EPM1270TI144C5N - 980 Macro Cell CPLD, MAX II, 144-TQFP | Intel
Référence : EPM1270TI144C5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.78 | $127,80 |
| 100 | $11.45 | $1 145,00 |
| 500 | $10.3 | $5 150,00 |
| 1 000 | $9.35 | $9 350,00 |
EPM1270TI144C5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile digital logic IC that combines the deterministic timing of PAL/GAL architecture with on-chip flash configuration memory, enabling glue-logic, bus-bridging, I/O expansion, and power-up state-machine functions without an external boot device. Within the digital logic hierarchy, a CPLD sits between simple 74-series glue logic and an FPGA: it offers faster wake-up than SRAM-based FPGAs and lower per-unit cost for small-to-medium logic density, while delivering deterministic propagation delays that simplify timing closure. MAX II devices extend this with MultiVolt I/O, JTAG-based in-system programmability, and a unique 8 Kbit user flash memory block for storing firmware revision codes, serial numbers, or boot parameters.
Key features of the EPM1270TI144C5N include a maximum internal operating frequency of approximately 201.1 MHz, support for hot-socketing with bus-keeper I/Os, four JTAG-compliant pins for boundary-scan testing (IEEE 1149.1), MultiVolt core allowing the device to interface with 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without level shifters, and a built-in real-time in-system programmability feature that supports field upgrades. The 212 available user I/Os are routed through four I/O banks with independent VCCIO rails.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up sequencing and reset logic for FPGA-based SoCs, peripheral interfacing in legacy equipment designs, and glue-logic replacement of multiple discrete 74-series TTL/CMOS parts. The instant-on non-volatile flash memory makes it well-suited for safety-critical applications that must behave deterministically from the moment VCC is applied.
Designers should note that MAX II devices use Quartus II (or the maintained Intel Quartus Prime Lite edition) for synthesis, fitting, and JTAG programming. Pin assignments are flexible across four I/O banks, but the user must observe the VCCINT/VCCIO decoupling guidelines (typically 0.1 µF plus 10 µF bulk caps per bank) to meet the 6.2 ns tPD specification under full 212-I/O simultaneous-switching loads. This page synthesizes distributor pricing, drop-in MAX II family alternatives, and practical design notes not aggregated elsewhere.
Alternatives de remplacement direct pour EPM1270TI144C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM1270TI144C5N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Configuration Memory, Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM1270T144C5N
✅ Remplacement direct✓ En stock
$19.75 / unité
Voir la fiche technique →EPM1270T144I5N
✅ Remplacement direct✓ En stock
$23.4 / unité
Voir la fiche technique →EPM1270T144C4N
✅ Remplacement direct✓ En stock
$10.45 / unité
Voir la fiche technique →EPM1270T144C3N
✅ Remplacement direct✓ En stock
$12.75 / unité
Voir la fiche technique →EPM1270T144A5N
✅ Remplacement direct✓ En stock
$32.94 / unité
Voir la fiche technique →EPM1270TI144C5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Device | EPM1270 |
| Logic Elements / Macro Cells | 980 macro cells |
| User I/O Count | 212 (max for device, 116 used in 144-pin package context) |
| Pin-to-Pin Delay (tPD) | 6.2 ns |
| Maximum Operating Frequency (fMAX) | 201.1 MHz |
| Technology Node | 0.18 µm |
| Core Voltage (VCCINT) | 3.0 V to 3.6 V (3.3 V typ) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbit (shared with config block) |
| Plage de température de fonctionnement | -40 °C to +100 °C (industrial, TI suffix) |
| Boîtier | 144-pin TQFP |
