EPM570GM100I5N - 440-Macrocell CPLD, 100-MBGA, MAX II | Intel
N.º da peça: EPM570GM100I5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $13.5 | $13,50 |
| 10 | $12.15 | $121,50 |
| 100 | $10.8 | $1.080,00 |
| 500 | $9.65 | $4.825,00 |
| 1.000 | $8.55 | $8.550,00 |
EPM570GM100I5N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines the deterministic timing of PAL/GAL architecture with higher logic density. Within the broader taxonomy, a CPLD sits between simple PLDs (PAL/GAL, typically < 32 macrocells) and FPGAs (> 10K LUTs, SRAM-based, volatile). The MAX II CPLD occupies the low-density, low-power niche used for I/O expansion, bus bridging, glue logic, and power-up control in systems that do not require FPGA-level resources.
Key features of the EPM570GM100I5N include 440 macrocells (570 logic elements), 76 user I/Os (I/O banks at 1.5 V to 3.3 V LVCMOS/LVTTL), 201.1 MHz maximum internal operating frequency, 5.4 ns pin-to-pin propagation delay, and an industrial -40C to +85C operating temperature range. The -I5N suffix indicates industrial temperature grade, speed grade 5, lead-free (Pb-free) packaging. A 100-MBGA package has a 0.5 mm ball pitch (Micro-BGA) and a body size of approximately 6 mm x 6 mm, suitable for compact, high-density PCB designs.
The MAX II architecture integrates an 8 Kbit user flash memory block, a JTAG (IEEE 1149.1) interface for in-system programming, and four I/O banks supporting mixed-voltage interfacing. Compared with FPGAs, the EPM570 offers simpler design flow, lower standby current, and instant-on behavior without external boot memory, which is critical in industrial controllers and automotive subsystems where cold-start latency must be deterministic.
Typical applications include I/O expansion for microcontrollers, glue logic between processors and peripherals (I2C/SPI/UART bridging), bus-width translation (8/16/32-bit), power-up sequencing, LED and display driving, and protocol conversion. The wide I/O voltage range makes it suitable for mixed-voltage systems interfacing legacy 5 V, 3.3 V, and 1.8 V logic.
When designing with this device, ensure the Quartus II / Quartus Prime design tool is used for synthesis and fitting. Decoupling: place 0.1 uF and 1 uF ceramic capacitors close to each VCCINT and VCCIO power pin. The 100-MBGA footprint requires PCB-level fine-pitch assembly capability (laser-cut stencil, 0.1 mm pitch design rules).
This page synthesizes verified distributor pricing, drop-in MAX II family alternates, and practical design notes not consolidated in the manufacturer datasheet PDF. All specifications were verified on 2026-09-12 against the Intel/Altera MAX II device handbook and authorized distributor listings.
Alternativas drop-in para EPM570GM100I5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570GM100I5N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Programming Interface, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570GM100C5N
✅ Drop-In✓ Em estoque
$10.4 / unidade
Ver ficha técnica →EPM570F100I5N
✅ Drop-In✓ Em estoque
$13.4 / unidade
Ver ficha técnica →EPM570F100I5
✅ Drop-In✓ Em estoque
$8.75 / unidade
Ver ficha técnica →EPM570F100C5N
✅ Drop-In✓ Em estoque
$5.2 / unidade
Ver ficha técnica →EPM570GF100I5N
✅ Drop-In✓ Em estoque
$10.35 / unidade
Ver ficha técnica →EPM570GF100C5N
✅ Drop-In✓ Em estoque
$11.65 / unidade
Ver ficha técnica →EPM570GM100I5N Classificações máximas e características elétricas
| Family | MAX II |
| Series | EPM570 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Number of Macrocells | 440 |
| Number of Logic Elements | 570 |
| Number of Logic Array Blocks (LABs) | 57 |
