EPM570T144I5N - 570 LE MAX II CPLD, 144-TQFP | Intel (Altera)
N.º da peça: EPM570T144I5N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.95 | $5.975,00 |
| 1.000 | $10.5 | $10.500,00 |
EPM570T144I5N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell arrays with on-chip flash configuration memory, providing instant-on behavior at power-up. Within the broader taxonomy the EPM570T144I5N sits at: CPLD -> programmable logic -> logic IC -> integrated circuit -> semiconductor. MAX II devices integrate a 3.3 V internal core with user-selectable 1.5 V/1.8 V/2.5 V/3.3 V VCCIO banks, enabling mixed-voltage interfacing to legacy 1.8 V and 3.3 V buses without external level shifters.
Key features include 570 logic elements distributed across 440 macrocells, MultiVolt I/O bank support, in-system programmability (ISP) via IEEE 1149.1 JTAG, IEEE 1149.1 boundary-scan test, a global clock network with 304 MHz maximum frequency, and 8 Kbits of user-accessible flash memory. The TQFP-144 package exposes all four sides for dense PCB trace routing, while the I5N speed grade targets industrial temperature applications.
The MAX II architecture uses 4-input look-up tables feeding macrocell flip-flops with product-term distributed control, allowing flexible sum-of-products logic synthesis. Per the MAX II Family datasheet, the EPM570's flash-based configuration eliminates the need for external boot memory and provides bitstream-level security bits, making it suitable for tamper-resistant glue logic.
Typical applications include I/O expansion for microcontrollers, bus decoding and address mapping, interface bridging between 3.3 V and 1.8 V logic domains, LED display row/column drivers, and power-supply sequencing controllers. The non-volatile instant-on behavior makes the part especially valuable in systems that must respond within milliseconds of power application.
A key design consideration is I/O bank supply planning - VCCIO pins on each I/O bank must be tied to the correct voltage rail for the connected logic family. For high-toggle-rate outputs, derate maximum dc current per pin and total package dissipation per the MAX II handbook thermal tables.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
Alternativas drop-in para EPM570T144I5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570T144I5N (mesmo formato e footprint) — diferindo em Package, Process Technology, Programming Interface, Operating Temperature, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570GT144I5N
✅ Drop-In✓ Em estoque
$14.85 / unidade
Ver ficha técnica →EPM570GT144I5
✅ Drop-In✓ Em estoque
$23.1 / unidade
Ver ficha técnica →EPM570T144C5N
✅ Drop-In✓ Em estoque
$9.35 / unidade
Ver ficha técnica →EPM570GT144C5N
✅ Drop-In✓ Em estoque
$14.2 / unidade
Ver ficha técnica →EPM570GT144C5
✅ Drop-In✓ Em estoque
$14.2 / unidade
Ver ficha técnica →EPM570GT144C4N
✅ Drop-In✓ Em estoque
$22.5 / unidade
Ver ficha técnica →EPM570GT144C4
✅ Drop-In✓ Em estoque
$22.1 / unidade
Ver ficha técnica →EPM570T144I5N Classificações máximas e características elétricas
| Family | MAX II |
| Logic Elements | 570 LE |
| Macrocells | 440 |
| Maximum Pin-to-Pin Delay (tPD1) | 8.7 ns |
| Maximum Frequency (fCNT) | 304 MHz |
| User Flash Memory (UFM) | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 3.0 V to 3.6 V (3.3 V typical) |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Temperatura de operação | -40C to +100C (industrial) |
| Speed Grade | I5N |
| Process Technology | 0.18 um CMOS, 6-layer-metal flash |
| Encapsulamento | TQFP-144 (22 mm x 22 mm, 0.5 mm pitch) |
| Tipo de montagem | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Boundary-Scan Test | IEEE 1149.1 compliant |
| Status RoHS | Compliant |
Configuração de pinos do EPM570T144I5N
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | GND — Ground |
| Pino 13 | I/O — User I/O pin (bank 2) |
