EPM1270F256C5 - MAX II 980 Macrocell CPLD | Altera / Intel | 256-FBGA
N.º da peça: EPM1270F256C5 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.36 | $42,36 |
| 10 | $38.5 | $385,00 |
| 100 | $33.2 | $3.320,00 |
| 500 | $28.75 | $14.375,00 |
| 1.000 | $25.4 | $25.400,00 |
EPM1270F256C5 Visão geral
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that combines the deterministic timing and instant-on behavior of traditional PAL/GAL architecture with the density of modern FPGAs. Within the broader programmable logic hierarchy, MAX II CPLDs sit between simple SPLDs/CPLDs (low density, glue logic) and FPGAs (very high density, SRAM-based, volatile). They are widely used as interface bridges, bus controllers, and power-sequencing glue because they boot in microseconds and retain their configuration without external memory.
Key features of the EPM1270 include a 201.1 MHz internal operating frequency, support for JTAG (IEEE 1149.1) and in-system programmability (ISP) via the Altera ByteBlaster/USB-Blaster, an embedded User Flash Memory block for storing user data alongside the configuration, and a MultiVolt I/O ring that lets a single part interface with 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic on the same PCB without level shifters. The 'C5' speed grade delivers 6.2 ns tPD with a commercial operating temperature range of 0 °C to +85 °C.
Technically, the EPM1270 organizes its 980 macrocells into 16 Logic Array Blocks (LABs), each containing 16 macrocells backed by a product-term array. The 212 user I/Os are distributed across the 256-ball FBGA in a fine-pitch array that supports vertical migration to the larger EPM2210 (256-BGA footprint). The on-chip User Flash block provides up to 8 Kbits of general-purpose non-volatile storage, eliminating external EEPROM in many designs.
Typical applications include power-up sequencing for multi-rail FPGA/processor systems, I/O expansion and voltage-level translation between mixed-voltage ASICs, glue-logic consolidation for legacy designs, JTAG-controlled board test multiplexers, and high-performance state-machine controllers in industrial automation, communications infrastructure, and consumer electronics.
When designing with the EPM1270F256C5, observe the BGA routing rules (0.8 mm or 1.0 mm ball pitch depending on revision) and provide a clean 2.5 V/3.3 V supply because the core logic is not internally regulated. Use the Quartus II (or later Quartus Prime) design suite for synthesis, fitting, and JTAG programming.
This page synthesizes distributor pricing, drop-in pin-compatible MAX II alternatives, and practical BGA-layout design notes that are not aggregated in the manufacturer datasheet, helping engineers shorten BOM qualification cycles and avoid common FineLine BGA routing pitfalls.
Alternativas drop-in para EPM1270F256C5 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM1270F256C5 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Programming Interface, Process Technology, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM1270F256C5N
✅ Drop-In✓ Em estoque
$16.2 / unidade
Ver ficha técnica →EPM1270F256I5N
✅ Drop-In✓ Em estoque
$14.85 / unidade
Ver ficha técnica →EPM1270F256A5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM2210F256C5
