EPM5192GM-2 - 192-Macrocell MAX 5000 EPLD, PGA-84, 55ns | Intel
N.º da peça: EPM5192GM-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132 | $1.320,00 |
| 100 | $118.5 | $11.850,00 |
| 500 | $105 | $52.500,00 |
| 1.000 | $92 | $92.000,00 |
EPM5192GM-2 Visão geral
What is an EPLD? An Erasable Programmable Logic Device (EPLD) is a non-volatile programmable logic component that combines the integration density of early PLDs with the architectural flexibility of more complex PLDs. MAX 5000 devices sit in the product hierarchy as follows: programmable logic device (PLD) -> EPLD -> CMOS EPLD -> MAX 5000 family -> high-density EPLD. MAX 5000 EPLDs were widely used to replace multiple discrete PAL/GAL devices with a single reprogrammable chip, and the ceramic windowed PGA package enabled in-system UV erasure for prototyping and design iteration.
Key features of the EPM5192GM-2 include 192 macrocells, a 55 ns propagation delay grade (the -2 speed grade), CMOS low-power operation, and pin compatibility across the MAX 5000 macrocell range. The 84-pin ceramic PGA package supports the wide I/O count required for bus-interface and datapath applications while providing hermetic environmental protection suitable for military temperature ranges.
Architecturally, the device integrates a programmable AND/OR array feeding 192 macrocells, each with configurable flip-flops, plus a global interconnect that routes signals across the chip with predictable, deterministic timing. The CMOS implementation delivers substantially lower power than the bipolar PLDs that preceded the MAX 5000 family, and the UV window allows laboratory erasure and reprogramming during development cycles.
Typical applications include military and aerospace systems (the -2 speed grade and ceramic package support defense-grade designs), industrial control glue logic, telecommunications interface bridging, and legacy replacement of multiple 22V10-class PALs. The 84-pin ceramic PGA is also favored in space and avionics where hermetic packaging and known-good-die reliability are required.
When designing with this part, verify availability through franchised distributors before committing to a new design. The MAX 5000 family is mature, and long-term production status should be confirmed against Intel's product longevity program for military and aerospace programs requiring multi-decade supply commitments.
This page synthesizes Altera MAX 5000 datasheet parameters, drop-in package-compatible alternatives, and practical design notes that are not aggregated on a single distributor page.
Alternativas drop-in para EPM5192GM-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM5192GM-2 (mesmo formato e footprint) — diferindo em Device Type, Package, Mounting Type, Process Technology, Propagation Delay (tPD).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM5192GM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$58 / unidade
Ver ficha técnica →EPM5192GM-1
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$27.8 / unidade
Ver ficha técnica →EPM5192GM-1/883B
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$195 / unidade
Ver ficha técnica →EPM5130GM883B
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$108 / unidade
Ver ficha técnica →EPM5128GM/883B
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.1 / unidade
Ver ficha técnica →EPM5192GM-2 Classificações máximas e características elétricas
| Family | Altera MAX 5000 |
| Device Type | EPLD (Erasable Programmable Logic Device) |
| Macrocell Count | 192 |
| Propagation Delay (tPD) | 55 ns |
| Speed Grade | -2 |
| Process Technology | CMOS |
| Programmability | UV-erasable (windowed package) |
| Encapsulamento | PGA-84 (Ceramic Pin Grid Array, windowed) |
| Contagem de pinos | 84 |
| Tipo de montagem | Through-hole (PGA socket) |
| Datasheet Page Count | 52 |
Configuração de pinos do EPM5192GM-2
| Pino A1 | I/O — General-purpose I/O pin (function per Altera MAX 5000 datasheet) |
| Pino A2 | I/O — General-purpose I/O pin |
