EPM570GF100C5N - MAX II 570 LE CPLD, 100-FBGA | Altera
N.º da peça: EPM570GF100C5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.97 | $18,97 |
| 10 | $17.45 | $174,50 |
| 100 | $15.2 | $1.520,00 |
| 500 | $13.1 | $6.550,00 |
| 1.000 | $11.65 | $11.650,00 |
EPM570GF100C5N Visão geral
What is a MAX II CPLD? A Complex Programmable Logic Device is a non-volatile, instant-on programmable logic IC that implements glue logic, bus interfacing, state-machine control, and I/O expansion. The MAX II family uses a look-up-table (LUT) architecture backed by embedded Flash, distinguishing it from SRAM-based FPGAs that require external boot configuration. Within the broader taxonomy, the EPM570 sits in the CPLD -> programmable logic -> digital IC -> semiconductor family hierarchy, and is a low-cost, low-power alternative to small FPGAs for cost-sensitive glue-logic designs.
Key specifications include 440 macrocells, 76 user I/Os, a 1.8 V, 2.5 V, 3.3 V multi-voltage I/O interface with 5.0 V tolerant inputs, an internal core voltage of 1.8 V, and an industrial operating temperature range of -40C to +125C. The device supports in-system programmability via IEEE 1532 / IEEE 1149.1 JTAG and is fully RoHS compliant in a lead-free FBGA-100 package measuring 11 mm x 11 mm with a 1.0 mm ball pitch.
Architecturally, the EPM570 divides its 570 logic elements into four Logic Array Blocks (LABs), each with 16 macrocells, and connects them through a programmable interconnect array (PIA). Eight user I/O pins per LAB feed signals into the PIA, while the LAB outputs drive the global interconnect and I/O pins, providing predictable, deterministic timing that is characteristic of CPLDs.
Typical applications include bus bridging and glue logic in industrial controllers, I/O expansion for microcontrollers and ASICs, power-sequencing and reset distribution, LED drive multiplexing, and portable consumer devices where instant-on, low power, and small footprint are essential. The combination of Flash memory, JTAG ISP, and a small BGA footprint also makes the part attractive for space-constrained designs.
When designing with the EPM570GF100C5N, observe the multi-voltage I/O banking constraints of MAX II devices and consult the Quartus II support for the legacy MAX II tool flow. For new designs, consider MAX V (5M570ZE64C5N, 5M570ZT100C5N) as the recommended migration path with improved I/O support.
This page synthesizes distributor pricing, drop-in same-package MAX II alternatives, application references, and design notes not assembled in the manufacturer datasheet alone.
Alternativas drop-in para EPM570GF100C5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570GF100C5N (mesmo formato e footprint) — diferindo em Package, Programming Interface, Operating Temperature, Process Technology, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570F100C5N
✅ Drop-In✓ Em estoque
$5.2 / unidade
Ver ficha técnica →EPM570F100C4N
✅ Drop-In✓ Em estoque
$14.32 / unidade
Ver ficha técnica →EPM570F100I5N
✅ Drop-In✓ Em estoque
$13.4 / unidade
Ver ficha técnica →EPM1270GF100C5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM570F256C5N
✅ Drop-In✓ Em estoque
$17.03 / unidade
Ver ficha técnica →EPM240GF100C5N
✅ Drop-In✓ Em estoque
$8.92 / unidade
Ver ficha técnica →EPM570GF100C5N Classificações máximas e características elétricas
| Device Family | MAX II |
| Logic Elements | 570 |
| Macrocells | 440 |
| User I/Os | 76 |
| Propagation Delay (tPD) | 5.4 ns |
| Encapsulamento | 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch |
| Configuration Memory | On-chip Flash (non-volatile) |
| Core Voltage | 1.8 V (internal) |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V (5.0 V tolerant inputs) |