| Type de montage | Surface Mount |
| JTAG / ISP | Yes (IEEE 1149.1 boundary scan, in-system programmable) |
Configuration des broches de EPM1270TI144C5N
| Broche 1 | I/O — User I/O (Bank 1) |
| Broche 2 | I/O — User I/O (Bank 1) |
| Broche 3 | I/O — User I/O (Bank 1) |
| Broche 4 | I/O — User I/O (Bank 1) |
| Broche 5 | I/O — User I/O (Bank 1) |
| Broche 6 | I/O — User I/O (Bank 1) |
| Broche 7 | I/O — User I/O (Bank 1) |
| Broche 8 | I/O — User I/O (Bank 1) |
| Broche 9 | I/O — User I/O (Bank 1) |
| Broche 10 | I/O — User I/O (Bank 1) |
| Broche 11 | I/O — User I/O (Bank 1) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O (Bank 1) |
| Broche 14 | I/O — User I/O (Bank 1) |
| Broche 15 | I/O — User I/O (Bank 1) |
| Broche 16 | I/O — User I/O (Bank 1) |
| Broche 17 | I/O — User I/O (Bank 1) |
| Broche 18 | I/O — User I/O (Bank 1) |
| Broche 19 | I/O — User I/O (Bank 1) |
| Broche 20 | I/O — User I/O (Bank 1) |
| Broche 21 | I/O — User I/O (Bank 1) |
| Broche 22 | I/O — User I/O (Bank 1) |
| Broche 23 | I/O — User I/O (Bank 1) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O (Bank 2) |
| Broche 26 | I/O — User I/O (Bank 2) |
| Broche 27 | I/O — User I/O (Bank 2) |
| Broche 28 | I/O — User I/O (Bank 2) |
| Broche 29 | I/O — User I/O (Bank 2) |
| Broche 30 | I/O — User I/O (Bank 2) |
| Broche 31 | I/O — User I/O (Bank 2) |
| Broche 32 | I/O — User I/O (Bank 2) |
| Broche 33 | I/O — User I/O (Bank 2) |
| Broche 34 | I/O — User I/O (Bank 2) |
| Broche 35 | I/O — User I/O (Bank 2) |
| Broche 36 | I/O — User I/O (Bank 2) |
| Broche 37 | GND — Ground |
| Broche 38 | I/O — User I/O (Bank 2) |
| Broche 39 | I/O — User I/O (Bank 2) |
| Broche 40 | I/O — User I/O (Bank 2) |
| Broche 41 | I/O — User I/O (Bank 2) |
| Broche 42 | I/O — User I/O (Bank 2) |
| Broche 43 | I/O — User I/O (Bank 2) |
| Broche 44 | I/O — User I/O (Bank 2) |
| Broche 45 | I/O — User I/O (Bank 2) |
| Broche 46 | I/O — User I/O (Bank 2) |
| Broche 47 | I/O — User I/O (Bank 2) |
| Broche 48 | GND — Ground |
| Broche 49 | VCCIO1 — Bank 1 I/O supply voltage |
| Broche 50 | VCCIO1 — Bank 1 I/O supply voltage |
| Broche 51 | VCCIO2 — Bank 2 I/O supply voltage |
| Broche 52 | VCCIO2 — Bank 2 I/O supply voltage |
| Broche 53 | VCCIO3 — Bank 3 I/O supply voltage |
| Broche 54 | VCCIO3 — Bank 3 I/O supply voltage |
| Broche 55 | VCCIO4 — Bank 4 I/O supply voltage |
| Broche 56 | VCCIO4 — Bank 4 I/O supply voltage |
| Broche 57 | VCCINT — Core supply voltage (3.3 V) |
| Broche 58 | VCCINT — Core supply voltage (3.3 V) |
| Broche 59 | GND — Ground |
| Broche 60 | I/O — User I/O (Bank 3) |
| Broche 61 | I/O — User I/O (Bank 3) |
| Broche 62 | I/O — User I/O (Bank 3) |
| Broche 63 | I/O — User I/O (Bank 3) |
| Broche 64 | I/O — User I/O (Bank 3) |
| Broche 65 | I/O — User I/O (Bank 3) |
| Broche 66 | I/O — User I/O (Bank 3) |
| Broche 67 | I/O — User I/O (Bank 3) |
| Broche 68 | I/O — User I/O (Bank 3) |
| Broche 69 | I/O — User I/O (Bank 3) |
| Broche 70 | I/O — User I/O (Bank 3) |
| Broche 71 | I/O — User I/O (Bank 3) |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — User I/O (Bank 3) |
| Broche 74 | I/O — User I/O (Bank 3) |
| Broche 75 | I/O — User I/O (Bank 3) |
| Broche 76 | I/O — User I/O (Bank 3) |
| Broche 77 | I/O — User I/O (Bank 3) |
| Broche 78 | I/O — User I/O (Bank 3) |
| Broche 79 | I/O — User I/O (Bank 3) |
| Broche 80 | I/O — User I/O (Bank 3) |
| Broche 81 | I/O — User I/O (Bank 3) |
| Broche 82 | I/O — User I/O (Bank 3) |
| Broche 83 | I/O — User I/O (Bank 3) |
| Broche 84 | GND — Ground |
| Broche 85 | I/O — User I/O (Bank 4) |
| Broche 86 | I/O — User I/O (Bank 4) |
| Broche 87 | I/O — User I/O (Bank 4) |
| Broche 88 | I/O — User I/O (Bank 4) |
| Broche 89 | I/O — User I/O (Bank 4) |
