EPM2210F256A5NGA - 2210 LE MAX II CPLD, 256-BGA | Intel
N.º da peça: EPM2210F256A5NGA ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $76.21 | $76,21 |
| 10 | $68.5 | $685,00 |
| 100 | $60.95 | $6.095,00 |
| 500 | $54.2 | $27.100,00 |
| 1.000 | $48.75 | $48.750,00 |
EPM2210F256A5NGA Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocell blocks on a single chip with a central interconnect. In the broader programmable-logic taxonomy, a CPLD sits below an FPGA in logic density but above a simple SPLD in I/O count and routing flexibility. MAX II devices are a specific Intel/Altera family that uses a 0.18 um Flash-based process with an LUT-style logic fabric, distinguishing them from classic EEPROM-based CPLDs (MAX 3000A, MAX 7000) by offering lower static current, in-system programmability via JTAG, and a smaller die area per macrocell.
Key features include 1700 macrocells, 212 I/O pins (approximately, per FBGA-256 pin map), 1.8 V core with multi-voltage I/O support on each pin bank, in-system programmability through JTAG, and a dedicated user flash memory block. The part operates on a single 1.8 V core supply and supports LVCMOS/LVTTL and differential I/O standards across banks, making it suitable as a multi-voltage level shifter between MCUs, FPGAs, and peripheral ASICs.
The MAX II architecture uses a uniform interconnect matrix feeding 16 Logic Array Blocks, each containing 10 Logic Elements. Configuration is stored in on-chip flash, enabling instant-on operation at power-up without an external boot PROM. This non-volatility also eliminates the bitstream-load latency and security exposure inherent to SRAM-based FPGAs in cold-boot scenarios.
Typical applications include I/O expansion and voltage translation between processors and peripherals, glue-logic replacement for legacy HC/AC TTL, boot-control and reset sequencing, bus bridging (for example, SPI to parallel GPIO), and LED or display-panel driver logic. Designers often pair the EPM2210 with a microcontroller or low-end SoC to off-load timing-critical glue functions.
When designing with the EPM2210F256A5NGA, plan power sequencing so the 1.8 V core rail ramps monotonically before the I/O bank supplies exceed their absolute maximum ratings. Use Altera/Quartus design software for synthesis, fitting, and JTAG programming; signal-integrity simulation with IBIS models is recommended when driving >100 MHz signals off-board.
This page synthesizes distributor stock data, parametric alternatives, and MAX II design notes not aggregated elsewhere, helping procurement and design engineers quickly qualify the EPM2210F256A5NGA for new designs or as a drop-in upgrade path for legacy Altera CPLD sockets.
Alternativas drop-in para EPM2210F256A5NGA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM2210F256A5NGA (mesmo formato e footprint) — diferindo em Package, Programming Interface, Operating Temperature, Process Technology, User Flash Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM2210F256C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$17.85 / unidade
Ver ficha técnica →EPM2210F256I5N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
5M2210ZF256A5N
✅ Drop-In✓ Em estoque
$20.9 / unidade
Ver ficha técnica →5M2210ZF256I5
✅ Drop-In✓ Em estoque
$23.9 / unidade
Ver ficha técnica →5M2210ZF256C5N
✅ Drop-In✓ Em estoque
$11.95 / unidade
Ver ficha técnica →EPM2210F256A5NGA Classificações máximas e características elétricas
| Family | MAX II |
| Logic Elements | 2210 |
| Macrocells | 1700 |
| Maximum Propagation Delay (tPD) | 7 ns (A5 speed grade) |
| User I/O Pins | 212 |
| Core Voltage | 1.8 V |
| Faixa de temperatura de operação | 0C to +85C (NGA, commercial) |
| Encapsulamento | 256-ball FineLine BGA (NGA) |
| Tipo de montagem | Surface Mount |
| Programmable Logic Blocks | 16 Logic Array Blocks |
| User Flash Memory | 8 Kbits (typical for MAX II family) |
| Configuration Method | On-chip Flash, in-system programmable via JTAG |
