EPF6010ATC144-3N - FLEX 6000 10K Gates FPGA 102 I/O | Intel
Артикул: EPF6010ATC144-3N ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $48.75 | $48,75 |
| 10 | $42.5 | $425,00 |
| 100 | $35.8 | $3.580,00 |
| 250 | $31.2 | $7.800,00 |
| 500 | $27.95 | $13.975,00 |
| 1.000 | $24.6 | $24.600,00 |
EPF6010ATC144-3N Обзор
A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit hierarchically under programmable logic > logic ICs > integrated circuits > semiconductors, allowing hardware designers to implement custom digital circuits without the cost or lead-time of an ASIC. The FLEX 6000 family is Altera's classic SRAM-based, low-density FPGA line, optimized for low-cost, high-volume designs and wide-gate-count glue applications. Modern descendants include the Cyclone and MAX families from Intel PSG.
Key features of the EPF6010ATC144-3N include 88 Logic Array Blocks (LABs), 880 logic elements (cells), SRAM-based configuration memory that allows unlimited reprogramming, in-system programmability via the IEEE 1149.1 JTAG interface, and 4 dedicated clock input pins. The 144-pin TQFP package offers a 1.0 mm pitch with a low-profile gull-wing lead form (per Partstack package code LFQFP), enabling standard SMT assembly on FR-4 PCB substrates. Operating temperature range is 0 °C to 85 °C (commercial grade), with the speed grade "-3" indicating a medium performance bin.
Architecturally, the FLEX 6000 device uses an SRAM-based lookup-table (LUT) logic element feeding into a fast cascade chain and a LAB-wide carry chain. Each LAB contains 10 logic elements and shares carry/interconnect resources. Configuration data is loaded at power-up from a serial PROM or via JTAG; the device supports 8-bit or 16-bit passive parallel, passive serial, and JTAG configuration modes. Embedded array blocks (EABs) provide on-chip ROM/RAM for small memory functions.
Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, PCI bus interface bridges, video and image processing front-ends, and legacy ASIC replacement. The wide 102-I/O count and 880 logic cells comfortably implement 32-bit datapaths, DMA controllers, FIFOs, and protocol converters. The 144-pin TQFP footprint allows hand-rework and socket-based prototyping.
Design consideration: confirm JTAG chain integrity before configuration - the EPF6010ATC144-3N will not enumerate on the chain if TCK/TMS/TDI/TDO are open. Use the Quartus II (or MAX+PLUS II) toolchain for legacy FLEX 6000 designs; modern Intel Quartus Prime no longer supports this family, so design migration to Cyclone II/IV is the long-term path.
This page synthesizes distributor pricing across multiple sources, validated drop-in alternatives, lifecycle warnings, and practical design notes that are not collected in the original Altera datasheet.
Аналоги без доработки для EPF6010ATC144-3N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF6010ATC144-3N (тот же форм-фактор и посадочное место) — отличается по Process Technology, Package, Operating Temperature, Family, Speed Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF6010ATC144-3
✅ Прямая замена✓ В наличии
$9.75 / шт.
Открыть даташит →EPF6010ATC144-2
✅ Прямая замена✓ В наличии
$14.95 / шт.
Открыть даташит →EPF6010ATC144-1
✅ Прямая замена✓ В наличии
$10.95 / шт.
Открыть даташит →EPF6010ATC144-3N
✅ Прямая замена✓ В наличии
$24.6 / шт.
Открыть даташит →EPF10K30ATC144-3
✅ Прямая замена✓ В наличии
$17.8 / шт.
