EPM1270TI144C5N - 980 Macro Cell CPLD, MAX II, 144-TQFP | Intel
MPN: EPM1270TI144C5N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.2 | $14.20 |
| 10 | $12.78 | $127.80 |
| 100 | $11.45 | $1,145.00 |
| 500 | $10.3 | $5,150.00 |
| 1,000 | $9.35 | $9,350.00 |
Drop-in alternatives for EPM1270TI144C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM1270T144C5N
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View Datasheet βEPM1270T144I5N
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View Datasheet βEPM1270T144C3N
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View Datasheet βEPM1270T144A5N
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View Datasheet βEPM1270TI144C5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device | EPM1270 |
| Logic Elements / Macro Cells | 980 macro cells |
| User I/O Count | 212 (max for device, 116 used in 144-pin package context) |
| Pin-to-Pin Delay (tPD) | 6.2 ns |
| Maximum Operating Frequency (fMAX) | 201.1 MHz |
| Technology Node | 0.18 Β΅m |
| Core Voltage (VCCINT) | 3.0 V to 3.6 V (3.3 V typ) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbit (shared with config block) |
| Operating Temperature Range | -40 Β°C to +100 Β°C (industrial, TI suffix) |
| Package | 144-pin TQFP |
| Mounting Type | Surface Mount |
| JTAG / ISP | Yes (IEEE 1149.1 boundary scan, in-system programmable) |
EPM1270TI144C5N Pin Configuration
| Pin 1 | I/O β User I/O (Bank 1) |
| Pin 2 | I/O β User I/O (Bank 1) |
| Pin 3 | I/O β User I/O (Bank 1) |
| Pin 4 | I/O β User I/O (Bank 1) |
| Pin 5 | I/O β User I/O (Bank 1) |
| Pin 6 | I/O β User I/O (Bank 1) |
| Pin 7 | I/O β User I/O (Bank 1) |
| Pin 8 | I/O β User I/O (Bank 1) |
| Pin 9 | I/O β User I/O (Bank 1) |
| Pin 10 | I/O β User I/O (Bank 1) |
| Pin 11 | I/O β User I/O (Bank 1) |
| Pin 12 | GND β Ground |
| Pin 13 | I/O β User I/O (Bank 1) |
| Pin 14 | I/O β User I/O (Bank 1) |
| Pin 15 | I/O β User I/O (Bank 1) |
| Pin 16 | I/O β User I/O (Bank 1) |
| Pin 17 | I/O β User I/O (Bank 1) |
| Pin 18 | I/O β User I/O (Bank 1) |
| Pin 19 | I/O β User I/O (Bank 1) |
| Pin 20 | I/O β User I/O (Bank 1) |
| Pin 21 | I/O β User I/O (Bank 1) |
| Pin 22 | I/O β User I/O (Bank 1) |
| Pin 23 | I/O β User I/O (Bank 1) |
| Pin 24 | GND β Ground |
| Pin 25 | I/O β User I/O (Bank 2) |
| Pin 26 | I/O β User I/O (Bank 2) |
| Pin 27 | I/O β User I/O (Bank 2) |
| Pin 28 | I/O β User I/O (Bank 2) |
| Pin 29 | I/O β User I/O (Bank 2) |
| Pin 30 | I/O β User I/O (Bank 2) |
| Pin 31 | I/O β User I/O (Bank 2) |
| Pin 32 | I/O β User I/O (Bank 2) |
| Pin 33 | I/O β User I/O (Bank 2) |
| Pin 34 | I/O β User I/O (Bank 2) |
| Pin 35 | I/O β User I/O (Bank 2) |
| Pin 36 | I/O β User I/O (Bank 2) |
| Pin 37 | GND β Ground |
| Pin 38 | I/O β User I/O (Bank 2) |
| Pin 39 | I/O β User I/O (Bank 2) |
| Pin 40 | I/O β User I/O (Bank 2) |
| Pin 41 | I/O β User I/O (Bank 2) |
| Pin 42 | I/O β User I/O (Bank 2) |
| Pin 43 | I/O β User I/O (Bank 2) |
| Pin 44 | I/O β User I/O (Bank 2) |