| Pino 14 | I/O — User I/O pin (bank 2) |
| Pino 15 | I/O — User I/O pin (bank 2) |
| Pino 16 | I/O — User I/O pin (bank 2) |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | I/O — User I/O pin (bank 2) |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | GND — Ground |
| Pino 31 | I/O — User I/O pin (bank 3) |
| Pino 32 | I/O — User I/O pin (bank 3) |
| Pino 33 | I/O — User I/O pin (bank 3) |
| Pino 34 | I/O — User I/O pin (bank 3) |
| Pino 35 | I/O — User I/O pin (bank 3) |
| Pino 36 | I/O — User I/O pin (bank 3) |
| Pino 37 | I/O — User I/O pin (bank 3) |
| Pino 38 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 39 | I/O — User I/O pin (bank 3) |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | GND — Ground |
| Pino 43 | I/O — User I/O pin (bank 4) |
| Pino 44 | I/O — User I/O pin (bank 4) |
| Pino 45 | I/O — User I/O pin (bank 4) |
| Pino 46 | I/O — User I/O pin (bank 4) |
| Pino 47 | I/O — User I/O pin (bank 4) |
| Pino 48 | I/O — User I/O pin (bank 4) |
| Pino 49 | I/O — User I/O pin (bank 4) |
| Pino 50 | I/O — User I/O pin (bank 4) |
| Pino 51 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 52 | I/O — User I/O pin (bank 4) |
| Pino 53 | I/O — User I/O pin (bank 4) |
| Pino 54 | I/O — User I/O pin (bank 4) |
| Pino 55 | I/O — User I/O pin (bank 4) |
| Pino 56 | I/O — User I/O pin (bank 4) |
| Pino 57 | I/O — User I/O pin (bank 4) |
| Pino 58 | I/O — User I/O pin (bank 4) |
| Pino 59 | GND — Ground |
| Pino 60 | I/O — User I/O pin (bank 5) |
| Pino 61 | I/O — User I/O pin (bank 5) |
| Pino 62 | I/O — User I/O pin (bank 5) |
| Pino 63 | I/O — User I/O pin (bank 5) |
| Pino 64 | I/O — User I/O pin (bank 5) |
| Pino 65 | I/O — User I/O pin (bank 5) |
| Pino 66 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 67 | I/O — User I/O pin (bank 5) |
| Pino 68 | I/O — User I/O pin (bank 5) |
| Pino 69 | I/O — User I/O pin (bank 5) |
| Pino 70 | GND — Ground |
| Pino 71 | I/O — User I/O pin (bank 6) |
| Pino 72 | I/O — User I/O pin (bank 6) |
| Pino 73 | I/O — User I/O pin (bank 6) |
| Pino 74 | I/O — User I/O pin (bank 6) |
| Pino 75 | I/O — User I/O pin (bank 6) |
| Pino 76 | I/O — User I/O pin (bank 6) |
| Pino 77 | I/O — User I/O pin (bank 6) |
| Pino 78 | I/O — User I/O pin (bank 6) |
| Pino 79 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 80 | I/O — User I/O pin (bank 6) |
| Pino 81 | I/O — User I/O pin (bank 6) |
| Pino 82 | I/O — User I/O pin (bank 6) |
| Pino 83 | I/O — User I/O pin (bank 6) |
| Pino 84 | I/O — User I/O pin (bank 6) |
| Pino 85 | I/O — User I/O pin (bank 6) |
| Pino 86 | GND — Ground |
| Pino 87 | I/O — User I/O pin (bank 7) |
| Pino 88 | I/O — User I/O pin (bank 7) |
| Pino 89 | I/O — User I/O pin (bank 7) |
| Pino 90 | I/O — User I/O pin (bank 7) |
| Pino 91 | I/O — User I/O pin (bank 7) |
| Pino 92 | I/O — User I/O pin (bank 7) |
| Pino 93 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 94 | I/O — User I/O pin (bank 7) |
| Pino 95 | I/O — User I/O pin (bank 7) |
| Pino 96 | I/O — User I/O pin (bank 7) |
| Pino 97 | GND — Ground |
| Pino 98 | I/O — User I/O pin (bank 8) |
| Pino 99 | I/O — User I/O pin (bank 8) |
| Pino 100 | I/O — User I/O pin (bank 8) |
| Pino 101 | I/O — User I/O pin (bank 8) |
| Pino 102 | I/O — User I/O pin (bank 8) |
| Pino 103 | I/O — User I/O pin (bank 8) |
| Pino 104 | I/O — User I/O pin (bank 8) |
| Pino 105 | I/O — User I/O pin (bank 8) |
| Pino 106 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 107 | I/O — User I/O pin (bank 8) |
| Pino 108 | I/O — User I/O pin (bank 8) |
| Pino 109 | I/O — User I/O pin (bank 8) |
| Pino 110 | I/O — User I/O pin (bank 8) |
| Pino 111 | I/O — User I/O pin (bank 8) |
| Pino 112 | I/O — User I/O pin (bank 8) |
| Pino 113 | GND — Ground |
| Pino 114 | TDI — JTAG test data in |
| Pino 115 | TMS — JTAG test mode select |
| Pino 116 | TCK — JTAG test clock |
| Pino 117 | NC — Not connected (per datasheet) |
