EPM570GT100C3 - MAX II CPLD, 570 LEs, 100-TQFP | Altera (Intel)
N.º da peça: EPM570GT100C3 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $13.31 | $13,31 |
| 10 | $12.45 | $124,50 |
| 100 | $11.2 | $1.120,00 |
| 500 | $10.1 | $5.050,00 |
| 1.000 | $9.05 | $9.050,00 |
EPM570GT100C3 Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on, deterministic behavior of traditional PAL/GAL architectures with modern flash-backed configuration memory. In the broader programmable logic hierarchy, CPLDs sit below FPGAs in density but above simple PLDs in capability, offering deterministic timing, high I/O count, and zero-configuration boot time. The MAX II family specifically targets low-power, low-cost glue logic, bus bridging, and I/O expansion roles that FPGAs over-serve.
Key features of the EPM570GT100C3 include 570 logic elements (440 equivalent macrocells), 76 maximum user I/O pins, four global clocks, an 8 Kbit UFM block, JTAG/IEEE 1149.1 boundary-scan support, and MultiVolt core allowing mixed-voltage interfacing on a single die. Its flash-backed non-volatile configuration means zero configuration time on power-up, a critical advantage over SRAM-based FPGAs in deterministic boot applications.
The device uses a Lab/Logic Array Block (LAB) architecture with each LAB containing 16 macrocells and a programmable interconnect array (PIA). The 0.18 µm embedded flash process delivers low dynamic power and high noise immunity, while the 100-pin TQFP package with exposed-pad-compatible footprint simplifies thermal dissipation in space-constrained designs.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-supply sequencing and supervisory glue logic, interface translation between 3.3 V and 1.8 V domains, LED display drivers, and legacy peripheral replacement. The commercial-extended temperature grade also suits benign industrial environments and telecom line cards.
When designing with the EPM570GT100C3, observe the I/O bank VCCIO constraints (each bank must be powered before or simultaneously with the core VCCINT) and provide adequate decoupling (0.1 µF ceramic at every VCC pin) to suppress flash-programming noise. The Quartus II / Quartus Prime toolchain is required for synthesis, fitting, and JTAG programming.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para EPM570GT100C3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570GT100C3 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Programming Interface, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570GT100C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$11.05 / unidade
Ver ficha técnica →EPM570GT100I5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$16.5 / unidade
Ver ficha técnica →EPM570F100C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.2 / unidade
Ver ficha técnica →EPM570T100A5N
✅ Drop-In✓ Em estoque
$6.72 / unidade
Ver ficha técnica →EPM570T100C5N
✅ Drop-In✓ Em estoque
$10.2 / unidade
Ver ficha técnica →EPM570F100A5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.85 / unidade
Ver ficha técnica →EPM570GT100C3 Classificações máximas e características elétricas
| Family | MAX II |
| Logic Elements | 570 |
| Equivalent Macrocells | 440 |
| Maximum User I/O | 76 |
| User Flash Memory (UFM) | 8 Kbit |
| Internal Operating Frequency | 304 MHz |
| Global Clocks | 4 |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Programmability | In-System Programmable (JTAG / IEEE 1149.1) |
| Configuration Memory | Non-volatile flash (instant-on, zero boot time) |
| Temperatura de operação | 0 °C to +85 °C (commercial extended) |
