EPF10K30ETI144-2N - FLEX 10KE FPGA 30K Gates 144-TQFP | Intel
N.º da peça: EPF10K30ETI144-2N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.8 | $2.980,00 |
| 500 | $26.5 | $13.250,00 |
| 1.000 | $23.4 | $23.400,00 |
EPF10K30ETI144-2N Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. Architecturally, an FPGA sits between fixed-function ASICs and general-purpose processors in the design hierarchy: ASIC > FPGA > CPLD > PLD > programmable logic. FPGAs like the FLEX 10KE family extend traditional gate-array logic with on-chip embedded memory blocks, enabling System-on-a-Programmable-Chip (SOPC) integration of megafunctions such as microcontrollers, FIFOs, DSP filters, and custom peripherals.
Key features of the EPF10K30ETI144-2N include 102 user I/O pins, 216 Logic Array Blocks (LABs) in the structured Logic Element array, a MultiVolt I/O interface supporting 2.5 V/3.3 V/5.0 V mixed-voltage operation, PCI-compliant I/O buffers with selectable pull-up clamping diodes, slew-rate control, and open-drain output options configured on a pin-by-pin basis via Altera logic options. The embedded array blocks (EABs) provide synchronous dual-port RAM, ROM, and multiplier implementations without external memory.
The FLEX 10KE architecture combines a fine-grained Logic Element fabric with coarse-grained Embedded Array Blocks, a flexible interconnect (FastTrack), and a continuous I/O ring supporting a variety of single-ended and differential I/O standards. This hybrid fabric allows designers to implement glue logic, state machines, and memory-intensive megafunctions on a single chip while preserving deterministic timing for the FPGA fabric. The 0.22 µm process provides mature, low-power operation with extensive third-party tool support from the legacy Altera MAX+PLUS II and Quartus flows.
Typical applications include industrial control and factory automation, telecommunications line-card glue logic, PCI interface bridging, prototype ASIC replacement, and low-volume embedded systems requiring on-chip memory and flexible I/O voltage. The 144-TQFP footprint supports a hand-solderable, low-cost PCB assembly process that is well suited to industrial and legacy designs.
When designing with this device, ensure the Quartus or MAX+PLUS II toolchain version is matched to the FLEX 10KE device support, because newer Quartus releases have removed legacy FLEX device support. For new designs, consider migrating to the MAX II or Cyclone families, since FLEX 10KE is a mature, last-time-buy product line.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN catalog, and design considerations not collected in a single place in the manufacturer datasheet.
Alternativas drop-in para EPF10K30ETI144-2N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K30ETI144-2N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Configuration Method, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K30ETI144-2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$41.5 / unidade
Ver ficha técnica →EPF10K30ETC144-2N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.25 / unidade
Ver ficha técnica →EPF10K30ETC144-2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$37.8 / unidade
Ver ficha técnica →EPF10K30ETC144-3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$26.75 / unidade
Ver ficha técnica →EPF10K30ETC144-3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$35.2 / unidade
Ver ficha técnica →EPF10K30ETI144-2N Classificações máximas e características elétricas
| Family | FLEX 10KE |
| Series | FLEX 10KE |
| Typical Gates | 30,000 |
| Logic Elements (LEs) | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB) | 24,576 bits |
| User I/O Pins | 102 |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 200 MHz |
| Encapsulamento | 144-pin TQFP (LQFP-144) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 °C to +85 °C (Industrial) |