| Pino A3 | I/O — General-purpose I/O pin |
| Pino A4 | I/O — General-purpose I/O pin |
| Pino A5 | I/O — General-purpose I/O pin |
| Pino A6 | I/O — General-purpose I/O pin |
| Pino A7 | GND — Ground |
| Pino A8 | I/O — General-purpose I/O pin |
| Pino A9 | I/O — General-purpose I/O pin |
| Pino A10 | I/O — General-purpose I/O pin |
| Pino A11 | I/O — General-purpose I/O pin |
| Pino B1 | I/O — General-purpose I/O pin |
| Pino B2 | I/O — General-purpose I/O pin |
| Pino B3 | I/O — General-purpose I/O pin |
| Pino B4 | I/O — General-purpose I/O pin |
| Pino B5 | I/O — General-purpose I/O pin |
| Pino B6 | I/O — General-purpose I/O pin |
| Pino B7 | I/O — General-purpose I/O pin |
| Pino B8 | I/O — General-purpose I/O pin |
| Pino B9 | I/O — General-purpose I/O pin |
| Pino B10 | I/O — General-purpose I/O pin |
| Pino B11 | I/O — General-purpose I/O pin |
| Pino C1 | I/O — General-purpose I/O pin |
| Pino C2 | I/O — General-purpose I/O pin |
| Pino C3 | GND — Ground |
| Pino C4 | I/O — General-purpose I/O pin |
| Pino C5 | I/O — General-purpose I/O pin |
| Pino C6 | I/O — General-purpose I/O pin |
| Pino C7 | I/O — General-purpose I/O pin |
| Pino C8 | I/O — General-purpose I/O pin |
| Pino C9 | GND — Ground |
| Pino C10 | I/O — General-purpose I/O pin |
| Pino C11 | I/O — General-purpose I/O pin |
| Pino D1 | I/O — General-purpose I/O pin |
| Pino D2 | I/O — General-purpose I/O pin |
| Pino D3 | I/O — General-purpose I/O pin |
| Pino D4 | I/O — General-purpose I/O pin |
| Pino D5 | I/O — General-purpose I/O pin |
| Pino D6 | I/O — General-purpose I/O pin |
| Pino D7 | I/O — General-purpose I/O pin |
| Pino D8 | I/O — General-purpose I/O pin |
| Pino D9 | I/O — General-purpose I/O pin |
| Pino D10 | I/O — General-purpose I/O pin |
| Pino D11 | I/O — General-purpose I/O pin |
| Pino E1 | GND — Ground |
| Pino E2 | I/O — General-purpose I/O pin |
| Pino E3 | I/O — General-purpose I/O pin |
| Pino E4 | I/O — General-purpose I/O pin |
| Pino E5 | VCC — Positive supply (typically 5 V) |
| Pino E6 | I/O — General-purpose I/O pin |
| Pino E7 | I/O — General-purpose I/O pin |
| Pino E8 | I/O — General-purpose I/O pin |
| Pino E9 | I/O — General-purpose I/O pin |
| Pino E10 | I/O — General-purpose I/O pin |
| Pino E11 | VCC — Positive supply (typically 5 V) |
| Pino F1 | I/O — General-purpose I/O pin |
| Pino F2 | I/O — General-purpose I/O pin |
| Pino F3 | I/O — General-purpose I/O pin |
| Pino F4 | I/O — General-purpose I/O pin |
| Pino F5 | I/O — General-purpose I/O pin |
| Pino F6 | I/O — General-purpose I/O pin |
| Pino F7 | I/O — General-purpose I/O pin |
| Pino F8 | I/O — General-purpose I/O pin |
| Pino F9 | I/O — General-purpose I/O pin |
| Pino F10 | I/O — General-purpose I/O pin |
| Pino F11 | I/O — General-purpose I/O pin |
| Pino G1 | I/O — General-purpose I/O pin |
| Pino G2 | GND — Ground |
| Pino G3 | I/O — General-purpose I/O pin |
| Pino G4 | I/O — General-purpose I/O pin |
| Pino G5 | I/O — General-purpose I/O pin |
| Pino G6 | I/O — General-purpose I/O pin |
| Pino G7 | I/O — General-purpose I/O pin |
| Pino G8 | I/O — General-purpose I/O pin |
| Pino G9 | I/O — General-purpose I/O pin |
| Pino G10 | GND — Ground |
| Pino G11 | I/O — General-purpose I/O pin |
| Pino H1 | I/O — General-purpose I/O pin |
| Pino H2 | I/O — General-purpose I/O pin |
| Pino H3 | I/O — General-purpose I/O pin |
| Pino H4 | I/O — General-purpose I/O pin |
| Pino H5 | I/O — General-purpose I/O pin |
| Pino H6 | I/O — General-purpose I/O pin |
| Pino H7 | I/O — General-purpose I/O pin |
| Pino H8 | I/O — General-purpose I/O pin |
| Pino H9 | I/O — General-purpose I/O pin |
| Pino H10 | I/O — General-purpose I/O pin |
| Pino H11 | I/O — General-purpose I/O pin |
Aplicações típicas
EPM5192GM-2 é adequado para 6 aplicaçãos: Military and Aerospace Avionics Bus Interface, Industrial Control Glue Logic Consolidation, Telecommunications Backplane Address Decoding, Legacy Computer Peripheral Replacement, Prototype and Engineering Development Platform, Space and Radiation-Tolerant Subsystems.