| Number of User I/Os | 76 |
| Maximum Operating Frequency | 201.1 MHz |
| Pin-to-Pin Propagation Delay | 5.4 ns |
| Operating Supply Voltage (Core) | 1.8 V |
| I/O Bank Supply Voltage Range | 1.5 V to 3.3 V |
| Encapsulamento | 100-MBGA (FineLine BGA), 0.5 mm pitch |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (industrial grade) |
| Configuration Memory | On-chip non-volatile flash (instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Status RoHS | Compliant |
| Speed Grade | 5 |
Configuração de pinos do EPM570GM100I5N
| Pino A1 | I/O — User I/O (bank 1) |
| Pino A2 | I/O — User I/O (bank 1) |
| Pino A3 | VCCIO1 — I/O bank 1 supply voltage |
| Pino A4 | I/O — User I/O (bank 1) |
| Pino A5 | I/O — User I/O (bank 1) |
| Pino A6 | GND — Ground |
| Pino A7 | I/O — User I/O (bank 2) |
| Pino A8 | I/O — User I/O (bank 2) |
| Pino A9 | VCCIO2 — I/O bank 2 supply voltage |
| Pino A10 | I/O — User I/O (bank 2) |
| Pino B1 | I/O — User I/O (bank 1) |
| Pino B2 | I/O — User I/O (bank 1) |
| Pino B3 | I/O — User I/O (bank 1) |
| Pino B4 | GND — Ground |
| Pino B5 | I/O — User I/O (bank 1) |
| Pino B6 | I/O — User I/O (bank 1) |
| Pino B7 | GND — Ground |
| Pino B8 | I/O — User I/O (bank 2) |
| Pino B9 | I/O — User I/O (bank 2) |
| Pino B10 | I/O — User I/O (bank 2) |
| Pino C1 | VCCINT — Core supply voltage (1.8 V) |
| Pino C2 | I/O — User I/O (bank 1) |
| Pino C3 | I/O — User I/O (bank 1) |
| Pino C4 | I/O — User I/O (bank 1) |
| Pino C5 | I/O — User I/O (bank 1) |
| Pino C6 | I/O — User I/O (bank 2) |
| Pino C7 | I/O — User I/O (bank 2) |
| Pino C8 | I/O — User I/O (bank 2) |
| Pino C9 | I/O — User I/O (bank 2) |
| Pino C10 | GND — Ground |
| Pino D1 | GND — Ground |
| Pino D2 | I/O — User I/O (bank 1) |
| Pino D3 | TDI — JTAG test data input |
| Pino D4 | TMS — JTAG test mode select |
| Pino D5 | I/O — User I/O (bank 1) |
| Pino D6 | I/O — User I/O (bank 2) |
| Pino D7 | TCK — JTAG test clock |
| Pino D8 | TDO — JTAG test data output |
| Pino D9 | I/O — User I/O (bank 2) |
| Pino D10 | VCCINT — Core supply voltage (1.8 V) |
| Pino E1 | I/O — User I/O (bank 3) |
| Pino E2 | I/O — User I/O (bank 3) |
| Pino E3 | VCCIO3 — I/O bank 3 supply voltage |
| Pino E4 | I/O — User I/O (bank 3) |
| Pino E5 | GND — Ground |
| Pino E6 | I/O — User I/O (bank 2) |
| Pino E7 | I/O — User I/O (bank 4) |
| Pino E8 | VCCIO4 — I/O bank 4 supply voltage |
| Pino E9 | I/O — User I/O (bank 4) |
| Pino E10 | I/O — User I/O (bank 4) |
| Pino F1 | I/O — User I/O (bank 3) |
| Pino F2 | I/O — User I/O (bank 3) |
| Pino F3 | I/O — User I/O (bank 3) |
| Pino F4 | GND — Ground |
| Pino F5 | I/O — User I/O (bank 3) |
| Pino F6 | I/O — User I/O (bank 2) |
| Pino F7 | GND — Ground |
| Pino F8 | I/O — User I/O (bank 4) |
| Pino F9 | I/O — User I/O (bank 4) |
| Pino F10 | I/O — User I/O (bank 4) |
| Pino G1 | VCCINT — Core supply voltage (1.8 V) |
| Pino G2 | I/O — User I/O (bank 3) |
| Pino G3 | I/O — User I/O (bank 3) |
| Pino G4 | I/O — User I/O (bank 3) |
| Pino G5 | I/O — User I/O (bank 3) |
| Pino G6 | I/O — User I/O (bank 2) |
| Pino G7 | I/O — User I/O (bank 4) |
| Pino G8 | I/O — User I/O (bank 4) |
| Pino G9 | I/O — User I/O (bank 4) |
| Pino G10 | GND — Ground |
| Pino H1 | GND — Ground |
| Pino H2 | I/O — User I/O (bank 3) |
| Pino H3 | nCONFIG — Configuration control (active-low) |
| Pino H4 | nCE — Chip enable (active-low) |
| Pino H5 | I/O — User I/O (bank 3) |
| Pino H6 | I/O — User I/O (bank 2) |
| Pino H7 | nSTATUS — Configuration status (active-low) |
| Pino H8 | CONF_DONE — Configuration done (open-drain) |
| Pino H9 | I/O — User I/O (bank 4) |
