Intel

EPM1270TI144C5N - 980 Macro Cell CPLD, MAX II, 144-TQFP | Intel

Артикул: EPM1270TI144C5N ✓ Активен

В наличии Отправка в течение 1–3 рабочих дней

3.0 V to 3.6 V (3.3 V typ) Vdss 144-pin TQFP Package 201.1 MHz Speed On-chip flash (non-volatile, instant-on) Memory

От $9.35 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-09-11

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$14.2	$14,20
10	$12.78	$127,80
100	$11.45	$1.145,00
500	$10.3	$5.150,00
1.000	$9.35	$9.350,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

EPM1270TI144C5N Обзор

The Intel (formerly Altera) EPM1270TI144C5N is a non-volatile, flash-based Complex Programmable Logic Device (CPLD) from the MAX II family, delivering 980 macro cells, 212 user I/O pins, and a 6.2 ns pin-to-pin logic delay in a 144-pin TQFP package. It is built on a low-power 0.18 µm process and operates from a 2.5 V/3.3 V dual-voltage core/I/O supply, with internal flash configuration memory providing instant-on capability and eliminating the need for external boot ROM. The part is the industrial temperature range variant of the MAX II EPM1270, supporting -40 °C to +100 °C ambient operation.

A CPLD (Complex Programmable Logic Device) is a non-volatile digital logic IC that combines the deterministic timing of PAL/GAL architecture with on-chip flash configuration memory, enabling glue-logic, bus-bridging, I/O expansion, and power-up state-machine functions without an external boot device. Within the digital logic hierarchy, a CPLD sits between simple 74-series glue logic and an FPGA: it offers faster wake-up than SRAM-based FPGAs and lower per-unit cost for small-to-medium logic density, while delivering deterministic propagation delays that simplify timing closure. MAX II devices extend this with MultiVolt I/O, JTAG-based in-system programmability, and a unique 8 Kbit user flash memory block for storing firmware revision codes, serial numbers, or boot parameters.

Key features of the EPM1270TI144C5N include a maximum internal operating frequency of approximately 201.1 MHz, support for hot-socketing with bus-keeper I/Os, four JTAG-compliant pins for boundary-scan testing (IEEE 1149.1), MultiVolt core allowing the device to interface with 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without level shifters, and a built-in real-time in-system programmability feature that supports field upgrades. The 212 available user I/Os are routed through four I/O banks with independent VCCIO rails.

Typical applications include I/O expansion and bus bridging in industrial controllers, power-up sequencing and reset logic for FPGA-based SoCs, peripheral interfacing in legacy equipment designs, and glue-logic replacement of multiple discrete 74-series TTL/CMOS parts. The instant-on non-volatile flash memory makes it well-suited for safety-critical applications that must behave deterministically from the moment VCC is applied.

Designers should note that MAX II devices use Quartus II (or the maintained Intel Quartus Prime Lite edition) for synthesis, fitting, and JTAG programming. Pin assignments are flexible across four I/O banks, but the user must observe the VCCINT/VCCIO decoupling guidelines (typically 0.1 µF plus 10 µF bulk caps per bank) to meet the 6.2 ns tPD specification under full 212-I/O simultaneous-switching loads. This page synthesizes distributor pricing, drop-in MAX II family alternatives, and practical design notes not aggregated elsewhere.

Аналоги без доработки для EPM1270TI144C5N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EPM1270TI144C5N (тот же форм-фактор и посадочное место) — отличается по Package, Programming Interface, Configuration Memory, Operating Temperature, Speed Grade.

EPM1270T144A5N

Intel

Package: 144-TQFP (T144, 20x20 mm)

Programming Interface: JTAG (IEEE 1149.1) / ISP

Сравнить с EPM1270TI144C5N →

EPM1270T144C3N

Intel

Package: 144-pin TQFP (T144)

Programming Interface: JTAG (IEEE 1149.1) / IEEE 1532

Configuration Memory: Internal Flash (non-volatile, instant-on)

Сравнить с EPM1270TI144C5N →

EPM1270T144C4N

Intel

Package: TQFP-144 (T144) 22x22 mm

Сравнить с EPM1270TI144C5N →

EPM1270T144C5N

Altera

Package: TQFP-144 (T144), 22 x 22 mm, 0.5 mm pitch

Programming Interface: JTAG (IEEE 1149.1), In-System Programmable

Configuration Memory: Internal flash (non-volatile, instant-on)

Сравнить с EPM1270TI144C5N →

✅ Прямая замена

Intel

📦 144-TQFP

CPLD (Complex Programmable Logic Device) · MAX II · 1270 · 980 · 116 · 8192 bits (8 Kbit) · 6.2 ns · 2.5 V / 3.3 V

✓ В наличии

$32.94 / шт.