| Speed Grade | -2 |
| Lead-Free (N suffix) | Yes |
Configuração de pinos do EPF10K30ETI144-2N
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | VCCIO1 — I/O supply for bank 1 (MultiVolt: 2.5/3.3/5.0 V) |
| Pino 15 | I/O — User I/O pin (bank 1) |
| Pino 16 | I/O — User I/O pin (bank 1) |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | I/O — User I/O pin (bank 1) |
| Pino 20 | I/O — User I/O pin (bank 1) |
| Pino 21 | I/O — User I/O pin (bank 1) |
| Pino 22 | I/O — User I/O pin (bank 1) |
| Pino 23 | I/O — User I/O pin (bank 1) |
| Pino 24 | I/O — User I/O pin (bank 1) |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | I/O — User I/O pin (bank 2) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | VCCIO2 — I/O supply for bank 2 (MultiVolt: 2.5/3.3/5.0 V) |
| Pino 39 | I/O — User I/O pin (bank 2) |
| Pino 40 | I/O — User I/O pin (bank 2) |
| Pino 41 | I/O — User I/O pin (bank 2) |
| Pino 42 | I/O — User I/O pin (bank 2) |
| Pino 43 | I/O — User I/O pin (bank 2) |
| Pino 44 | I/O — User I/O pin (bank 2) |
| Pino 45 | I/O — User I/O pin (bank 2) |
| Pino 46 | I/O — User I/O pin (bank 2) |
| Pino 47 | I/O — User I/O pin (bank 2) |
| Pino 48 | I/O — User I/O pin (bank 2) |
| Pino 49 | GND — Ground |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | I/O — User I/O pin (bank 3) |
| Pino 55 | I/O — User I/O pin (bank 3) |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | I/O — User I/O pin (bank 3) |
| Pino 58 | I/O — User I/O pin (bank 3) |
| Pino 59 | I/O — User I/O pin (bank 3) |
| Pino 60 | I/O — User I/O pin (bank 3) |
| Pino 61 | I/O — User I/O pin (bank 3) |
| Pino 62 | VCCIO3 — I/O supply for bank 3 (MultiVolt: 2.5/3.3/5.0 V) |
| Pino 63 | I/O — User I/O pin (bank 3) |
| Pino 64 | I/O — User I/O pin (bank 3) |
| Pino 65 | I/O — User I/O pin (bank 3) |
| Pino 66 | I/O — User I/O pin (bank 3) |
| Pino 67 | I/O — User I/O pin (bank 3) |
| Pino 68 | I/O — User I/O pin (bank 3) |
| Pino 69 | I/O — User I/O pin (bank 3) |
| Pino 70 | I/O — User I/O pin (bank 3) |
| Pino 71 | I/O — User I/O pin (bank 3) |
| Pino 72 | I/O — User I/O pin (bank 3) |
| Pino 73 | GND — Ground |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | I/O — User I/O pin (bank 4) |
| Pino 76 | I/O — User I/O pin (bank 4) |
| Pino 77 | I/O — User I/O pin (bank 4) |
| Pino 78 | I/O — User I/O pin (bank 4) |
| Pino 79 | I/O — User I/O pin (bank 4) |
| Pino 80 | I/O — User I/O pin (bank 4) |
| Pino 81 | I/O — User I/O pin (bank 4) |
| Pino 82 | I/O — User I/O pin (bank 4) |
| Pino 83 | I/O — User I/O pin (bank 4) |
| Pino 84 | I/O — User I/O pin (bank 4) |
| Pino 85 | I/O — User I/O pin (bank 4) |
| Pino 86 | VCCIO4 — I/O supply for bank 4 (MultiVolt: 2.5/3.3/5.0 V) |
| Pino 87 | I/O — User I/O pin (bank 4) |
| Pino 88 | I/O — User I/O pin (bank 4) |
| Pino 89 | I/O — User I/O pin (bank 4) |
| Pino 90 | I/O — User I/O pin (bank 4) |
| Pino 91 | I/O — User I/O pin (bank 4) |
| Pino 92 | I/O — User I/O pin (bank 4) |
| Pino 93 | I/O — User I/O pin (bank 4) |
| Pino 94 | I/O — User I/O pin (bank 4) |
| Pino 95 | I/O — User I/O pin (bank 4) |
| Pino 96 | I/O — User I/O pin (bank 4) |
| Pino 97 | GND — Ground |
| Pino 98 | TDI — JTAG Test Data In |
| Pino 99 | TMS — JTAG Test Mode Select |
| Pino 100 | TCK — JTAG Test Clock |
| Pino 101 | nCONFIG — Configuration control (active low) |
| Pino 102 | VCCINT — Core supply (2.5 V) |
| Pino 103 | nSTATUS — Configuration status (active low) |
| Pino 104 | CONF_DONE — Configuration done indicator |
| Pino 105 | DCLK — Configuration clock input |
| Pino 106 | DATA0 — Configuration data input (LSB) |
| Pino 107 | GND — Ground |
| Pino 108 | VCCINT — Core supply (2.5 V) |
| Pino 109 | DATA1 — Configuration data input |
| Pino 110 | DATA2 — Configuration data input |
| Pino 111 | DATA3 — Configuration data input |
| Pino 112 | DATA4 — Configuration data input |