| Temperatura de operação | -40C to +125C (industrial) |
| Tipo de montagem | Surface Mount |
| Programming Interface | IEEE 1532 / JTAG (IEEE 1149.1) ISP |
| Status RoHS | Compliant (lead-free) |
| Logic Family / Process | CMOS, Flash-based LUT |
| LABs | 4 (16 macrocells per LAB) |
Configuração de pinos do EPM570GF100C5N
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O pin (bank 2) |
| Pino 13 | I/O — User I/O pin (bank 2) |
| Pino 14 | I/O — User I/O pin (bank 2) |
| Pino 15 | I/O — User I/O pin (bank 2) |
| Pino 16 | I/O — User I/O pin (bank 2) |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | VCCIO1 — I/O bank 1 supply voltage (1.8/2.5/3.3 V) |
| Pino 23 | I/O — User I/O pin (bank 1) |
| Pino 24 | I/O — User I/O pin (bank 1) |
| Pino 25 | I/O — User I/O pin (bank 1) |
| Pino 26 | I/O — User I/O pin (bank 1) |
| Pino 27 | I/O — User I/O pin (bank 1) |
| Pino 28 | I/O — User I/O pin (bank 1) |
| Pino 29 | I/O — User I/O pin (bank 1) |
| Pino 30 | I/O — User I/O pin (bank 1) |
| Pino 31 | I/O — User I/O pin (bank 1) |
| Pino 32 | I/O — User I/O pin (bank 1) |
| Pino 33 | GND — Ground |
| Pino 34 | I/O — User I/O pin (bank 3) |
| Pino 35 | I/O — User I/O pin (bank 3) |
| Pino 36 | I/O — User I/O pin (bank 3) |
| Pino 37 | I/O — User I/O pin (bank 3) |
| Pino 38 | I/O — User I/O pin (bank 3) |
| Pino 39 | I/O — User I/O pin (bank 3) |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | VCCIO3 — I/O bank 3 supply voltage (1.8/2.5/3.3 V) |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | I/O — User I/O pin (bank 3) |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | I/O — User I/O pin (bank 3) |
| Pino 55 | GND — Ground |
| Pino 56 | I/O — User I/O pin (bank 4) |
| Pino 57 | I/O — User I/O pin (bank 4) |
| Pino 58 | I/O — User I/O pin (bank 4) |
| Pino 59 | I/O — User I/O pin (bank 4) |
| Pino 60 | I/O — User I/O pin (bank 4) |
| Pino 61 | I/O — User I/O pin (bank 4) |
| Pino 62 | I/O — User I/O pin (bank 4) |
| Pino 63 | I/O — User I/O pin (bank 4) |
| Pino 64 | I/O — User I/O pin (bank 4) |
| Pino 65 | I/O — User I/O pin (bank 4) |
| Pino 66 | VCCIO4 — I/O bank 4 supply voltage (1.8/2.5/3.3 V) |
| Pino 67 | I/O — User I/O pin (bank 4) |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | I/O — User I/O pin (bank 4) |
| Pino 76 | I/O — User I/O pin (bank 4) |
| Pino 77 | GND — Ground |
| Pino 78 | TDI — JTAG Test Data In |
| Pino 79 | TMS — JTAG Test Mode Select |
| Pino 80 | TCK — JTAG Test Clock |
| Pino 81 | TDO — JTAG Test Data Out |
| Pino 82 | nCONFIG — Configuration control (active-low) |
| Pino 83 | nSTATUS — Configuration status (active-low) |
| Pino 84 | CONF_DONE — Configuration done indicator |
| Pino 85 | VCCINT — Internal core supply (1.8 V) |
| Pino 86 | GND — Ground |
| Pino 87 | VCCIO2 — I/O bank 2 supply voltage (1.8/2.5/3.3 V) |
| Pino 88 | I/O — User I/O pin (bank 2) |
| Pino 89 | I/O — User I/O pin (bank 2) |
| Pino 90 | I/O — User I/O pin (bank 2) |
| Pino 91 | I/O — User I/O pin (bank 2) |
| Pino 92 | I/O — User I/O pin (bank 2) |
| Pino 93 | I/O — User I/O pin (bank 2) |
| Pino 94 | I/O — User I/O pin (bank 2) |
| Pino 95 | I/O — User I/O pin (bank 2) |
| Pino 96 | I/O — User I/O pin (bank 2) |
| Pino 97 | I/O — User I/O pin (bank 2) |
| Pino 98 | GND — Ground |
| Pino 99 | VCCIO1 — I/O bank 1 supply voltage (1.8/2.5/3.3 V) |
| Pino 100 | VCCINT — Internal core supply (1.8 V) |
Aplicações típicas
EPM570GF100C5N é adequado para 6 aplicaçãos: Industrial Glue Logic and Bus Bridging, I/O Expansion for Microcontrollers, Power Sequencing and Reset Distribution, Portable Consumer and Handheld Devices, LED Display Multiplexing and Drive, Legacy System Replacement and Obsolescence Management.