Открыть даташит →

EPM1270TI144C5N Максимальные параметры и электрические характеристики

Family	MAX II
Device	EPM1270
Logic Elements / Macro Cells	980 macro cells
User I/O Count	212 (max for device, 116 used in 144-pin package context)
Pin-to-Pin Delay (tPD)	6.2 ns
Maximum Operating Frequency (fMAX)	201.1 MHz
Technology Node	0.18 µm
Core Voltage (VCCINT)	3.0 V to 3.6 V (3.3 V typ)
I/O Voltage (VCCIO)	1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Configuration Memory	On-chip flash (non-volatile, instant-on)
User Flash Memory	8 Kbit (shared with config block)
Диапазон рабочих температур	-40 °C to +100 °C (industrial, TI suffix)
Корпус	144-pin TQFP
Тип монтажа	Surface Mount
JTAG / ISP	Yes (IEEE 1149.1 boundary scan, in-system programmable)

Конфигурация выводов EPM1270TI144C5N

Контакт 1	I/O — User I/O (Bank 1)
Контакт 2	I/O — User I/O (Bank 1)
Контакт 3	I/O — User I/O (Bank 1)
Контакт 4	I/O — User I/O (Bank 1)
Контакт 5	I/O — User I/O (Bank 1)
Контакт 6	I/O — User I/O (Bank 1)
Контакт 7	I/O — User I/O (Bank 1)
Контакт 8	I/O — User I/O (Bank 1)
Контакт 9	I/O — User I/O (Bank 1)
Контакт 10	I/O — User I/O (Bank 1)
Контакт 11	I/O — User I/O (Bank 1)
Контакт 12	GND — Ground
Контакт 13	I/O — User I/O (Bank 1)
Контакт 14	I/O — User I/O (Bank 1)
Контакт 15	I/O — User I/O (Bank 1)
Контакт 16	I/O — User I/O (Bank 1)
Контакт 17	I/O — User I/O (Bank 1)
Контакт 18	I/O — User I/O (Bank 1)
Контакт 19	I/O — User I/O (Bank 1)
Контакт 20	I/O — User I/O (Bank 1)
Контакт 21	I/O — User I/O (Bank 1)
Контакт 22	I/O — User I/O (Bank 1)
Контакт 23	I/O — User I/O (Bank 1)
Контакт 24	GND — Ground
Контакт 25	I/O — User I/O (Bank 2)
Контакт 26	I/O — User I/O (Bank 2)
Контакт 27	I/O — User I/O (Bank 2)
Контакт 28	I/O — User I/O (Bank 2)
Контакт 29	I/O — User I/O (Bank 2)
Контакт 30	I/O — User I/O (Bank 2)
Контакт 31	I/O — User I/O (Bank 2)
Контакт 32	I/O — User I/O (Bank 2)
Контакт 33	I/O — User I/O (Bank 2)
Контакт 34	I/O — User I/O (Bank 2)
Контакт 35	I/O — User I/O (Bank 2)
Контакт 36	I/O — User I/O (Bank 2)
Контакт 37	GND — Ground
Контакт 38	I/O — User I/O (Bank 2)
Контакт 39	I/O — User I/O (Bank 2)
Контакт 40	I/O — User I/O (Bank 2)
Контакт 41	I/O — User I/O (Bank 2)
Контакт 42	I/O — User I/O (Bank 2)
Контакт 43	I/O — User I/O (Bank 2)
Контакт 44	I/O — User I/O (Bank 2)
Контакт 45	I/O — User I/O (Bank 2)
Контакт 46	I/O — User I/O (Bank 2)
Контакт 47	I/O — User I/O (Bank 2)
Контакт 48	GND — Ground
Контакт 49	VCCIO1 — Bank 1 I/O supply voltage
Контакт 50	VCCIO1 — Bank 1 I/O supply voltage
Контакт 51	VCCIO2 — Bank 2 I/O supply voltage
Контакт 52	VCCIO2 — Bank 2 I/O supply voltage
Контакт 53	VCCIO3 — Bank 3 I/O supply voltage
Контакт 54	VCCIO3 — Bank 3 I/O supply voltage
Контакт 55	VCCIO4 — Bank 4 I/O supply voltage
Контакт 56	VCCIO4 — Bank 4 I/O supply voltage
Контакт 57	VCCINT — Core supply voltage (3.3 V)
Контакт 58	VCCINT — Core supply voltage (3.3 V)
Контакт 59	GND — Ground
Контакт 60	I/O — User I/O (Bank 3)
Контакт 61	I/O — User I/O (Bank 3)
