EPM570GT100C3 - MAX II CPLD, 570 LEs, 100-TQFP | Altera (Intel)
MPN: EPM570GT100C3 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.31 | $13.31 |
| 10 | $12.45 | $124.50 |
| 100 | $11.2 | $1,120.00 |
| 500 | $10.1 | $5,050.00 |
| 1,000 | $9.05 | $9,050.00 |
Drop-in alternatives for EPM570GT100C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570GT100C5N
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View Datasheet →EPM570GT100I5N
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View Datasheet →EPM570F100C5N
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View Datasheet →EPM570T100A5N
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View Datasheet →EPM570T100C5N
✅ Drop-In✓ In Stock
$10.2 / Unit
View Datasheet →EPM570F100A5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.85 / Unit
View Datasheet →EPM570GT100C3 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements | 570 |
| Equivalent Macrocells | 440 |
| Maximum User I/O | 76 |
| User Flash Memory (UFM) | 8 Kbit |
| Internal Operating Frequency | 304 MHz |
| Global Clocks | 4 |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Programmability | In-System Programmable (JTAG / IEEE 1149.1) |
| Configuration Memory | Non-volatile flash (instant-on, zero boot time) |
| Operating Temperature | 0 °C to +85 °C (commercial extended) |
| Package | 100-pin TQFP (14 x 14 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EPM570GT100C3 Pin Configuration
| Pin 1 | I/O — User I/O (Bank 1) |
| Pin 2 | I/O — User I/O (Bank 1) |
| Pin 3 | I/O — User I/O (Bank 1) |
| Pin 4 | I/O — User I/O (Bank 1) |
| Pin 5 | I/O — User I/O (Bank 1) |
| Pin 6 | GND — Ground |
| Pin 7 | I/O — User I/O (Bank 1) |
| Pin 8 | I/O — User I/O (Bank 1) |
| Pin 9 | I/O — User I/O (Bank 1) |
| Pin 10 | I/O — User I/O (Bank 1) |
| Pin 11 | VCCIO1 — Bank 1 I/O supply (1.5/1.8/2.5/3.3 V) |
| Pin 12 | I/O — User I/O (Bank 1) |
| Pin 13 | I/O — User I/O (Bank 1) |
| Pin 14 | I/O — User I/O (Bank 1) |
| Pin 15 | I/O — User I/O (Bank 1) |
| Pin 16 | GND — Ground |
| Pin 17 | I/O — User I/O (Bank 1) |
| Pin 18 | I/O — User I/O (Bank 1) |
| Pin 19 | I/O — User I/O (Bank 1) |
| Pin 20 | I/O — User I/O (Bank 1) |
| Pin 21 | VCCINT — Core supply (1.71-1.89 V) |
| Pin 22 | I/O — User I/O (Bank 1) |
| Pin 23 | I/O — User I/O (Bank 1) |
| Pin 24 | I/O — User I/O (Bank 1) |
| Pin 25 | I/O — User I/O (Bank 1) |
| Pin 26 | GND — Ground |
| Pin 27 | I/O — User I/O (Bank 1) |
| Pin 28 | I/O — User I/O (Bank 1) |
| Pin 29 | I/O — User I/O (Bank 1) |
| Pin 30 | I/O — User I/O (Bank 1) |
| Pin 31 | VCCIO1 — Bank 1 I/O supply |
| Pin 32 | I/O — User I/O (Bank 2) |
| Pin 33 | I/O — User I/O (Bank 2) |
| Pin 34 | I/O — User I/O (Bank 2) |
| Pin 35 | I/O — User I/O (Bank 2) |
| Pin 36 | GND — Ground |
| Pin 37 | I/O — User I/O (Bank 2) |
| Pin 38 | I/O — User I/O (Bank 2) |
| Pin 39 | I/O — User I/O (Bank 2) |
| Pin 40 | I/O — User I/O (Bank 2) |
| Pin 41 | TDI — JTAG Test Data In |
| Pin 42 | TMS — JTAG Test Mode Select |
| Pin 43 | TCK — JTAG Test Clock |
| Pin 44 | nCONFIG — Configuration control (pull high for normal operation) |
| Pin 45 | VCCIO2 — Bank 2 I/O supply |
| Pin 46 | I/O — User I/O (Bank 2) |
| Pin 47 | I/O — User I/O (Bank 2) |
| Pin 48 | I/O — User I/O (Bank 2) |
| Pin 49 | I/O — User I/O (Bank 2) |
| Pin 50 | GND — Ground |
| Pin 51 | I/O — User I/O (Bank 2) |
| Pin 52 | I/O — User I/O (Bank 2) |
| Pin 53 | I/O — User I/O (Bank 2) |
| Pin 54 | I/O — User I/O (Bank 2) |
| Pin 55 | VCCINT — Core supply (1.71-1.89 V) |
| Pin 56 | I/O — User I/O (Bank 2) |
| Pin 57 | I/O — User I/O (Bank 2) |
| Pin 58 | I/O — User I/O (Bank 2) |
| Pin 59 | I/O — User I/O (Bank 2) |
| Pin 60 | GND — Ground |
| Pin 61 | I/O — User I/O (Bank 3) |
| Pin 62 | I/O — User I/O (Bank 3) |
| Pin 63 | I/O — User I/O (Bank 3) |
| Pin 64 | I/O — User I/O (Bank 3) |
