 |
| 핀 11 | GND — Ground |
| 핀 12 | I/O — User I/O bank 2 |
| 핀 13 | I/O — User I/O bank 2 |
| 핀 14 | I/O — User I/O bank 2 |
| 핀 15 | I/O — User I/O bank 2 |
| 핀 16 | I/O — User I/O bank 2 |
| 핀 17 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| 핀 18 | I/O — User I/O bank 2 |
| 핀 19 | I/O — User I/O bank 2 |
| 핀 20 | I/O — User I/O bank 2 |
| 핀 21 | I/O — User I/O bank 2 |
| 핀 22 | GND — Ground |
| 핀 23 | I/O — User I/O bank 2 |
| 핀 24 | I/O — User I/O bank 2 |
| 핀 25 | I/O — User I/O bank 2 |
| 핀 26 | I/O — User I/O bank 2 |
| 핀 27 | I/O — User I/O bank 2 |
| 핀 28 | I/O — User I/O bank 2 |
| 핀 29 | I/O — User I/O bank 2 |
| 핀 30 | I/O — User I/O bank 2 |
| 핀 31 | GND — Ground |
| 핀 32 | I/O — User I/O bank 2 |
| 핀 33 | I/O — User I/O bank 2 |
| 핀 34 | I/O — User I/O bank 2 |
| 핀 35 | I/O — User I/O bank 2 |
| 핀 36 | VCCINT — Core supply 2.5 V |
| 핀 37 | I/O — User I/O bank 3 |
| 핀 38 | I/O — User I/O bank 3 |
| 핀 39 | I/O — User I/O bank 3 |
| 핀 40 | I/O — User I/O bank 3 |
| 핀 41 | I/O — User I/O bank 3 |
| 핀 42 | GND — Ground |
| 핀 43 | I/O — User I/O bank 3 |
| 핀 44 | I/O — User I/O bank 3 |
| 핀 45 | I/O — User I/O bank 3 |
| 핀 46 | I/O — User I/O bank 3 |
| 핀 47 | I/O — User I/O bank 3 |
| 핀 48 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| 핀 49 | I/O — User I/O bank 3 |
| 핀 50 | I/O — User I/O bank 3 |
| 핀 51 | I/O — User I/O bank 3 |
| 핀 52 | I/O — User I/O bank 3 |
| 핀 53 | GND — Ground |
| 핀 54 | I/O — User I/O bank 3 |
| 핀 55 | I/O — User I/O bank 3 |
| 핀 56 | I/O — User I/O bank 3 |
| 핀 57 | I/O — User I/O bank 3 |
| 핀 58 | I/O — User I/O bank 3 |
| 핀 59 | I/O — User I/O bank 3 |
| 핀 60 | I/O — User I/O bank 3 |
| 핀 61 | I/O — User I/O bank 3 |
| 핀 62 | GND — Ground |
| 핀 63 | I/O — User I/O bank 3 |
| 핀 64 | I/O — User I/O bank 3 |
| 핀 65 | I/O — User I/O bank 3 |
| 핀 66 | I/O — User I/O bank 3 |
| 핀 67 | VCCINT — Core supply 2.5 V |
| 핀 68 | I/O — User I/O bank 4 |
| 핀 69 | I/O — User I/O bank 4 |
| 핀 70 | I/O — User I/O bank 4 |
| 핀 71 | I/O — User I/O bank 4 |
| 핀 72 | I/O — User I/O bank 4 |
| 핀 73 | GND — Ground |
| 핀 74 | I/O — User I/O bank 4 |
| 핀 75 | I/O — User I/O bank 4 |
| 핀 76 | I/O — User I/O bank 4 |
| 핀 77 | I/O — User I/O bank 4 |
| 핀 78 | I/O — User I/O bank 4 |
| 핀 79 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| 핀 80 | I/O — User I/O bank 4 |
| 핀 81 | I/O — User I/O bank 4 |
| 핀 82 | I/O — User I/O bank 4 |
| 핀 83 | I/O — User I/O bank 4 |
| 핀 84 | GND — Ground |
| 핀 85 | I/O — User I/O bank 4 |
| 핀 86 | I/O — User I/O bank 4 |
| 핀 87 | I/O — User I/O bank 4 |
| 핀 88 | I/O — User I/O bank 4 |
| 핀 89 | I/O — User I/O bank 4 |
| 핀 90 | I/O — User I/O bank 4 |
| 핀 91 | I/O — User I/O bank 4 |
| 핀 92 | GND — Ground |
| 핀 93 | I/O — User I/O bank 4 |
| 핀 94 | I/O — User I/O bank 4 |
| 핀 95 | I/O — User I/O bank 4 |
| 핀 96 | I/O — User I/O bank 4 |
| 핀 97 | I/O — User I/O bank 4 |
| 핀 98 | VCCINT — Core supply 2.5 V |
| 핀 99 | I/O — User I/O bank 5 |
| 핀 100 | I/O — User I/O bank 5 |
| 핀 101 | I/O — User I/O bank 5 |
| 핀 102 | I/O — User I/O bank 5 |
| 핀 103 | GND — Ground |
| 핀 104 | I/O — User I/O bank 5 |
| 핀 105 | I/O — User I/O bank 5 |
| 핀 106 | I/O — User I/O bank 5 |
| 핀 107 | I/O — User I/O bank 5 |
| 핀 108 | I/O — User I/O bank 5 |
| 핀 109 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| 핀 110 | I/O — User I/O bank 5 |
| 핀 111 | I/O — User I/O bank 5 |
| 핀 112 | I/O — User I/O bank 5 |
| 핀 113 | I/O — User I/O bank 5 |