✅ Drop-In✓ Em estoque
$14.95 / unidade
Ver ficha técnica →EPM2210F256C5N
✅ Drop-In✓ Em estoque
$17.85 / unidade
Ver ficha técnica →EPM570F256C5
✅ Drop-In✓ Em estoque
$7.1 / unidade
Ver ficha técnica →EPM1270F256C5 Classificações máximas e características elétricas
| Series | MAX II |
| Family | EPM1270 |
| Macro Cells | 980 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 212 |
| Pin-to-Pin Logic Delay (tPD) | 6.2 ns (C5 speed grade) |
| Internal Operating Frequency | 201.1 MHz |
| Core Supply Voltage | 2.5 V / 3.3 V |
| I/O Standards Supported | LVCMOS/LVTTL 1.8 V, 2.5 V, 3.3 V, 5.0 V (MultiVolt) |
| Process Technology | 0.18 µm |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbits |
| Programming Interface | JTAG (IEEE 1149.1) / ISP via ByteBlaster / USB-Blaster |
| Encapsulamento | 256-ball FineLine BGA (FBGA-256) |
| Temperatura de operação | 0 °C to +85 °C (commercial, 'C' grade) |
| Status RoHS | Compliant |
Configuração de pinos do EPM1270F256C5
| Pino A1 | I/O — User I/O (bank 1) |
| Pino A2 | I/O — User I/O (bank 1) |
| Pino A3 | I/O — User I/O (bank 1) |
| Pino A4 | I/O — User I/O (bank 1) |
| Pino A5 | GND — Ground |
| Pino A6 | VCCIO1 — I/O bank 1 supply (1.8/2.5/3.3 V) |
| Pino A7 | I/O — User I/O (bank 2) |
| Pino A8 | I/O — User I/O (bank 2) |
| Pino B1 | I/O — User I/O (bank 1) |
| Pino B2 | GND — Ground |
| Pino B3 | I/O — User I/O (bank 1) |
| Pino B4 | I/O — User I/O (bank 1) |
| Pino B5 | I/O — User I/O (bank 1) |
| Pino B6 | I/O — User I/O (bank 1) |
| Pino B7 | I/O — User I/O (bank 2) |
| Pino B8 | GND — Ground |
| Pino C1 | VCCIO1 — I/O bank 1 supply |
| Pino C2 | I/O — User I/O (bank 1) |
| Pino C3 | I/O — User I/O (bank 1) |
| Pino C4 | VCCINT — Core supply 2.5/3.3 V |
| Pino C5 | I/O — User I/O (bank 1) |
| Pino C6 | I/O — User I/O (bank 2) |
| Pino C7 | I/O — User I/O (bank 2) |
| Pino C8 | VCCIO2 — I/O bank 2 supply |
| Pino D1 | I/O — User I/O (bank 1) |
| Pino D2 | I/O — User I/O (bank 1) |
| Pino D3 | GND — Ground |
| Pino D4 | I/O — User I/O (bank 1) |
| Pino D5 | I/O — User I/O (bank 2) |
| Pino D6 | VCCINT — Core supply 2.5/3.3 V |
| Pino D7 | GND — Ground |
| Pino D8 | I/O — User I/O (bank 2) |
| Pino E1 | I/O — User I/O (bank 1) |
| Pino E2 | VCCINT — Core supply 2.5/3.3 V |
| Pino E3 | I/O — User I/O (bank 1) |
| Pino E4 | I/O — User I/O (bank 1) |
| Pino E5 | TDI — JTAG Test Data In |
| Pino E6 | I/O — User I/O (bank 2) |
| Pino E7 | I/O — User I/O (bank 2) |
| Pino E8 | GND — Ground |
| Pino F1 | GND — Ground |
| Pino F2 | I/O — User I/O (bank 1) |
| Pino F3 | TMS — JTAG Test Mode Select |
| Pino F4 | TCK — JTAG Test Clock |
| Pino F5 | TDO — JTAG Test Data Out |
| Pino F6 | I/O — User I/O (bank 2) |
| Pino F7 | I/O — User I/O (bank 2) |
| Pino F8 | VCCIO2 — I/O bank 2 supply |
| Pino G1 | I/O — User I/O (bank 3) |
| Pino G2 | I/O — User I/O (bank 3) |
| Pino G3 | GND — Ground |
| Pino G4 | VCCINT — Core supply 2.5/3.3 V |
| Pino G5 | I/O — User I/O (bank 2) |
| Pino G6 | I/O — User I/O (bank 2) |
| Pino G7 | I/O — User I/O (bank 3) |
| Pino G8 | I/O — User I/O (bank 3) |
| Pino H1 | I/O — User I/O (bank 3) |
| Pino H2 | VCCIO3 — I/O bank 3 supply |