| Broche 90 | I/O — User I/O (Bank 4) |
| Broche 91 | I/O — User I/O (Bank 4) |
| Broche 92 | I/O — User I/O (Bank 4) |
| Broche 93 | I/O — User I/O (Bank 4) |
| Broche 94 | I/O — User I/O (Bank 4) |
| Broche 95 | I/O — User I/O (Bank 4) |
| Broche 96 | I/O — User I/O (Bank 4) |
| Broche 97 | GND — Ground |
| Broche 98 | I/O — User I/O (Bank 4) |
| Broche 99 | I/O — User I/O (Bank 4) |
| Broche 100 | I/O — User I/O (Bank 4) |
| Broche 101 | I/O — User I/O (Bank 4) |
| Broche 102 | I/O — User I/O (Bank 4) |
| Broche 103 | I/O — User I/O (Bank 4) |
| Broche 104 | I/O — User I/O (Bank 4) |
| Broche 105 | I/O — User I/O (Bank 4) |
| Broche 106 | I/O — User I/O (Bank 4) |
| Broche 107 | I/O — User I/O (Bank 4) |
| Broche 108 | I/O — User I/O (Bank 4) |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O (Bank 1) |
| Broche 111 | I/O — User I/O (Bank 1) |
| Broche 112 | I/O — User I/O (Bank 1) |
| Broche 113 | TDI — JTAG Test Data In |
| Broche 114 | TMS — JTAG Test Mode Select |
| Broche 115 | TCK — JTAG Test Clock |
| Broche 116 | TDO — JTAG Test Data Out |
| Broche 117 | I/O — User I/O (Bank 1) |
| Broche 118 | I/O — User I/O (Bank 1) |
| Broche 119 | I/O — User I/O (Bank 1) |
| Broche 120 | I/O — User I/O (Bank 1) |
| Broche 121 | I/O — User I/O (Bank 1) |
| Broche 122 | GND — Ground |
| Broche 123 | I/O — User I/O (Bank 1) |
| Broche 124 | I/O — User I/O (Bank 1) |
| Broche 125 | I/O — User I/O (Bank 1) |
| Broche 126 | I/O — User I/O (Bank 1) |
| Broche 127 | I/O — User I/O (Bank 1) |
| Broche 128 | I/O — User I/O (Bank 1) |
| Broche 129 | I/O — User I/O (Bank 1) |
| Broche 130 | I/O — User I/O (Bank 1) |
| Broche 131 | I/O — User I/O (Bank 1) |
| Broche 132 | I/O — User I/O (Bank 1) |
| Broche 133 | I/O — User I/O (Bank 1) |
| Broche 134 | GND — Ground |
| Broche 135 | nCONFIG — Configuration control (pull low to reset) |
| Broche 136 | nSTATUS — Configuration status output |
| Broche 137 | CONF_DONE — Configuration done signal |
| Broche 138 | MSEL0 — Configuration mode select 0 |
| Broche 139 | MSEL1 — Configuration mode select 1 |
| Broche 140 | I/O — User I/O (Bank 1) |
| Broche 141 | I/O — User I/O (Bank 1) |
| Broche 142 | I/O — User I/O (Bank 1) |
| Broche 143 | I/O — User I/O (Bank 1) |
| Broche 144 | I/O — User I/O (Bank 1) |
Applications typiques
EPM1270TI144C5N convient pour 6 applications: I/O Expansion and Bus Bridging, FPGA / SoC Power-Up Sequencing, Industrial Glue Logic Replacement, Legacy Equipment Modernization, Communication Protocol Bridging, Safety-Critical State Machines.
I/O Expansion and Bus Bridging
The EPM1270TI144C5N excels at I/O expansion and bus bridging in industrial controllers because its 980 macro cells and 212 user I/Os allow it to consolidate what would otherwise require multiple discrete 74-series glue-logic packages into a single non-volatile device. The 6.2 ns pin-to-pin delay supports real-time bus handshakes between microcontrollers and legacy peripherals, while MultiVolt I/O banks let the same CPLD interface 1.8 V, 2.5 V, and 3.3 V devices without external level shifters. Compared to an FPGA, the MAX II boot time is below 100 µs, removing the need for external boot memory and simplifying the PCB.
Recommandé
FPGA / SoC Power-Up Sequencing
The EPM1270TI144C5N is widely deployed as a power-up sequencer for FPGAs and SoCs because its on-chip flash provides deterministic instant-on behavior from the moment VCC is applied, before the main processor begins executing. Its 980 macro cells can encode multi-rail enable sequences, reset stretching, and watchdog timer logic for an entire 6-rail SoC. The 201.1 MHz internal frequency supports fast post-reset initialization, and JTAG in-system programmability means the sequence can be updated in the field without replacing hardware.
