EPM570M256C5N - MAX II CPLD 440LE 5.4ns 256-MBGA | Intel
MPN: EPM570M256C5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $29.89 | $29.89 |
| 10 | $26.81 | $268.10 |
| 100 | $23.72 | $2,372.00 |
| 500 | $21.58 | $10,790.00 |
| 1,000 | $19.45 | $19,450.00 |
Drop-in alternatives for EPM570M256C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM1270M256C5N
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EPM2210M256C5N
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EPM570M256C4N
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View Datasheet →EPM570GM256I5N
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View Datasheet →EPM570GF256C5N
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View Datasheet →EPM570M256C5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Series | EPM570 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 440 |
| Macro Cells | 440 |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Maximum Operating Frequency | 201.1 MHz |
| Process Technology | 0.18 µm CMOS, non-volatile Flash |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O Banks | 2.5 V / 3.3 V |
| User I/O Pins | 212 (max, package-limited) |
| User Flash Memory | 8 Kbits |
| Package | 256-MBGA (Micro FineLine BGA), 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C to +85°C (commercial) |
| Configuration Interface | JTAG (IEEE 1149.1) / in-system programmable |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EPM570M256C5N 256-mbga (micro fineline bga), 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EPM570M256C5N (256-mbga (micro fineline bga), 1.0 mm pitch package) with 212 (max, package-limited) pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570M256C5N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 212 (max, package-limited) pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570M256C5N is suitable for 6 applications: Microprocessor Address Decoding & Bus Bridging, I/O Expansion & Voltage Level Translation, Power-Up Sequencing Controller, Industrial Controller Glue Logic, Peripheral Interface Consolidation, LED Display & Scanner Driving.
Microprocessor Address Decoding & Bus Bridging
The EPM570M256C5N is well suited to decode 32-bit or 64-bit microprocessor address buses into multiple chip-select strobes with deterministic 5.4 ns propagation delay, ensuring zero wait-state operation. Its 212 user I/Os in the 256-MBGA package accept wide address and data buses directly without external buffering. MultiVolt I/O banks bridge 1.8 V, 2.5 V, and 3.3 V peripherals to a 3.3 V or 2.5 V processor without level shifters. Typical implementations consume under 50 mW standby, making the part ideal for always-on industrial controller boards.
Recommended
I/O Expansion & Voltage Level Translation
With MultiVolt I/O banks supporting 1.8 V, 2.5 V, and 3.3 V simultaneously, the EPM570M256C5N consolidates multiple level-translating buffers into one CPLD. The 440 LE array is sufficient to implement 16 to 32 channels of bidirectional voltage translation plus optional direction-control logic. The 5.4 ns tPD adds less than one clock of latency on 100 MHz buses, preserving timing margins in FPGA-to-ASIC or FPGA-to-DDR memory bridges used in prototyping platforms.
Recommended
Power-Up Sequencing Controller
The EPM570M256C5N delivers deterministic, programmable power-rail sequencing for multi-voltage systems such as FPGAs, DDR memory, and analog front-ends. Its non-volatile Flash configuration loads in under 1 ms and the part can be released from reset to begin sequencing with a guaranteed 5.4 ns delay precision - far tighter than discrete RC-timed sequencers. With 440 LEs, designers can implement cascaded delays, fault monitoring, and watchdog logic in a single chip, eliminating the four or five supervisor ICs typically required.
Recommended
Industrial Controller Glue Logic
Factory automation controllers, PLCs, and motor-drive boards rely on the EPM570M256C5N for peripheral glue logic: encoder interfaces, PWM gating, SPI-to-parallel expansion, and isolated I/O conditioning. The 256-MBGA package's 212 user I/Os accept numerous encoder and sensor inputs simultaneously. The 0.18 µm Flash process delivers industrial-grade reliability with predictable timing for safety-related functions up to SIL-2 when paired with appropriate diagnostics.
