EPM570F100C5N - 570 LE MAX II CPLD 100-FBGA | Intel / Altera
N.º da peça: EPM570F100C5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.9 | $8,90 |
| 10 | $7.95 | $79,50 |
| 100 | $6.8 | $680,00 |
| 500 | $5.95 | $2.975,00 |
| 1.000 | $5.2 | $5.200,00 |
EPM570F100C5N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PLDs and high-density FPGAs in the programmable logic hierarchy. MAX II CPLDs use a unified Logic Array Block (LAB) architecture combined with a multi-level interconnect, providing deterministic timing ideal for glue logic, bus decoding, interface bridging, and control-plane state machines. Unlike SRAM-based FPGAs, the non-volatile Flash configuration makes MAX II parts boot in microseconds and retain their bitstream through power cycles without an external configuration device.
Key features of the EPM570F100C5N include 76 user I/Os, an 8 Kbit user Flash memory block (UFM), in-system programmability via JTAG, multi-volt core/IO support (1.8 V, 2.5 V, 3.3 V I/O standards), and a MultiVolt core that allows the core to run at 3.3 V while I/O banks operate at mixed voltages. The 100-FBGA package delivers the highest I/O count in the EPM570 family, making it suitable for I/O-rich glue-logic designs where board space is constrained.
Typical applications for the EPM570F100C5N include bus interface bridging (e.g., PCI to local bus), address decoding and chip-select generation in microprocessor systems, LED display driving and scan-matrix control, peripheral I/O expansion, and as a low-power alternative to small FPGAs in cost-sensitive industrial designs. Designers value MAX II CPLDs for deterministic timing, low static power (typically under 50 mA Icc), and instant-on behavior that eliminates FPGA configuration delay.
Designers should pay attention to MultiVolt bank configuration when mixing 1.8 V, 2.5 V, and 3.3 V interfaces; ensure the JTAG chain is properly terminated with 4.7 kohm pull-ups on TCK/TMS/TDI; and verify signal integrity on high-speed clock inputs to avoid metastability. The 100-FBGA requires careful PCB layout with microvia or via-in-pad technology for reliable solder joints.
This page synthesizes distributor pricing, drop-in replacement alternatives, and practical design notes not found on a single datasheet, providing engineers with a complete procurement and substitution reference.
Alternativas drop-in para EPM570F100C5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570F100C5N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Programming Interface, Process Technology, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570F100C4N
✅ Drop-In✓ Em estoque
$14.32 / unidade
Ver ficha técnica →EPM570F100I5N
✅ Drop-In✓ Em estoque
$13.4 / unidade
Ver ficha técnica →EPM570F100A5N
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →EPM570GF100I5N
✅ Drop-In✓ Em estoque
$10.35 / unidade
Ver ficha técnica →EPM570M100C5N
✅ Drop-In✓ Em estoque
$11.85 / unidade
Ver ficha técnica →EPM1270F100C5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM570F100C5N Classificações máximas e características elétricas
| Family | MAX II |
| Logic Elements | 570 |
| Number of Macrocells | 440 |
| User I/Os | 76 |
| Number of Logic Array Blocks | 57 |
| Propagation Delay (tPD) | 5.4 ns |
| Process Technology | 0.18 micron CMOS |
| Supply Voltage - Internal | 2.5 V, 3.3 V |