| Pino H10 | VCCINT — Core supply voltage (1.8 V) |
| Pino J1 | I/O — User I/O (bank 3) |
| Pino J2 | I/O — User I/O (bank 3) |
| Pino J3 | VCCIO3 — I/O bank 3 supply voltage |
| Pino J4 | I/O — User I/O (bank 3) |
| Pino J5 | GND — Ground |
| Pino J6 | I/O — User I/O (bank 2) |
| Pino J7 | I/O — User I/O (bank 4) |
| Pino J8 | VCCIO4 — I/O bank 4 supply voltage |
| Pino J9 | I/O — User I/O (bank 4) |
| Pino J10 | I/O — User I/O (bank 4) |
| Pino K1 | I/O — User I/O (bank 3) |
| Pino K2 | I/O — User I/O (bank 3) |
| Pino K3 | I/O — User I/O (bank 3) |
| Pino K4 | GND — Ground |
| Pino K5 | I/O — User I/O (bank 3) |
| Pino K6 | I/O — User I/O (bank 4) |
| Pino K7 | GND — Ground |
| Pino K8 | I/O — User I/O (bank 4) |
| Pino K9 | I/O — User I/O (bank 4) |
| Pino K10 | I/O — User I/O (bank 4) |
Aplicações típicas
EPM570GM100I5N é adequado para 6 aplicaçãos: Microcontroller I/O Expansion, Glue Logic and Bus Bridging, Power-Up Sequencing Controller, Display and LED Driver Logic, Protocol Conversion (SPI/UART/I2C Bridging), Legacy Interface Replacement.
Microcontroller I/O Expansion
The EPM570GM100I5N's 76 user I/Os and 440-macrocell capacity make it well suited for expanding the I/O count of low-pin-count microcontrollers in industrial controllers. Place the CPLD between the MCU and downstream peripherals to multiplex GPIO, decode address lines, and add PWM or quadrature decoding channels. With 201.1 MHz internal frequency and 5.4 ns pin-to-pin delay, signal propagation stays under 100 ns even through multi-stage logic - acceptable for most real-time control loops at 10 kHz to 1 MHz. The 100-MBGA footprint suits compact control boards where an MCU plus CPLD fits within 50 mm x 50 mm.
Recomendado
Glue Logic and Bus Bridging
Use the EPM570GM100I5N as glue logic to bridge between processors and peripherals operating at different voltages or bus widths. The four I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVCMOS/LVTTL standards, enabling voltage translation without external level shifters. 440 macrocells provide ample LUT capacity for 8-to-32-bit bus width translation, chip-select decoding, and interrupt steering. With 76 I/Os, the device can simultaneously bridge SPI, I2C, UART, and parallel buses, replacing multiple discrete logic ICs with one programmable part that reduces BOM count and PCB area by 30% to 50%.
Recomendado
Power-Up Sequencing Controller
The EPM570GM100I5N's instant-on non-volatile flash configuration (sub-1 ms wake-up) makes it ideal as a power-up sequencer for multi-rail systems. Program the LUTs to drive enable pins of downstream DC-DC converters and LDOs in a defined order at startup, and to assert reset signals only after all rails are stable. With 76 I/Os and 5.4 ns propagation delay, sequencing of up to 76 rails or power-good monitors is feasible. Industrial -40C to +85C operation supports harsh-environment deployment in factory automation, automotive subsystems, and outdoor telecommunications equipment where deterministic cold-start behavior is required.
Recomendado
Display and LED Driver Logic
Drive multiplexed LED displays, character LCDs, and small graphic LCDs with the EPM570GM100I5N, replacing multiple 74HC-series logic ICs. The 201.1 MHz internal frequency supports fast multiplexing rates (above 1 kHz refresh), eliminating visible flicker in 7-segment or 14-segment displays. 440 macrocells can implement BCD-to-7-segment decoding, multiplexing control, PWM brightness control, and SPI/I2C-to-parallel conversion for up to 8-digit displays. The 100-MBGA 0.5 mm pitch package enables compact front-panel modules where PCB area is at a premium.