| Pino 113 | DATA5 — Configuration data input |
| Pino 114 | DATA6 — Configuration data input |
| Pino 115 | DATA7 — Configuration data input (MSB) |
| Pino 116 | GND — Ground |
| Pino 117 | CLK0 — Clock input 0 |
| Pino 118 | CLK1 — Clock input 1 |
| Pino 119 | CLK2 — Clock input 2 |
| Pino 120 | VCCINT — Core supply (2.5 V) |
| Pino 121 | GND — Ground |
| Pino 122 | I/O — User I/O pin (bank 4) |
| Pino 123 | I/O — User I/O pin (bank 4) |
| Pino 124 | I/O — User I/O pin (bank 1) |
| Pino 125 | I/O — User I/O pin (bank 1) |
| Pino 126 | I/O — User I/O pin (bank 1) |
| Pino 127 | I/O — User I/O pin (bank 1) |
| Pino 128 | I/O — User I/O pin (bank 1) |
| Pino 129 | I/O — User I/O pin (bank 1) |
| Pino 130 | I/O — User I/O pin (bank 1) |
| Pino 131 | I/O — User I/O pin (bank 1) |
| Pino 132 | I/O — User I/O pin (bank 1) |
| Pino 133 | I/O — User I/O pin (bank 1) |
| Pino 134 | I/O — User I/O pin (bank 1) |
| Pino 135 | I/O — User I/O pin (bank 1) |
| Pino 136 | I/O — User I/O pin (bank 1) |
| Pino 137 | I/O — User I/O pin (bank 1) |
| Pino 138 | I/O — User I/O pin (bank 1) |
| Pino 139 | I/O — User I/O pin (bank 1) |
| Pino 140 | I/O — User I/O pin (bank 1) |
| Pino 141 | I/O — User I/O pin (bank 1) |
| Pino 142 | I/O — User I/O pin (bank 1) |
| Pino 143 | I/O — User I/O pin (bank 1) |
| Pino 144 | I/O — User I/O pin (bank 1) |
Aplicações típicas
EPF10K30ETI144-2N é adequado para 6 aplicaçãos: Industrial Control and Factory Automation, Telecommunications Line-Card Glue Logic, PCI Interface Bridge and Adapter Cards, ASIC Replacement and Prototype Emulation, Legacy Embedded Systems and Long-Lifecycle Industrial Designs, Education, Hobby and Legacy Design Reproduction.
Industrial Control and Factory Automation
The EPF10K30ETI144-2N suits industrial control designs because of its industrial temperature range (-40 °C to +85 °C) and 102 user I/O pins, which can absorb the multiple sensor inputs, relay-driver outputs, and isolated communication links typical of a PLC or machine controller. The FLEX 10KE embedded array blocks (EABs, 24,576 bits of synchronous dual-port RAM) handle FIFOs, control tables, and protocol buffers without external memory, reducing board complexity. The MultiVolt I/O interface supports 5 V tolerant inputs on a 2.5 V core supply, allowing direct connection to legacy 5 V industrial sensors and HMI displays. Designers should budget clock-tree margin and use the JTAG boundary-scan to validate solder joints during factory production.
Recomendado
Telecommunications Line-Card Glue Logic
Telecommunications line cards require deterministic glue logic between a framer, TDM switch, and backplane SERDES. The EPF10K30ETI144-2N provides 1,728 logic elements for cell/packet delineation, alarm monitoring, and watchdog functions, with the embedded EABs implementing small FIFOs that smooth TDM bursts at line rates up to 200 MHz. The PCI-compliant I/O buffers (3.3 V/33 MHz) allow direct connection to a backplane processor through the PCI bus, while the slew-rate-controlled outputs reduce EMI on the densely populated line card. Pair the device with an EPM7128A CPLD for power-up sequencing and an EPC2 configuration PROM for in-system reprogrammability.
Recomendado
PCI Interface Bridge and Adapter Cards
The EPF10K30ETI144-2N is a natural fit for legacy PCI adapter cards, where its PCI-compliant I/O buffers (3.3 V, 33 MHz, 102 user I/O) implement the 32-bit PCI target or master interface, plus local bus glue logic, scatter-gather DMA engines, and on-chip FIFOs. The 24,576 bits of embedded SRAM provide the data-path buffer between PCI bursts and the local bus, while the 0.22 µm CMOS process keeps active power within the PCI 5 V signaling budget. For a 5 V PCI slot, set VCCIO to 5.0 V; for a 3.3 V Universal PCI slot, set VCCIO to 3.3 V. Add a resistive divider on the JTAG chain to allow in-system programming through the PCI backplane.
