EPM2210F256A5NGA - 2210 LE MAX II CPLD, 256-BGA | Intel
MPN: EPM2210F256A5NGA ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $76.21 | $76.21 |
| 10 | $68.5 | $685.00 |
| 100 | $60.95 | $6,095.00 |
| 500 | $54.2 | $27,100.00 |
| 1,000 | $48.75 | $48,750.00 |
Drop-in alternatives for EPM2210F256A5NGA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM2210F256C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$17.85 / Unit
View Datasheet →EPM2210F256I5N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
5M2210ZF256A5N
✅ Drop-In✓ In Stock
$20.9 / Unit
View Datasheet →5M2210ZF256I5
✅ Drop-In✓ In Stock
$23.9 / Unit
View Datasheet →5M2210ZF256C5N
✅ Drop-In✓ In Stock
$5.49 / Unit
View Datasheet →EPM2210F256A5NGA Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements | 2210 |
| Macrocells | 1700 |
| Maximum Propagation Delay (tPD) | 7 ns (A5 speed grade) |
| User I/O Pins | 212 |
| Core Voltage | 1.8 V |
| Operating Temperature Range | 0C to +85C (NGA, commercial) |
| Package | 256-ball FineLine BGA (NGA) |
| Mounting Type | Surface Mount |
| Programmable Logic Blocks | 16 Logic Array Blocks |
| User Flash Memory | 8 Kbits (typical for MAX II family) |
| Configuration Method | On-chip Flash, in-system programmable via JTAG |
| I/O Standards | LVTTL, LVCMOS, PCI, LVDS (per bank) |
EPM2210F256A5NGA Pin Configuration
| Pin A1 | I/O Bank 1 — User I/O - Bank 1 |
| Pin B2 | I/O Bank 1 — User I/O - Bank 1 |
| Pin C3 | I/O Bank 1 — User I/O - Bank 1 |
| Pin D4 | I/O Bank 1 — User I/O - Bank 1 |
| Pin E5 | GND — Ground |
| Pin F6 | I/O Bank 2 — User I/O - Bank 2 |
| Pin G7 | I/O Bank 2 — User I/O - Bank 2 |
| Pin H8 | I/O Bank 2 — User I/O - Bank 2 |
| Pin J9 | I/O Bank 2 — User I/O - Bank 2 |
| Pin K10 | I/O Bank 2 — User I/O - Bank 2 |
| Pin L11 | VCCIO2 — Bank 2 I/O supply (1.5/1.8/2.5/3.3 V) |
| Pin M12 | I/O Bank 3 — User I/O - Bank 3 |
| Pin N13 | I/O Bank 3 — User I/O - Bank 3 |
| Pin P14 | I/O Bank 3 — User I/O - Bank 3 |
| Pin R15 | VCCIO3 — Bank 3 I/O supply (1.5/1.8/2.5/3.3 V) |
| Pin T16 | I/O Bank 4 — User I/O - Bank 4 |
| Pin U15 | I/O Bank 4 — User I/O - Bank 4 |
| Pin V14 | I/O Bank 4 — User I/O - Bank 4 |
| Pin W13 | GND — Ground |
| Pin Y12 | VCCINT — Core supply (1.8 V) |
| Pin AA11 | I/O Bank 4 — User I/O - Bank 4 |
| Pin AB10 | TCK — JTAG Test Clock |
| Pin AC9 | TMS — JTAG Test Mode Select |
| Pin AD8 | TDI — JTAG Test Data In |
| Pin AE7 | TDO — JTAG Test Data Out |
| Pin AF6 | nCONFIG — Configuration / reset (active low) |
| Pin AG5 | nSTATUS — Configuration status (active low) |
| Pin AH4 | DCLK — JTAG configuration clock (legacy) |
| Pin AJ3 | DATA0 — JTAG configuration data (legacy) |
| Pin AK2 | VCCIO1 — Bank 1 I/O supply (1.5/1.8/2.5/3.3 V) |
| Pin AL1 | GND — Ground |
| Pin B1 | I/O Bank 1 — User I/O - Bank 1 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM2210F256A5NGA is suitable for 6 applications: Microcontroller I/O Expansion and Voltage Translation, Glue-Logic Replacement for TTL/HC Designs, Industrial Control and Factory Automation, Boot Sequencing and Reset Management, Communication Bus Bridging (SPI, I2C, UART, Parallel), LED Display and Panel Driver Logic.
Microcontroller I/O Expansion and Voltage Translation
The EPM2210F256A5NGA delivers 212 user I/O pins organized in four I/O banks, each independently configurable for 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V logic levels - ideal for translating between a 1.8 V MCU and 5 V or 3.3 V peripherals. Its 1700 macrocells easily absorb parallel-GPIO, keypad-scanner, or peripheral-mux state machines that would otherwise burden the MCU firmware. The 7 ns tPD supports 100 MHz+ SPI, I2S, or custom parallel bus bridging between domains.
Recommended
Glue-Logic Replacement for TTL/HC Designs
Replace dozens of 74-series HC, AC, and LVTH logic chips with a single MAX II CPLD to reduce PCB area and BOM cost. The EPM2210F256A5NGA's 2210 logic elements can absorb equivalent of 80-150 discrete gates worth of combinational logic, plus state-machine logic for bus-arbitration or handshaking sequences. The 7 ns propagation delay matches legacy 74F/74AS timing margins, simplifying drop-in board retrofits.