Открыть даташит →EPF6010ATC144-3N Максимальные параметры и электрические характеристики
| Family | FLEX 6000 |
| Logic Elements / Cells | 880 |
| Number of Gates | 10,000 |
| Number of LABs/CLBs | 88 |
| Number of User I/Os | 102 |
| Number of Logic Elements/Cells | 880 |
| Напряжение питания | 3.3 V |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Internal Performance | 200 MHz |
| Configuration Memory | SRAM (volatile, requires external PROM) |
| Programming Interface | JTAG (IEEE 1149.1) + passive serial/parallel |
| Корпус | 144-pin TQFP (20x20 mm, 1.0 mm pitch) |
| Supplier Device Package | 144-TQFP |
| Способ монтажа | Surface Mount (SMD) |
| Рабочая температура | 0 °C to 85 °C |
| Speed Grade | -3 |
| Part Status | Obsolete (End of Life) |
| Packaging | Tray |
Конфигурация выводов EPF6010ATC144-3N
| Контакт 1 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 2 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 3 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 4 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 5 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 6 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 7 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 8 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 9 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 10 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 11 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 12 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 13 | VCCINT — Core supply voltage (3.3 V) |
| Контакт 14 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 15 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 16 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 17 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 18 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 19 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 20 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 21 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 22 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 23 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 24 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 25 | GND — Ground |
| Контакт 26 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 27 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 28 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 29 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 30 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 31 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 32 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 33 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 34 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 35 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 36 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 37 | VCCIO — I/O supply voltage (3.3 V) |
| Контакт 38 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 39 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 40 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 41 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 42 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 43 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 44 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 45 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 46 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 47 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 48 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 49 | GND — Ground |
| Контакт 50 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 51 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 52 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 53 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 54 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 55 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 56 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 57 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 58 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 59 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 60 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 61 | VCCINT — Core supply voltage (3.3 V) |
| Контакт 62 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 63 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 64 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 65 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 66 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 67 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 68 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 69 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 70 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 71 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 72 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 73 | GND — Ground |
| Контакт 74 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 75 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 76 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 77 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 78 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 79 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 80 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 81 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 82 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 83 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 84 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 85 | VCCIO — I/O supply voltage (3.3 V) |
| Контакт 86 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 87 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 88 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 89 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 90 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 91 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 92 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 93 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 94 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 95 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 96 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 97 | GND — Ground |
| Контакт 98 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 99 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 100 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 101 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 102 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 103 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 104 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 105 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 106 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 107 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 108 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 109 | VCCINT — Core supply voltage (3.3 V) |
| Контакт 110 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 111 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 112 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 113 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 114 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 115 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 116 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 117 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 118 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 119 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 120 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 121 | GND — Ground |
| Контакт 122 | TCK — JTAG test clock input (IEEE 1149.1) |
| Контакт 123 | TMS — JTAG test mode select input |
| Контакт 124 | TDI — JTAG test data input |
| Контакт 125 | TDO — JTAG test data output |
| Контакт 126 | nCE — Chip enable (active low) |
| Контакт 127 | nCONFIG — Configuration control (active low) |
| Контакт 128 | nSTATUS — Configuration status (active low) |
| Контакт 129 | CONF_DONE — Configuration done indicator |
| Контакт 130 | MSEL0 — Configuration mode select 0 |
| Контакт 131 | MSEL1 — Configuration mode select 1 |
| Контакт 132 | CLK0 — Dedicated clock input 0 |
| Контакт 133 | CLK1 — Dedicated clock input 1 |
| Контакт 134 | CLK2 — Dedicated clock input 2 |
| Контакт 135 | CLK3 — Dedicated clock input 3 |
| Контакт 136 | VCCIO — I/O supply voltage (3.3 V) |
| Контакт 137 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 138 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 139 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 140 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 141 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 142 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 143 | I/O — User I/O pin (per datasheet pin table) |
| Контакт 144 | I/O — User I/O pin (per datasheet pin table) |
Типичное применение
EPF6010ATC144-3N подходит для 6 применениеs: Telecom Line-Card Glue Logic, PCI Bus Interface Bridge, Industrial Control & Instrumentation, Video & Image Processing Front-End, Legacy ASIC Replacement, Embedded MCU Coprocessor.
