EPM2210F256C5 - MAX II CPLD 1700 Macrocells 201MHz FBGA-256 | Altera / Intel
MPN: EPM2210F256C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $23.5 | $23.50 |
| 10 | $21.2 | $212.00 |
| 100 | $18.75 | $1,875.00 |
| 500 | $16.4 | $8,200.00 |
| 1,000 | $14.95 | $14,950.00 |
Drop-in alternatives for EPM2210F256C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM2210F256C5N
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View Datasheet →EPM2210F256C5 Maximum Ratings & Electrical Characteristics
| Device Family | MAX II |
| Series | EPM2210 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macro Cells (Logic Elements) | 1700 |
| Maximum Internal Frequency | 201.1 MHz |
| Propagation Delay | 5 ns (C5 speed grade) |
| User I/Os | 272 |
| Supply Voltage | 2.5 V / 3.3 V (MultiVolt I/O) |
| Process Technology | 0.18 µm flash-based |
| Package | 256-ball FineLine BGA (FBGA-256) |
| Package Code | BGA, 17 x 17 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial, C5 suffix) |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Configuration Memory | On-chip flash (instant-on, non-volatile) |
| On-chip User Flash Memory | 8 Kbits |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
EPM2210F256C5 bga, 17 x 17 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EPM2210F256C5 (bga, 17 x 17 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM2210F256C5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM2210F256C5 is suitable for 6 applications: FPGA I/O Bank Expansion, Mixed-Voltage Level Translation, Board-Level Glue Logic Replacement, Power-Rail Sequencing & Supervisory, Bus Protocol Bridging (SPI/I2C/Parallel), Legacy Industrial Control Systems.
FPGA I/O Bank Expansion
The EPM2210F256C5's 272 user I/Os and 1.5V-3.3V MultiVolt I/O banks make it a natural fit for expanding FPGA I/O count when the primary FPGA is full. Position the CPLD between the FPGA and peripheral connectors; each FPGA pin can fan out to multiple CPLD-driven I/Os. The 201 MHz fMAX and 5 ns tPD easily handle typical LVCMOS/LVTTL peripheral speeds (UART, SPI, parallel buses up to ~80 MHz). The instant-on flash configuration means peripherals are ready before the FPGA finishes booting, eliminating boot-time I/O glitches. Altera's MAX II device handbook explicitly recommends the EPM2210F256 for I/O expansion designs.
Recommended
Mixed-Voltage Level Translation
The EPM2210F256C5 supports MultiVolt I/O banks that operate at 1.5V, 1.8V, 2.5V, and 3.3V on the same device, enabling bidirectional level translation between legacy 5V-tolerant systems and modern low-voltage processors without external level-shifters. With 272 I/Os available, the device can translate wide parallel buses (16/32-bit) plus control signals in a single chip. The 0.18 µm flash process provides 5 ns propagation delay, fast enough for 100 MHz memory interfaces when used as a glue translator. This makes the EPM2210F256C5 ideal for industrial systems migrating from 3.3V MCUs to 1.8V SoCs while keeping legacy peripherals.
Recommended
Board-Level Glue Logic Replacement
Designers replace arrays of 74-series TTL/CMOS glue-logic chips (decoders, muxes, flipflops, state machines) with a single EPM2210F256C5 to reduce board area, BOM count, and assembly cost. The 1700 macrocells can absorb dozens of SSI/MSI parts while the FBGA-256 package fits where multiple SOIC/TSSOP packages previously lived. The non-volatile flash configuration means the board powers up with correct logic states immediately - no boot PROM, no FPGA bitstream load required. Industrial and test-equipment designs benefit particularly from reduced PCB complexity and improved noise immunity versus discrete logic.
Recommended
Power-Rail Sequencing & Supervisory
The EPM2210F256C5's instant-on flash configuration and 5 ns deterministic delay make it ideal for sequencing multiple power rails during system start-up, replacing discrete supervisor ICs and reset generators. With 272 I/Os the CPLD can monitor PG (power-good) signals from dozens of DC-DC converters and generate enable/reset signals in the required order. The on-chip 8 Kbit User Flash Memory (UFM) can store board configuration parameters (rail voltages, timing constants) readable by an external MCU during boot. Industrial server and telecom equipment frequently use MAX II CPLDs for this supervisory role.