| Encapsulamento | 100-pin TQFP (14 x 14 mm) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do EPM570GT100C3
| Pino 1 | I/O — User I/O (Bank 1) |
| Pino 2 | I/O — User I/O (Bank 1) |
| Pino 3 | I/O — User I/O (Bank 1) |
| Pino 4 | I/O — User I/O (Bank 1) |
| Pino 5 | I/O — User I/O (Bank 1) |
| Pino 6 | GND — Ground |
| Pino 7 | I/O — User I/O (Bank 1) |
| Pino 8 | I/O — User I/O (Bank 1) |
| Pino 9 | I/O — User I/O (Bank 1) |
| Pino 10 | I/O — User I/O (Bank 1) |
| Pino 11 | VCCIO1 — Bank 1 I/O supply (1.5/1.8/2.5/3.3 V) |
| Pino 12 | I/O — User I/O (Bank 1) |
| Pino 13 | I/O — User I/O (Bank 1) |
| Pino 14 | I/O — User I/O (Bank 1) |
| Pino 15 | I/O — User I/O (Bank 1) |
| Pino 16 | GND — Ground |
| Pino 17 | I/O — User I/O (Bank 1) |
| Pino 18 | I/O — User I/O (Bank 1) |
| Pino 19 | I/O — User I/O (Bank 1) |
| Pino 20 | I/O — User I/O (Bank 1) |
| Pino 21 | VCCINT — Core supply (1.71-1.89 V) |
| Pino 22 | I/O — User I/O (Bank 1) |
| Pino 23 | I/O — User I/O (Bank 1) |
| Pino 24 | I/O — User I/O (Bank 1) |
| Pino 25 | I/O — User I/O (Bank 1) |
| Pino 26 | GND — Ground |
| Pino 27 | I/O — User I/O (Bank 1) |
| Pino 28 | I/O — User I/O (Bank 1) |
| Pino 29 | I/O — User I/O (Bank 1) |
| Pino 30 | I/O — User I/O (Bank 1) |
| Pino 31 | VCCIO1 — Bank 1 I/O supply |
| Pino 32 | I/O — User I/O (Bank 2) |
| Pino 33 | I/O — User I/O (Bank 2) |
| Pino 34 | I/O — User I/O (Bank 2) |
| Pino 35 | I/O — User I/O (Bank 2) |
| Pino 36 | GND — Ground |
| Pino 37 | I/O — User I/O (Bank 2) |
| Pino 38 | I/O — User I/O (Bank 2) |
| Pino 39 | I/O — User I/O (Bank 2) |
| Pino 40 | I/O — User I/O (Bank 2) |
| Pino 41 | TDI — JTAG Test Data In |
| Pino 42 | TMS — JTAG Test Mode Select |
| Pino 43 | TCK — JTAG Test Clock |
| Pino 44 | nCONFIG — Configuration control (pull high for normal operation) |
| Pino 45 | VCCIO2 — Bank 2 I/O supply |
| Pino 46 | I/O — User I/O (Bank 2) |
| Pino 47 | I/O — User I/O (Bank 2) |
| Pino 48 | I/O — User I/O (Bank 2) |
| Pino 49 | I/O — User I/O (Bank 2) |
| Pino 50 | GND — Ground |
| Pino 51 | I/O — User I/O (Bank 2) |
| Pino 52 | I/O — User I/O (Bank 2) |
| Pino 53 | I/O — User I/O (Bank 2) |
| Pino 54 | I/O — User I/O (Bank 2) |
| Pino 55 | VCCINT — Core supply (1.71-1.89 V) |
| Pino 56 | I/O — User I/O (Bank 2) |
| Pino 57 | I/O — User I/O (Bank 2) |
| Pino 58 | I/O — User I/O (Bank 2) |
| Pino 59 | I/O — User I/O (Bank 2) |
| Pino 60 | GND — Ground |
| Pino 61 | I/O — User I/O (Bank 3) |
| Pino 62 | I/O — User I/O (Bank 3) |
| Pino 63 | I/O — User I/O (Bank 3) |
| Pino 64 | I/O — User I/O (Bank 3) |
| Pino 65 | VCCIO3 — Bank 3 I/O supply |
| Pino 66 | I/O — User I/O (Bank 3) |
| Pino 67 | I/O — User I/O (Bank 3) |
| Pino 68 | I/O — User I/O (Bank 3) |
| Pino 69 | I/O — User I/O (Bank 3) |
| Pino 70 | GND — Ground |
| Pino 71 | I/O — User I/O (Bank 3) |
| Pino 72 | I/O — User I/O (Bank 3) |
| Pino 73 | I/O — User I/O (Bank 3) |
| Pino 74 | I/O — User I/O (Bank 3) |
| Pino 75 | CLK0 — Global clock input 0 / User I/O |
| Pino 76 | VCCIO4 — Bank 4 I/O supply |
| Pino 77 | I/O — User I/O (Bank 4) |
| Pino 78 | I/O — User I/O (Bank 4) |
| Pino 79 | I/O — User I/O (Bank 4) |
| Pino 80 | I/O — User I/O (Bank 4) |
| Pino 81 | GND — Ground |
| Pino 82 | I/O — User I/O (Bank 4) |
| Pino 83 | I/O — User I/O (Bank 4) |
| Pino 84 | I/O — User I/O (Bank 4) |
| Pino 85 | I/O — User I/O (Bank 4) |
| Pino 86 | VCCINT — Core supply (1.71-1.89 V) |
| Pino 87 | I/O — User I/O (Bank 4) |
| Pino 88 | I/O — User I/O (Bank 4) |
| Pino 89 | I/O — User I/O (Bank 4) |
| Pino 90 | I/O — User I/O (Bank 4) |
| Pino 91 | GND — Ground |
