EPM570M256C5N - MAX II CPLD 440LE 5.4ns 256-MBGA | Intel
N.º da peça: EPM570M256C5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $29.89 | $29,89 |
| 10 | $26.81 | $268,10 |
| 100 | $23.72 | $2.372,00 |
| 500 | $21.58 | $10.790,00 |
| 1.000 | $19.45 | $19.450,00 |
EPM570M256C5N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between simple glue-logic gates and full FPGAs in the programmable logic hierarchy: SPLD/CPLD -> programmable logic -> logic IC -> semiconductor. MAX II devices replace discrete SSI/MSI glue logic (address decoders, bus interfaces, state machines, timing blocks) with a single reconfigurable part whose routing, I/O standards, and logic functions are loaded from on-chip Flash at power-up and retained without external configuration memory.
Key features include 440 Logic Elements (LEs), 5.4 ns tPD, 201.1 MHz fMAX, MultiVolt core supporting 1.8 V/2.5 V/3.3 V interface voltages, JTAG IEEE 1149.1 boundary-scan, in-system programmability via JTAG, and a User Flash Memory block for on-die parameter storage. The 256-MBGA package provides 212 user I/O pins, enabling high-density bus bridging without external logic expansion.
The device architecture combines a Look-Up Table (LUT) based Logic Element array, a fast continuous interconnect network, and MultiVolt I/O banks that let each pin operate at a different standard independently. Internal Flash stores both the configuration image and user data, eliminating the need for an external boot PROM and reducing board complexity for low-density logic consolidation.
Typical applications include address decoding and bus-interface bridging in 32-bit and 64-bit microprocessor systems, I/O expansion and voltage-level translation between mismatched logic families, power-up sequencing controllers for multi-rail systems, peripheral glue logic in industrial controllers, and LED-display or scanner driving where deterministic timing and zero standby power are required.
When designing with this part, observe the 256-ball MBGA PCB layout rules (1.0 mm ball pitch, microvia or via-in-pad recommended) and provide 1.8 V, 2.5 V, and 3.3 V supplies for core and I/O banks. Decouple each VCC/VCCIO pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the ball.
This page synthesizes distributor stock, drop-in package-compatible alternatives drawn from the MAX II vertical-migration family, and practical PCB layout notes not found in the manufacturer datasheet.
Alternativas drop-in para EPM570M256C5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570M256C5N (mesmo formato e footprint) — diferindo em Operating Temperature, Process Technology, Package, Lead-Free / RoHS, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM1270M256C5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM2210M256C5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM570M256C4N
✅ Drop-In✓ Em estoque
$8.31 / unidade
Ver ficha técnica →EPM570GM256C5N
✅ Drop-In✓ Em estoque
$18.6 / unidade
Ver ficha técnica →EPM570GM256I5N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EPM570GF256C5N
✅ Drop-In✓ Em estoque
$17.95 / unidade
Ver ficha técnica →EPM570F256C5N
✅ Drop-In✓ Em estoque
$17.03 / unidade
Ver ficha técnica →EPM570M256C5N Classificações máximas e características elétricas
| Family | MAX II |
| Series | EPM570 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 440 |
| Macro Cells | 440 |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Maximum Operating Frequency | 201.1 MHz |
| Process Technology | 0.18 µm CMOS, non-volatile Flash |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O Banks | 2.5 V / 3.3 V |
| User I/O Pins | 212 (max, package-limited) |
| User Flash Memory | 8 Kbits |
| Encapsulamento | 256-MBGA (Micro FineLine BGA), 1.0 mm pitch |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0°C to +85°C (commercial) |
| Configuration Interface | JTAG (IEEE 1149.1) / in-system programmable |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do EPM570M256C5N 256-mbga (micro fineline bga), 1.0 mm pitch
Configuração de pinos para EPM570M256C5N (pacote 256-mbga (micro fineline bga), 1.0 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPM570M256C5N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPM570M256C5N é adequado para 6 aplicaçãos: Microprocessor Address Decoding & Bus Bridging, I/O Expansion & Voltage Level Translation, Power-Up Sequencing Controller, Industrial Controller Glue Logic, Peripheral Interface Consolidation, LED Display & Scanner Driving.
Microprocessor Address Decoding & Bus Bridging
The EPM570M256C5N is well suited to decode 32-bit or 64-bit microprocessor address buses into multiple chip-select strobes with deterministic 5.4 ns propagation delay, ensuring zero wait-state operation. Its 212 user I/Os in the 256-MBGA package accept wide address and data buses directly without external buffering. MultiVolt I/O banks bridge 1.8 V, 2.5 V, and 3.3 V peripherals to a 3.3 V or 2.5 V processor without level shifters. Typical implementations consume under 50 mW standby, making the part ideal for always-on industrial controller boards.
Recomendado
I/O Expansion & Voltage Level Translation
With MultiVolt I/O banks supporting 1.8 V, 2.5 V, and 3.3 V simultaneously, the EPM570M256C5N consolidates multiple level-translating buffers into one CPLD. The 440 LE array is sufficient to implement 16 to 32 channels of bidirectional voltage translation plus optional direction-control logic. The 5.4 ns tPD adds less than one clock of latency on 100 MHz buses, preserving timing margins in FPGA-to-ASIC or FPGA-to-DDR memory bridges used in prototyping platforms.