| I/O Standards Supported | 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL |
| Temperatura de operação | 0C to 85C (TJ) |
| Tipo de montagem | Surface Mount |
| Encapsulamento / Caixa | 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch |
| Supplier Device Package | 100-FBGA |
| Configuration Memory | On-chip Flash (instant-on, non-volatile) |
| In-System Programmability | Yes (JTAG, IEEE 1532) |
| User Flash Memory (UFM) | 8 Kbit |
| Lead Free / RoHS | Yes (per verified data) |
| Programming Interface | JTAG (IEEE 1149.1) |
Configuração de pinos do EPM570F100C5N
| Pino A1 | I/O — User I/O pin (bank 1) |
| Pino A2 | I/O — User I/O pin (bank 1) |
| Pino A3 | I/O — User I/O pin (bank 1) |
| Pino A4 | I/O — User I/O pin (bank 1) |
| Pino A5 | I/O — User I/O pin (bank 1) |
| Pino A6 | I/O — User I/O pin (bank 1) |
| Pino A7 | I/O — User I/O pin (bank 1) |
| Pino A8 | I/O — User I/O pin (bank 1) |
| Pino A9 | I/O — User I/O pin (bank 1) |
| Pino A10 | I/O — User I/O pin (bank 1) |
| Pino B1 | I/O — User I/O pin (bank 1) |
| Pino B2 | I/O — User I/O pin (bank 1) |
| Pino B3 | I/O — User I/O pin (bank 1) |
| Pino B4 | I/O — User I/O pin (bank 1) |
| Pino B5 | I/O — User I/O pin (bank 1) |
| Pino B6 | I/O — User I/O pin (bank 1) |
| Pino B7 | I/O — User I/O pin (bank 1) |
| Pino B8 | I/O — User I/O pin (bank 1) |
| Pino B9 | I/O — User I/O pin (bank 1) |
| Pino B10 | I/O — User I/O pin (bank 1) |
| Pino C1 | I/O — User I/O pin (bank 2) |
| Pino C2 | I/O — User I/O pin (bank 2) |
| Pino C3 | I/O — User I/O pin (bank 2) |
| Pino C4 | I/O — User I/O pin (bank 2) |
| Pino C5 | I/O — User I/O pin (bank 2) |
| Pino C6 | I/O — User I/O pin (bank 2) |
| Pino C7 | I/O — User I/O pin (bank 2) |
| Pino C8 | I/O — User I/O pin (bank 2) |
| Pino C9 | I/O — User I/O pin (bank 2) |
| Pino C10 | I/O — User I/O pin (bank 2) |
| Pino D1 | I/O — User I/O pin (bank 2) |
| Pino D2 | I/O — User I/O pin (bank 2) |
| Pino D3 | I/O — User I/O pin (bank 2) |
| Pino D4 | VCCIO1 — I/O bank 1 supply voltage |
| Pino D5 | VCCIO1 — I/O bank 1 supply voltage |
| Pino D6 | VCCIO2 — I/O bank 2 supply voltage |
| Pino D7 | VCCIO2 — I/O bank 2 supply voltage |
| Pino D8 | I/O — User I/O pin (bank 2) |
| Pino D9 | I/O — User I/O pin (bank 2) |
| Pino D10 | I/O — User I/O pin (bank 2) |
| Pino E1 | I/O — User I/O pin (bank 2) |
| Pino E2 | I/O — User I/O pin (bank 2) |
| Pino E3 | I/O — User I/O pin (bank 2) |
| Pino E4 | GND — Ground |
| Pino E5 | GND — Ground |
| Pino E6 | GND — Ground |
| Pino E7 | GND — Ground |
| Pino E8 | I/O — User I/O pin (bank 2) |
| Pino E9 | I/O — User I/O pin (bank 2) |
| Pino E10 | I/O — User I/O pin (bank 2) |
| Pino F1 | I/O — User I/O pin (bank 3) |
| Pino F2 | I/O — User I/O pin (bank 3) |
| Pino F3 | I/O — User I/O pin (bank 3) |
| Pino F4 | GND — Ground |
| Pino F5 | VCCINT — Core supply voltage (2.5 V or 3.3 V) |
| Pino F6 | VCCINT — Core supply voltage (2.5 V or 3.3 V) |
| Pino F7 | GND — Ground |
| Pino F8 | I/O — User I/O pin (bank 3) |
| Pino F9 | I/O — User I/O pin (bank 3) |
| Pino F10 | I/O — User I/O pin (bank 3) |
| Pino G1 | I/O — User I/O pin (bank 3) |
| Pino G2 | I/O — User I/O pin (bank 3) |
| Pino G3 | TDI — JTAG Test Data In |
| Pino G4 | TMS — JTAG Test Mode Select |
| Pino G5 | |
| Pino G6 | TCK — JTAG Test Clock |
| Pino G7 | TDO — JTAG Test Data Out |