Recommended
Peripheral Interface Consolidation
Legacy designs using 74-series TTL glue for keyboard scanners, seven-segment drivers, and 8255-compatible peripheral interfaces can be fully consolidated into one EPM570M256C5N, reducing PCB area by up to 80% and BOM count by dozens of parts. The CPLD's deterministic timing reproduces the original discrete logic waveforms exactly, so existing firmware does not require modification. This makes the part popular in industrial and aerospace retrofits where form-fit-function replacement is required.
Recommended
LED Display & Scanner Driving
The EPM570M256C5N's high output drive strength, 212 user I/Os, and 201.1 MHz maximum internal frequency make it suitable for multiplexing large LED matrices, dot-matrix displays, and barcode scanner arrays. Designers can implement Charlieplexing, PWM dimming, and row/column scanning in one part while offloading the display refresh from a microcontroller. MultiVolt I/O compatibility lets the CPLD drive both 3.3 V logic-level LEDs and 5 V tolerant high-brightness strings without external drivers.
Recommended
Recommended Products Summary
Engineering reference data for EPM570M256C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM1270M256C5N | EPM2210M256C5N | EPM570M256C4N | EPM570GM256C5N | EPM570GM256I5N | EPM570GF256C5N | EPM570F256C5N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-MBGA (1.0 mm pitch) | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same |
| Logic Elements | 440 | 980 (+123%) | 2210 (+402%) | 440 (same die) | 440 (same) | 440 (same) | 440 (same) | 440 (same) |
| tPD (pin-to-pin) | 5.4 ns | 5.4 ns (same) | 5.4 ns (same) | 7.5 ns (slower -4 grade) | 5.4 ns (same) | 5.4 ns (same) | 5.4 ns (same) | 5.4 ns (same) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.5 V / 3.3 V |
| Operating Temperature | 0°C to +85°C (commercial) | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C (industrial) | 0°C to +85°C | 0°C to +85°C |
| Family Series | MAX II M-series | MAX II M-series | MAX II M-series | MAX II M-series | MAX II G-series | MAX II G-series | MAX II G-series | MAX II F-series (legacy) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Key Differentiators
- Lowest-density drop-in upgrade path in the MAX II family (vs EPM1270M256C5N)
- Highest-density option for the same 256-MBGA footprint (vs EPM2210M256C5N)
- 1.8 V core architecture with MultiVolt I/O (vs EPM570F256C5N)
Design Notes
Estimated: The 256-MBGA package uses 1.0 mm ball pitch and requires 4 to 6 PCB layers with microvia or via-in-pad construction for reliable assembly. Place one 0.1 µF X7R 0402 decoupling capacitor within 3 mm of every VCC and VCCIO pin pair, and add four 4.7 µF bulk capacitors near each package corner. Maintain a continuous ground plane on the layer directly beneath the BGA and avoid signal traces crossing beneath the BGA shadow to minimize crosstalk into the 201 MHz internal logic.
Estimated: Power sequencing for the EPM570M256C5N requires the 1.8 V VCCINT rail to ramp before or simultaneously with any 2.5 V / 3.3 V VCCIO bank. A hot-swap or sequencing controller such as the LTC2955 should drive the enable inputs of upstream regulators to enforce this order; out-of-order power-up can latch I/O pins into undefined states. Total typical supply current at 50 MHz toggle with all I/O active is approximately 30 mA, well within the capability of any LDO rated above 100 mA.
Do not connect the JTAG TCK, TMS, TDI, and TDO pins to any non-JTAG function in the Quartus pin assignments without setting them as input tri-state in the device options - leaving them enabled can prevent boundary-scan from acquiring the chain. When migrating a design from a 100-pin TQFP MAX II device to the 256-MBGA package, unused I/O pins must be set to 'tri-state' in the fitter settings rather than left floating, since input-only MBGA balls can float into the linear region and draw supply current.
Compliance Information
RoHS compliant and lead-free per Intel product declaration. BGA balls use SAC305 lead-free alloy compatible with JEDEC J-STD-020 260°C peak reflow. AEC-Q100 not applicable - this is a commercial-grade CPLD; industrial-temperature variants (EPM570GM256I5N) are recommended for harsh-environment applications.
