EPM3512AFC256-2 - MAX 3000A CPLD, 512 Macrocells, BGA-256 | Altera
N.º da peça: EPM3512AFC256-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $19.4 | $1.940,00 |
| 500 | $16.2 | $8.100,00 |
| 1.000 | $14.85 | $14.850,00 |
EPM3512AFC256-2 Visão geral
A CPLD, or Complex Programmable Logic Device, is a non-volatile programmable logic device that combines multiple PLA-style macrocells with a centralized interconnect fabric. The MAX 3000A family sits in the broader taxonomy of programmable logic: CPLD -> programmable logic -> logic IC -> semiconductor. CPLDs are typically chosen over FPGAs when designers need instant-on non-volatile configuration, deterministic pin-to-pin propagation delays (typically 3.5-7.5 ns tPD for this family), and a smaller, more predictable power envelope than SRAM-based FPGAs.
Key features of the EPM3512AFC256-2 include 512 macrocells organized into 16 logic array blocks (LABs) of 32 macrocells each, 12 dedicated input pins feeding a global interconnect, MultiVolt I/O supporting mixed-voltage system design, JTAG-based boundary-scan test support, and a -2 speed grade delivering faster propagation delay than the -7 or -10 grades. The BGA-256 package maximizes I/O density for I/O-intensive glue-logic applications where the PCB has the routing capability to support a 1.0 mm pitch array.
Architecturally, the device is built on a 0.30 um CMOS EEPROM process with a 5-V tolerant input structure and 2.5 V/3.3 V output drive. The pin-to-pin propagation delay for the -2 speed grade is in the range of 3.5 ns tPD, with a maximum toggle frequency (fCNT) in the hundreds of MHz range for internal counters. The MAX 3000A architecture uses a classic AND-OR plane with a programmable interconnect matrix, providing deterministic, jitter-free timing that is easier to model than FPGA routing delays.
Typical applications include bus-interface bridging (e.g., 8/16/32-bit glue logic between microcontrollers and peripherals), address decoding and chip-select generation in microprocessor systems, power-up sequencing control, JTAG-controlled board-level test access, and replacement of discrete 74-series TTL/MSI glue logic. The wide I/O count makes it well-suited to high-density memory-interface cards, telecom line cards, and industrial controllers.
When designing with the EPM3512AFC256-2, ensure that the BGA-256 footprint uses 1.0 mm ball pitch and that PCB routing allows fan-out from the inner-row balls. Decoupling should follow the MAX 3000A datasheet recommendation of 0.1 uF and 10 uF bulk capacitors placed close to the supply pins. Programming is performed via JTAG (IEEE 1149.1) or via the legacy Altera ByteBlaster interface.
This page synthesizes distributor pricing, same-family drop-in alternatives from the Altera/Intel MAX 3000A and MAX II families, and practical design notes that go beyond what is in the manufacturer's datasheet.
Alternativas drop-in para EPM3512AFC256-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM3512AFC256-2 (mesmo formato e footprint) — diferindo em Package, Programming Interface, In-System Programmability, Speed Grade, Logic Array Blocks (LABs).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM3512AFC256-7N
✅ Drop-In✓ Em estoque
$61 / unidade
Ver ficha técnica →EPM3512AFC256-10N
✅ Drop-In✓ Em estoque
$43.22 / unidade
Ver ficha técnica →EPM3512AFC256-10
✅ Drop-In✓ Em estoque
$17.5 / unidade
Ver ficha técnica →EPM3512AFC256-18
✅ Drop-In✓ Em estoque
$17.2 / unidade
Ver ficha técnica →EPM3512AFC256-19
✅ Drop-In✓ Em estoque
$10.85 / unidade
Ver ficha técnica →EPM3512AFC256-2 Classificações máximas e características elétricas
| Family | MAX 3000A |
| Macrocells | 512 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 212 |
| Core Supply Voltage | 3.3 V |
| I/O Output Drive Voltage | 2.5 V or 3.3 V (MultiVolt) |
| Input Tolerance | 2.5 V, 3.3 V, 5.0 V tolerant |
| Encapsulamento | BGA-256 (FineLine BGA) |
| Ball Pitch | 1.0 mm |
| Programming Interface | JTAG (IEEE Std 1149.1) / ByteBlaster |
| Process Technology | 0.30 um CMOS EEPROM |
| Temperatura de operação | 0C to +70C (commercial) |
| Speed Grade | -2 |
Guia de Configuração de Pinos do EPM3512AFC256-2 bga-256 (fineline bga)
Configuração de pinos para EPM3512AFC256-2 (pacote bga-256 (fineline bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPM3512AFC256-2.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPM3512AFC256-2 é adequado para 6 aplicaçãos: Microprocessor Bus Glue Logic, Address Decoding and Chip-Select Generation, Power-Up Sequencing and Reset Control, Industrial Control and I/O Expansion, Telecom Line Card Interface Logic, Legacy Board Repair and Obsolescence Mitigation.