| 핀 114 | GND — Ground |
| 핀 115 | I/O — User I/O bank 5 |
| 핀 116 | I/O — User I/O bank 5 |
| 핀 117 | I/O — User I/O bank 5 |
| 핀 118 | I/O — User I/O bank 5 |
| 핀 119 | I/O — User I/O bank 5 |
| 핀 120 | I/O — User I/O bank 5 |
| 핀 121 | I/O — User I/O bank 5 |
| 핀 122 | I/O — User I/O bank 5 |
| 핀 123 | GND — Ground |
| 핀 124 | I/O — User I/O bank 5 |
| 핀 125 | I/O — User I/O bank 5 |
| 핀 126 | I/O — User I/O bank 5 |
| 핀 127 | I/O — User I/O bank 5 |
| 핀 128 | I/O — User I/O bank 5 |
| 핀 129 | VCCINT — Core supply 2.5 V |
| 핀 130 | I/O — User I/O bank 6 |
| 핀 131 | I/O — User I/O bank 6 |
| 핀 132 | I/O — User I/O bank 6 |
| 핀 133 | I/O — User I/O bank 6 |
| 핀 134 | I/O — User I/O bank 6 |
| 핀 135 | GND — Ground |
| 핀 136 | I/O — User I/O bank 6 |
| 핀 137 | I/O — User I/O bank 6 |
| 핀 138 | I/O — User I/O bank 6 |
| 핀 139 | I/O — User I/O bank 6 |
| 핀 140 | I/O — User I/O bank 6 |
| 핀 141 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| 핀 142 | I/O — User I/O bank 6 |
| 핀 143 | I/O — User I/O bank 6 |
| 핀 144 | I/O — User I/O bank 6 |
| 핀 145 | I/O — User I/O bank 6 |
| 핀 146 | GND — Ground |
| 핀 147 | I/O — User I/O bank 6 |
| 핀 148 | I/O — User I/O bank 6 |
| 핀 149 | I/O — User I/O bank 6 |
| 핀 150 | I/O — User I/O bank 6 |
| 핀 151 | I/O — User I/O bank 6 |
| 핀 152 | I/O — User I/O bank 6 |
| 핀 153 | I/O — User I/O bank 6 |
| 핀 154 | I/O — User I/O bank 6 |
| 핀 155 | I/O — User I/O bank 6 |
| 핀 156 | GND — Ground |
| 핀 157 | I/O — User I/O bank 6 |
| 핀 158 | I/O — User I/O bank 6 |
| 핀 159 | I/O — User I/O bank 6 |
| 핀 160 | I/O — User I/O bank 6 |
| 핀 161 | VCCINT — Core supply 2.5 V |
| 핀 162 | I/O — User I/O bank 6 |
| 핀 163 | I/O — User I/O bank 6 |
| 핀 164 | I/O — User I/O bank 6 |
| 핀 165 | I/O — User I/O bank 6 |
| 핀 166 | I/O — User I/O bank 6 |
| 핀 167 | I/O — User I/O bank 6 |
| 핀 168 | I/O — User I/O bank 6 |
| 핀 169 | I/O — User I/O bank 6 |
| 핀 170 | I/O — User I/O bank 6 |
| 핀 171 | I/O — User I/O bank 6 |
| 핀 172 | I/O — User I/O bank 6 |
| 핀 173 | TCK — JTAG Test Clock (IEEE 1149.1) |
| 핀 174 | TMS — JTAG Test Mode Select |
| 핀 175 | TDI — JTAG Test Data In |
| 핀 176 | TDO — JTAG Test Data Out |
| 핀 177 | nSTATUS — Configuration status (open-drain) |
| 핀 178 | nCONFIG — Configuration start (active-low) |
| 핀 179 | CONF_DONE — Configuration complete (open-drain) |
| 핀 180 | DCLK — Configuration clock input |
| 핀 181 | DATA0 — Configuration data input 0 |
| 핀 182 | nCE — Chip enable (active-low, cascade for multi-device config) |
| 핀 183 | nCEO — Chip enable out (cascade) |
| 핀 184 | CLK0 — Clock input 0 (global) |
| 핀 185 | CLK1 — Clock input 1 (global) |
| 핀 186 | CLK2 — Clock input 2 (global) |
| 핀 187 | CLK3 — Clock input 3 (global) |
| 핀 188 | CLR — Global clear (active-low) |
| 핀 189 | OE — Global output enable |
| 핀 190 | MSEL0 — Configuration mode select 0 |
| 핀 191 | MSEL1 — Configuration mode select 1 |
| 핀 192 | VCCINT — Core supply 2.5 V |
| 핀 193 | I/O — User I/O bank 7 |
| 핀 194 | I/O — User I/O bank 7 |
| 핀 195 | I/O — User I/O bank 7 |
| 핀 196 | I/O — User I/O bank 7 |
| 핀 197 | GND — Ground |
| 핀 198 | I/O — User I/O bank 7 |
| 핀 199 | I/O — User I/O bank 7 |
| 핀 200 | I/O — User I/O bank 7 |
| 핀 201 | I/O — User I/O bank 7 |
| 핀 202 | I/O — User I/O bank 7 |
| 핀 203 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| 핀 204 | I/O — User I/O bank 7 |
| 핀 205 | I/O — User I/O bank 7 |
| 핀 206 | I/O — User I/O bank 7 |
