EPM570GM256C5N - 440 Macrocell MAX II CPLD | Altera / Intel
MPN: EPM570GM256C5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $26.8 | $26.80 |
| 10 | $24.5 | $245.00 |
| 25 | $23.2 | $580.00 |
| 100 | $21.4 | $2,140.00 |
| 250 | $19.75 | $4,937.50 |
| 500 | $18.6 | $9,300.00 |
Drop-in alternatives for EPM570GM256C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570GF256C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$17.95 / Unit
View Datasheet →EPM1270GM256C5N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPM2210GM256C5N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPM570GM100C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$10.4 / Unit
View Datasheet →EPM570GM256C5N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Family | CPLD - Complex Programmable Logic Device |
| Macro Cells | 440 |
| Logic Array Blocks (LABs) | 57 |
| Number of I/Os | 160 |
| Maximum Operating Frequency | 304 MHz |
| Maximum Internal Frequency (datasheet fMAX) | 201.1 MHz |
| Pin-to-Pin Logic Delay (Speed Grade C5) | 5 ns |
| Operating Supply Voltage (Core VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) |
| I/O Bank Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) |
| Process Technology | 0.18 um flash-based CMOS |
| Programmable Type | In System Programmable (ISP) via JTAG |
| Package / Case | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| Lead Free / RoHS Status | See manufacturer page; legacy part - verify per lot |
| Configuration Memory | Internal flash (non-volatile, instant-on) |
| JTAG Support | Yes (IEEE 1149.1 / 1532) |
| Vertical Migration | Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package |
EPM570GM256C5N 256-ball micro fineline bga, 11x11 mm, 0.8 mm pitch Pin Configuration Guide
Complete pinout information for EPM570GM256C5N (256-ball micro fineline bga, 11x11 mm, 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570GM256C5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GM256C5N is suitable for 6 applications: Industrial Control Glue Logic, Bus Bridging and Protocol Conversion, Telecom Line-Card Interface Logic, Motor-Control Timing and PWM Generation, Medical Instrumentation Glue Logic, Display Panel Timing Generator.
Industrial Control Glue Logic
The EPM570GM256C5N is well suited to industrial control boards as a glue-logic consolidator that replaces 5-10 discrete MSI/SSI packages with a single non-volatile device. Its 440 macrocells and 160 user I/Os comfortably handle address-latch, chip-select, bus-arbitration, and watchdog logic around a microcontroller or SoC. The instant-on flash-based configuration (under 200 µs) ensures deterministic power-up state for safety-critical interlocks, while the multiVolt I/O banks interface directly to 3.3 V MCUs and 5 V legacy peripherals. The 256-MBGA package keeps board area compact for DIN-rail PLC form factors.
Recommended
Bus Bridging and Protocol Conversion
Designers use the EPM570GM256C5N as a flexible bus bridge between mismatched interfaces - for example, converting a parallel Local Bus to SPI/I2C, or implementing a custom memory-mapped register decoder. The 57 LAB structure delivers wide fan-in for address decoding, and the 5 ns pin-to-pin delay (C5 grade) keeps glue-logic latency low enough that the CPLD does not bottleneck the bus. Its 160 I/Os handle full 16-bit data + 24-bit address + control bus implementations in a single device. The MAX II flash memory stores the bridge configuration non-volatility, so power-cycling does not require re-programming.
Recommended
Telecom Line-Card Interface Logic
In telecom line cards the EPM570GM256C5N implements TDM/timeslot switching, frame-alignment detection, and clock-domain crossing between the framer, mapper, and backplane SERDES. Its 1.8 V core plus multiVolt I/Os interface directly to 2.5 V and 3.3 V framers and to 1.5 V LVCMOS backplane logic without external level shifters, reducing BOM and board area. The JTAG (IEEE 1149.1/1532) interface supports in-system boundary-scan tests across the line-card population, simplifying manufacturing test and field diagnostics. The 256-ball Micro FineLine BGA fits the dense backplane real-estate typical of ATCA/AMC line cards.
Recommended
Motor-Control Timing and PWM Generation
Factory-automation motor drives rely on the EPM570GM256C5N for deterministic PWM generation, dead-time insertion, Hall-sensor decoding, and protection logic. The 5 ns pin-to-pin logic delay gives sub-microsecond response to over-current and over-temperature faults, critical for IGBT/SiC inverter safety. The 160 I/Os allow direct interface to three-phase gate drivers, encoders, and the host DSP/FPGA without external muxes. The instant-on behavior ensures the motor drive boots into a safe state (gates low) within 200 µs of power-up, eliminating dangerous transient pulses during power-on sequencing.
Recommended
Medical Instrumentation Glue Logic
In medical imaging carts, patient monitors, and bench-top analyzers, the EPM570GM256C5N serves as a low-power glue-logic hub between ADCs, DACs, displays, and a host processor. Its 0.18-um flash CMOS process yields low quiescent current, helping battery-powered portable monitors meet IEC 60601-1 energy budgets. The 160 user I/Os handle parallel TFT-LCD bridges, keypad scanners, audio CODEC interfaces, and SD-card multiplexers within a single device. Non-volatile instant-on configuration eliminates boot-time variability, important for clinical workflows where power-cycle-to-ready time must be reproducible.