| Pino 92 | I/O — User I/O (Bank 4) |
| Pino 93 | I/O — User I/O (Bank 4) |
| Pino 94 | I/O — User I/O (Bank 4) |
| Pino 95 | I/O — User I/O (Bank 4) |
| Pino 96 | CLK1 — Global clock input 1 / User I/O |
| Pino 97 | TDO — JTAG Test Data Out |
| Pino 98 | nCE — Chip enable (active low, tie low for single-device JTAG chain) |
| Pino 99 | nSTATUS — Configuration status (pull-up to VCCIO during normal operation) |
| Pino 100 | CONF_DONE — Configuration done (open-drain, pull-up to VCCIO) |
Aplicações típicas
EPM570GT100C3 é adequado para 6 aplicaçãos: Industrial I/O Expansion and Bus Bridging, Power Supply Sequencing and Supervisory Glue Logic, Legacy Peripheral Replacement and Interface Translation, LED Display Driver and Signage Multiplexing, Telecom Line Card Glue Logic, Consumer Appliance Control Board.
Industrial I/O Expansion and Bus Bridging
The EPM570GT100C3 is well suited to industrial I/O expansion where a microcontroller lacks sufficient pins or voltage domains. Its 76 user I/O across four MultiVolt banks allow direct interfacing between a 3.3 V MCU and 1.8 V peripherals without external level shifters. The 570-LE fabric comfortably fits I2C/SPI-to-parallel bridges, address decoding, and timing-critical glue logic, while the 304 MHz internal frequency keeps glue-logic propagation delays under ~5 ns. The instant-on flash configuration eliminates FPGA boot latency, making it ideal for fail-safe industrial controllers that must respond within milliseconds of power-up.
Recomendado
Power Supply Sequencing and Supervisory Glue Logic
Power-supply sequencers in multi-rail systems demand deterministic, instant-on logic. The EPM570GT100C3's flash-backed non-volatile configuration boots in microseconds with no external configuration PROM, generating enable signals to DC-DC converters in the correct order. Its four global clocks and 0.18 µm flash process provide sub-5 ns tPD for tight power-good timing budgets. The 8 Kbit UFM can store fault logs or trimming values, replacing an external EEPROM. Designers commonly pair it with PWM controllers such as the UCC28C42 or voltage supervisors to build a complete digital power manager.
Recomendado
Legacy Peripheral Replacement and Interface Translation
Many designs require replacing obsolete 74-series glue logic with a single modern device. The EPM570GT100C3 replaces dozens of 74HC/74LVC gates, latches, and bus transceivers while adding 1.5 V-3.3 V voltage translation through its MultiVolt I/O banks. A 570-LE CPLD typically replaces 30-60 discrete SSI/MSI packages, simplifying PCB layout and BOM. The JTAG boundary-scan capability further aids in-circuit testing of legacy boards where bed-of-nails fixtures are impractical. This application is especially relevant for industrial upgrade programs and aerospace sustainment where the original 74xx parts are no longer available.
Recomendado
LED Display Driver and Signage Multiplexing
Large LED matrix displays and channel-letter signage benefit from the EPM570GT100C3's high I/O count and deterministic timing. With 76 user I/O, the CPLD can directly drive 8-bit RGB multiplexers for modest-density matrices or function as a refresh controller for larger panels. The 304 MHz internal frequency supports row-scanning frequencies well above the 100 Hz flicker threshold for high-PWM-bit-depth video walls. MultiVolt I/O allows direct connection to LED driver shift registers operating at 3.3 V or 5 V. The non-volatile configuration means the display controller starts scanning immediately on power-up with no boot splash screen.