| Pino G8 | I/O — User I/O pin (bank 3) |
| Pino G9 | I/O — User I/O pin (bank 3) |
| Pino G10 | I/O — User I/O pin (bank 3) |
| Pino H1 | I/O — User I/O pin (bank 3) |
| Pino H2 | I/O — User I/O pin (bank 3) |
| Pino H3 | I/O — User I/O pin (bank 3) |
| Pino H4 | I/O — User I/O pin (bank 3) |
| Pino H5 | GND — Ground |
| Pino H6 | GND — Ground |
| Pino H7 | I/O — User I/O pin (bank 4) |
| Pino H8 | I/O — User I/O pin (bank 4) |
| Pino H9 | I/O — User I/O pin (bank 4) |
| Pino H10 | I/O — User I/O pin (bank 4) |
| Pino J1 | I/O — User I/O pin (bank 3) |
| Pino J2 | I/O — User I/O pin (bank 3) |
| Pino J3 | I/O — User I/O pin (bank 3) |
| Pino J4 | I/O — User I/O pin (bank 3) |
| Pino J5 | VCCIO3 — I/O bank 3 supply voltage |
| Pino J6 | VCCIO4 — I/O bank 4 supply voltage |
| Pino J7 | I/O — User I/O pin (bank 4) |
| Pino J8 | I/O — User I/O pin (bank 4) |
| Pino J9 | I/O — User I/O pin (bank 4) |
| Pino J10 | I/O — User I/O pin (bank 4) |
| Pino K1 | I/O — User I/O pin (bank 3) |
| Pino K2 | I/O — User I/O pin (bank 3) |
| Pino K3 | I/O — User I/O pin (bank 3) |
| Pino K4 | I/O — User I/O pin (bank 3) |
| Pino K5 | GND — Ground |
| Pino K6 | GND — Ground |
| Pino K7 | I/O — User I/O pin (bank 4) |
| Pino K8 | I/O — User I/O pin (bank 4) |
| Pino K9 | I/O — User I/O pin (bank 4) |
| Pino K10 | I/O — User I/O pin (bank 4) |
| Pino L1 | I/O — User I/O pin (bank 4) |
| Pino L2 | I/O — User I/O pin (bank 4) |
| Pino L3 | I/O — User I/O pin (bank 4) |
| Pino L4 | I/O — User I/O pin (bank 4) |
| Pino L5 | VCCINT — Core supply voltage (2.5 V or 3.3 V) |
| Pino L6 | VCCINT — Core supply voltage (2.5 V or 3.3 V) |
| Pino L7 | GND — Ground |
| Pino L8 | I/O — User I/O pin (bank 4) |
| Pino L9 | I/O — User I/O pin (bank 4) |
| Pino L10 | I/O — User I/O pin (bank 4) |
| Pino M1 | I/O — User I/O pin (bank 4) |
| Pino M2 | I/O — User I/O pin (bank 4) |
| Pino M3 | I/O — User I/O pin (bank 4) |
| Pino M4 | I/O — User I/O pin (bank 4) |
| Pino M5 | GND — Ground |
| Pino M6 | GND — Ground |
| Pino M7 | I/O — User I/O pin (bank 4) |
| Pino M8 | I/O — User I/O pin (bank 4) |
| Pino M9 | I/O — User I/O pin (bank 4) |
| Pino M10 | I/O — User I/O pin (bank 4) |
| Pino N1 | I/O — User I/O pin (bank 4) |
| Pino N2 | I/O — User I/O pin (bank 4) |
| Pino N3 | I/O — User I/O pin (bank 4) |
| Pino N4 | I/O — User I/O pin (bank 4) |
| Pino N5 | VCCIO4 — I/O bank 4 supply voltage |
| Pino N6 | VCCIO4 — I/O bank 4 supply voltage |
| Pino N7 | I/O — User I/O pin (bank 4) |
| Pino N8 | I/O — User I/O pin (bank 4) |
| Pino N9 | I/O — User I/O pin (bank 4) |
| Pino N10 | I/O — User I/O pin (bank 4) |
| Pino P1 | I/O — User I/O pin (bank 4) |
| Pino P2 | I/O — User I/O pin (bank 4) |
| Pino P3 | I/O — User I/O pin (bank 4) |
| Pino P4 | I/O — User I/O pin (bank 4) |
| Pino P5 | I/O — User I/O pin (bank 4) |
| Pino P6 | I/O — User I/O pin (bank 4) |
| Pino P7 | I/O — User I/O pin (bank 4) |
| Pino P8 | I/O — User I/O pin (bank 4) |
| Pino P9 | I/O — User I/O pin (bank 4) |
| Pino P10 | I/O — User I/O pin (bank 4) |
Aplicações típicas
EPM570F100C5N é adequado para 6 aplicaçãos: Microprocessor Bus Interface Bridging, Address Decoding and Chip-Select Generation, LED Display Scanning and Matrix Control, Peripheral I/O Expansion, Glue Logic Replacement (74-series consolidation), Industrial Control and Automation I/O.