Microprocessor Bus Glue Logic
The EPM3512AFC256-2 fits microprocessor bus glue logic because its 512 macrocells and 212 user I/O pins provide ample combinatorial-plus-register logic for address decoding, chip-select generation, wait-state insertion, and bus-width translation between microprocessors and peripherals. With MultiVolt I/O supporting 5.0 V-tolerant inputs, it can directly interface 5 V TTL peripherals to a 3.3 V microcontroller bus without external level shifters. The non-volatile EEPROM-based configuration guarantees instant-on deterministic behavior at reset, which is critical for bootstrap chip-selects that must be valid before the CPU fetches its first instruction. The -2 speed grade gives the shortest tPD in the MAX 3000A family for timing-sensitive bus cycles.
Recomendado
Address Decoding and Chip-Select Generation
The EPM3512AFC256-2 is well-suited to address decoding in memory-mapped systems because its 16 LABs of 32 macrocells each can be partitioned into multiple independent decode trees. Each LAB acts as a wide AND/OR plane, ideal for translating CPU address and control signals (A[31:0], MREQ, RD, WR) into per-chip chip-select strobes for SRAM, DRAM, Flash, and peripheral devices. The 3.5 ns-class tPD of the -2 grade ensures that chip-select assertion meets the most aggressive memory access timing without inserting wait states. JTAG programming means the decode map can be updated in the field via boundary-scan.
Recomendado
Power-Up Sequencing and Reset Control
The EPM3512AFC256-2 is commonly used for power-up sequencing in multi-rail systems because it powers up in a known deterministic state from its non-volatile EEPROM configuration, providing stable reset and power-good signals before the system CPU boots. Each of its 212 user I/O pins can source or sink enough current to drive a MOSFET gate or a reset line to multiple downstream regulators. The MultiVolt I/O allows the CPLD to interface 5.0 V-tolerant supervisory circuitry at start-up and then operate in a 3.3 V logic domain thereafter. The BGA-256 package maximizes I/O for systems that must sequence many rails independently.
Recomendado
Industrial Control and I/O Expansion
The EPM3512AFC256-2 fits industrial control designs that need a deterministic, rugged logic device to expand microcontroller I/O count, debounce switch inputs, drive relays and optocouplers, and implement safety interlocks. The 212 user I/O pins easily exceed the I/O budget of typical microcontrollers, allowing one CPLD to replace dozens of 74-series glue packages. Commercial temperature grade (0C to +70C) is suitable for cabinet-internal control, while the EEPROM-based configuration means no inrush current spike from FPGA configuration memory. JTAG boundary-scan simplifies board-level test in production.
Recomendado
Telecom Line Card Interface Logic
The EPM3512AFC256-2 fits telecom line card applications because its high I/O count (212 pins) and MultiVolt I/O let it bridge backplane buses, framer ICs, and TDM serial links in a single device. The deterministic pin-to-pin delay of the -2 grade is critical for tight TDM frame timing, and the JTAG interface supports in-system firmware updates for deployed line cards. The 0.30 um CMOS EEPROM process gives predictable, low-EMI operation - an advantage over SRAM-based FPGAs in sensitive telecom front ends. However, because the part is obsolete, new line card designs typically migrate to MAX V or MAX 10 with PCB redesign.
