Altera

EPF10K30ETI144-3 - 30K FLEX-10KE FPGA 102 I/O | Intel / Altera

Name: EPF10K30ETI144-3 - 30K FLEX-10KE FPGA 102 I/O | Intel / Altera
Brand: Altera
SKU: EPF10K30ETI144-3
Price: 29.8 USD
Availability: InStock

N.º da peça: EPF10K30ETI144-3 ✗ Fim de vida

Em estoque Enviado em 1 a 3 dias úteis

2.5 V / 3.3 V Vdss 144-LQFP (LFQFP) Package 12.5 ns Speed

A partir de $29.8 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-11

Preços por volume

Qtd.	Preço unitário	Total
1	$49.5	$49,50
10	$44.2	$442,00
100	$38.9	$3.890,00
500	$33.5	$16.750,00
1.000	$29.8	$29.800,00

ℹ️ Todos os preços estão em USD

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Quantidade

EPF10K30ETI144-3 Visão geral

The Intel (formerly Altera) EPF10K30ETI144-3 is a high-density FLEX-10KE family Field Programmable Gate Array (FPGA) IC integrating 1728 logic elements, 216 logic array blocks (LABs), and 24,576 bits of embedded RAM in a 144-pin LQFP (Low-profile Quad Flat Pack) package. It provides 102 programmable user I/O pins, supports an equivalent gate count of 119,000, and runs at a 12.5 ns pin-to-pin logic delay graded for industrial temperature operation (-40C to +85C). The device is built on a 2.5 V/3.3 V core architecture with 5 V-tolerant I/O, giving it wide applicability in mixed-voltage legacy designs.

A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the user can re-program after manufacture to implement arbitrary digital logic. In the broader semiconductor taxonomy, an FPGA sits below ASICs and ASSPs in volume efficiency but above discrete glue logic in integration density, making it the optimal choice for prototyping, low-volume production, and time-to-market-critical designs. The FLEX-10KE family in particular pioneered embedded array block (EAB) memory, blending distributed logic and dedicated RAM in the same fabric.

Key features of the EPF10K30ETI144-3 include 102 user I/Os routed to four I/O banks, JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface, multi-volt I/O support for interfacing to 5.0 V, 3.3 V and 2.5 V buses, and SRAM-based configuration memory allowing unlimited reconfigurations in the field. The 12.5 ns speed grade (the '-3' suffix) is the mid-tier option in the FLEX-10KE family, trading absolute speed for cost savings versus the -4 grade.

Architecturally, the device pairs 1728 logic elements across 216 LABs with embedded array blocks (EABs) providing true dual-port and single-port RAM of up to 24,576 bits. Each LAB contains 8 logic elements and local interconnect, while FastTrack Interconnect provides predictable delay across rows and columns. The 144-pin LQFP (1.6 mm height) is the most popular low-density FLEX-10KE package, balancing pin access with hand-solder-friendly lead pitch.

Typical applications include industrial control logic, telecom glue logic, networking bridges and protocol converters, PCI bridge and bus interface glue, DSP co-processing front-ends, and legacy 5 V system retrofits. The wide I/O count makes the part equally suitable for prototyping ASIC designs before mask commitment.

When designing with this device, route all four I/O bank reference voltages (VCCIO pins) and observe the 2.5 V/3.3 V core supply sequencing requirements. JTAG configuration is recommended for production because it allows fast in-system updates and supports read-back verification.

This page synthesizes distributor pricing, same-package FLEX-10KE alternatives, and design notes not found in the manufacturer datasheet.

Alternativas drop-in para EPF10K30ETI144-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF10K30ETI144-3 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Family, Configuration Method.

EPF10K30ETC144-2

Intel

Operating Temperature: 0C to +70C (Commercial)

Package: 144-LQFP (TQFP, 20x20 mm)

Process Technology: CMOS, SRAM-based