Recommended
Display Panel Timing Generator
Large LCD/OLED panels in industrial HMIs, point-of-sale terminals, and digital signage require a dedicated timing controller (TCON) that generates row/column driver waveforms, gamma correction tables, and backlight PWM. The EPM570GM256C5N provides the 160 I/Os and 5 ns logic delay needed to drive LVDS/FPD-Link bridges and to implement per-panel color-depth conversion in real time. Its multiVolt I/O banks interface to 1.8 V, 2.5 V, and 3.3 V source drivers without level shifters. The instant-on flash memory stores per-panel calibration coefficients, removing the need for an external EEPROM.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GM256C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GF256C5N | EPM1270GM256C5N | EPM2210GM256C5N | EPM570GM100C5N |
|---|---|---|---|---|---|
| Package | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch | 256-ball Micro FineLine BGA, 11x11 mm - same | 256-ball Micro FineLine BGA, 11x11 mm - same | 256-ball Micro FineLine BGA, 11x11 mm - same | 100-ball Micro FBGA - different |
| Brand | Altera (now part of Intel) | Altera (now part of Intel) | Altera (now part of Intel) | Altera (now part of Intel) | Altera (now part of Intel) |
| Macro Cells | 440 | 440 | 1270 | 2210 | 440 |
| Logic Array Blocks (LABs) | 57 | 57 | 127 | 221 | 57 |
| Maximum User I/Os | 160 | 160 | 212 | 212 | 76 |
| Operating Voltage (VCCINT) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) |
| Pin-to-Pin Delay (Speed Grade C5) | 5 ns | 5 ns | 6 ns (C6 grade standard, C5 on request) | 7 ns (C7 grade standard) | 5 ns |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Configuration Memory | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) |
| Approx. Unit Price (qty 1, USD) | 26.80 | 26.00 | 40.00 | 62.00 | 20.00 |
Key Differentiators
- Highest-density non-volatile CPLD with 160 I/Os in 11x11 mm BGA (vs EPM570GM100C5N (100-ball Micro FBGA))
- Instant-on non-volatile flash configuration (vs SRAM-based FPGAs (e.g., Cyclone IV))
- Pin-compatible vertical-migration to higher densities (vs EPM1270GM256C5N / EPM2210GM256C5N)
Design Notes
The 256-ball Micro FineLine BGA uses a 0.8 mm ball pitch, which demands NSMD (non-solder mask defined) pads with via-in-pad or microvia escape routing. Use at least 4 PCB layers with a continuous ground plane directly under the BGA. Stitching vias around the BGA perimeter at 1 mm spacing suppress ground bounce. For prototype builds, request gold-wire-ball or SAC305 lead-free balls from the distributor; non-leaded solder spheres require precise reflow profiling between 245 °C and 260 °C peak.
The MAX II family requires a clean 1.8 V VCCINT rail. Place a 0.1 µF X7R ceramic bypass capacitor directly at every VCCINT/GND pair (8 pairs in the 256-MBGA), plus one 4.7 µF bulk decoupling capacitor at the package entry point. Each I/O bank should have its own VCCIO rail and its own 0.1 µF + 1 µF decoupling pair; mixing bank supplies on a single ferrite risks simultaneous-switching-noise (SSN) coupling. Power-on ramp should be monotonic between 0 V and 1.89 V in less than 100 ms to satisfy MAX II configuration timing.
Do not confuse the EPM570GM256C5N ('GM' = Micro FineLine BGA, 11x11 mm, 0.8 mm pitch) with the EPM570F256C5N ('F' = FineLine BGA, 17x17 mm, 1.0 mm pitch). The two share the same die but have different ball maps and are NOT drop-in replacements. Also confirm the speed grade suffix - C5N specifies commercial temperature and 5 ns pin-to-pin delay, whereas C4N or C3N denote slower grades. Mixing speed grades in a JTAG chain can produce timing violations on TDO-to-TDI paths longer than 50 MHz; use a buffered JTAG chain for multi-device boards.
Long 160-I/O buses on the 256-MBGA benefit from series-damping resistors (22-33 Ω) on high-edge-rate outputs to control overshoot. The MAX II I/O slew-rate should be set to 'Slow' on buses longer than 50 mm to reduce SSN. For LVDS or LVPECL interfacing, use external resistor networks near the CPLD pin; the MAX II does not include true LVDS drivers. Always route the JTAG TCK signal as a 50 Ω microstrip with a 33 Ω source-termination resistor if the chain exceeds 100 mm.
Compliance Information
RoHS / REACH / lead-free status not explicitly stated in the verified distributor snippets. Altera/Intel MAX II parts are typically RoHS-compliant but lot-by-lot verification with the manufacturer is recommended for new designs.