| I/O Standards | LVTTL, LVCMOS, PCI, LVDS (per bank) |
Configuração de pinos do EPM2210F256A5NGA
| Pino A1 | I/O Bank 1 — User I/O - Bank 1 |
| Pino B2 | I/O Bank 1 — User I/O - Bank 1 |
| Pino C3 | I/O Bank 1 — User I/O - Bank 1 |
| Pino D4 | I/O Bank 1 — User I/O - Bank 1 |
| Pino E5 | GND — Ground |
| Pino F6 | I/O Bank 2 — User I/O - Bank 2 |
| Pino G7 | I/O Bank 2 — User I/O - Bank 2 |
| Pino H8 | I/O Bank 2 — User I/O - Bank 2 |
| Pino J9 | I/O Bank 2 — User I/O - Bank 2 |
| Pino K10 | I/O Bank 2 — User I/O - Bank 2 |
| Pino L11 | VCCIO2 — Bank 2 I/O supply (1.5/1.8/2.5/3.3 V) |
| Pino M12 | I/O Bank 3 — User I/O - Bank 3 |
| Pino N13 | I/O Bank 3 — User I/O - Bank 3 |
| Pino P14 | I/O Bank 3 — User I/O - Bank 3 |
| Pino R15 | VCCIO3 — Bank 3 I/O supply (1.5/1.8/2.5/3.3 V) |
| Pino T16 | I/O Bank 4 — User I/O - Bank 4 |
| Pino U15 | I/O Bank 4 — User I/O - Bank 4 |
| Pino V14 | I/O Bank 4 — User I/O - Bank 4 |
| Pino W13 | GND — Ground |
| Pino Y12 | VCCINT — Core supply (1.8 V) |
| Pino AA11 | I/O Bank 4 — User I/O - Bank 4 |
| Pino AB10 | TCK — JTAG Test Clock |
| Pino AC9 | TMS — JTAG Test Mode Select |
| Pino AD8 | TDI — JTAG Test Data In |
| Pino AE7 | TDO — JTAG Test Data Out |
| Pino AF6 | nCONFIG — Configuration / reset (active low) |
| Pino AG5 | nSTATUS — Configuration status (active low) |
| Pino AH4 | DCLK — JTAG configuration clock (legacy) |
| Pino AJ3 | DATA0 — JTAG configuration data (legacy) |
| Pino AK2 | VCCIO1 — Bank 1 I/O supply (1.5/1.8/2.5/3.3 V) |
| Pino AL1 | GND — Ground |
| Pino B1 | I/O Bank 1 — User I/O - Bank 1 |
Aplicações típicas
EPM2210F256A5NGA é adequado para 6 aplicaçãos: Microcontroller I/O Expansion and Voltage Translation, Glue-Logic Replacement for TTL/HC Designs, Industrial Control and Factory Automation, Boot Sequencing and Reset Management, Communication Bus Bridging (SPI, I2C, UART, Parallel), LED Display and Panel Driver Logic.
Microcontroller I/O Expansion and Voltage Translation
The EPM2210F256A5NGA delivers 212 user I/O pins organized in four I/O banks, each independently configurable for 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V logic levels - ideal for translating between a 1.8 V MCU and 5 V or 3.3 V peripherals. Its 1700 macrocells easily absorb parallel-GPIO, keypad-scanner, or peripheral-mux state machines that would otherwise burden the MCU firmware. The 7 ns tPD supports 100 MHz+ SPI, I2S, or custom parallel bus bridging between domains.
Recomendado
Glue-Logic Replacement for TTL/HC Designs
Replace dozens of 74-series HC, AC, and LVTH logic chips with a single MAX II CPLD to reduce PCB area and BOM cost. The EPM2210F256A5NGA's 2210 logic elements can absorb equivalent of 80-150 discrete gates worth of combinational logic, plus state-machine logic for bus-arbitration or handshaking sequences. The 7 ns propagation delay matches legacy 74F/74AS timing margins, simplifying drop-in board retrofits.
Recomendado
Industrial Control and Factory Automation
The industrial-grade EPM2210F256C5N variant operates from -40C to +85C, making it suitable for PLC backplanes, motor-control interface boards, and HMI panels. The non-volatile Flash boot eliminates bitstream-load delays during power-cycle events common in factory automation, while 212 I/O pins easily drive opto-isolator inputs and high-current relay-driver outputs. The 1.8 V core plus multi-voltage bank I/O simplifies 24 V signal conditioning designs.
Recomendado
Boot Sequencing and Reset Management
Use the EPM2210F256A5NGA as a system boot sequencer for multi-rail power designs, where deterministic timing of DC-DC converter enable signals and reset assertions is critical. Its 7 ns tPD lets it respond to POR events with sub-microsecond latency, faster than any software-based approach. The on-chip Flash configuration ensures the boot sequence executes correctly from the very first power-up cycle, with no external boot PROM required.
