EPM5128GM/883B - Military MAX 5000 EPLD 128 Macrocell | Altera
MPN: EPM5128GM/883B ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.5 | $2.50 |
| 10 | $2.4 | $24.00 |
| 100 | $2.3 | $230.00 |
| 500 | $2.2 | $1,100.00 |
| 1,000 | $2.1 | $2,100.00 |
Drop-in alternatives for EPM5128GM/883B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM5128GM/883
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EPM5128GM-2/883B
✅ Drop-In📋 Reference alternative (not in catalog)
EPM5128GM/883
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EPM5128GI
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EPM5128GC
✅ Drop-In✓ In Stock
$19.2 / Unit
View Datasheet →EPM5128GM/883B Maximum Ratings & Electrical Characteristics
| Family | MAX 5000 |
| Device Type | EPLD (Erasable Programmable Logic Device) |
| Macrocells | 128 |
| Package Type | PGA (Pin Grid Array) |
| Package Material | Ceramic (windowed, UV-erasable) |
| Operating Temperature Range | -55C to +125C (military) |
| Process Technology | CMOS, UV-erasable |
| Supply Voltage | 5 V (typical) |
| Programmability | User-configurable, UV-erasable |
| MIL-STD Screening | MIL-STD-883 Class B (per /883B suffix) |
| Mounting Type | Through-hole (PGA socket) |
| Programming Tool | MAX+PLUS II (legacy Altera toolchain) |
| Datasheet | 52 pages, Altera MAX 5000 family datasheet |
EPM5128GM/883B ceramic (windowed, uv-erasable) Pin Configuration Guide
Complete pinout information for EPM5128GM/883B (ceramic (windowed, uv-erasable) package) with [DATA_NEEDED: pin count] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM5128GM/883B.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: pin count] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM5128GM/883B is suitable for 7 applications: Military Avionics Bus Interface Logic, Radar Signal Pre-Processing, Missile Guidance Electronics, Legacy 7400-Series TTL Replacement, Sonar and Underwater Acoustic Systems, Industrial Control and Nuclear-Hardened Systems, Spacecraft Subsystem Electronics.
Military Avionics Bus Interface Logic
The EPM5128GM/883B is well suited to military avionics bus decoding where 1553B, ARINC 429, and discrete signal conditioning must be consolidated into a single high-reliability part. The 128-macrocell MAX 5000 architecture can absorb what would otherwise require dozens of 54LS/54ALS TTL packages, reducing PCB area and improving MTBF. The MIL-STD-883 Class B screening guarantees operation from -55C to +125C, which is essential at high-altitude and supersonic flight envelopes. Predictable pin-locked timing (a hallmark of MAX architecture) eliminates routing-induced skew in synchronous avionics state machines.
Recommended
Radar Signal Pre-Processing
Radar front-end systems require deterministic latency for beam steering, range gating, and I/Q demodulation control. The EPM5128GM/883B provides 128 macrocells and predictable combinational/registered logic paths that can be timed without Monte Carlo simulation, which is critical for radar signal paths where unknown delay skew can shift the beam. The ceramic PGA package withstands vibration and thermal cycling typical of naval and ground-mobile radar installations. Use the EPM5128GM-2/883B speed grade when timing margins are tight, and the standard grade for general control glue logic.
Recommended
Missile Guidance Electronics
The EPM5128GM/883B is qualified for use in missile guidance subsystems where MIL-STD-883 Class B screening, hermetic ceramic packaging, and long-term parts availability through sustainment programs are mandatory. The non-volatile UV-erasable architecture means no boot PROM is required, which reduces board area and eliminates a single-point-of-failure common in SRAM-based FPGAs. The 128-macrocell capacity absorbs guidance computer glue logic, sensor interface conditioning, and actuator drive sequencing in one device, simplifying the BOM and improving reliability.
Recommended
Legacy 7400-Series TTL Replacement
The EPM5128GM/883B was specifically designed to replace racks of 7400-series SSI and MSI TTL with a single programmable part, reducing power, board area, and inventory burden. A single EPM5128GM/883B can integrate up to 100 equivalent PAL/GAL devices plus miscellaneous glue logic. The MAX 5000 family datasheet shows typical design conversions replacing 30-50 SSI packages with one EPLD. The MIL-STD-883B variant maintains the pin-equivalent logic functionality in a military-qualified ceramic package for retrofit of legacy defense electronics.
Recommended
Sonar and Underwater Acoustic Systems
Sonar signal-processing subsystems in surface ships and submarines require high-reliability logic that can survive prolonged vibration, salt-fog exposure, and -55C to +125C thermal swings. The EPM5128GM/883B's hermetic ceramic PGA and MIL-STD-883 Class B screening make it a fit-and-forget replacement for legacy TTL in these systems. The 128-macrocell count handles beam-forming control, hydrophone multiplexing, and timing/sequencing for pulse transmission. Sustained availability through military parts-control programs is a key advantage over modern CPLDs that change silicon revisions frequently.