| 핀 207 | I/O — User I/O bank 7 |
| 핀 208 | I/O — User I/O bank 7 |
일반적인 애플리케이션
EPF10K30EQC208-1 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Backplanes, Test & Measurement Instrumentation, Legacy Microprocessor Bridge Logic, Medical Imaging Front-End Signal Routing, Aerospace & Defense Avionics Retrofit.
Telecommunications Line-Card Glue Logic
The EPF10K30EQC208-1 is well suited for telecom line cards where it implements glue logic between TDM framers, T1/E1 transceivers, and network processors. Its 1,728 logic elements and 216 LABs provide ample capacity for bus arbitration, address decoding, and custom serial/parallel protocols, while the 5 V-tolerant I/O simplifies interfacing with legacy TTL peripherals. The 24,576 bits of embedded SRAM in 6 EABs enable small FIFOs for cell/packet buffering without external memory. Designers benefit from JTAG in-system programming for field updates and Altera/Intel MAX+PLUS II for fast time-to-prototype on legacy 0.30 µm CMOS architectures.
추천
Industrial Control and PLC Backplanes
In industrial control and PLC backplane designs, the EPF10K30EQC208-1 implements custom protocols such as Profibus, Modbus, and CAN bridging between legacy parallel busses and modern serial interfaces. The 2.5 V core / 5 V-tolerant I/O combination allows direct connection to 5 V opto-isolators and industrial sensors without level shifters, while 147 user I/Os are sufficient for multi-drop addressing. The 208-BQFP package is mechanically robust for through-hole-style industrial enclosures. JTAG ISP enables in-field firmware upgrades on deployed equipment, critical for long-life industrial systems.
추천
Test & Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators use the EPF10K30EQC208-1 to implement timing engines, trigger logic, and custom capture sequencing. The 0.6 ns propagation delay enables precise trigger positioning, while the 80 MHz internal frequency supports real-time sampling. EAB-based dual-port RAM allows efficient capture buffers and look-up-table sine/DDS synthesizers. Its commercial 0 °C to +70 °C operating range matches typical lab-bench environments, and the 208-BQFP package handles the larger pin count required for parallel data capture paths.
추천
Legacy Microprocessor Bridge Logic
The EPF10K30EQC208-1 frequently serves as a bridge between older 8/16-bit microprocessors (8086, 68000, Z80) and modern peripherals like USB, Ethernet, or SDRAM controllers. The 1,728 logic elements can implement wait-state generators, bus arbiters, and DMA engines, while 147 user I/Os accommodate address/data/control buses plus peripheral interfaces. The device's 2.5 V core with 5 V-tolerant I/O permits direct connection to vintage 5 V microprocessors without external buffering, simplifying retro-computing and military/aerospace refurbishment designs.
추천
Medical Imaging Front-End Signal Routing
Ultrasound and MRI front-end subsystems use the EPF10K30EQC208-1 to route analog front-end channels to ADCs and beamformer DSPs. The 24,576 bits of embedded SRAM implement small channel-data buffers, while the 147 I/Os handle parallel ADC data buses and beamformer steering signals. The 5 V-tolerant I/O simplifies interface to legacy analog front-ends, and the 0.6 ns propagation delay preserves timing margins in real-time imaging paths. Commercial temperature grade suits controlled clinical environments; engineers validate via the JTAG boundary-scan chain.