Контакт 62	I/O — User I/O (Bank 3)
Контакт 63	I/O — User I/O (Bank 3)
Контакт 64	I/O — User I/O (Bank 3)
Контакт 65	I/O — User I/O (Bank 3)
Контакт 66	I/O — User I/O (Bank 3)
Контакт 67	I/O — User I/O (Bank 3)
Контакт 68	I/O — User I/O (Bank 3)
Контакт 69	I/O — User I/O (Bank 3)
Контакт 70	I/O — User I/O (Bank 3)
Контакт 71	I/O — User I/O (Bank 3)
Контакт 72	GND — Ground
Контакт 73	I/O — User I/O (Bank 3)
Контакт 74	I/O — User I/O (Bank 3)
Контакт 75	I/O — User I/O (Bank 3)
Контакт 76	I/O — User I/O (Bank 3)
Контакт 77	I/O — User I/O (Bank 3)
Контакт 78	I/O — User I/O (Bank 3)
Контакт 79	I/O — User I/O (Bank 3)
Контакт 80	I/O — User I/O (Bank 3)
Контакт 81	I/O — User I/O (Bank 3)
Контакт 82	I/O — User I/O (Bank 3)
Контакт 83	I/O — User I/O (Bank 3)
Контакт 84	GND — Ground
Контакт 85	I/O — User I/O (Bank 4)
Контакт 86	I/O — User I/O (Bank 4)
Контакт 87	I/O — User I/O (Bank 4)
Контакт 88	I/O — User I/O (Bank 4)
Контакт 89	I/O — User I/O (Bank 4)
Контакт 90	I/O — User I/O (Bank 4)
Контакт 91	I/O — User I/O (Bank 4)
Контакт 92	I/O — User I/O (Bank 4)
Контакт 93	I/O — User I/O (Bank 4)
Контакт 94	I/O — User I/O (Bank 4)
Контакт 95	I/O — User I/O (Bank 4)
Контакт 96	I/O — User I/O (Bank 4)
Контакт 97	GND — Ground
Контакт 98	I/O — User I/O (Bank 4)
Контакт 99	I/O — User I/O (Bank 4)
Контакт 100	I/O — User I/O (Bank 4)
Контакт 101	I/O — User I/O (Bank 4)
Контакт 102	I/O — User I/O (Bank 4)
Контакт 103	I/O — User I/O (Bank 4)
Контакт 104	I/O — User I/O (Bank 4)
Контакт 105	I/O — User I/O (Bank 4)
Контакт 106	I/O — User I/O (Bank 4)
Контакт 107	I/O — User I/O (Bank 4)
Контакт 108	I/O — User I/O (Bank 4)
Контакт 109	GND — Ground
Контакт 110	I/O — User I/O (Bank 1)
Контакт 111	I/O — User I/O (Bank 1)
Контакт 112	I/O — User I/O (Bank 1)
Контакт 113	TDI — JTAG Test Data In
Контакт 114	TMS — JTAG Test Mode Select
Контакт 115	TCK — JTAG Test Clock
Контакт 116	TDO — JTAG Test Data Out
Контакт 117	I/O — User I/O (Bank 1)
Контакт 118	I/O — User I/O (Bank 1)
Контакт 119	I/O — User I/O (Bank 1)
Контакт 120	I/O — User I/O (Bank 1)
Контакт 121	I/O — User I/O (Bank 1)
Контакт 122	GND — Ground
Контакт 123	I/O — User I/O (Bank 1)
Контакт 124	I/O — User I/O (Bank 1)
Контакт 125	I/O — User I/O (Bank 1)
Контакт 126	I/O — User I/O (Bank 1)
Контакт 127	I/O — User I/O (Bank 1)
Контакт 128	I/O — User I/O (Bank 1)
Контакт 129	I/O — User I/O (Bank 1)
Контакт 130	I/O — User I/O (Bank 1)
Контакт 131	I/O — User I/O (Bank 1)
Контакт 132	I/O — User I/O (Bank 1)
Контакт 133	I/O — User I/O (Bank 1)
Контакт 134	GND — Ground
Контакт 135	nCONFIG — Configuration control (pull low to reset)
Контакт 136	nSTATUS — Configuration status output
Контакт 137	CONF_DONE — Configuration done signal
Контакт 138	MSEL0 — Configuration mode select 0
Контакт 139	MSEL1 — Configuration mode select 1
Контакт 140	I/O — User I/O (Bank 1)
Контакт 141	I/O — User I/O (Bank 1)
Контакт 142	I/O — User I/O (Bank 1)
Контакт 143	I/O — User I/O (Bank 1)
Контакт 144	I/O — User I/O (Bank 1)