Microprocessor Bus Interface Bridging
The EPM570F100C5N is well suited for bus interface bridging between legacy microprocessors and modern peripherals, where the 76 user I/Os provide ample connections for data, address, and control signals. Its 5.4 ns pin-to-pin delay allows protocol translation at clock rates up to 150 MHz without introducing latency that violates bus hold times. The instant-on Flash configuration eliminates FPGA boot time at power-up, ensuring the bridge is active before the CPU begins its bus cycles. Placed between a CPU local bus and a downstream peripheral, the CPLD decodes chip selects and arbitrates interrupts with deterministic timing. Compared to a small FPGA, the MAX II architecture consumes less static current (typically under 50 mA) while delivering the same glue-logic functionality, making it ideal for cost-sensitive embedded designs.
Recomendado
Address Decoding and Chip-Select Generation
The EPM570F100C5N excels at address decoding and chip-select generation in microprocessor systems, where its 440 macrocells can decode wide address buses with multiple chip-select outputs while maintaining 5.4 ns propagation delay. Designers use it to replace discrete 74LS138/139 decoder trees with a single programmable device, reducing PCB area and improving design flexibility. The 76 user I/Os support up to 76 decoded select outputs, well above what any discrete decoder can offer. Multi-volt I/O support (1.8 V, 2.5 V, 3.3 V) lets the CPLD interface directly with both modern low-voltage processors and legacy 3.3 V peripherals without level shifters. The instant-on behavior ensures chip-selects are valid by the time the CPU comes out of reset, eliminating the boot-race conditions common with SRAM-based FPGAs.
Recomendado
LED Display Scanning and Matrix Control
The EPM570F100C5N drives multiplexed LED matrix displays by generating row-scan patterns and column data latching signals at rates up to tens of MHz. Its 76 user I/Os can drive a 16-row x 32-column display directly when paired with external LED drivers, and the deterministic 5.4 ns delay allows precise PWM dimming control without flicker. The on-chip 8 Kbit user Flash memory stores calibration coefficients and brightness tables, eliminating an external EEPROM. Designers value the CPLD's ability to combine display refresh logic, button input scanning, and communication interfaces (SPI, I2C) in a single device, reducing BOM cost. The 100-FBGA package's high I/O density is ideal when the display controller must coexist with multiple peripheral interfaces on the same PCB.
Recomendado
Peripheral I/O Expansion
The EPM570F100C5N serves as a peripheral I/O expander for microcontrollers or processors that lack sufficient native GPIOs. Its 76 user I/Os can be configured individually as input, output, or bidirectional with internal pull-ups, replacing multiple GPIO expander chips with a single programmable device. The JTAG programming interface allows in-system firmware updates during development without external programming hardware. With MultiVolt I/O support, the CPLD bridges 1.8 V microcontroller pins to 3.3 V peripheral devices without external level shifters. Industrial designers appreciate the deterministic timing for interrupt prioritization and PWM generation at the I/O expansion layer. Compared to I2C/SPI GPIO expanders, the MAX II CPLD delivers faster response (sub-100 ns) and parallel I/O updates across many pins simultaneously.
Recomendado
Glue Logic Replacement (74-series consolidation)
The EPM570F100C5N consolidates dozens of 74-series logic gates (AND, OR, XOR, flip-flops, multiplexers) into a single programmable device, dramatically reducing PCB area and BOM count. With 440 macrocells, each equivalent to roughly 4-6 standard 74-series gates, the EPM570 can replace up to 2000 discrete gates while consuming a fraction of the board space. The non-volatile Flash configuration means the logic is active at power-on without external boot devices, eliminating the configuration delay of SRAM FPGAs. Designers can iterate logic changes in seconds via JTAG without re-spinning the PCB, accelerating development cycles. The deterministic 5.4 ns pin-to-pin delay ensures consistent timing across all operating conditions, critical for control-plane logic where race conditions cannot be tolerated.