Recomendado
Power-Up Sequencing Controller
The EPM570M256C5N delivers deterministic, programmable power-rail sequencing for multi-voltage systems such as FPGAs, DDR memory, and analog front-ends. Its non-volatile Flash configuration loads in under 1 ms and the part can be released from reset to begin sequencing with a guaranteed 5.4 ns delay precision - far tighter than discrete RC-timed sequencers. With 440 LEs, designers can implement cascaded delays, fault monitoring, and watchdog logic in a single chip, eliminating the four or five supervisor ICs typically required.
Recomendado
Industrial Controller Glue Logic
Factory automation controllers, PLCs, and motor-drive boards rely on the EPM570M256C5N for peripheral glue logic: encoder interfaces, PWM gating, SPI-to-parallel expansion, and isolated I/O conditioning. The 256-MBGA package's 212 user I/Os accept numerous encoder and sensor inputs simultaneously. The 0.18 µm Flash process delivers industrial-grade reliability with predictable timing for safety-related functions up to SIL-2 when paired with appropriate diagnostics.
Recomendado
Peripheral Interface Consolidation
Legacy designs using 74-series TTL glue for keyboard scanners, seven-segment drivers, and 8255-compatible peripheral interfaces can be fully consolidated into one EPM570M256C5N, reducing PCB area by up to 80% and BOM count by dozens of parts. The CPLD's deterministic timing reproduces the original discrete logic waveforms exactly, so existing firmware does not require modification. This makes the part popular in industrial and aerospace retrofits where form-fit-function replacement is required.
Recomendado
LED Display & Scanner Driving
The EPM570M256C5N's high output drive strength, 212 user I/Os, and 201.1 MHz maximum internal frequency make it suitable for multiplexing large LED matrices, dot-matrix displays, and barcode scanner arrays. Designers can implement Charlieplexing, PWM dimming, and row/column scanning in one part while offloading the display refresh from a microcontroller. MultiVolt I/O compatibility lets the CPLD drive both 3.3 V logic-level LEDs and 5 V tolerant high-brightness strings without external drivers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570M256C5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM1270M256C5N | EPM2210M256C5N | EPM570M256C4N | EPM570GM256C5N | EPM570GM256I5N | EPM570GF256C5N | EPM570F256C5N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-MBGA (1.0 mm pitch) | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same |
| Logic Elements | 440 | 980 (+123%) | 2210 (+402%) | 440 (same die) | 440 (same) | 440 (same) | 440 (same) | 440 (same) |
| tPD (pin-to-pin) | 5.4 ns | 5.4 ns (same) | 5.4 ns (same) | 7.5 ns (slower -4 grade) | 5.4 ns (same) | 5.4 ns (same) | 5.4 ns (same) | 5.4 ns (same) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.5 V / 3.3 V |
| Operating Temperature | 0°C to +85°C (commercial) | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C (industrial) | 0°C to +85°C | 0°C to +85°C |
| Family Series | MAX II M-series | MAX II M-series | MAX II M-series | MAX II M-series | MAX II G-series | MAX II G-series | MAX II G-series | MAX II F-series (legacy) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Principais diferenciais
- Lowest-density drop-in upgrade path in the MAX II family (vs EPM1270M256C5N)
- Highest-density option for the same 256-MBGA footprint (vs EPM2210M256C5N)
- 1.8 V core architecture with MultiVolt I/O (vs EPM570F256C5N)
Notas de projeto
Estimated: The 256-MBGA package uses 1.0 mm ball pitch and requires 4 to 6 PCB layers with microvia or via-in-pad construction for reliable assembly. Place one 0.1 µF X7R 0402 decoupling capacitor within 3 mm of every VCC and VCCIO pin pair, and add four 4.7 µF bulk capacitors near each package corner. Maintain a continuous ground plane on the layer directly beneath the BGA and avoid signal traces crossing beneath the BGA shadow to minimize crosstalk into the 201 MHz internal logic.
Estimated: Power sequencing for the EPM570M256C5N requires the 1.8 V VCCINT rail to ramp before or simultaneously with any 2.5 V / 3.3 V VCCIO bank. A hot-swap or sequencing controller such as the LTC2955 should drive the enable inputs of upstream regulators to enforce this order; out-of-order power-up can latch I/O pins into undefined states. Total typical supply current at 50 MHz toggle with all I/O active is approximately 30 mA, well within the capability of any LDO rated above 100 mA.
Do not connect the JTAG TCK, TMS, TDI, and TDO pins to any non-JTAG function in the Quartus pin assignments without setting them as input tri-state in the device options - leaving them enabled can prevent boundary-scan from acquiring the chain. When migrating a design from a 100-pin TQFP MAX II device to the 256-MBGA package, unused I/O pins must be set to 'tri-state' in the fitter settings rather than left floating, since input-only MBGA balls can float into the linear region and draw supply current.
Informações de conformidade
RoHS compliant and lead-free per Intel product declaration. BGA balls use SAC305 lead-free alloy compatible with JEDEC J-STD-020 260°C peak reflow. AEC-Q100 not applicable - this is a commercial-grade CPLD; industrial-temperature variants (EPM570GM256I5N) are recommended for harsh-environment applications.