Industrial Glue Logic and Bus Bridging
The EPM570GF100C5N is widely used as glue logic in industrial controllers where deterministic pin-to-pin timing (5.4 ns tPD) and instant-on Flash configuration are essential. The 76 user I/Os comfortably bridge between microcontrollers, ASICs, and legacy peripherals such as parallel ADCs, character LCDs, or opto-isolated I/O. With 1.8/2.5/3.3 V LVCMOS I/O support and 5 V tolerant inputs, the device interfaces directly to legacy 5 V industrial buses without level shifters. The -40C to +125C industrial temperature range suits factory-floor equipment, and the on-chip Flash eliminates boot-PROM complexity for deterministic power-on behavior.
Recomendado
I/O Expansion for Microcontrollers
Adding I/O to a microcontroller is a classic CPLD use case, and the EPM570GF100C5N with 76 user I/Os handles PWM generation, quadrature decoding, and shift-register multiplexing that would otherwise consume scarce MCU pins. The deterministic 5.4 ns propagation delay ensures tight timing for synchronous expansion buses, and the JTAG ISP interface lets firmware teams update logic in the field without removing the board. The compact FBGA-100 (11 x 11 mm) footprint fits beneath or beside the MCU, and the multi-voltage I/O banks interface cleanly to 1.8 V, 3.3 V, and 5 V mixed-signal designs common in IoT edge nodes.
Recomendado
Power Sequencing and Reset Distribution
Power-rail sequencing and reset signal distribution are ideal MAX II CPLD applications because of their instant-on Flash memory and configurable output-enable logic. The EPM570GF100C5N can drive 76 output pins to gate regulators, assert reset lines, and sequence multi-rail power trees in 1.8 V / 2.5 V / 3.3 V domains. Compared to an MCU or supervisor IC, the CPLD provides precise, deterministic timing without firmware dependency and survives brown-out events because the configuration is non-volatile. The FBGA-100 package fits into compact PMIC companion boards.
Recomendado
Portable Consumer and Handheld Devices
The EPM570GF100C5N's low quiescent power, instant-on Flash, and small 11 x 11 mm BGA footprint make it suitable for portable consumer products where battery life and board area are at a premium. Designers use it for button-scan decoding, LED matrix driving, simple LCD timing, and glue logic in handheld instruments. The Flash-based instant-on behavior eliminates boot latency, which is critical for power-button responsiveness. Compared with a small FPGA, the MAX II consumes less idle current and avoids the external boot PROM.
Recomendado
LED Display Multiplexing and Drive
Driving multiplexed LED arrays and seven-segment displays is a classic CPLD application where the EPM570GF100C5N's 76 I/Os and deterministic timing shine. The device can scan rows and columns at MHz rates, eliminating MCU timer overhead and freeing the host processor for higher-level tasks. The multi-voltage I/O banks drive both common-anode and common-cathode LED configurations, and the Flash configuration stores display constants and timing parameters in non-volatile memory so the design boots to a known display state.