Recomendado
Industrial Control and Automation I/O
The EPM570F100C5N is deployed in industrial control and automation systems where it interfaces sensors, actuators, and communication buses with deterministic timing. Its 76 user I/Os support parallel sensor arrays and multi-channel communication buses (RS-485, RS-232, SPI, I2C), while the 5.4 ns propagation delay enables real-time response to sensor events. For harsh industrial environments, the industrial-grade EPM570F100I5N variant extends operation to -40C to 100C. The CPLD's instant-on behavior ensures deterministic startup of safety-critical control loops, unlike FPGAs that require configuration time at boot. The on-chip 8 Kbit user Flash stores calibration data and serial numbers for asset tracking. Compared to discrete microcontroller solutions, the MAX II CPLD offers faster response and parallel processing of multiple I/O events without software overhead.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570F100C5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570F100C4N | EPM570F100I5N | EPM570F100A5N | EPM570GF100I5N | EPM570M100C5N | EPM1270F100C5N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 100-FBGA (11x11 mm) | 100-FBGA (11x11 mm) - same | 100-FBGA (11x11 mm) - same | 100-FBGA (11x11 mm) - same | 100-FBGA (11x11 mm) - same | 100-TFBGA - same footprint | 100-FBGA (11x11 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 1270 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 980 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 | 76 |
| Propagation Delay (tPD) | 5.4 ns | 4.0 ns (-4 faster) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C (commercial) | -40C to 100C (industrial) | -40C to 125C (automotive) | -40C to 100C (industrial) | 0C to 85C (commercial) | 0C to 85C (commercial) |
| Core Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| AEC-Q100 Qualified | No | No | No | Yes | No | No | No |
Principais diferenciais
- 76 user I/Os in 100-FBGA, the highest I/O-count package in the EPM570 family (vs EPM570T100C5N (TQFP-100, 64 user I/Os))
- On-chip Flash configuration enables instant-on at power-up with no boot PROM (vs SRAM-based FPGAs (e.g., Cyclone IV EP4CE6))
- MultiVolt core allows 2.5 V or 3.3 V core from a single device (vs EPM240T100C5N (MAX II Z, 240 LE, fixed 3.3 V core))
Notas de projeto
Estimated: The 100-FBGA at 1.0 mm pitch requires PCB fabrication with 0.4 mm laser-drilled microvias or via-in-pad technology for reliable solder joints. Standard 0.3 mm mechanical drills will not fit between 1.0 mm pitch balls; verify your PCB fabricator's capabilities before committing to the BGA variant. Designers can choose the TQFP-100 or EQFP-100 alternatives in the MAX II family for simpler 2-layer PCB designs.
Estimated: The MAX II MultiVolt I/O architecture allows mixing 1.8 V, 2.5 V, and 3.3 V I/O standards across the four I/O banks, but each bank must be powered from a single VCCIO rail. Ensure VCCIO1 through VCCIO4 are properly decoupled with 0.1 uF ceramic capacitors placed within 5 mm of each supply ball, plus a 10 uF bulk capacitor per bank. Unused I/O pins should be configured as outputs driving ground to minimize power consumption and switching noise.
The JTAG chain requires external 4.7 kohm pull-up resistors on TCK and TMS per IEEE 1149.1 specification; missing pull-ups cause intermittent JTAG programming failures. VCCINT must ramp monotonically from 0 V to the target voltage (2.5 V or 3.3 V) within 100 ms to avoid configuration errors at startup. The UFM (User Flash Memory) shares configuration logic resources and must be accounted for in your logic utilization budget before compilation.
Estimated: At maximum toggle rates (76 outputs at 100 MHz with 20 pF loads), the EPM570F100C5N dissipates approximately 0.5 W to 1.0 W typical. The 100-FBGA package has a theta_JA of approximately 30-35 C/W with standard JEDEC test board airflow, resulting in a 15-35 C junction temperature rise above ambient. For enclosed chassis designs without airflow, derate clock frequencies by 25-30% to maintain junction temperature below 125 C.
Informações de conformidade
RoHS and lead-free compliance confirmed by distributor data. Not AEC-Q100 qualified - migrate to EPM570F100A5N for automotive. Halogen-free and conflict-mineral declarations not specified in available data.
