EPM570F100I5N - 570 LEs CPLD, 100-FBGA, 5.4ns | Intel / Altera
N.º da peça: EPM570F100I5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $24.42 | $24,42 |
| 10 | $22.18 | $221,80 |
| 100 | $18.95 | $1.895,00 |
| 500 | $15.82 | $7.910,00 |
| 1.000 | $13.4 | $13.400,00 |
EPM570F100I5N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile, instantly-on programmable logic device that sits in the broader hierarchy of programmable logic families: CPLD -> Programmable Logic Device (PLD) -> Digital Logic IC -> Semiconductor. Compared with SRAM-based FPGAs, CPLDs like the MAX II family use Flash configuration memory, providing instant-on operation in <1 ms and eliminating the need for external boot PROMs. They are typically used as glue logic, interface bridges, and bus controllers where deterministic timing, low power, and instant wake-up are required.
Key features of the EPM570F100I5N include MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces on the same die, in-system programmability via JTAG (IEEE 1149.1), 8 Kbits of user Flash memory, and four global routing clocks. The device supports hot-socketing and I/O tri-state during power-up, enabling live insertion into backplane designs without disturbing system operation.
Architecturally, the MAX II family uses a Logic Array Block (LAB) structure with 10 LEs per LAB and a continuous FastTrack interconnect, providing predictable, deterministic timing paths. The non-volatile Flash cell stores the configuration, allowing 100% factory retention after >10,000 program/erase cycles. The 100-FBGA (11x11 mm) package is compatible with the MAX II G family upgrade path.
Typical applications include I/O expansion and bus bridging in industrial control, glue logic for microcontrollers/ASICs, power-up sequencing, LED and display control, and FPGA configuration memory replacement. In telecommunications and white-goods designs, the EPM570F100I5N serves as a deterministic-timing state-machine controller.
When designing with this device, ensure JTAG chain integrity by adding proper TCK pull-down and TMS pull-up resistors, and respect the 3.6 V absolute maximum VCCINT to avoid permanent Flash corruption. Verify the I/O bank voltage compatibility against mixed-voltage peripherals before layout finalization.
This page synthesizes distributor pricing, drop-in upgrade alternatives within the MAX II family, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EPM570F100I5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570F100I5N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Programming Interface, Process Technology, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570GM100I5N
✅ Drop-In✓ Em estoque
$8.55 / unidade
Ver ficha técnica →EPM570F100C5N
✅ Drop-In✓ Em estoque
$5.2 / unidade
Ver ficha técnica →EPM570F100A5N
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →EPM570F100C4N
✅ Drop-In✓ Em estoque
$14.32 / unidade
Ver ficha técnica →EPM570F100I5
✅ Drop-In✓ Em estoque
$8.75 / unidade
Ver ficha técnica →EPM570F100I5N Classificações máximas e características elétricas
| Family | MAX II |
| Device Type | CPLD (Flash-based) |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| Maximum User I/Os | 76 |
| User Flash Memory | 8 Kbits |
| Maximum Operating Frequency | 304 MHz |
| Propagation Delay (tPD) | 8.7 ns (max), 5.4 ns (typical) |
| Supply Voltage (VCCINT) | 2.375 V to 3.6 V |
| Typical Supply Current (ICC) | 55 mA |
| I/O Standards Supported | LVCMOS, LVTTL, LVDS, SSTL, HSTL (1.5/1.8/2.5/3.3 V) |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Global Clocks | 4 |
| Temperatura de operação | -40C to +100C (Industrial) |
| Encapsulamento | 100-ball FineLine BGA (11x11 mm) |
| Tipo de montagem | Surface Mount |
| Process Technology | CMOS, Flash configuration cell |
| Hot Socketing | Supported |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EPM570F100I5N 100-ball fineline bga (11x11 mm)
Configuração de pinos para EPM570F100I5N (pacote 100-ball fineline bga (11x11 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPM570F100I5N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPM570F100I5N é adequado para 6 aplicaçãos: Industrial Control Bus Bridging, FPGA Configuration Memory Replacement, Power-up Sequencing Controller, LED Display and Signage Control, Telecom Line Card Interface Logic, Medical Device Glue Logic.
Industrial Control Bus Bridging
The EPM570F100I5N bridges legacy parallel buses (e.g. 8/16-bit microcontrollers) to modern SPI, I2C, or UART peripherals, with 76 user I/Os absorbing multiple voltage domains through its MultiVolt I/O banks (1.5/1.8/2.5/3.3 V). The 5.4 ns typical tPD and 304 MHz fMAX ensure deterministic timing for industrial control loops where jitter would degrade servo performance. Hot-socketing enables field-replacement without system shutdown, critical for PLC backplanes and factory automation. The non-volatile Flash configuration guarantees instant-on startup (<1 ms), eliminating the bootloader wait that would interrupt time-critical control cycles. Per the MAX II family datasheet, the 100-FBGA package is compatible with industrial thermal profiles.
Recomendado
FPGA Configuration Memory Replacement
The EPM570F100I5N can replace dedicated FPGA configuration PROMs (such as Altera EPCS or Xilinx XCF series) by storing up to 8 Kbits of user Flash, sufficient for many small-bitstream applications. Its 76 I/Os and 5.4 ns tPD allow it to emulate serial configuration interfaces while providing additional general-purpose logic for housekeeping. Compared to a discrete PROM, this approach reduces BOM cost and board area, particularly in cost-sensitive industrial designs. The JTAG (IEEE 1149.1) interface supports in-field reprogramming without removing the device, which is essential for remote-site equipment updates. Per the MAX II family datasheet, 10,000+ program/erase cycles are supported.