Telecom Line-Card Glue Logic
The EPF6010ATC144-3N's 880 logic elements and 102 I/O pins make it well-suited for telecom line-card glue logic, where it bridges backplane buses, implements framing/deframing state machines, and provides interrupt aggregation between DSPs and network processors. Its 3.3 V core supply matches legacy telecom voltage rails, while the 144-pin TQFP footprint supports the multi-layer FR-4 PCBs typical of NEBS-compliant designs. The 88 LABs comfortably host 32-bit datapath controllers and DMA engines, and JTAG-based in-system programmability enables field firmware updates on installed line cards without card swap.
Рекомендуется
PCI Bus Interface Bridge
With 102 user I/Os, the EPF6010ATC144-3N can implement a 32-bit PCI 2.1 target or master bridge between a host CPU and a peripheral ASIC. The 880 logic cells are sufficient for the PCI arbiter, configuration space registers (256 bytes), and FIFO control logic, while the 88 LABs map naturally to 32-bit datapath multiplexing. The 144-TQFP package exposes enough I/O to bring out both the 32-bit PCI AD bus and the local-side data/address/control signals. Designers should observe 33 MHz timing across the 144-pin TQFP trace-length-matched bus and ensure CONF_DONE is held low during PCI RST#.
Рекомендуется
Industrial Control & Instrumentation
The EPF6010ATC144-3N's 102 I/Os and 880 logic elements suit industrial PLC-style controllers and instrumentation front-ends, where the FPGA handles digital I/O conditioning, encoder quadrature decoding, PWM generation, and UART/SPI bridging. Its 0 to 85 °C commercial temperature range covers most factory-floor enclosures; for harsher environments, the EPF6010ATI144 industrial variant provides -40 °C to 100 °C operation. The 144-TQFP package is hand-reworkable for prototype builds, and the JTAG chain allows in-system firmware updates via test points on the PCB.
Рекомендуется
Video & Image Processing Front-End
The EPF6010ATC144-3N is widely deployed in legacy broadcast and medical imaging equipment as a video timing generator, sync separator, and pixel-format converter. Its 102 I/Os handle parallel ITU-R BT.656 / SMPTE 259M video buses (8/10-bit parallel) plus genlock reference inputs, while 880 logic elements implement line/frame FIFOs and chroma resampling. The 144-TQFP package supports the 4-layer PCBs typical of video capture cards. For higher-resolution designs, the FLEX 10K family (EPF10K30ATC144-3) in the same footprint offers triple the logic capacity.
Рекомендуется
Legacy ASIC Replacement
When a 1990s-era ASIC reaches end-of-life, the EPF6010ATC144-3N provides a drop-in functional equivalent in the same 144-TQFP footprint, allowing PCB-level re-use while preserving the original I/O pinout. The 880 logic cells and 10K-gate capacity match the typical gate counts of mid-complexity gate-array ASICs, and the SRAM-based configuration supports iterative design refinement. JTAG programming allows late-stage bug fixes without re-spinning the silicon, dramatically reducing NRE cost compared to a new ASIC. The 144-TQFP package is also socket-compatible, enabling rapid prototype swap.