추천
Aerospace & Defense Avionics Retrofit
Long-life aerospace platforms retrofit older FLEX 10KE-based boards with the EPF10K30EQC208-1 to replace end-of-life discrete logic. Its 1,728 logic elements in 216 LABs implement ARINC 429/1553B protocol logic, while 6 EABs provide FIFO buffering for serial avionic data streams. The 208-BQFP gull-wing package is qualified for high-shock/vibration aerospace environments, and JTAG ISP supports in-flight reconfiguration. Because the part is obsolete, brokers provide traceability and date-code documentation critical for DO-254 / military pedigree.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K30EQC208-1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K30EQC208-1X | EPF10K30AQC208-1 | EPF10K100EQC208-1 | EPF10K50EQC208-1 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 208-BQFP (PQFP) 28x28 mm | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same | 208-BQFP (PQFP) - same | 208-BQFP (PQFP) - same | 208-PQFP (28x28) - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KA | FLEX 10KE | FLEX 10KE | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 4,992 | 2,880 | 1,728 |
| Total Gates (typical) | 30,000 | 30,000 | 30,000 | 100,000 | 50,000 | 30,000 |
| Embedded RAM Bits | 24,576 | 24,576 | 12,288 | 40,960 | 20,480 | 12,288 |
| Core Voltage | 2.5 V | 2.5 V | 5.0 V | 2.5 V | 2.5 V | 5.0 V |
| Internal Frequency (max) | 80 MHz | 80 MHz | 166.67 MHz | 80 MHz | 80 MHz | 166.67 MHz |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| RoHS Status | Non-RoHS (SnPb) | RoHS (lead-free) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Non-RoHS (SnPb) | RoHS (lead-free) |
주요 차별점
- RoHS lead-free variant on identical footprint (vs EPF10K30EQC208-1X)
- FLEX 10KE 2.5 V core lowers power vs FLEX 10KA 5 V core (vs EPF10K30AQC208-1 (FLEX 10KA))
- Higher logic capacity in same 208-PQFP footprint (vs EPF10K100EQC208-1)
설계 노트
Estimated: The EPF10K30EQC208-1 requires two supplies — VCCINT = 2.5 V (± 5%, i.e. 2.375 V–2.625 V) for the core and VCCIO = 3.3 V or 5.0 V tolerant for I/O banks. Decouple VCCINT with one 0.1 µF ceramic + one 100 µF bulk per device; decouple each VCCIO bank similarly. Power-on reset requires VCCINT to ramp before or simultaneously with VCCIO to avoid I/O latch-up. Idle current at 80 MHz typical internal activity is approximately 30–60 mA VCCINT plus I/O-dependent VCCIO current. Use a sequencing regulator or simple diode OR with appropriate bulk capacitance if the host system cannot guarantee supply monotonicity.
Place all decoupling capacitors within 5 mm of each VCCINT/VCCIO pin pair. Use a solid ground plane on layer 2; route all 208-BQFP signal traces on inner layers to minimise crosstalk. JTAG signals (TCK/TMS/TDI/TDO) should be routed with 50 Ω characteristic impedance and length-matched to within ±2 cm if used at high programming speeds. Configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) require pull-up resistors (typically 10 kΩ) to VCCIO. Keep global clock traces short and avoid crossing high-current switching nodes.
Do not confuse the EPF10K30EQC208-1 (FLEX 10KE, 2.5 V core) with the EPF10K30AQC208-1 (FLEX 10KA, 5.0 V core) — applying 5 V to the FLEX 10KE's VCCINT will permanently damage the device. Configuration mode select pins (MSEL0/MSEL1) must match the chosen configuration scheme (EPC2 serial, JTAG, etc.); wrong settings cause configuration failure. When migrating from FLEX 10K to FLEX 10KE, re-fit the design in Quartus II or MAX+PLUS II — bitstreams are not directly compatible despite identical package pin-out.
Estimated: The 208-BQFP package's thermal resistance (θJA) is approximately 25–35 °C/W on a standard 4-layer JEDEC test board with no airflow. At 60 mA core current and 2.5 V VCCINT (0.15 W core dissipation) plus typical I/O switching (~0.2 W average), total power is well under 0.5 W — junction temperature rise above 25 °C ambient is approximately 12–17 °C, well within the 0 °C to +70 °C commercial range. Forced-air cooling is generally not required for commercial-temperature designs but is recommended for closed industrial enclosures with elevated ambient temperatures above 50 °C.
규정 준수 정보
Standard -1 finish is SnPb (leaded) on 208-BQFP, not RoHS compliant. For RoHS applications, choose EPF10K30EQC208-1X (lead-free finish). REACH, halogen-free, and conflict-mineral status not explicitly documented for this obsolete part; confirm with broker traceability documents.