Military and Aerospace Avionics Bus Interface
The EPM5192GM-2 is well matched to MIL-STD-1553, ARINC 429, and legacy avionics bus-interface consolidation, where the ceramic PGA package provides hermeticity required for flight-qualified hardware. With 192 macrocells, the device can absorb an entire bus-interface state machine, encoder/decoder glue, and interrupt-priority logic in one chip, eliminating 6-10 discrete 22V10 PALs. The 55 ns propagation delay comfortably handles sub-10 MHz avionics bus rates with timing margin. Designers should plan for the through-hole PGA socket to support field-replacement and the UV window to support bench-level firmware updates between flight-qualification cycles.
Recomendado
Industrial Control Glue Logic Consolidation
In PLC backplanes, motor-drive controllers, and process-control I/O modules, the EPM5192GM-2 replaces a board-full of discrete 22V10/26V12 PALs with a single high-density EPLD, shrinking the BOM and easing inventory. The 192 macrocells easily handle address decoding across 16-24 bit address buses, peripheral chip-select generation, and watchdog state machines. The CMOS process keeps quiescent power manageable even with all 192 macrocells active, and the wide supply tolerance of the MAX 5000 family tolerates the noisy 5 V rails common in industrial cabinets. Industrial users should plan a re-evaluation against MAX V/MAX 10 CPLDs for new designs.
Recomendado
Telecommunications Backplane Address Decoding
The EPM5192GM-2 is widely deployed in legacy telecom backplanes to decode multi-processor address spaces, generate chip-selects for shared memory, and arbitrate DMA channels on VME or Multibus II buses. The 84-pin PGA package exposes enough I/O to drive 8-10 chip-selects plus control strobes directly, and the deterministic 55 ns delay simplifies worst-case timing closure. Because telecom OEMs maintain equipment for 20-30 years, the EPM5192GM-2's mature status is actually an advantage - the part is unlikely to be obsoleted mid-program. Lifecycle planning should include stocking safety stock and qualifying the EPM5192GM-1 grade as a second source.
Recomendado
Legacy Computer Peripheral Replacement
The EPM5192GM-2 is commonly used to sustain legacy VMEbus, VXIbus, and Multibus systems by emulating obsolete peripheral controllers, DMA engines, and interrupt handlers in a single reprogrammable device. The 192-macrocell density handles the equivalent of 8-12 discrete PALs and a handful of 74LS glue logic, restoring board functionality without re-spinning the entire backplane. The UV window allows engineering teams to iterate firmware fixes for new peripheral attachments without board rework. Recommended pairing with the EPM5192GM-1 grade when timing margin becomes a concern in faster peripheral upgrades.
Recomendado
Prototype and Engineering Development Platform
The EPM5192GM-2's UV-transparent ceramic window makes it a strong laboratory workhorse for developing and iterating state machines, datapath controllers, and interface bridges before committing to one-time-programmable or modern CPLD silicon. Engineers can erase and re-program the device 50-100 times during development, then migrate the verified netlist to a production CPLD (MAX 7000 or MAX V) once the design stabilizes. The 84-pin PGA socket simplifies board bring-up and design swaps. For sustained production, transition to a non-windowed ceramic or plastic package variant from the same MAX 5000 family.