Recommended
Bus Protocol Bridging (SPI/I2C/Parallel)
The EPM2210F256C5 bridges between incompatible bus protocols - for example, SPI to parallel, I2C to GPIO, UART to SPI - using its 1700 macrocells and MultiVolt I/O. With 201 MHz fMAX the device handles full-speed SPI (50 MHz) and I2C (3.4 MHz Fast-mode Plus) with substantial timing margin. The non-volatile configuration and instant-on capability allow the bridge to be operational before the main processor boots, enabling bootloader-style firmware upgrades. Embedded designers value MAX II CPLDs for protocol-bridging because they avoid the FPGA bitstream-load delay that would otherwise block early system communication.
Recommended
Legacy Industrial Control Systems
The EPM2210F256C5 is widely deployed in long-lifecycle industrial automation, CNC, and process-control systems where designs must remain in production for 10-20 years and where 5V/3.3V mixed-voltage logic is common. The 272 user I/Os handle the wide parallel interfaces to legacy motor drivers and PLC I/O modules, while MultiVolt I/O banks interface directly to 5V sensors and 3.3V controllers. The flash-based instant-on behavior is critical for safety interlocks that must be active before the main processor boots. Engineers maintaining legacy industrial designs often specify the EPM2210F256C5 because its proven long-term availability and the MAX II family's wide third-party support.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210F256C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210F256C5N | EPM2210F256C4 | EPM2210F256C4N | EPM2210F256C3N | EPM2210F256A5NGA | EPM1270F256C5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | FBGA-256 (FineLine BGA) | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Device Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Macro Cells | 1700 | 1700 | 1700 | 1700 | 1700 | 1700 | 1270 |
| Speed Grade | C5 (~5 ns tPD) | C5 (~5 ns tPD) | C4 (~7 ns tPD) | C4 (~7 ns tPD) | C3 (~10 ns tPD) | A5 (automotive temp) | C5 (~5 ns tPD) |
| Maximum Internal Frequency | 201.1 MHz | 201.1 MHz | ~152 MHz (est.) | ~152 MHz (est.) | ~100 MHz (est.) | 201.1 MHz | 201.1 MHz |
| User I/Os | 272 | 272 | 272 | 272 | 272 | 272 | 212 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +125C (automotive) | 0C to +85C |
| RoHS Compliant | [DATA_NEEDED: lead-free status] | Yes (N suffix) | No (non-N) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (non-N) |
Key Differentiators
- Highest-density MAX II device with 1700 macrocells and 272 user I/Os (vs EPM1270F256C5)
- Fastest C5 commercial speed grade at ~5 ns tPD (vs EPM2210F256C4N)
- Commercial temperature grade with NRND status - lowest cost, broadest availability in stock channels (vs EPM2210F256A5NGA)
Design Notes
The 256-ball FineLine BGA package uses 1.0 mm pitch and requires a 4-layer (or more) PCB with microvia technology for breakout. Fanout the signals on inner layers to avoid routing congestion on the top layer. Place 0.1 µF decoupling capacitors (one per VCCIO bank, plus 4-6 distributed VCCINT caps) within 100 mils of their respective balls. Use a continuous ground plane on layer 2 directly under the BGA to provide a low-impedance return path for high-speed signals.
JTAG signals (TCK, TMS, TDI, TDO) require careful routing: keep the TCK trace short and straight, route TMS/TDI/TDO parallel to TCK with ground guard traces on both sides for signal integrity. Add 10 kΩ pull-ups to VCCIO on TMS, TDI, and TDO to keep the JTAG state machine in a known state at power-up. The nCE (chip enable) and nCONFIG pins must each have a 10 kΩ pull-up to VCCIO to ensure proper configuration startup.
Do not confuse speed-grade suffixes: C5 is the fastest commercial grade (~5 ns tPD), C4 is slower (~7 ns), C3 is slowest (~10 ns). An EPM2210F256C3N cannot be substituted for a C5 design without re-running timing analysis. Also, the A5NGA automotive-grade variant supports -40C to +125C and is not electrically identical at temperature extremes. When migrating between grades, recompile the Quartus design with the new speed-grade constraint to regenerate the JEDEC programming file.
The MAX II family is known for ultra-low standby current, but during active operation each VCCIO bank draws 10-30 mA depending on switching frequency and load. For a fully populated 272-I/O design at 100 MHz, plan for approximately 200-300 mA total supply current. Use a linear regulator (not a switching converter) for VCCINT if low noise is critical, and add a ferrite bead on each VCCIO bank supply to isolate switching noise between banks.
Compliance Information
The base EPM2210F256C5 is the non-RoHS variant (no 'N' suffix). For RoHS-compliant designs, use EPM2210F256C5N. AEC-Q100 not applicable to base part - use EPM2210F256A5NGA for automotive. Compliance data for the base C5 part not directly stated in verified web data - flagged as unknown.