| Pin 65 | VCCIO3 — Bank 3 I/O supply |
| Pin 66 | I/O — User I/O (Bank 3) |
| Pin 67 | I/O — User I/O (Bank 3) |
| Pin 68 | I/O — User I/O (Bank 3) |
| Pin 69 | I/O — User I/O (Bank 3) |
| Pin 70 | GND — Ground |
| Pin 71 | I/O — User I/O (Bank 3) |
| Pin 72 | I/O — User I/O (Bank 3) |
| Pin 73 | I/O — User I/O (Bank 3) |
| Pin 74 | I/O — User I/O (Bank 3) |
| Pin 75 | CLK0 — Global clock input 0 / User I/O |
| Pin 76 | VCCIO4 — Bank 4 I/O supply |
| Pin 77 | I/O — User I/O (Bank 4) |
| Pin 78 | I/O — User I/O (Bank 4) |
| Pin 79 | I/O — User I/O (Bank 4) |
| Pin 80 | I/O — User I/O (Bank 4) |
| Pin 81 | GND — Ground |
| Pin 82 | I/O — User I/O (Bank 4) |
| Pin 83 | I/O — User I/O (Bank 4) |
| Pin 84 | I/O — User I/O (Bank 4) |
| Pin 85 | I/O — User I/O (Bank 4) |
| Pin 86 | VCCINT — Core supply (1.71-1.89 V) |
| Pin 87 | I/O — User I/O (Bank 4) |
| Pin 88 | I/O — User I/O (Bank 4) |
| Pin 89 | I/O — User I/O (Bank 4) |
| Pin 90 | I/O — User I/O (Bank 4) |
| Pin 91 | GND — Ground |
| Pin 92 | I/O — User I/O (Bank 4) |
| Pin 93 | I/O — User I/O (Bank 4) |
| Pin 94 | I/O — User I/O (Bank 4) |
| Pin 95 | I/O — User I/O (Bank 4) |
| Pin 96 | CLK1 — Global clock input 1 / User I/O |
| Pin 97 | TDO — JTAG Test Data Out |
| Pin 98 | nCE — Chip enable (active low, tie low for single-device JTAG chain) |
| Pin 99 | nSTATUS — Configuration status (pull-up to VCCIO during normal operation) |
| Pin 100 | CONF_DONE — Configuration done (open-drain, pull-up to VCCIO) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GT100C3 is suitable for 6 applications: Industrial I/O Expansion and Bus Bridging, Power Supply Sequencing and Supervisory Glue Logic, Legacy Peripheral Replacement and Interface Translation, LED Display Driver and Signage Multiplexing, Telecom Line Card Glue Logic, Consumer Appliance Control Board.
Industrial I/O Expansion and Bus Bridging
The EPM570GT100C3 is well suited to industrial I/O expansion where a microcontroller lacks sufficient pins or voltage domains. Its 76 user I/O across four MultiVolt banks allow direct interfacing between a 3.3 V MCU and 1.8 V peripherals without external level shifters. The 570-LE fabric comfortably fits I2C/SPI-to-parallel bridges, address decoding, and timing-critical glue logic, while the 304 MHz internal frequency keeps glue-logic propagation delays under ~5 ns. The instant-on flash configuration eliminates FPGA boot latency, making it ideal for fail-safe industrial controllers that must respond within milliseconds of power-up.
Recommended
Power Supply Sequencing and Supervisory Glue Logic
Power-supply sequencers in multi-rail systems demand deterministic, instant-on logic. The EPM570GT100C3's flash-backed non-volatile configuration boots in microseconds with no external configuration PROM, generating enable signals to DC-DC converters in the correct order. Its four global clocks and 0.18 µm flash process provide sub-5 ns tPD for tight power-good timing budgets. The 8 Kbit UFM can store fault logs or trimming values, replacing an external EEPROM. Designers commonly pair it with PWM controllers such as the UCC28C42 or voltage supervisors to build a complete digital power manager.
Recommended
Legacy Peripheral Replacement and Interface Translation
Many designs require replacing obsolete 74-series glue logic with a single modern device. The EPM570GT100C3 replaces dozens of 74HC/74LVC gates, latches, and bus transceivers while adding 1.5 V-3.3 V voltage translation through its MultiVolt I/O banks. A 570-LE CPLD typically replaces 30-60 discrete SSI/MSI packages, simplifying PCB layout and BOM. The JTAG boundary-scan capability further aids in-circuit testing of legacy boards where bed-of-nails fixtures are impractical. This application is especially relevant for industrial upgrade programs and aerospace sustainment where the original 74xx parts are no longer available.