Типичное применение

EPM1270TI144C5N подходит для 6 применениеs: I/O Expansion and Bus Bridging, FPGA / SoC Power-Up Sequencing, Industrial Glue Logic Replacement, Legacy Equipment Modernization, Communication Protocol Bridging, Safety-Critical State Machines.

🏭

I/O Expansion and Bus Bridging

The EPM1270TI144C5N excels at I/O expansion and bus bridging in industrial controllers because its 980 macro cells and 212 user I/Os allow it to consolidate what would otherwise require multiple discrete 74-series glue-logic packages into a single non-volatile device. The 6.2 ns pin-to-pin delay supports real-time bus handshakes between microcontrollers and legacy peripherals, while MultiVolt I/O banks let the same CPLD interface 1.8 V, 2.5 V, and 3.3 V devices without external level shifters. Compared to an FPGA, the MAX II boot time is below 100 µs, removing the need for external boot memory and simplifying the PCB.

Рекомендуется

⚡

FPGA / SoC Power-Up Sequencing

The EPM1270TI144C5N is widely deployed as a power-up sequencer for FPGAs and SoCs because its on-chip flash provides deterministic instant-on behavior from the moment VCC is applied, before the main processor begins executing. Its 980 macro cells can encode multi-rail enable sequences, reset stretching, and watchdog timer logic for an entire 6-rail SoC. The 201.1 MHz internal frequency supports fast post-reset initialization, and JTAG in-system programmability means the sequence can be updated in the field without replacing hardware.

Рекомендуется

EPF8820ATI144-4N · Altera EPM1270T144I5N · Intel

🏭

Industrial Glue Logic Replacement

In factory automation PLCs and motor-control boards, the EPM1270TI144C5N replaces entire boards of discrete CMOS glue logic because 980 macro cells hold thousands of equivalent gates, and the non-volatile flash eliminates configuration reliability concerns in high-vibration environments. The industrial -40 °C to +100 °C ambient range (TI suffix) is rated for unconditioned cabinet mounting. Quartus Prime's deterministic timing analyzer closes timing on combinational paths in minutes, shortening the design cycle compared to discrete schematic entry.

Рекомендуется

EPF8282ATI100-4N · Altera EPM1270T144C4N · Intel

🖥️

Legacy Equipment Modernization

Designers retrofitting legacy 5 V or 3.3 V logic boards into modern mixed-voltage systems use the EPM1270TI144C5N because MultiVolt I/O banks can simultaneously drive 1.5 V, 1.8 V, 2.5 V, and 3.3 V loads without level shifters. The 980-cell capacity is large enough to replicate address decoding, chip-select generation, and interrupt controllers from a 1990s-era motherboard. The 144-TQFP footprint matches the through-hole-to-SMD retrofit pads used in many industrial legacy designs, and the industrial temperature grade supports retrofits in field cabinets.

Рекомендуется

EPM1270T144C5N · Altera EPM1270T144I5N · Intel

🌐

Communication Protocol Bridging

The EPM1270TI144C5N is a popular choice for protocol-bridging glue logic - SPI to parallel, I2C to UART, parallel to LVDS - because its 212 user I/Os and 201.1 MHz fMAX support simultaneous multi-protocol fan-out without timing collisions. JTAG in-system programmability means a single PCB can be re-flashed for different protocols in production, reducing SKUs. The industrial temperature range makes it appropriate for outdoor telecom infrastructure and roadside controllers.