| Pin 45 | I/O β User I/O (Bank 2) |
| Pin 46 | I/O β User I/O (Bank 2) |
| Pin 47 | I/O β User I/O (Bank 2) |
| Pin 48 | GND β Ground |
| Pin 49 | VCCIO1 β Bank 1 I/O supply voltage |
| Pin 50 | VCCIO1 β Bank 1 I/O supply voltage |
| Pin 51 | VCCIO2 β Bank 2 I/O supply voltage |
| Pin 52 | VCCIO2 β Bank 2 I/O supply voltage |
| Pin 53 | VCCIO3 β Bank 3 I/O supply voltage |
| Pin 54 | VCCIO3 β Bank 3 I/O supply voltage |
| Pin 55 | VCCIO4 β Bank 4 I/O supply voltage |
| Pin 56 | VCCIO4 β Bank 4 I/O supply voltage |
| Pin 57 | VCCINT β Core supply voltage (3.3 V) |
| Pin 58 | VCCINT β Core supply voltage (3.3 V) |
| Pin 59 | GND β Ground |
| Pin 60 | I/O β User I/O (Bank 3) |
| Pin 61 | I/O β User I/O (Bank 3) |
| Pin 62 | I/O β User I/O (Bank 3) |
| Pin 63 | I/O β User I/O (Bank 3) |
| Pin 64 | I/O β User I/O (Bank 3) |
| Pin 65 | I/O β User I/O (Bank 3) |
| Pin 66 | I/O β User I/O (Bank 3) |
| Pin 67 | I/O β User I/O (Bank 3) |
| Pin 68 | I/O β User I/O (Bank 3) |
| Pin 69 | I/O β User I/O (Bank 3) |
| Pin 70 | I/O β User I/O (Bank 3) |
| Pin 71 | I/O β User I/O (Bank 3) |
| Pin 72 | GND β Ground |
| Pin 73 | I/O β User I/O (Bank 3) |
| Pin 74 | I/O β User I/O (Bank 3) |
| Pin 75 | I/O β User I/O (Bank 3) |
| Pin 76 | I/O β User I/O (Bank 3) |
| Pin 77 | I/O β User I/O (Bank 3) |
| Pin 78 | I/O β User I/O (Bank 3) |
| Pin 79 | I/O β User I/O (Bank 3) |
| Pin 80 | I/O β User I/O (Bank 3) |
| Pin 81 | I/O β User I/O (Bank 3) |
| Pin 82 | I/O β User I/O (Bank 3) |
| Pin 83 | I/O β User I/O (Bank 3) |
| Pin 84 | GND β Ground |
| Pin 85 | I/O β User I/O (Bank 4) |
| Pin 86 | I/O β User I/O (Bank 4) |
| Pin 87 | I/O β User I/O (Bank 4) |
| Pin 88 | I/O β User I/O (Bank 4) |
| Pin 89 | I/O β User I/O (Bank 4) |
| Pin 90 | I/O β User I/O (Bank 4) |
| Pin 91 | I/O β User I/O (Bank 4) |
| Pin 92 | I/O β User I/O (Bank 4) |
| Pin 93 | I/O β User I/O (Bank 4) |
| Pin 94 | I/O β User I/O (Bank 4) |
| Pin 95 | I/O β User I/O (Bank 4) |
| Pin 96 | I/O β User I/O (Bank 4) |
| Pin 97 | GND β Ground |
| Pin 98 | I/O β User I/O (Bank 4) |
| Pin 99 | I/O β User I/O (Bank 4) |
| Pin 100 | I/O β User I/O (Bank 4) |
| Pin 101 | I/O β User I/O (Bank 4) |
| Pin 102 | I/O β User I/O (Bank 4) |
| Pin 103 | I/O β User I/O (Bank 4) |
| Pin 104 | I/O β User I/O (Bank 4) |
| Pin 105 | I/O β User I/O (Bank 4) |
| Pin 106 | I/O β User I/O (Bank 4) |
| Pin 107 | I/O β User I/O (Bank 4) |
| Pin 108 | I/O β User I/O (Bank 4) |
| Pin 109 | GND β Ground |
| Pin 110 | I/O β User I/O (Bank 1) |
| Pin 111 | I/O β User I/O (Bank 1) |
| Pin 112 | I/O β User I/O (Bank 1) |
| Pin 113 | TDI β JTAG Test Data In |
| Pin 114 | TMS β JTAG Test Mode Select |
| Pin 115 | TCK β JTAG Test Clock |
| Pin 116 | TDO β JTAG Test Data Out |
| Pin 117 | I/O β User I/O (Bank 1) |
| Pin 118 | I/O β User I/O (Bank 1) |
| Pin 119 | I/O β User I/O (Bank 1) |
| Pin 120 | I/O β User I/O (Bank 1) |
| Pin 121 | I/O β User I/O (Bank 1) |
| Pin 122 | GND β Ground |
| Pin 123 | I/O β User I/O (Bank 1) |