Recomendado
Telecom Line Card Glue Logic
Telecom line cards require deterministic, high-reliability glue logic for TDM bus multiplexing, alarm aggregation, and clock distribution. The EPM570GT100C3's flash-backed configuration ensures no boot-time vulnerabilities for line-protection relays, and its 1.71-1.89 V core draws minimal current. The four global clocks can directly feed telecom framers such as the DS26504 or T1/E1 transceivers with sub-3 ns skew. Commercial-extended temperature rating (0 °C to +85 °C) covers most indoor central-office deployments. Compared to a small FPGA, the MAX II offers predictable timing closure without lengthy place-and-route iterations.
Recomendado
Consumer Appliance Control Board
Consumer appliances such as washing machines, induction cooktops, and HVAC controllers need a low-cost, deterministic controller for user-interface scanning, relay driving, and sensor multiplexing. The EPM570GT100C3 replaces microcontrollers in hard-real-time scan loops, with sub-microsecond response to safety-critical inputs. Its 0.18 µm flash process delivers low standby current (<1 mA typical), suiting Energy Star standby requirements. MultiVolt I/O supports direct connection to 3.3 V sensors and 5 V relay drivers without level shifters. Instant-on behavior eliminates MCU firmware boot delays for fast user feedback.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570GT100C3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570GT100C5N | EPM570GT100I5N | EPM570F100C5N | EPM570T100A5N | EPM570T100C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-100 (14x14 mm) | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Speed Grade | C3 (304 MHz) | C5 (~250 MHz) | I5 (industrial temp, speed grade C5) | C5 | A5 (slowest) | C5 |
| Operating Temperature | 0 to +85 C (commercial extended) | 0 to +85 C | -40 to +100 C (industrial) | 0 to +85 C | 0 to +85 C | 0 to +85 C |
| User I/O (max) | 76 | 76 | 76 | 76 | 76 | 76 |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
| Silicon Revision | G | G | G | F (earlier revision) | T (earliest revision) | T (earliest revision) |
Principais diferenciais
- Fastest C3 speed grade in MAX II 570-LE family (vs EPM570GT100C5N)
- Commercial-extended temperature grade with standard silicon revision G (vs EPM570F100C5N)
- Same die as T100A5N/T100C5N but faster speed grade (vs EPM570T100A5N)
Notas de projeto
Decouple every VCCINT pin with a 0.1 µF ceramic capacitor placed within 3 mm of the pin, and bulk-decouple with a 10 µF tantalum or ceramic at the CPLD power entry point. Each VCCIO bank requires its own 0.1 µF + 10 µF decoupling pair because MultiVolt banks switch independently and inject switching noise back into the supply. Power VCCIO banks before or simultaneously with VCCINT to avoid I/O latch-up during ramp-up - the datasheet specifies a maximum VCCIO-VCCINT differential of 0.7 V during power-up sequencing.
Route all JTAG signals (TDI, TDO, TMS, TCK) with 50 Ω controlled impedance and keep the JTAG cable stub shorter than 50 mm total. Place the JTAG connector at the board edge for production programming access. Route nCONFIG, nSTATUS, and CONF_DONE with 10 kΩ pull-ups to VCCIO to prevent spurious configuration events during power glitches. Maintain solid ground planes under the TQFP package; the thermal pad is not exposed on the standard TQFP-100, so rely on copper pours on top and inner layers for heat spreading.
Do not assume that a C5 speed-grade part is bit-stream-compatible with a C3 design - the Quartus fitter generates speed-grade-specific bitstreams. Re-compile the Quartus project when substituting speed grades. Also, do not leave unused I/O floating - configure them as outputs driving low or as inputs with internal pull-up enabled, otherwise floating inputs draw 50-100 µA per pin from leakage. The 8 Kbit UFM has a 100,000-erase-cycle endurance limit - use it for configuration data or trimming values, not for high-write-rate logging.
Group same-bank I/O together on the board to simplify routing and avoid unnecessary VCCIO plane splits. CLK0-CLK3 should each have a short, direct connection to the clock source; avoid routing clock traces over ground splits. For high-speed outputs (>100 MHz), use series termination resistors (22-33 Ω) close to the CPLD pin to dampen reflections. Keep JTAG chain length under 6 inches for reliable ByteBlaster/USB-Blaster programming at 10 MHz TCK.
Informações de conformidade
RoHS compliant per Altera/Intel product page. Lead-free Pb-free assembly. Not AEC-Q100 qualified - industrial-grade part. Commercial extended temperature grade (0 to +85 C).