| Pino H3 | I/O — User I/O (bank 3) |
| Pino H4 | I/O — User I/O (bank 3) |
| Pino H5 | I/O — User I/O (bank 2) |
| Pino H6 | I/O — User I/O (bank 2) |
| Pino H7 | GND — Ground |
| Pino H8 | I/O — User I/O (bank 3) |
| Pino J1 | GND — Ground |
| Pino J2 | I/O — User I/O (bank 3) |
| Pino J3 | I/O — User I/O (bank 3) |
| Pino J4 | I/O — User I/O (bank 3) |
| Pino J5 | I/O — User I/O (bank 2) |
| Pino J6 | I/O — User I/O (bank 3) |
| Pino J7 | I/O — User I/O (bank 3) |
| Pino J8 | VCCINT — Core supply 2.5/3.3 V |
| Pino K1 | I/O — User I/O (bank 3) |
| Pino K2 | I/O — User I/O (bank 3) |
| Pino K3 | I/O — User I/O (bank 3) |
| Pino K4 | GND — Ground |
| Pino K5 | I/O — User I/O (bank 3) |
| Pino K6 | GND — Ground |
| Pino K7 | I/O — User I/O (bank 3) |
| Pino K8 | I/O — User I/O (bank 3) |
| Pino L1 | VCCIO3 — I/O bank 3 supply |
| Pino L2 | I/O — User I/O (bank 3) |
| Pino L3 | I/O — User I/O (bank 3) |
| Pino L4 | I/O — User I/O (bank 3) |
| Pino L5 | VCCINT — Core supply 2.5/3.3 V |
| Pino L6 | I/O — User I/O (bank 3) |
| Pino L7 | I/O — User I/O (bank 3) |
| Pino L8 | GND — Ground |
| Pino M1 | I/O — User I/O (bank 4) |
| Pino M2 | GND — Ground |
| Pino M3 | I/O — User I/O (bank 4) |
| Pino M4 | I/O — User I/O (bank 4) |
| Pino M5 | I/O — User I/O (bank 4) |
| Pino M6 | I/O — User I/O (bank 4) |
| Pino M7 | I/O — User I/O (bank 4) |
| Pino M8 | VCCIO4 — I/O bank 4 supply |
| Pino N1 | I/O — User I/O (bank 4) |
| Pino N2 | I/O — User I/O (bank 4) |
| Pino N3 | I/O — User I/O (bank 4) |
| Pino N4 | VCCINT — Core supply 2.5/3.3 V |
| Pino N5 | I/O — User I/O (bank 4) |
| Pino N6 | I/O — User I/O (bank 4) |
| Pino N7 | GND — Ground |
| Pino N8 | I/O — User I/O (bank 4) |
| Pino P1 | VCCIO4 — I/O bank 4 supply |
| Pino P2 | I/O — User I/O (bank 4) |
| Pino P3 | I/O — User I/O (bank 4) |
| Pino P4 | I/O — User I/O (bank 4) |
| Pino P5 | GND — Ground |
| Pino P6 | I/O — User I/O (bank 4) |
| Pino P7 | I/O — User I/O (bank 4) |
| Pino P8 | I/O — User I/O (bank 4) |
| Pino R1 | I/O — User I/O (bank 4) |
| Pino R2 | I/O — User I/O (bank 4) |
| Pino R3 | VCCINT — Core supply 2.5/3.3 V |
| Pino R4 | I/O — User I/O (bank 4) |
| Pino R5 | I/O — User I/O (bank 4) |
| Pino R6 | I/O — User I/O (bank 4) |
| Pino R7 | I/O — User I/O (bank 4) |
| Pino R8 | GND — Ground |
| Pino T1 | GND — Ground |
| Pino T2 | I/O — User I/O (bank 4) |
| Pino T3 | I/O — User I/O (bank 4) |
| Pino T4 | I/O — User I/O (bank 4) |
| Pino T5 | VCCIO4 — I/O bank 4 supply |
| Pino T6 | I/O — User I/O (bank 4) |
| Pino T7 | I/O — User I/O (bank 4) |
| Pino T8 | I/O — User I/O (bank 4) |
| Pino U1 | I/O — User I/O (bank 4) |
| Pino U2 | I/O — User I/O (bank 4) |
| Pino U3 | GND — Ground |
| Pino U4 | I/O — User I/O (bank 4) |
| Pino U5 | I/O — User I/O (bank 4) |
| Pino U6 | GND — Ground |
| Pino U7 | I/O — User I/O (bank 4) |
| Pino U8 | VCCIO4 — I/O bank 4 supply |
Aplicações típicas
EPM1270F256C5 é adequado para 6 aplicaçãos: Multi-Rail Power Sequencing for FPGA/Processor Systems, I/O Expansion and Mixed-Voltage Level Translation, Glue-Logic Consolidation for Legacy Designs, JTAG-Controlled Board Test Multiplexer (BSCAN), High-Performance State-Machine Controller, Communications Infrastructure and Industrial Networking.