Recommended
Industrial Control and Factory Automation
The industrial-grade EPM2210F256C5N variant operates from -40C to +85C, making it suitable for PLC backplanes, motor-control interface boards, and HMI panels. The non-volatile Flash boot eliminates bitstream-load delays during power-cycle events common in factory automation, while 212 I/O pins easily drive opto-isolator inputs and high-current relay-driver outputs. The 1.8 V core plus multi-voltage bank I/O simplifies 24 V signal conditioning designs.
Recommended
Boot Sequencing and Reset Management
Use the EPM2210F256A5NGA as a system boot sequencer for multi-rail power designs, where deterministic timing of DC-DC converter enable signals and reset assertions is critical. Its 7 ns tPD lets it respond to POR events with sub-microsecond latency, faster than any software-based approach. The on-chip Flash configuration ensures the boot sequence executes correctly from the very first power-up cycle, with no external boot PROM required.
Recommended
Communication Bus Bridging (SPI, I2C, UART, Parallel)
The EPM2210F256A5NGA is well-suited for bridging between incompatible bus protocols - SPI to parallel, I2C to UART, or custom FPGA-SoC register bus translation. Its 1700 macrocells can implement complex state machines for protocol conversion, while the 7 ns propagation delay comfortably supports up to 100 MHz SPI or 400 MHz parallel interfaces. Multi-voltage bank I/O enables direct level translation between 1.8 V SoC and 5 V legacy peripherals.
Recommended
LED Display and Panel Driver Logic
Drive multi-channel LED displays, segment panels, or signage matrices with the EPM2210F256A5NGA's 212 user I/O pins. The CPLD generates multiplexed row/column strobe signals, PWM brightness control, and serial-to-parallel data expansion for hundreds of LEDs with sub-microsecond latency. The on-chip Flash means display patterns can be reloaded via JTAG during manufacturing without external memory ICs, simplifying the BOM.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210F256A5NGA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210F256C5N | EPM2210F256I5N | 5M2210ZF256 | 5M2210ZF256I5 | 5M2210ZF256C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Logic Elements | 2210 | 2210 | 2210 | 2210 | 2210 | 2210 |
| Macrocells | 1700 | 1700 | 1700 | 1700 | 1700 | 1700 |
| tPD (Propagation Delay) | 7 ns (A5 grade) | 7 ns | 7 ns | ~7 ns (MAX V typical) | ~7 ns (MAX V typical) | ~7 ns (MAX V typical) |
| User I/O Pins | 212 | 212 | 212 | 212 | 212 | 212 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Temperature Range | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Family / Generation | MAX II | MAX II - same | MAX II - same | MAX V (successor) | MAX V (successor) | MAX V (successor) |
| Approx. Unit Price (qty 1) | $76.21 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Instant-on non-volatile boot without external PROM (vs EPM1270F256C5N)
- Lower static current than MAX V successor in same footprint (vs 5M2210ZF256)
- 212 user I/O pins in 256-ball BGA (vs EPM1270T144C5N)
Design Notes
Estimated: The EPM2210F256A5NGA typically draws ~25 mA quiescent current on VCCINT (1.8 V) and ~5-15 mA per active I/O bank supply (VCCIO1-4) at full I/O switching. For a design using all 212 I/Os at 50 MHz, plan ~250 mA total core+I/O current. Decouple each VCCIO bank with a 0.1 uF ceramic plus 10 uF bulk, and place a 0.1 uF ceramic directly at each VCCINT ball. Power-up must be monotonic - any glitch on VCCINT below 1.65 V triggers reconfiguration.
The 256-ball FineLine BGA uses 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia or via-in-pad technology for reliable assembly. Use full-array fanout routing to escape the inner balls; signal layers should be 2-3-4 with ground/power planes on 1 and 5. Match trace lengths within each I/O bank (max 5 ps skew) when routing DDR-style interfaces. Use 0.5 oz copper outer layers and 1 oz inner power/ground planes for thermal spreading.
Do not exceed 3.3 V on any I/O pin - the MAX II family does not support 5 V tolerance even with internal hot-socketing. Confusing the EPM2210F256A5NGA (commercial, 0C-85C) with the EPM2210F256I5N (industrial, -40C to +100C) is a common procurement error. Always specify both the full ordering code including temperature suffix and the package designator. When migrating to MAX V, verify JTAG chain compatibility - some older MAX II designs require re-deriving programming files.
Keep TCK traces short (under 50 mm) and free of stubs. Place a 4.7 kohm pull-up on TCK and TMS, and a 4.7 kohm pull-up on nCONFIG and nSTATUS. Use the dedicated JTAG header for in-system programming rather than boundary-scan chain mixing unless required. Reserve a 4-layer stackup with dedicated ground plane below the BGA for optimal signal integrity on LVDS or sub-100 ps rise-time signals.
Compliance Information
Compliance status not explicitly stated in Verified Web Data; consult Intel/Altera product page or manufacturer datasheet for RoHS / REACH / lead-free / halogen-free confirmation. Not AEC-Q100 qualified - this part is commercial grade only.