Recommended
Industrial Control and Nuclear-Hardened Systems
Nuclear-hardened and radiation-tolerant industrial controls require EPLDs that can withstand total ionizing dose and single-event effects without reconfiguration. The EPM5128GM/883B's non-volatile MAX 5000 architecture is immune to configuration SEU, a common failure mode in SRAM-based FPGAs. Combined with MIL-STD-883 Class B screening, it is widely used in reactor instrumentation, safety shutdown systems, and process-control PLCs where deterministic logic is non-negotiable. For lower-criticality industrial applications, the commercial EPM5128GM delivers the same logic capacity at lower cost.
Recommended
Spacecraft Subsystem Electronics
Low-earth-orbit and geostationary satellite subsystems historically used MAX 5000 EPLDs because of their non-volatile configuration, predictable timing, and proven space heritage. The EPM5128GM/883B continues to serve in sustainment programs for legacy satellite constellations where any redesign would require full re-qualification. The 128 macrocells handle command/telemetry decoding, attitude-control sensor conditioning, and propulsion valve drive logic. For new spacecraft programs, modern radiation-hardened FPGAs are now preferred, but the EPM5128GM/883B remains valuable for spare-part provisioning.
Recommended
Recommended Products Summary
Engineering reference data for EPM5128GM/883B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5128GM/883 | EPM5128GM-2/883B | EPM5128GM | EPM5128GI | EPM5128GC |
|---|---|---|---|---|---|---|
| Package | Ceramic PGA (windowed) | Ceramic PGA (windowed) - same | Ceramic PGA (windowed) - same | Ceramic PGA (windowed) - same | Ceramic PGA (windowed) - same | Ceramic PGA (windowed) - same |
| Brand | Altera | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Macrocells | 128 | 128 | 128 | 128 | 128 | 128 |
| MIL-STD-883 Screening | Class B | Class B equivalent | Class B | None (commercial) | None (industrial) | None (ceramic commercial) |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | 0C to +70C | -40C to +85C | 0C to +70C |
| Speed Grade | Standard | Standard | -2 (faster tPD) | Standard | Standard | Standard |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Programming Tool | MAX+PLUS II | MAX+PLUS II | MAX+PLUS II | MAX+PLUS II | MAX+PLUS II | MAX+PLUS II |
| Approx. Unit Price (qty 1, as of 2026-09-12) | USD 2.50 | USD [DATA_NEEDED] | USD [DATA_NEEDED] | USD [DATA_NEEDED] | USD [DATA_NEEDED] | USD [DATA_NEEDED] |
Key Differentiators
- MIL-STD-883 Class B full screening (vs EPM5128GM (commercial))
- Same-die drop-in compatibility with -2 speed grade (vs EPM5128GM-2/883B)
- Non-volatile UV-erasable configuration (vs SRAM-based FPGAs (Cyclone, etc.))
- Predictable pin-locked timing (vs Modern CPLDs (MAX II/V))
Design Notes
The EPM5128GM/883B is screened for -55C to +125C operation per MIL-STD-883 Class B, which means the ceramic PGA package is engineered to handle the full military thermal range. Designers must still verify junction temperature in worst-case enclosed military enclosures where ambient may approach +90C with little airflow; adding a small heatsink or thermal pad between the ceramic PGA and the chassis can lower junction temperature by 8-15C. The hermetic ceramic lid also acts as a heat spreader, helping keep the silicon die temperature uniform across macrocell usage patterns.
Do not attempt to program the EPM5128GM/883B with modern Intel Quartus Prime software - the MAX 5000 family is supported only by the legacy MAX+PLUS II toolchain. Designers restoring legacy systems must source MAX+PLUS II from long-term archival repositories and pair it with an Altera Master Programming Unit (or compatible third-party programmer such as BP Microsystems). Also note that the ceramic PGA window is UV-transparent: cover the window with opaque label after programming to prevent data loss under sunlight or fluorescent UV exposure.
The ceramic PGA package requires a through-hole socket (e.g., machined-pin PGA socket with gold contacts) for reliable field serviceability; solder-mounting the PGA directly to the PCB is possible but makes rework difficult and risks thermal-shock cracking of the ceramic body. Provide a 0.1 inch (2.54 mm) keep-out zone around the PGA for the socket housing, and route all high-speed signals on inner layers with controlled impedance (50 ohm typical) to minimize reflections. Decouple each power pin with a 0.1 uF X7R ceramic + 10 uF tantalum pair, placed within 5 mm of the pin.
When laying out a PCB for the EPM5128GM/883B, group all high-speed I/O on adjacent PGA pins to minimize loop inductance in the decoupling path. The MAX 5000 architecture uses fixed pin-locked timing, so signal integrity is largely a function of PCB routing - keep matched-length pairs within 1.5 mm tolerance and use a continuous ground plane on the layer directly beneath the PGA socket. Avoid routing clock signals over the PGA window aperture to minimize capacitive coupling.
Compliance Information
RoHS and lead-free status not stated in available data. MIL-STD-883 Class B screening implies lead-bearing ceramic package with hermetic sealing, typically exempted from RoHS under military/aerospace provisions. AEC-Q100 not applicable (this is a programmable logic device, not an automotive analog IC).