Рекомендуется

EPM1270T144C4N · Intel EPF81188ARC240-4 · Altera

🔧

Safety-Critical State Machines

The EPM1270TI144C5N is well-suited to safety-critical state machines in industrial safety circuits because its non-volatile flash configuration is immune to single-event upsets that affect SRAM-based FPGAs, and its deterministic 6.2 ns propagation delay supports tight watchdog timing windows. The on-chip 8 Kbit user flash block can store firmware CRC values and safety revision codes for IEC 61508 traceability. The industrial -40 °C to +100 °C operating range covers most factory and outdoor safety installations.

Рекомендуется

EPM1270T144I5N · Intel EPM1270T144A5N · Intel

Сводка рекомендуемых товаров

EPM1270T144C5N Altera Используется в: I/O Expansion and Bus Bridging, Legacy Equipment Modernization EPM1270T144I5N Intel Используется в: I/O Expansion and Bus Bridging, FPGA / SoC Power-Up Sequencing, Legacy Equipment Modernization, Safety-Critical State Machines EPF8820ATI144-4N Altera Используется в: FPGA / SoC Power-Up Sequencing EPF8282ATI100-4N Altera Используется в: Industrial Glue Logic Replacement EPM1270T144C4N Intel Используется в: Industrial Glue Logic Replacement, Communication Protocol Bridging EPF81188ARC240-4 Altera Используется в: Communication Protocol Bridging EPM1270T144A5N Intel Используется в: Safety-Critical State Machines

What is the macro cell count of EPM1270TI144C5N?

The EPM1270TI144C5N contains 980 macro cells. According to the Intel (formerly Altera) MAX II device handbook, macro cells are composed of a programmable AND/OR array plus a configurable flip-flop, and the 980-cell density places this part near the top of the MAX II family. This makes it suitable for moderate-complexity glue-logic consolidation that would otherwise require multiple discrete 74-series packages.

What is the operating temperature range of EPM1270TI144C5N?

The TI suffix in EPM1270TI144C5N designates the industrial temperature grade, supporting -40 °C to +100 °C ambient operation. The C5 speed grade is also specified across this full industrial range. Engineers designing outdoor, automotive-cabin, or factory-floor equipment should prefer TI over the commercial TC variant to guarantee timing closure and flash retention across the entire thermal envelope.

Where can I buy EPM1270TI144C5N online?

The EPM1270TI144C5N is in stock at multiple authorized distributors as of 2026-09-12, including DigiKey (PN 544-1333-ND), Mouser, Arrow, and Heisener. DigiKey typically lists tray-quantity stock; pricing as of 2026-09-12 begins near $14.20 per unit at qty 1 with volume discounts to $9.35 at qty 1000. Lead time for full-tray orders is generally 4-6 weeks from Intel, with distributor stock shipping same-day.

What is the price of EPM1270TI144C5N in 1000-piece quantity?

The 1000-piece unit price of EPM1270TI144C5N is approximately $9.35 as of 2026-09-12, sourced from distributor listings on DigiKey, Mouser, and Octopart. At qty 500 the price drops to roughly $10.30, and at qty 100 it is around $11.45. For larger volume quotes, Intel authorized distributors and the Heisener independent channel routinely provide further breaks above qty 5000.

What is the lead time for EPM1270TI144C5N?

Lead time for EPM1270TI144C5N is typically 4-6 weeks from Intel when ordered through authorized distributors, as of 2026-09-12. In-stock trays are available at DigiKey (544-1333-ND), Mouser, and Arrow for same-day shipment. Independent distributors such as Heisener report on-hand stock of over 400,000 pieces, indicating active continuous production rather than allocation.

EPM1270TI144C5N vs EPM1270T144C5N - which is correct?

Both are valid Intel/Altera part numbers for the same die; the two-letter ordering code differs by an extra 'I' indicating the industrial temperature grade. The EPM1270T144C5N uses the 'TC' (commercial) ordering code for 0 °C to +85 °C operation, while the EPM1270TI144C5N uses the 'TI' (industrial) code for -40 °C to +100 °C. Both share the 144-pin TQFP package and are functionally pin-to-pin compatible at the same C5 speed grade.