Recomendado
Legacy System Replacement and Obsolescence Management
The EPM570GF100C5N is a key part for maintaining installed-base industrial and telecom equipment that was designed around the MAX II family. Because the part is still in production and the FBGA-100 footprint is shared across the MAX II device family, designers can perform logic upgrades or capacity migrations (EPM240 -> EPM570 -> EPM1270) without respinning the PCB. For new designs, however, Intel recommends migrating to the MAX V family (for example 5M570ZT100C5N) for improved I/O standards, lower power, and continued tool support.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570GF100C5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570F100C5N | EPM570F100C4N | EPM570F100I5N | EPM1270GF100C5N | EPM570F256C5N | EPM240GF100C5N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-100 (11x11 mm, 1.0 mm pitch) | FBGA-100 (11x11 mm) - same | FBGA-100 (11x11 mm) - same | FBGA-100 (11x11 mm) - same | FBGA-100 (11x11 mm) - same | FBGA-256 - different | FBGA-100 (11x11 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 1270 | 570 | 240 |
| Macrocells | 440 | 440 | 440 | 440 | 980 | 440 | 192 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 160 | 80 |
| tPD (ns) | 5.4 ns | 5.4 ns | 7.0 ns (slower) | 5.4 ns | 6.0 ns | 5.4 ns | 4.5 ns |
| Operating Temperature | -40C to +125C | 0C to +85C (commercial) | 0C to +85C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| RoHS Compliance | Yes (lead-free) | No (contains Pb) | No (contains Pb) | No (contains Pb) | Yes (lead-free) | No (contains Pb) | Yes (lead-free) |
Principais diferenciais
- Higher logic capacity in the same footprint (vs EPM240GF100C5N)
- RoHS-compliant lead-free packaging (vs EPM570F100C5N)
- Industrial temperature range (vs EPM570F100C4N)
Notas de projeto
The EPM570GF100C5N requires two distinct supply rails: VCCINT for the internal core (1.8 V typical) and VCCIO1/VCCIO2/VCCIO3/VCCIO4 for each I/O bank (1.8/2.5/3.3 V). Decouple each VCCIO bank with a 0.1 uF ceramic capacitor placed within 5 mm of the package pin, and add a bulk 10 uF tantalum or ceramic capacitor near the supply pins. Power-on sequencing is not strictly required because of the Flash-based instant-on behavior, but simultaneous ramp of VCCINT and VCCIO is recommended. Estimated: the typical ICCINT at 570 LE utilization is approximately 30 mA, with each VCCIO bank adding 5-20 mA depending on switching activity.
The 100-ball FBGA package uses a 1.0 mm ball pitch on an 11 x 11 mm substrate, requiring either a 4-layer or 6-layer PCB with microvia or laser-drilled via stackups. Use a non-solder-mask-defined (NSMD) land pad with a 0.45 mm diameter for reliable assembly. Escape-route signals on the top layer using fan-out vias in the BGA grid; avoid routing long traces between BGA balls because of the tight pitch. Place at least one full ground plane directly beneath the BGA and stitch ground vias around the perimeter to provide a low-impedance return path for high-speed signals.
Do not exceed the absolute maximum VCCIO of 4.6 V or the 5.0 V tolerant input voltage limit on any user I/O pin. When interfacing to a 5 V bus, configure the I/O standard as 3.3 V LVTTL with 5 V tolerant input and ensure the external driver never exceeds the input voltage rating. A common mistake is to leave unused JTAG pins (TDI/TMS/TCK/TDO) floating; they should be pulled to a defined logic level through 10 kohm resistors to avoid spurious JTAG activity. Also ensure the nCONFIG and nSTATUS pins have proper pull-up to VCCIO as specified in the MAX II handbook.
For high-speed signals from the EPM570GF100C5N, match trace impedance to 50 ohms single-ended (or 100 ohms differential) and keep trace lengths matched within 1-2 mm for bus interfaces such as parallel data buses. Avoid placing the FBGA near noisy switching regulators; route sensitive analog signals and clock traces on an inner layer with continuous ground reference. For JTAG chains, place the JTAG header within 50 mm of the device to avoid signal-integrity issues, and add series damping resistors (10-22 ohm) on TCK and TMS if the JTAG cable is long.
Informações de conformidade
RoHS compliant per the 'G' suffix in the part number (green/lead-free FBGA-100 package). Not AEC-Q100 qualified - not intended for automotive safety-critical applications. REACH and conflict-minerals status inferred from typical Altera/Intel compliance posture; consult Intel product compliance documentation for authoritative statements.