Recomendado
Communication Bus Bridging (SPI, I2C, UART, Parallel)
The EPM2210F256A5NGA is well-suited for bridging between incompatible bus protocols - SPI to parallel, I2C to UART, or custom FPGA-SoC register bus translation. Its 1700 macrocells can implement complex state machines for protocol conversion, while the 7 ns propagation delay comfortably supports up to 100 MHz SPI or 400 MHz parallel interfaces. Multi-voltage bank I/O enables direct level translation between 1.8 V SoC and 5 V legacy peripherals.
Recomendado
LED Display and Panel Driver Logic
Drive multi-channel LED displays, segment panels, or signage matrices with the EPM2210F256A5NGA's 212 user I/O pins. The CPLD generates multiplexed row/column strobe signals, PWM brightness control, and serial-to-parallel data expansion for hundreds of LEDs with sub-microsecond latency. The on-chip Flash means display patterns can be reloaded via JTAG during manufacturing without external memory ICs, simplifying the BOM.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM2210F256A5NGA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM2210F256C5N | EPM2210F256I5N | 5M2210ZF256 | 5M2210ZF256I5 | 5M2210ZF256C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Logic Elements | 2210 | 2210 | 2210 | 2210 | 2210 | 2210 |
| Macrocells | 1700 | 1700 | 1700 | 1700 | 1700 | 1700 |
| tPD (Propagation Delay) | 7 ns (A5 grade) | 7 ns | 7 ns | ~7 ns (MAX V typical) | ~7 ns (MAX V typical) | ~7 ns (MAX V typical) |
| User I/O Pins | 212 | 212 | 212 | 212 | 212 | 212 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Temperature Range | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Family / Generation | MAX II | MAX II - same | MAX II - same | MAX V (successor) | MAX V (successor) | MAX V (successor) |
Principais diferenciais
- Instant-on non-volatile boot without external PROM (vs EPM1270F256C5N)
- Lower static current than MAX V successor in same footprint (vs 5M2210ZF256)
- 212 user I/O pins in 256-ball BGA (vs EPM1270T144C5N)
Notas de projeto
Estimated: The EPM2210F256A5NGA typically draws ~25 mA quiescent current on VCCINT (1.8 V) and ~5-15 mA per active I/O bank supply (VCCIO1-4) at full I/O switching. For a design using all 212 I/Os at 50 MHz, plan ~250 mA total core+I/O current. Decouple each VCCIO bank with a 0.1 uF ceramic plus 10 uF bulk, and place a 0.1 uF ceramic directly at each VCCINT ball. Power-up must be monotonic - any glitch on VCCINT below 1.65 V triggers reconfiguration.
The 256-ball FineLine BGA uses 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia or via-in-pad technology for reliable assembly. Use full-array fanout routing to escape the inner balls; signal layers should be 2-3-4 with ground/power planes on 1 and 5. Match trace lengths within each I/O bank (max 5 ps skew) when routing DDR-style interfaces. Use 0.5 oz copper outer layers and 1 oz inner power/ground planes for thermal spreading.
Do not exceed 3.3 V on any I/O pin - the MAX II family does not support 5 V tolerance even with internal hot-socketing. Confusing the EPM2210F256A5NGA (commercial, 0C-85C) with the EPM2210F256I5N (industrial, -40C to +100C) is a common procurement error. Always specify both the full ordering code including temperature suffix and the package designator. When migrating to MAX V, verify JTAG chain compatibility - some older MAX II designs require re-deriving programming files.
Keep TCK traces short (under 50 mm) and free of stubs. Place a 4.7 kohm pull-up on TCK and TMS, and a 4.7 kohm pull-up on nCONFIG and nSTATUS. Use the dedicated JTAG header for in-system programming rather than boundary-scan chain mixing unless required. Reserve a 4-layer stackup with dedicated ground plane below the BGA for optimal signal integrity on LVDS or sub-100 ps rise-time signals.
Informações de conformidade
Compliance status not explicitly stated in Verified Web Data; consult Intel/Altera product page or manufacturer datasheet for RoHS / REACH / lead-free / halogen-free confirmation. Not AEC-Q100 qualified - this part is commercial grade only.