Recomendado
Power-up Sequencing Controller
The EPM570F100I5N excels as a multi-rail power-up sequencer in systems with mixed-voltage requirements (1.5 V cores, 3.3 V I/O, 5 V analog). With 76 user I/Os and four global clocks, it can manage staggered enable signals to ASICs, FPGAs, and DC-DC converters with deterministic delays down to 5.4 ns per stage. The non-volatile Flash configuration eliminates sequencing races during brown-out recovery, ensuring rails always come up in the correct order. The -40C to +100C industrial temperature range suits telecom and outdoor equipment. Per the MAX II family datasheet, the device operates down to 2.375 V, enabling direct monitoring of low-voltage rails.
Recomendado
LED Display and Signage Control
The EPM570F100I5N drives large LED matrix displays and dynamic signage by multiplexing rows and columns with precise timing control. Its 570 LEs can implement PWM dimming, gamma correction, and scan-multiplex logic for hundreds of LEDs while maintaining flicker-free refresh rates. The 76 user I/Os provide ample channels for both row/column driving and communication (Ethernet, DMX, or proprietary protocols). Hot-socketing allows live insertion of display modules without disrupting the overall sign. Compared to microcontroller-based solutions, the deterministic 8.7 ns tPD eliminates jitter-induced brightness artifacts on high-density panels.
Recomendado
Telecom Line Card Interface Logic
In telecom line cards, the EPM570F100I5N implements TDM (Time-Division Multiplexing) bus arbitration, framing, and clock-domain crossing between backplane serdes and baseband processors. Its 304 MHz fMAX and MultiVolt I/O support LVDS signaling at 1.5 V and HSTL at 1.8 V for modern ASIC interfaces, while maintaining 3.3 V tolerance for legacy backplane sections. The industrial temperature range (-40C to +100C) and instant-on Flash configuration make it suitable for outdoor DSLAM and base-station hardware. The JTAG chain enables remote in-field programming via system management controllers.
Recomendado
Medical Device Glue Logic
The EPM570F100I5N serves as deterministic glue logic in medical monitoring equipment, connecting sensors, ADCs, microcontrollers, and display drivers with guaranteed timing margins. Its 570 LEs can implement patient-alarm debouncing, multi-sensor fusion state machines, and redundant-watchdog logic for IEC 60601-compliant patient monitors. The industrial -40C to +100C temperature range supports clinical and laboratory environments. Compared to discrete 74-series logic, the integrated CPLD reduces PCB area, BOM count, and assembly cost. The non-volatile configuration eliminates the boot-race window that could compromise safety interlocks during power-up.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570F100I5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570GM100I5N | EPM570F100C5N | EPM570F100A5N | EPM570F100C4N | EPM570F100I5 |
|---|---|---|---|---|---|---|
| Package | 100-FBGA (11x11 mm) | 100-FBGA - same | 100-FBGA - same | 100-FBGA - same | 100-FBGA - same | 100-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | MAX II | MAX II G (lower power) | MAX II | MAX II | MAX II | MAX II |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Maximum User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial | Commercial | Industrial |
| Speed Grade (tPD) | 5.4 ns typical / 8.7 ns max | 5.4 ns typical | 5.4 ns typical | 5.4 ns typical | C4 grade (slower) | 5.4 ns typical |
| Dynamic Power vs MAX II | Standard | 50% lower | Standard | Standard | Standard | Standard |
Principais diferenciais
- MAX II G family upgrade path with 50% lower dynamic current (vs EPM570GM100I5N)
- Full industrial temperature range -40C to +100C (vs EPM570F100C5N)
- Non-volatile Flash configuration for instant-on operation (vs SRAM-based FPGAs)
Notas de projeto
The EPM570F100I5N requires a single VCCINT supply between 2.375 V and 3.6 V; the VCCIO pins must be tied to the same or different supplies (1.5/1.8/2.5/3.3 V) for each I/O bank. Place a 100 nF decoupling capacitor within 5 mm of each VCCINT ball and a 10 uF bulk capacitor near the device. The typical ICC of 55 mA rises with fMAX utilization; ensure the regulator can supply at least 200 mA peak. Use separate analog and digital grounds if the design includes mixed-signal peripherals.
The 100-FBGA package uses 0.5 mm ball pitch, which requires laser-drilled microvias and 4-layer stack-up for reliable assembly. Per IPC-7351, the land pad diameter should be 0.30 mm with 0.40 mm solder mask opening. Escape-route the inner balls through via-in-pad or dog-bone fan-out; keep all signals on the top two layers when possible to minimize stub lengths. Match trace lengths within a byte lane to 0.5 mm to preserve setup/hold margins at 100 MHz+ parallel interfaces.
Do not exceed the absolute maximum VCCINT of 3.6 V - the on-chip Flash cell can be permanently damaged. The JTAG chain requires 10 kohm pull-ups on TMS and TCK for reliable in-system programming; without them, ByteBlaster/USB-Blaster downloads may fail intermittently. The MultiVolt I/O banks are NOT 5 V tolerant; connect 5 V signals through a level shifter. During power-up, I/Os are tri-stated (not pulled high) - if your design relies on a known state, add external pull-up resistors.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 ohm impedance and length-matched to within 25 mm to avoid chain-skew failures during in-system programming. Keep TCK trace away from switching power converters and clock lines to minimize EMI-induced programming errors. The 100-FBGA thermal pad should be soldered to a copper pour of at least 25 mm x 25 mm to keep theta_JA within the datasheet spec; insufficient thermal relief will trigger thermal shutdown during continuous high-utilization operation.
Informações de conformidade
RoHS and REACH compliant per Intel/Altera product declaration. 100-FBGA package uses lead-free solder balls. Not AEC-Q100 qualified - automotive applications should consider MAX II AEC-Q100 qualified variants or MAX V automotive CPLDs.