Recomendado
Legacy Board Repair and Obsolescence Mitigation
The EPM3512AFC256-2 is primarily used today for legacy board repair and obsolescence mitigation - replacing failed devices on in-service boards whose original CPLD has gone EOL. Its BGA-256 footprint matches the original PCB exactly, so rework is mechanical (reballing and reflow) rather than a redesign. Engineers maintaining long-lifecycle systems (industrial controllers, military, avionics, telecom) stock the EPM3512AFC256-2 and its same-family variants as authorized substitutes to keep deployed equipment running. When stock is exhausted, the engineering path is migration to MAX V/MAX 10 with PCB re-layout.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM3512AFC256-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM3512AFC256-7N | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-18 | EPM3512AFC256-19 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | BGA-256 (FineLine BGA) | BGA-256 (FineLine BGA) - same | BGA-256 (FineLine BGA) - same | BGA-256 (FineLine BGA) - same | BGA-256 (FineLine BGA) - same | BGA-256 (FineLine BGA) - same |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| Logic Array Blocks | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum User I/O | 212 | 212 | 212 | 212 | 212 | 212 |
| Speed Grade | -2 (fastest) | -7 (mid) | -10 (slow) | -10 (slow) | -18 | -19 (slowest) |
| Programming Interface | JTAG / ByteBlaster | JTAG / ByteBlaster | JTAG / ByteBlaster | JTAG / ByteBlaster | JTAG / ByteBlaster | JTAG / ByteBlaster |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Indicative Unit Price (qty 1, USD) | $28.50 | $24.50 | $22.00 | $22.00 | $21.00 | $21.00 |
Principais diferenciais
- Fastest speed grade in the MAX 3000A 512-macrocell family (vs EPM3512AFC256-7N)
- 212 user I/O pins in a single BGA-256 package (vs EPM3512AFC256-10N)
- Same Altera MAX 3000A EEPROM process as other family variants (vs EPM3512AFC256-19)
Notas de projeto
The EPM3512AFC256-2 ships in a 1.0 mm pitch FineLine BGA with 256 balls. PCB layout must use either via-in-pad or dog-bone fan-out to route the inner-row balls; a 4-layer stack-up with 0.5 oz copper on outer layers and continuous power/ground planes on inner layers is recommended. Place 0.1 uF decoupling capacitors as close as possible to every VCC/VCCIO ball pair and add 10 uF bulk capacitors near the supply entry points. All JTAG signals (TDI, TDO, TMS, TCK) should be routed with 50 ohm controlled impedance and pulled to a known state per the datasheet to avoid spurious boundary-scan shifts.
Do not assume the EPM3512AFC256-2 is still in production - the MAX 3000A family is obsolete, so plan for last-time-buy or authorized distributor stock. When migrating, remember that MAX II, MAX V, and MAX 10 devices share the Quartus II toolchain but use different packages and ball maps; PCB re-layout is required. Also be aware that the -2 speed grade is the fastest bin and may have limited availability compared to the -7 and -10 grades - if your timing budget allows, choosing the -7 or -10 grade significantly improves sourcing.
MultiVolt I/O allows the EPM3512AFC256-2 to drive 2.5 V or 3.3 V outputs while accepting 5.0 V TTL inputs, but the VCCIO bank voltage must be configured correctly before any I/O is used. Mixing VCCIO voltages across banks is not permitted - all banks on this single-supply-pin device share one VCCIO rail. For series-termination on high-speed outputs, place the resistor within 300 mils of the CPLD pin to dampen reflections on traces longer than 2 inches.
Informações de conformidade
RoHS and REACH compliance status was not present in the verified web data and is marked unknown. The EPM3512AFC256-2 is a commercial-temperature-grade (0C to +70C) CPLD intended for industrial and consumer systems; it is not AEC-Q100 qualified for automotive applications.