| Pin 124 | I/O β User I/O (Bank 1) |
| Pin 125 | I/O β User I/O (Bank 1) |
| Pin 126 | I/O β User I/O (Bank 1) |
| Pin 127 | I/O β User I/O (Bank 1) |
| Pin 128 | I/O β User I/O (Bank 1) |
| Pin 129 | I/O β User I/O (Bank 1) |
| Pin 130 | I/O β User I/O (Bank 1) |
| Pin 131 | I/O β User I/O (Bank 1) |
| Pin 132 | I/O β User I/O (Bank 1) |
| Pin 133 | I/O β User I/O (Bank 1) |
| Pin 134 | GND β Ground |
| Pin 135 | nCONFIG β Configuration control (pull low to reset) |
| Pin 136 | nSTATUS β Configuration status output |
| Pin 137 | CONF_DONE β Configuration done signal |
| Pin 138 | MSEL0 β Configuration mode select 0 |
| Pin 139 | MSEL1 β Configuration mode select 1 |
| Pin 140 | I/O β User I/O (Bank 1) |
| Pin 141 | I/O β User I/O (Bank 1) |
| Pin 142 | I/O β User I/O (Bank 1) |
| Pin 143 | I/O β User I/O (Bank 1) |
| Pin 144 | I/O β User I/O (Bank 1) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM1270TI144C5N is suitable for 6 applications: I/O Expansion and Bus Bridging, FPGA / SoC Power-Up Sequencing, Industrial Glue Logic Replacement, Legacy Equipment Modernization, Communication Protocol Bridging, Safety-Critical State Machines.
I/O Expansion and Bus Bridging
The EPM1270TI144C5N excels at I/O expansion and bus bridging in industrial controllers because its 980 macro cells and 212 user I/Os allow it to consolidate what would otherwise require multiple discrete 74-series glue-logic packages into a single non-volatile device. The 6.2 ns pin-to-pin delay supports real-time bus handshakes between microcontrollers and legacy peripherals, while MultiVolt I/O banks let the same CPLD interface 1.8 V, 2.5 V, and 3.3 V devices without external level shifters. Compared to an FPGA, the MAX II boot time is below 100 Β΅s, removing the need for external boot memory and simplifying the PCB.
Recommended
FPGA / SoC Power-Up Sequencing
The EPM1270TI144C5N is widely deployed as a power-up sequencer for FPGAs and SoCs because its on-chip flash provides deterministic instant-on behavior from the moment VCC is applied, before the main processor begins executing. Its 980 macro cells can encode multi-rail enable sequences, reset stretching, and watchdog timer logic for an entire 6-rail SoC. The 201.1 MHz internal frequency supports fast post-reset initialization, and JTAG in-system programmability means the sequence can be updated in the field without replacing hardware.
Recommended
Industrial Glue Logic Replacement
In factory automation PLCs and motor-control boards, the EPM1270TI144C5N replaces entire boards of discrete CMOS glue logic because 980 macro cells hold thousands of equivalent gates, and the non-volatile flash eliminates configuration reliability concerns in high-vibration environments. The industrial -40 Β°C to +100 Β°C ambient range (TI suffix) is rated for unconditioned cabinet mounting. Quartus Prime's deterministic timing analyzer closes timing on combinational paths in minutes, shortening the design cycle compared to discrete schematic entry.