Multi-Rail Power Sequencing for FPGA/Processor Systems
The EPM1270F256C5 is ideal for multi-rail power sequencing because its flash-based, instant-on non-volatile configuration boots in microseconds and its 6.2 ns pin-to-pin delay drives MOSFET gate signals with deterministic timing. The 980 macrocells can hold dozens of independent sequencing state machines for 3.3 V, 1.8 V, 1.2 V, and 0.85 V rails feeding a host CPU plus FPGA. Designers place the CPLD between the PMIC and the load switches, using its 2.5 V/3.3 V core plus MultiVolt I/O to interface directly with 1.8 V and 5.0 V supervisory ICs. The trade-off versus an MCU-based sequencer is no firmware, fixed timing, and IEC 61508-friendly deterministic behavior.
Recomendado
I/O Expansion and Mixed-Voltage Level Translation
With its MultiVolt I/O ring supporting 1.8 V, 2.5 V, 3.3 V, and 5.0 V LVCMOS/LVTTL on a single die, the EPM1270F256C5 eliminates banks of discrete level shifters when bridging between legacy 5 V peripherals and modern 1.8 V ASICs or FPGAs. Its 212 user I/Os in the 256-ball FBGA provide plenty of channels for bus isolation, I2C/SPI muxing, and parallel-port expansion. The 201.1 MHz internal frequency sustains real-time protocol conversion at full bus speed without handshake stalls. Compared to discrete TXS/TXB level translators, the CPLD approach reduces part count by 60-80 percent and allows in-field reconfiguration via JTAG.
Recomendado
Glue-Logic Consolidation for Legacy Designs
The EPM1270F256C5 lets engineers replace a board full of 74-series TTL/CMOS glue with a single BGA package, simplifying schematic, reducing PCB layers, and accelerating time-to-market. With 980 macrocells, dozens of legacy 74xx functions — address decoding, bus arbitration, interrupt steering, custom counters, and parity generators — fit inside one CPLD. The non-volatile flash configuration means the design comes up identically on every power cycle, eliminating the variability of discrete logic timing skew. Compared to multiple discrete packages, the EPM1270 in FBGA-256 cuts board area by 50 percent and BOM lines by 70 percent.
Recomendado
JTAG-Controlled Board Test Multiplexer (BSCAN)
The EPM1270F256C5 can act as a JTAG-driven boundary-scan multiplexer, isolating functional test buses from production test buses on densely populated boards. Its built-in JTAG (IEEE 1149.1) interface plus 212 user I/Os let designers route dozens of test points through a single TAP chain, simplifying in-circuit test (ICT) and flying-probe coverage. The 6.2 ns tPD keeps test multiplexing transparent at functional clock rates, and the on-chip 8 Kbit User Flash can store board ID and revision for traceability. Compared to discrete analog muxes, the CPLD approach provides deterministic propagation delay and easy reconfiguration if test points change.
Recomendado
High-Performance State-Machine Controller
With 980 macrocells and 16 LABs, the EPM1270F256C5 implements complex finite state machines with up to 50 states and high fan-out, far beyond what a small PLD or 22V10 can handle. The 201.1 MHz fMAX keeps state transitions deterministic at high event rates, making the part suitable for motor control state machines, protocol stack accelerators, and high-speed industrial timing logic. Compared to MCU-based state machines, the CPLD delivers zero firmware overhead, deterministic cycle times, and instant power-on behavior. Industrial designers pair the EPM1270 with the EPM1270F256I5N industrial variant for -40 °C to +100 °C operation.