Recommended
LED Display Driver and Signage Multiplexing
Large LED matrix displays and channel-letter signage benefit from the EPM570GT100C3's high I/O count and deterministic timing. With 76 user I/O, the CPLD can directly drive 8-bit RGB multiplexers for modest-density matrices or function as a refresh controller for larger panels. The 304 MHz internal frequency supports row-scanning frequencies well above the 100 Hz flicker threshold for high-PWM-bit-depth video walls. MultiVolt I/O allows direct connection to LED driver shift registers operating at 3.3 V or 5 V. The non-volatile configuration means the display controller starts scanning immediately on power-up with no boot splash screen.
Recommended
Telecom Line Card Glue Logic
Telecom line cards require deterministic, high-reliability glue logic for TDM bus multiplexing, alarm aggregation, and clock distribution. The EPM570GT100C3's flash-backed configuration ensures no boot-time vulnerabilities for line-protection relays, and its 1.71-1.89 V core draws minimal current. The four global clocks can directly feed telecom framers such as the DS26504 or T1/E1 transceivers with sub-3 ns skew. Commercial-extended temperature rating (0 °C to +85 °C) covers most indoor central-office deployments. Compared to a small FPGA, the MAX II offers predictable timing closure without lengthy place-and-route iterations.
Recommended
Consumer Appliance Control Board
Consumer appliances such as washing machines, induction cooktops, and HVAC controllers need a low-cost, deterministic controller for user-interface scanning, relay driving, and sensor multiplexing. The EPM570GT100C3 replaces microcontrollers in hard-real-time scan loops, with sub-microsecond response to safety-critical inputs. Its 0.18 µm flash process delivers low standby current (<1 mA typical), suiting Energy Star standby requirements. MultiVolt I/O supports direct connection to 3.3 V sensors and 5 V relay drivers without level shifters. Instant-on behavior eliminates MCU firmware boot delays for fast user feedback.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GT100C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GT100C5N | EPM570GT100I5N | EPM570F100C5N | EPM570T100A5N | EPM570T100C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-100 (14x14 mm) | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Speed Grade | C3 (304 MHz) | C5 (~250 MHz) | I5 (industrial temp, speed grade C5) | C5 | A5 (slowest) | C5 |
| Operating Temperature | 0 to +85 C (commercial extended) | 0 to +85 C | -40 to +100 C (industrial) | 0 to +85 C | 0 to +85 C | 0 to +85 C |
| User I/O (max) | 76 | 76 | 76 | 76 | 76 | 76 |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
| Silicon Revision | G | G | G | F (earlier revision) | T (earliest revision) | T (earliest revision) |
Key Differentiators
- Fastest C3 speed grade in MAX II 570-LE family (vs EPM570GT100C5N)
- Commercial-extended temperature grade with standard silicon revision G (vs EPM570F100C5N)
- Same die as T100A5N/T100C5N but faster speed grade (vs EPM570T100A5N)
Design Notes
Decouple every VCCINT pin with a 0.1 µF ceramic capacitor placed within 3 mm of the pin, and bulk-decouple with a 10 µF tantalum or ceramic at the CPLD power entry point. Each VCCIO bank requires its own 0.1 µF + 10 µF decoupling pair because MultiVolt banks switch independently and inject switching noise back into the supply. Power VCCIO banks before or simultaneously with VCCINT to avoid I/O latch-up during ramp-up - the datasheet specifies a maximum VCCIO-VCCINT differential of 0.7 V during power-up sequencing.
Route all JTAG signals (TDI, TDO, TMS, TCK) with 50 Ω controlled impedance and keep the JTAG cable stub shorter than 50 mm total. Place the JTAG connector at the board edge for production programming access. Route nCONFIG, nSTATUS, and CONF_DONE with 10 kΩ pull-ups to VCCIO to prevent spurious configuration events during power glitches. Maintain solid ground planes under the TQFP package; the thermal pad is not exposed on the standard TQFP-100, so rely on copper pours on top and inner layers for heat spreading.
Do not assume that a C5 speed-grade part is bit-stream-compatible with a C3 design - the Quartus fitter generates speed-grade-specific bitstreams. Re-compile the Quartus project when substituting speed grades. Also, do not leave unused I/O floating - configure them as outputs driving low or as inputs with internal pull-up enabled, otherwise floating inputs draw 50-100 µA per pin from leakage. The 8 Kbit UFM has a 100,000-erase-cycle endurance limit - use it for configuration data or trimming values, not for high-write-rate logging.
Group same-bank I/O together on the board to simplify routing and avoid unnecessary VCCIO plane splits. CLK0-CLK3 should each have a short, direct connection to the clock source; avoid routing clock traces over ground splits. For high-speed outputs (>100 MHz), use series termination resistors (22-33 Ω) close to the CPLD pin to dampen reflections. Keep JTAG chain length under 6 inches for reliable ByteBlaster/USB-Blaster programming at 10 MHz TCK.
Compliance Information
RoHS compliant per Altera/Intel product page. Lead-free Pb-free assembly. Not AEC-Q100 qualified - industrial-grade part. Commercial extended temperature grade (0 to +85 C).