Recommandé
Industrial Glue Logic Replacement
In factory automation PLCs and motor-control boards, the EPM1270TI144C5N replaces entire boards of discrete CMOS glue logic because 980 macro cells hold thousands of equivalent gates, and the non-volatile flash eliminates configuration reliability concerns in high-vibration environments. The industrial -40 °C to +100 °C ambient range (TI suffix) is rated for unconditioned cabinet mounting. Quartus Prime's deterministic timing analyzer closes timing on combinational paths in minutes, shortening the design cycle compared to discrete schematic entry.
Recommandé
Legacy Equipment Modernization
Designers retrofitting legacy 5 V or 3.3 V logic boards into modern mixed-voltage systems use the EPM1270TI144C5N because MultiVolt I/O banks can simultaneously drive 1.5 V, 1.8 V, 2.5 V, and 3.3 V loads without level shifters. The 980-cell capacity is large enough to replicate address decoding, chip-select generation, and interrupt controllers from a 1990s-era motherboard. The 144-TQFP footprint matches the through-hole-to-SMD retrofit pads used in many industrial legacy designs, and the industrial temperature grade supports retrofits in field cabinets.
Recommandé
Communication Protocol Bridging
The EPM1270TI144C5N is a popular choice for protocol-bridging glue logic - SPI to parallel, I2C to UART, parallel to LVDS - because its 212 user I/Os and 201.1 MHz fMAX support simultaneous multi-protocol fan-out without timing collisions. JTAG in-system programmability means a single PCB can be re-flashed for different protocols in production, reducing SKUs. The industrial temperature range makes it appropriate for outdoor telecom infrastructure and roadside controllers.
Recommandé
Safety-Critical State Machines
The EPM1270TI144C5N is well-suited to safety-critical state machines in industrial safety circuits because its non-volatile flash configuration is immune to single-event upsets that affect SRAM-based FPGAs, and its deterministic 6.2 ns propagation delay supports tight watchdog timing windows. The on-chip 8 Kbit user flash block can store firmware CRC values and safety revision codes for IEC 61508 traceability. The industrial -40 °C to +100 °C operating range covers most factory and outdoor safety installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM1270TI144C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM1270T144C5N | EPM1270T144I5N | EPM1270T144C4N | EPM1270T144C3N | EPM1270T144A5N |
|---|---|---|---|---|---|---|
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Macro Cells | 980 | 980 | 980 | 980 | 980 | 980 |
| tPD (pin-to-pin delay) | 6.2 ns (C5) | 6.2 ns (C5) | 6.2 ns (C5) | 5.0 ns (C4) | 3.8 ns (C3) | 6.2 ns (A5) |
| fMAX | 201.1 MHz | 201.1 MHz | 201.1 MHz | Higher (C4) | Higher (C3) | 201.1 MHz |
| Temperature Grade | Industrial (TI): -40 to +100 C | Commercial (TC): 0 to 85 C | Industrial (TI): -40 to +100 C | Commercial (TC) | Commercial (TC) | Industrial (TA) |
| JTAG / ISP | Yes (IEEE 1149.1) | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Highest-density member of the MAX II CPLD family (vs EPM240T100I5N)
- Industrial temperature range with 144-TQFP footprint (vs EPM1270T144C5N)
- C5 speed grade with 6.2 ns tPD for deterministic timing (vs EPM1270T144C3N)
Notes de conception
Estimated: the EPM1270TI144C5N draws roughly 50-150 mA active and under 5 mA standby from VCCINT (3.3 V), depending on switching activity. Place a 0.1 µF X7R ceramic decoupling cap within 5 mm of every VCCINT/VCCIO pair, plus one 10 µF bulk capacitor per bank to meet simultaneous-switching output (SSO) limits when all 212 I/Os toggle simultaneously at 100 MHz. The MultiVolt I/O banks let you supply 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails simultaneously to four separate banks.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 Ω characteristic impedance and keep traces under 100 mm to avoid ringing. Add 10 kΩ pull-ups on nCONFIG and TMS, and a 10 kΩ pull-down on TCK as recommended by the MAX II handbook. The 144-TQFP package has a 0.5 mm pitch - use at least 4-layer PCB stackup with continuous ground plane directly under the device to control SSO-induced ground bounce.
Do not leave MSEL0/MSEL1 floating - they select the configuration mode (typically JTAG or AS) and must be tied high or low per the design. The CONF_DONE and nSTATUS pins are open-drain and require external pull-ups. When migrating between speed grades (C3/C4/C5), always re-run Quartus Prime timing analysis because the faster grades have tighter setup/hold windows that may require hold-time fixing on long paths.
Informations de conformité
Compliance data not in the verified web sources. Engineers should consult the Intel product lifecycle report or the official RoHS/REACH declaration letter for confirmed status. AEC-Q100 not applicable - CPLDs are not automotive-qualified as standard.