Recomendado
Space and Radiation-Tolerant Subsystems
Although not formally radiation-hardened, the EPM5192GM-2's ceramic PGA packaging, mature CMOS process, and Altera MAX 5000 family heritage make it a candidate for non-critical subsystems in low-earth-orbit small-satellite constellations where radiation tolerance budgets allow commercial-grade silicon. The 192 macrocells can host command/telemetry handling, sensor-multiplexing logic, and attitude-control state machines in a single package, reducing board area and mass compared to discrete PAL implementations. The ceramic PGA also tolerates the wide temperature swings of orbital environments better than plastic packages. Mission planners should still perform lot-specific radiation characterization and consider QML-V or QML-Q equivalents for critical functions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM5192GM-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM5192GM | EPM5192GM-1 | EPM5192GM-1/883B | EPM5130GM883B | EPM5128GM/883B |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | PGA-84 (Ceramic, Windowed) | PGA-84 (Ceramic, Windowed) - same | PGA-84 (Ceramic, Windowed) - same | PGA-84 (Ceramic, Windowed) - same | PGA-84 (Ceramic, Windowed) - same | PGA-84 (Ceramic, Windowed) - same |
| Macrocell Count | 192 | 192 (same die) | 192 (same die) | 192 (same die) | 128 (-33%) | 128 (-33%) |
| Speed Grade | -2 (55 ns) | Default grade | -1 (faster than -2) | -1 + MIL-STD-883B | MIL-STD-883B screened | MIL-STD-883B screened |
| Process / Technology | CMOS, UV-erasable | CMOS, UV-erasable | CMOS, UV-erasable | CMOS, UV-erasable | CMOS, UV-erasable | CMOS, UV-erasable |
| MIL-STD-883B Screening | No (industrial lot) | No | No | Yes | Yes | Yes |
| UV Erasure Window | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete / Last-time-buy | Obsolete / Last-time-buy | Obsolete / Last-time-buy | Mature, MIL supply may extend | Mature, MIL supply may extend | Mature, MIL supply may extend |
Principais diferenciais
- Same die as -1 grade, lower cost per unit at relaxed timing (vs EPM5192GM-1)
- Higher macrocell density in the same footprint (vs EPM5128GM/883B)
- Industrial-grade screening, lowest unit price among PGA-84 MAX 5000 family (vs EPM5192GM-1/883B)
Notas de projeto
The ceramic PGA-84 package of the EPM5192GM-2 is hermetic and offers good thermal conductivity but the through-hole pin grid is sized for socket mounting rather than direct PCB heatsinking. Estimate: at 5 V VCC with all 192 macrocells switching at moderate toggle rates, junction-to-ambient thermal resistance (theta_JA) for a PGA-84 in still air is typically 30-40 C/W. Mount the device in a PGA socket with adequate clearance above the PCB; do not pot or encapsulate the UV window.
Use a high-quality PGA-84 socket (e.g., machine-pin or low-insertion-force type) rated for at least 100 insertion cycles to support field replacement and laboratory UV-erase/reprogramming cycles. Decouple each VCC pin with a 0.1 uF ceramic capacitor placed as close to the pin lead as the socket geometry allows, plus a bulk 10 uF tantalum near the socket. Maintain a ground plane on an inner PCB layer and stitch the PGA socket perimeter with multiple ground via rows for signal-integrity and EMI suppression.
Do not use a plastic-erasable-window simulator (plastic packages) when designing the UV-erase procedure - only the ceramic-windowed PGA variant erases properly under UV exposure. Cover the quartz window with opaque electrical tape after programming to prevent accidental erasure from ambient UV (sunlight through windows, fluorescent lamps). For prototype re-erase cycles, use a calibrated UV eraser rated at the wavelength and intensity specified in the Altera MAX 5000 datasheet - typically 12 mW/cm^2 at 253.7 nm for 20-30 minutes.
Informações de conformidade
Ceramic PGA with UV window typically non-RoHS due to historical lead-bearing ceramic/brazing materials. RoHS and lead-free status must be verified lot-by-lot with the franchised distributor. AEC-Q100 is not applicable - this is a programmable logic device, not an automotive analog/digital IC. The /883B variants carry MIL-STD-883B environmental screening instead.