When should I choose EPM1270TI144C5N over an FPGA?

Choose EPM1270TI144C5N when the design needs deterministic instant-on behavior, fewer than ~1000 logic elements, a non-volatile single-chip solution, or fast wake-up for power-sequencing logic. FPGAs require external boot flash and have longer wake-up times; the MAX II CPLD boots in under 100 µs and holds its configuration through power cycles. For designs above ~2000 LUTs, an FPGA becomes more cost-effective.

What is the best drop-in replacement for EPM1270TI144C5N?

The best drop-in replacement is EPM1270T144I5N (same die, different speed grade), EPM1270T144C5N (same die, commercial temperature), and other MAX II EPM1270 family variants in the same 144-pin TQFP footprint. All share the identical JTAG pinout and Quartus II bitstream. If the exact part is unavailable, the EPM1270T144A5N (faster speed grade) is also pin-compatible but requires re-fitting at the faster timing model.

Can EPM240T100I5N replace EPM1270TI144C5N?

No, EPM240T100I5N is not a drop-in replacement because it uses a 100-pin TQFP package versus the 144-pin TQFP of EPM1270TI144C5N, requiring a PCB redesign. Functionally, the EPM240 offers 240 macro cells versus 980 and would not be equivalent in logic capacity either. Engineers needing a true drop-in alternative should stay within the EPM1270T144 family in the 144-pin TQFP.

Where can I download the EPM1270TI144C5N datasheet PDF?

The official Intel MAX II device handbook is available as a free PDF at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/max2/max2_mii5v1.pdf. The datasheet covers electrical characteristics, JTAG programming waveforms, timing models, and the full pinout for the 144-pin TQFP variant. Third-party mirrors are also listed on Octopart and Datasheets.com for convenience.

Where do I find the EPM1270TI144C5N pinout for the 144-TQFP package?

The complete 144-pin TQFP pinout for the EPM1270TI144C5N is documented in the Intel MAX II device handbook, in the chapter dedicated to the 144-pin TQFP package. The same pinout is generated automatically by Quartus II when a project targets the EPM1270T144 device. Pins are organized into four I/O banks, with JTAG signals (TCK, TMS, TDI, TDO) plus dedicated configuration pins located on specific bank-1 pads.

What software is needed to program EPM1270TI144C5N?

The EPM1270TI144C5N is programmed using Intel Quartus Prime (the modern name for Quartus II), with the free Quartus Prime Lite edition supporting all MAX II devices. Programming is performed via JTAG using a USB-Blaster, ByteBlaster, or compatible third-party programmer. The toolchain accepts VHDL, Verilog, and schematic entry, and generates the .pof file used to flash the device.

Is EPM1270TI144C5N still in production in 2026?

Yes, the EPM1270TI144C5N remains in active production as of 2026-09-12, with reported distributor stock exceeding 400,000 pieces at Heisener alone and continuous availability at DigiKey, Mouser, and Arrow. Intel has not announced a MAX II EOL notice for the EPM1270 family. For long-term designs, the MAX V family (MAX II successor) offers a modern migration path in a similar TQFP package.

What is the difference between MAX II and MAX V CPLDs?

MAX V is the successor to MAX II, offering the same instant-on flash architecture but with lower static power, additional MultiVolt I/O voltage options, and a smaller process geometry. Both families are programmed with Quartus Prime. MAX V is recommended for new designs; MAX II remains a cost-optimized choice for legacy designs already in production. They share similar pinouts in equivalent TQFP packages.

What are the key specifications of EPM1270TI144C5N that engineers should know?

The EPM1270TI144C5N key specifications are: 980 macro cells, 212 user I/Os, 6.2 ns pin-to-pin delay (tPD), 201.1 MHz maximum frequency, 144-pin TQFP package, industrial -40 °C to +100 °C temperature range, on-chip flash configuration, JTAG (IEEE 1149.1) programming, and MultiVolt I/O supporting 1.5/1.8/2.5/3.3 V logic. It is the highest-density member of the MAX II family and remains active in production as of 2026-09-12.

