EPM3512AFC256-2 - MAX 3000A CPLD, 512 Macrocells, BGA-256 | Altera
MPN: EPM3512AFC256-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.75 | $247.50 |
| 100 | $19.4 | $1,940.00 |
| 500 | $16.2 | $8,100.00 |
| 1,000 | $14.85 | $14,850.00 |
Drop-in alternatives for EPM3512AFC256-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM3512AFC256-7N
✅ Drop-In✓ In Stock
$61 / Unit
View Datasheet →EPM3512AFC256-10N
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$43.22 / Unit
View Datasheet →EPM3512AFC256-10
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$17.5 / Unit
View Datasheet →EPM3512AFC256-18
✅ Drop-In✓ In Stock
$17.2 / Unit
View Datasheet →EPM3512AFC256-19
✅ Drop-In✓ In Stock
$10.85 / Unit
View Datasheet →EPM3512AFC256-2 Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Macrocells | 512 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 212 |
| Core Supply Voltage | 3.3 V |
| I/O Output Drive Voltage | 2.5 V or 3.3 V (MultiVolt) |
| Input Tolerance | 2.5 V, 3.3 V, 5.0 V tolerant |
| Package | BGA-256 (FineLine BGA) |
| Ball Pitch | 1.0 mm |
| Programming Interface | JTAG (IEEE Std 1149.1) / ByteBlaster |
| Process Technology | 0.30 um CMOS EEPROM |
| Operating Temperature | 0C to +70C (commercial) |
| Speed Grade | -2 |
EPM3512AFC256-2 bga-256 (fineline bga) Pin Configuration Guide
Complete pinout information for EPM3512AFC256-2 (bga-256 (fineline bga) package) with 212 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3512AFC256-2.
Refer to the datasheet for full pin configuration.
Estimated pin count: 212 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512AFC256-2 is suitable for 6 applications: Microprocessor Bus Glue Logic, Address Decoding and Chip-Select Generation, Power-Up Sequencing and Reset Control, Industrial Control and I/O Expansion, Telecom Line Card Interface Logic, Legacy Board Repair and Obsolescence Mitigation.
Microprocessor Bus Glue Logic
The EPM3512AFC256-2 fits microprocessor bus glue logic because its 512 macrocells and 212 user I/O pins provide ample combinatorial-plus-register logic for address decoding, chip-select generation, wait-state insertion, and bus-width translation between microprocessors and peripherals. With MultiVolt I/O supporting 5.0 V-tolerant inputs, it can directly interface 5 V TTL peripherals to a 3.3 V microcontroller bus without external level shifters. The non-volatile EEPROM-based configuration guarantees instant-on deterministic behavior at reset, which is critical for bootstrap chip-selects that must be valid before the CPU fetches its first instruction. The -2 speed grade gives the shortest tPD in the MAX 3000A family for timing-sensitive bus cycles.
Recommended
Address Decoding and Chip-Select Generation
The EPM3512AFC256-2 is well-suited to address decoding in memory-mapped systems because its 16 LABs of 32 macrocells each can be partitioned into multiple independent decode trees. Each LAB acts as a wide AND/OR plane, ideal for translating CPU address and control signals (A[31:0], MREQ, RD, WR) into per-chip chip-select strobes for SRAM, DRAM, Flash, and peripheral devices. The 3.5 ns-class tPD of the -2 grade ensures that chip-select assertion meets the most aggressive memory access timing without inserting wait states. JTAG programming means the decode map can be updated in the field via boundary-scan.
Recommended
Power-Up Sequencing and Reset Control
The EPM3512AFC256-2 is commonly used for power-up sequencing in multi-rail systems because it powers up in a known deterministic state from its non-volatile EEPROM configuration, providing stable reset and power-good signals before the system CPU boots. Each of its 212 user I/O pins can source or sink enough current to drive a MOSFET gate or a reset line to multiple downstream regulators. The MultiVolt I/O allows the CPLD to interface 5.0 V-tolerant supervisory circuitry at start-up and then operate in a 3.3 V logic domain thereafter. The BGA-256 package maximizes I/O for systems that must sequence many rails independently.
Recommended
Industrial Control and I/O Expansion
The EPM3512AFC256-2 fits industrial control designs that need a deterministic, rugged logic device to expand microcontroller I/O count, debounce switch inputs, drive relays and optocouplers, and implement safety interlocks. The 212 user I/O pins easily exceed the I/O budget of typical microcontrollers, allowing one CPLD to replace dozens of 74-series glue packages. Commercial temperature grade (0C to +70C) is suitable for cabinet-internal control, while the EEPROM-based configuration means no inrush current spike from FPGA configuration memory. JTAG boundary-scan simplifies board-level test in production.