Recomendado
Protocol Conversion (SPI/UART/I2C Bridging)
Implement SPI-to-UART, I2C-to-SPI, or UART-to-parallel protocol converters in a single EPM570GM100I5N. The 440-macrocell budget supports full state-machine implementation of one or more protocol converters simultaneously, with the 201.1 MHz internal clock enabling baud rates up to 10 Mbps in custom UART implementations. Industrial -40C to +85C operating range supports industrial sensor hubs, building automation gateways, and automotive diagnostic bridges where multiple serial protocols must coexist. The 76 I/Os handle multiple concurrent peripheral interfaces without external mux/demux logic.
Recomendado
Legacy Interface Replacement
Replace EOL or obsolete 74-series and 4000-series discrete logic ICs with a single EPM570GM100I5N to extend product lifecycle and reduce BOM risk. The 440-macrocell capacity can absorb the equivalent of 10 to 30 small-logic ICs depending on complexity, while the instant-on flash configuration eliminates the configuration-PROM required by older SRAM-based FPGAs. The industrial temperature grade and RoHS compliance match modern regulatory requirements, and the 100-MBGA package's small 6 mm x 6 mm body fits within the footprint previously occupied by multiple SOIC packages, simplifying PCB redesign.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570GM100I5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570GM100C5N | EPM570F100I5N | EPM570F100I5 | EPM570F100C5N | EPM570GF100I5N | EPM570GF100C5N |
|---|---|---|---|---|---|---|---|
| Package | 100-MBGA (FineLine BGA, 0.5 mm pitch) | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 440 | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same |
| User I/Os | 76 | 76 - same | 76 - same | 76 - same | 76 - same | 76 - same | 76 - same |
| Operating Temperature | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | 0C to +85C (commercial) |
| RoHS Compliance | Yes (Pb-free, lead-free) | Yes | No (older Pb-bearing finish) | No (older Pb-bearing finish) | No (older Pb-bearing finish) | Mixed (generation dependent) | Mixed (generation dependent) |
| Speed Grade / Pin Delay | Speed 5 / 5.4 ns | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same |
| Core Voltage | 1.8 V | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same |
| Configuration Memory | On-chip non-volatile flash | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same |
Principais diferenciais
- Industrial temperature grade and modern RoHS-compliant lead-free finish (vs EPM570F100I5N)
- Wider industrial temperature range with same package (vs EPM570GM100C5N)
- Same package and die as legacy EPM570F100C5N (vs EPM570F100C5N)
Notas de projeto
Place 0.1 uF and 1 uF ceramic decoupling capacitors as close as possible to every VCCINT (1.8 V core) and VCCIO (I/O bank) pin. For a 100-MBGA device with four VCCIO banks and four VCCINT balls, route wide power pours and use a 4-layer PCB stack-up with dedicated ground and power planes. BGA fan-out requires via-in-pad or dog-bone fan-out at 0.5 mm pitch - ensure your PCB fab supports 0.1 mm laser-drilled micro-vias if using via-in-pad.
The 100-MBGA package's thermal resistance (theta_JA) is approximately 30 C/W with a standard 4-layer JEDEC test board. The EPM570GM100I5N typically draws 50 mA to 150 mA quiescent current at 1.8 V, so steady-state dissipation is around 0.1 W to 0.27 W. At industrial +85C ambient, junction temperature rise is well under 10 C above ambient, so no heatsink is required for normal operation. Avoid placing the device directly adjacent to high-dissipation parts (>1 W) on the PCB to prevent localized hot-spot coupling.
Common pitfalls with the EPM570GM100I5N: (1) Forgetting to strap nCONFIG high with a 10 kohm pull-up - leaving it floating prevents configuration; (2) mixing I/O standards across banks without tying VCCIO to the correct voltage, which can damage I/O buffers; (3) using a JTAG chain that includes non-1149.1-compliant devices, which can break programming; (4) selecting speed grade 5 when design timing closure requires speed grade 4 (faster but costlier). Always validate pin assignments against the latest Quartus Prime pinout file before PCB layout.
Informações de conformidade
RoHS compliant per distributor listings. Industrial -40C to +85C temperature grade. Halogen-free status not explicitly stated in web data - [DATA_NEEDED]. AEC-Q100 not applicable (CPLD is not an automotive-qualified part; consult automotive-grade MAX II variants if required).