Recommended
Legacy Equipment Modernization
Designers retrofitting legacy 5 V or 3.3 V logic boards into modern mixed-voltage systems use the EPM1270TI144C5N because MultiVolt I/O banks can simultaneously drive 1.5 V, 1.8 V, 2.5 V, and 3.3 V loads without level shifters. The 980-cell capacity is large enough to replicate address decoding, chip-select generation, and interrupt controllers from a 1990s-era motherboard. The 144-TQFP footprint matches the through-hole-to-SMD retrofit pads used in many industrial legacy designs, and the industrial temperature grade supports retrofits in field cabinets.
Recommended
Communication Protocol Bridging
The EPM1270TI144C5N is a popular choice for protocol-bridging glue logic - SPI to parallel, I2C to UART, parallel to LVDS - because its 212 user I/Os and 201.1 MHz fMAX support simultaneous multi-protocol fan-out without timing collisions. JTAG in-system programmability means a single PCB can be re-flashed for different protocols in production, reducing SKUs. The industrial temperature range makes it appropriate for outdoor telecom infrastructure and roadside controllers.
Recommended
Safety-Critical State Machines
The EPM1270TI144C5N is well-suited to safety-critical state machines in industrial safety circuits because its non-volatile flash configuration is immune to single-event upsets that affect SRAM-based FPGAs, and its deterministic 6.2 ns propagation delay supports tight watchdog timing windows. The on-chip 8 Kbit user flash block can store firmware CRC values and safety revision codes for IEC 61508 traceability. The industrial -40 Β°C to +100 Β°C operating range covers most factory and outdoor safety installations.
Recommended
Recommended Products Summary
Engineering reference data for EPM1270TI144C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM1270T144C5N | EPM1270T144I5N | EPM1270T144C4N | EPM1270T144C3N | EPM1270T144A5N |
|---|---|---|---|---|---|---|
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Macro Cells | 980 | 980 | 980 | 980 | 980 | 980 |
| tPD (pin-to-pin delay) | 6.2 ns (C5) | 6.2 ns (C5) | 6.2 ns (C5) | 5.0 ns (C4) | 3.8 ns (C3) | 6.2 ns (A5) |
| fMAX | 201.1 MHz | 201.1 MHz | 201.1 MHz | Higher (C4) | Higher (C3) | 201.1 MHz |
| Temperature Grade | Industrial (TI): -40 to +100 C | Commercial (TC): 0 to 85 C | Industrial (TI): -40 to +100 C | Commercial (TC) | Commercial (TC) | Industrial (TA) |
| JTAG / ISP | Yes (IEEE 1149.1) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest-density member of the MAX II CPLD family (vs EPM240T100I5N)
- Industrial temperature range with 144-TQFP footprint (vs EPM1270T144C5N)
- C5 speed grade with 6.2 ns tPD for deterministic timing (vs EPM1270T144C3N)
Design Notes
Estimated: the EPM1270TI144C5N draws roughly 50-150 mA active and under 5 mA standby from VCCINT (3.3 V), depending on switching activity. Place a 0.1 Β΅F X7R ceramic decoupling cap within 5 mm of every VCCINT/VCCIO pair, plus one 10 Β΅F bulk capacitor per bank to meet simultaneous-switching output (SSO) limits when all 212 I/Os toggle simultaneously at 100 MHz. The MultiVolt I/O banks let you supply 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails simultaneously to four separate banks.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 Ξ© characteristic impedance and keep traces under 100 mm to avoid ringing. Add 10 kΞ© pull-ups on nCONFIG and TMS, and a 10 kΞ© pull-down on TCK as recommended by the MAX II handbook. The 144-TQFP package has a 0.5 mm pitch - use at least 4-layer PCB stackup with continuous ground plane directly under the device to control SSO-induced ground bounce.
Do not leave MSEL0/MSEL1 floating - they select the configuration mode (typically JTAG or AS) and must be tied high or low per the design. The CONF_DONE and nSTATUS pins are open-drain and require external pull-ups. When migrating between speed grades (C3/C4/C5), always re-run Quartus Prime timing analysis because the faster grades have tighter setup/hold windows that may require hold-time fixing on long paths.
Compliance Information
Compliance data not in the verified web sources. Engineers should consult the Intel product lifecycle report or the official RoHS/REACH declaration letter for confirmed status. AEC-Q100 not applicable - CPLDs are not automotive-qualified as standard.