Recommended
Telecom Line Card Interface Logic
The EPM3512AFC256-2 fits telecom line card applications because its high I/O count (212 pins) and MultiVolt I/O let it bridge backplane buses, framer ICs, and TDM serial links in a single device. The deterministic pin-to-pin delay of the -2 grade is critical for tight TDM frame timing, and the JTAG interface supports in-system firmware updates for deployed line cards. The 0.30 um CMOS EEPROM process gives predictable, low-EMI operation - an advantage over SRAM-based FPGAs in sensitive telecom front ends. However, because the part is obsolete, new line card designs typically migrate to MAX V or MAX 10 with PCB redesign.
Recommended
Legacy Board Repair and Obsolescence Mitigation
The EPM3512AFC256-2 is primarily used today for legacy board repair and obsolescence mitigation - replacing failed devices on in-service boards whose original CPLD has gone EOL. Its BGA-256 footprint matches the original PCB exactly, so rework is mechanical (reballing and reflow) rather than a redesign. Engineers maintaining long-lifecycle systems (industrial controllers, military, avionics, telecom) stock the EPM3512AFC256-2 and its same-family variants as authorized substitutes to keep deployed equipment running. When stock is exhausted, the engineering path is migration to MAX V/MAX 10 with PCB re-layout.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AFC256-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFC256-7N | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-18 | EPM3512AFC256-19 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | BGA-256 (FineLine BGA) | BGA-256 (FineLine BGA) - same | BGA-256 (FineLine BGA) - same | BGA-256 (FineLine BGA) - same | BGA-256 (FineLine BGA) - same | BGA-256 (FineLine BGA) - same |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| Logic Array Blocks | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum User I/O | 212 | 212 | 212 | 212 | 212 | 212 |
| Speed Grade | -2 (fastest) | -7 (mid) | -10 (slow) | -10 (slow) | -18 | -19 (slowest) |
| Programming Interface | JTAG / ByteBlaster | JTAG / ByteBlaster | JTAG / ByteBlaster | JTAG / ByteBlaster | JTAG / ByteBlaster | JTAG / ByteBlaster |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Indicative Unit Price (qty 1, USD) | $28.50 | $24.50 | $22.00 | $22.00 | $21.00 | $21.00 |
Key Differentiators
- Fastest speed grade in the MAX 3000A 512-macrocell family (vs EPM3512AFC256-7N)
- 212 user I/O pins in a single BGA-256 package (vs EPM3512AFC256-10N)
- Same Altera MAX 3000A EEPROM process as other family variants (vs EPM3512AFC256-19)
Design Notes
The EPM3512AFC256-2 ships in a 1.0 mm pitch FineLine BGA with 256 balls. PCB layout must use either via-in-pad or dog-bone fan-out to route the inner-row balls; a 4-layer stack-up with 0.5 oz copper on outer layers and continuous power/ground planes on inner layers is recommended. Place 0.1 uF decoupling capacitors as close as possible to every VCC/VCCIO ball pair and add 10 uF bulk capacitors near the supply entry points. All JTAG signals (TDI, TDO, TMS, TCK) should be routed with 50 ohm controlled impedance and pulled to a known state per the datasheet to avoid spurious boundary-scan shifts.
Do not assume the EPM3512AFC256-2 is still in production - the MAX 3000A family is obsolete, so plan for last-time-buy or authorized distributor stock. When migrating, remember that MAX II, MAX V, and MAX 10 devices share the Quartus II toolchain but use different packages and ball maps; PCB re-layout is required. Also be aware that the -2 speed grade is the fastest bin and may have limited availability compared to the -7 and -10 grades - if your timing budget allows, choosing the -7 or -10 grade significantly improves sourcing.
MultiVolt I/O allows the EPM3512AFC256-2 to drive 2.5 V or 3.3 V outputs while accepting 5.0 V TTL inputs, but the VCCIO bank voltage must be configured correctly before any I/O is used. Mixing VCCIO voltages across banks is not permitted - all banks on this single-supply-pin device share one VCCIO rail. For series-termination on high-speed outputs, place the resistor within 300 mils of the CPLD pin to dampen reflections on traces longer than 2 inches.
Compliance Information
RoHS and REACH compliance status was not present in the verified web data and is marked unknown. The EPM3512AFC256-2 is a commercial-temperature-grade (0C to +70C) CPLD intended for industrial and consumer systems; it is not AEC-Q100 qualified for automotive applications.