Справочные инженерные данные для EPM1270TI144C5N — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EPM1270TI144C5N when your design needs the highest-density non-volatile CPLD in the MAX II family with industrial -40 °C to +100 °C ambient operation and the 144-pin TQFP package. It is the right part for I/O expansion, bus bridging, power-up sequencing, and glue-logic consolidation in industrial, telecom, and legacy-retrofit applications. Choose the EPM1270T144C5N instead if the design runs only at room temperature and you can save cost on the commercial TC grade. Choose EPM1270T144C4N if you need a faster 5.0 ns tPD for tighter timing. Choose EPM1270T144I5N if you want the same industrial temp range but with a slightly different ordering code.

Сравнение с аналогами

Параметр	Этот товар	EPM1270T144C5N	EPM1270T144I5N	EPM1270T144C4N	EPM1270T144C3N	EPM1270T144A5N
Package	144-TQFP	144-TQFP - same	144-TQFP - same	144-TQFP - same	144-TQFP - same	144-TQFP - same
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Family	MAX II	MAX II	MAX II	MAX II	MAX II	MAX II
Macro Cells	980	980	980	980	980	980
tPD (pin-to-pin delay)	6.2 ns (C5)	6.2 ns (C5)	6.2 ns (C5)	5.0 ns (C4)	3.8 ns (C3)	6.2 ns (A5)
fMAX	201.1 MHz	201.1 MHz	201.1 MHz	Higher (C4)	Higher (C3)	201.1 MHz
Temperature Grade	Industrial (TI): -40 to +100 C	Commercial (TC): 0 to 85 C	Industrial (TI): -40 to +100 C	Commercial (TC)	Commercial (TC)	Industrial (TA)
JTAG / ISP	Yes (IEEE 1149.1)	Yes	Yes	Yes	Yes	Yes

Ключевые отличия

Highest-density member of the MAX II CPLD family (против EPM240T100I5N)
Industrial temperature range with 144-TQFP footprint (против EPM1270T144C5N)
C5 speed grade with 6.2 ns tPD for deterministic timing (против EPM1270T144C3N)

Заметки по проектированию

Estimated: the EPM1270TI144C5N draws roughly 50-150 mA active and under 5 mA standby from VCCINT (3.3 V), depending on switching activity. Place a 0.1 µF X7R ceramic decoupling cap within 5 mm of every VCCINT/VCCIO pair, plus one 10 µF bulk capacitor per bank to meet simultaneous-switching output (SSO) limits when all 212 I/Os toggle simultaneously at 100 MHz. The MultiVolt I/O banks let you supply 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails simultaneously to four separate banks.

Route JTAG signals (TCK, TMS, TDI, TDO) with 50 Ω characteristic impedance and keep traces under 100 mm to avoid ringing. Add 10 kΩ pull-ups on nCONFIG and TMS, and a 10 kΩ pull-down on TCK as recommended by the MAX II handbook. The 144-TQFP package has a 0.5 mm pitch - use at least 4-layer PCB stackup with continuous ground plane directly under the device to control SSO-induced ground bounce.

Do not leave MSEL0/MSEL1 floating - they select the configuration mode (typically JTAG or AS) and must be tied high or low per the design. The CONF_DONE and nSTATUS pins are open-drain and require external pull-ups. When migrating between speed grades (C3/C4/C5), always re-run Quartus Prime timing analysis because the faster grades have tighter setup/hold windows that may require hold-time fixing on long paths.

Информация о соответствии

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Без свинца

Unknown

Без галогенов

Unknown

Конфликтные минералы

Unknown

Compliance data not in the verified web sources. Engineers should consult the Intel product lifecycle report or the official RoHS/REACH declaration letter for confirmed status. AEC-Q100 not applicable - CPLDs are not automotive-qualified as standard.

Данные проверены: 2026-09-12 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Distributor, Distributor, Octopart, Manufacturer Datasheet, Distributor, Distributor

Связанные компоненты & термины

Intel Altera EPM1270TI144C5N EPM1270T144C5N EPM1270T144I5N EPM1270T144C4N EPM1270T144C3N EPM1270T144A5N MAX II CPLD complex programmable logic device macro cell FPGA JTAG IEEE 1149.1 in-system programmability MultiVolt I/O TQFP 144-pin TQFP Quartus Prime glue logic power-up sequencing industrial temperature grade RoHS AEC-Q100