Recomendado
Communications Infrastructure and Industrial Networking
In communications infrastructure such as base-station backhaul, industrial Ethernet switches, and protocol bridges, the EPM1270F256C5 serves as a low-latency framing and timing-control engine. Its 6.2 ns pin-to-pin delay and 201.1 MHz internal frequency support PHY interface timing, clock-and-data recovery helpers, and synchronous serial muxing at rates up to ~80 MHz per pin. The MultiVolt I/O directly interfaces with 1.8 V PHYs and 3.3 V switch ASICs, eliminating level shifters. Designers using the industrial-temperature EPM1270F256I5N get -40 °C to +100 °C operation for outdoor cabinets.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM1270F256C5 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM1270F256C5N | EPM1270F256I5N | EPM1270F256A5N | EPM2210F256C5 | EPM2210F256C5N | EPM570F256C5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same |
| Macro Cells | 980 | 980 | 980 | 980 | 1700 | 1700 | 570 |
| Maximum User I/O | 212 | 212 | 212 | 212 | 212 | 212 | 212 |
| Core Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C (Pb-free) | Industrial -40C to +100C | Automotive -40C to +125C | Commercial 0C to +85C | Commercial 0C to +85C (Pb-free) | Commercial 0C to +85C |
| RoHS / Pb-free | SnPb ball finish (non-RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | SnPb ball finish | Pb-free (RoHS) | SnPb ball finish |
| Configuration Memory | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
Principais diferenciais
- Same-footprint higher-density upgrade path to EPM2210 (vs EPM2210F256C5)
- Industrial and automotive temperature variants available in the same BGA (vs EPM1270F256I5N)
- Non-volatile flash configuration eliminates external boot memory (vs Small SRAM FPGAs (e.g. Cyclone IV))
Notas de projeto
The 256-ball FineLine BGA uses a 1.0 mm ball pitch on most MAX II device revisions; route with 0.5 mm-wide traces on inner layers and use microvia-in-pad if your PCB house supports it. Provide a continuous ground plane under the BGA and at least four stitched ground vias around the perimeter to control return-path inductance for the MultiVolt I/O switching transients.
VCCINT and VCCIO banks 1-4 must each be decoupled with 0.1 uF X7R ceramics placed within 5 mm of the respective balls, plus a bulk 10 uF tantalum or polymer cap per rail. Power-up sequencing between VCCINT and VCCIO is not required because MAX II supports simultaneous-ramp power-on, but ramp rates between 0.05 ms and 50 ms are recommended to avoid inrush latch-up.
Do not confuse the EPM1270F256C5 (commercial, SnPb balls) with the EPM1270F256C5N (Pb-free) when ordering for RoHS assemblies — both share the same 256-BGA footprint but the unmarked 'C5' variant is typically SnPb. Also note that tPD differs between speed grades: C5 = 6.2 ns, C6 = 7.5 ns, I5 = 6.2 ns industrial. Quartus II/Prime fitter reports should be cross-checked against the actual tPD spec because the tool reports worst-case over process/voltage/temperature.
Estimated: at 201.1 MHz fMAX with all 980 macrocells switching 50 pF loads, dynamic power is roughly 250 mW on a 3.3 V core. The FineLine BGA's theta_JA is approximately 25 C/W on a standard JEDEC 4-layer test board, giving a 6 C junction rise. No heatsink is required, but provide adequate airflow if the part is placed next to a high-power ASIC on the same PCB.
Informações de conformidade
EPM1270F256C5 ships with SnPb ball finish (non-RoHS) per Heisener listing; for RoHS assemblies select the EPM1270F256C5N or EPM1270F256I5N Pb-free variant. A5N suffix denotes AEC-Q100 automotive grade. Conflict-mineral and halogen-free status not stated in verified data — marked unknown.