Рекомендуется
Embedded MCU Coprocessor
The EPF6010ATC144-3N can offload real-time tasks from a host MCU in embedded designs, such as motor control loops (FOC, trapezoidal commutation), custom peripheral bridges, and high-speed signal acquisition. Its 880 logic elements and dedicated carry chains enable single-cycle multiply-accumulate operations suitable for sensor-fusion DSP functions, while 102 I/Os provide parallel ADC/DAC interfaces and PWM channels. The 3.3 V supply is compatible with most ARM7/ARM9-era MCUs. Designers should use the Quartus II 13.0sp1 toolchain (last version supporting FLEX 6000) and consider migrating to MAX II CPLDs for new designs.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF6010ATC144-3N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF6010ATC144-3 | EPF6010ATC144-2 | EPF6010ATC144-1 | EPF6010ATC100-3N | EPF10K30ATC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 144-TQFP (20x20 mm, 1.0 mm pitch) | 144-TQFP (same) | 144-TQFP (same) | 144-TQFP (same) | 100-TQFP (different) | 144-TQFP (same) |
| Family | FLEX 6000 | FLEX 6000 (same) | FLEX 6000 (same) | FLEX 6000 (same) | FLEX 6000 (same) | FLEX 10K (different) |
| Logic Elements | 880 | 880 (same) | 880 (same) | 880 (same) | 880 (same) | ~3,000 (3x density) |
| Number of Gates | 10,000 | 10,000 (same) | 10,000 (same) | 10,000 (same) | 10,000 (same) | 30,000 (3x) |
| Speed Grade | -3 (slowest) | -3 (same) | -2 (faster Fmax) | -1 (fastest Fmax) | -3 (same) | -3 (same) |
| Supply Voltage | 3.3 V | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) |
| Lifecycle Status | Obsolete | Obsolete (same) | Obsolete (same) | Obsolete (same) | Obsolete (same) | Obsolete (same) |
Ключевые отличия
- Same-die drop-in compatibility with EPF6010ATC144-1 and -2 speed grades (против EPF6010ATC144-1 and EPF6010ATC144-2)
- Higher-density migration path via EPF10K30ATC144-3 in same footprint (против EPF10K30ATC144-3)
- Compact 100-pin alternative with reduced I/O count (против EPF6010ATC100-3N)
Заметки по проектированию
Estimated: Modern Intel Quartus Prime does NOT support the FLEX 6000 family. New designs must use Quartus II 13.0sp1 (last version) or MAX+PLUS II 10.23, both legacy toolchains. For new designs, migrate to MAX II/MAX V CPLDs or Cyclone II/IV FPGAs in the same 144-pin TQFP footprint - expect ~50% logic capacity reduction when porting. Always retain the original MAX+PLUS II .edf or Quartus II .qsf project files when designing for EPF6010ATC144-3N, as they cannot be regenerated from source.
Estimated: The EPF6010ATC144-3N requires separate VCCINT (3.3 V core) and VCCIO (3.3 V I/O) rails, each decoupled with 0.1 µF ceramic + 10 µF bulk capacitors placed within 5 mm of each supply pin. Total quiescent current draw is approximately 5-15 mA static plus dynamic current proportional to toggle rate (~0.5 mA per MHz at 25 °C). Use a power-on reset supervisor (e.g. TPS3823) to drive nCONFIG low for at least 40 µs after VCCINT stabilizes - this ensures clean configuration from the external serial PROM.
Route JTAG signals TCK, TMS, TDI, TDO as a daisy-chained bus with 10 kΩ pull-ups on TCK/TMS/TDI to VCCIO. Place the EPF6010ATC144-3N so that all JTAG pins are accessible via a 0.1" header for in-system programming. Dedicated clock inputs (CLK0-CLK3) should be routed with 50 Ω controlled-impedance traces and terminated close to the FPGA with a 33 Ω series resistor to dampen reflections. Avoid routing clocks adjacent to high-speed I/O banks to minimize crosstalk.
Estimated: At maximum toggle rate (~80 MHz LVCMOS outputs driving 50 pF loads), the EPF6010ATC144-3N dissipates approximately 0.8-1.2 W. The 144-TQFP package has θJA ≈ 35 °C/W (typical 4-layer PCB), so junction temperature rise above ambient is ~30-40 °C. No heatsink is required for the commercial 0-85 °C range. For sealed enclosures with no airflow, derate by 10 °C and ensure ambient stays below 75 °C. The die has no onboard thermal diode - rely on package thermal resistance calculations rather than direct measurement.
Информация о соответствии
RoHS compliance indicated by the 'N' suffix in MPN. AEC-Q100 not applicable - this is a commercial-grade FPGA with 0-85 °C operating range. Reach/halogen/conflict-mineral data not present in verified sources; recommend contacting Intel PSG for legacy compliance documentation.