Recomendado
ASIC Replacement and Prototype Emulation
For ASIC replacement and rapid prototyping, the EPF10K30ETI144-2N provides 30,000 gates of logic plus 24 Kbits of on-chip memory, which is sufficient to emulate most sub-system-level ASICs for low-to-medium volume production. Designers can iterate on the Quartus or MAX+PLUS II netlist, then port the verified logic to an ASIC for cost reduction in high volume. The 144-TQFP package is hand-solderable and breadboard-friendly for prototype builds, while the same die is available in 256-FBGA and 484-FBGA packages for the final production design. The FLEX 10KE embedded array blocks also support megafunctions such as multipliers and microsequencers.
Recomendado
Legacy Embedded Systems and Long-Lifecycle Industrial Designs
Long-lifecycle industrial designs (e.g., medical, aerospace, transportation) that were prototyped in the late 1990s and early 2000s often lock in the FLEX 10KE silicon to avoid re-validation. The EPF10K30ETI144-2N preserves the design's binary compatibility, the JTAG programming flow, and the existing PCB layout. The MultiVolt I/O bank allows direct connection to 5 V and 3.3 V peripherals on the same board, while the industrial temperature range ensures operation in uncontrolled environments. For maintenance and repair, the EPC2 configuration PROM provides in-system programming, and the 144-TQFP package can be reworked with standard hot-air stations.
Recomendado
Education, Hobby and Legacy Design Reproduction
The EPF10K30ETI144-2N is well suited to university FPGA labs, hobby projects, and the reproduction of legacy designs that target the FLEX 10KE family. The 144-TQFP is hand-solderable on a 0.5 mm pitch, and the legacy MAX+PLUS II and Quartus toolchains (older versions) still support the FLEX 10KE device, allowing students to learn first-generation FPGA design flows including Logic Element mapping, EAB megafunction instantiation, and JTAG configuration. The 30,000-gate complexity is large enough for teaching soft-core microcontrollers, simple DSP, and bus architectures but small enough to keep synthesis times short on a laptop.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K30ETI144-2N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K30ETI144-2 | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ETC144-3N | EPF10K30ETC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Memory (EAB) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (faster Fmax) | -3 (faster Fmax) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Lead-Free (Pb-free) | Yes (N suffix) | No | Yes | No | Yes | No |
| Core Voltage (VCCINT) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Process / Family | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE |
Principais diferenciais
- Industrial temperature range with Pb-free packaging (vs EPF10K30ETC144-2N)
- Pb-free (N suffix) for RoHS-compliant reflow assembly (vs EPF10K30ETI144-2)
- Speed grade -2 with stable timing closure margin (vs EPF10K30ETC144-3N)
Notas de projeto
The FLEX 10KE family uses a 2.5 V VCCINT core and a separate MultiVolt VCCIO supply per I/O bank (2.5/3.3/5.0 V). Decouple each VCCINT pin with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a single 10 µF bulk capacitor per bank. For mixed-voltage designs, set VCCIO independently per bank to allow 5 V peripherals on bank 1 and 3.3 V peripherals on bank 2 without external level shifters.
Newer Quartus versions (15.0 and later) have removed FLEX 10KE device support. Use Quartus II 13.0sp1 or earlier, or the legacy MAX+PLUS II toolchain, to synthesize for this device. For new designs, plan a migration path to the MAX II CPLD or Cyclone FPGA families before committing the PCB layout.
Route the JTAG chain (TCK/TMS/TDO/TDI) as a daisy chain with each device's TDO feeding the next device's TDI; keep the chain length under 6 inches to stay below the 10 MHz TCK limit of the Altera ByteBlaster. Add 4.7 kΩ pull-ups on TMS, TDI, and nCONFIG to VCCIO to ensure a defined idle state during board power-up. Decouple the configuration PROM (EPC2LC20N) with 0.1 µF + 10 µF and route DCLK as a short, impedance-controlled trace to minimize configuration timing violations.
Informações de conformidade
The 'N' suffix indicates Pb-free reflow-compatible lead finish per the Altera ordering information. RoHS/REACH/AEC-Q100 explicit status is not stated in the provided data and is marked unknown. FPGAs in this family are not typically AEC-Q100 qualified - this part is intended for industrial (not automotive) designs.