| Pino 118 | TDO — JTAG test data out |
| Pino 119 | VCCINT — Core supply voltage (3.3 V) |
| Pino 120 | GND — Ground |
| Pino 121 | I/O — User I/O pin (bank 1) |
| Pino 122 | I/O — User I/O pin (bank 1) |
| Pino 123 | I/O — User I/O pin (bank 1) |
| Pino 124 | I/O — User I/O pin (bank 1) |
| Pino 125 | I/O — User I/O pin (bank 1) |
| Pino 126 | I/O — User I/O pin (bank 1) |
| Pino 127 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 128 | I/O — User I/O pin (bank 1) |
| Pino 129 | I/O — User I/O pin (bank 1) |
| Pino 130 | I/O — User I/O pin (bank 1) |
| Pino 131 | GND — Ground |
| Pino 132 | I/O — User I/O pin (bank 2) |
| Pino 133 | I/O — User I/O pin (bank 2) |
| Pino 134 | I/O — User I/O pin (bank 2) |
| Pino 135 | I/O — User I/O pin (bank 2) |
| Pino 136 | I/O — User I/O pin (bank 2) |
| Pino 137 | I/O — User I/O pin (bank 2) |
| Pino 138 | I/O — User I/O pin (bank 2) |
| Pino 139 | VCCINT — Core supply voltage (3.3 V) |
| Pino 140 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 141 | I/O — User I/O pin (bank 2) |
| Pino 142 | I/O — User I/O pin (bank 2) |
| Pino 143 | I/O — User I/O pin (bank 2) |
| Pino 144 | GND — Ground |
Aplicações típicas
EPM570T144I5N é adequado para 7 aplicaçãos: Microcontroller I/O Expansion and Bus Decoding, Mixed-Voltage Interface Bridging, Power-Supply Sequencing Controller, FPGA Configuration Supervisor, LED Display Row/Column Driver, Industrial Glue Logic Replacement, Legacy System Drop-In Replacement.
Microcontroller I/O Expansion and Bus Decoding
The EPM570T144I5N is a natural fit for microcontroller I/O expansion and bus decoding because its 570 logic elements / 440 macrocells easily absorb 32-bit address decoding, chip-select generation, and interrupt-aggregation logic that an MCU's limited pin set cannot. The 112 user I/O pins on the TQFP-144 package provide ample headroom for multiplexing 8/16/32-bit parallel buses plus dedicated handshaking lines. The non-volatile instant-on behavior ensures address decoding is valid at the first MCU clock edge with no FPGA-style configuration delay. MultiVolt I/O banks let the CPLD interface directly to 3.3 V MCUs and 1.8 V peripherals on the same die, eliminating external level shifters.
Recomendado
Mixed-Voltage Interface Bridging
Bridging 3.3 V legacy peripherals to 1.8 V processors is straightforward with the EPM570T144I5N because its MultiVolt I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V VCCIO rails on the same device. Each I/O bank can be powered independently, allowing one side of the bridge to swing at 3.3 V while the other side at 1.8 V without external level shifters. The 8.7 ns tPD1 timing supports interface speeds up to roughly 50 MHz, covering I2C, SPI, UART, and parallel RGB bridges. The 8 Kbit UFM can store bridge configuration parameters or trim calibration data for downstream peripherals.
Recomendado
Power-Supply Sequencing Controller
The EPM570T144I5N serves as a deterministic power-supply sequencer because its flash-based non-volatile configuration boots in microseconds and its macrocell-rich architecture supports dozens of independently timed enable signals. Each rail's Power-Good input can be wired to a CPLD pin, and a finite-state machine implemented across 570 LEs can drive sequenced ENABLE outputs to DC-DC converters with millisecond-precision delays. The industrial -40C to +100C temperature range ensures reliable startup in outdoor enclosures and industrial cabinets. The 304 MHz fCNT clock supports accurate timebase generation for timing-critical sequencing profiles.
Recomendado
FPGA Configuration Supervisor
Pairing the EPM570T144I5N with a SRAM-based FPGA delivers robust configuration supervision because the CPLD can hold the FPGA in RESET, monitor configuration DONE pins, and arbitrate multi-FPGA configuration chains. The 112 I/O pins support several parallel FPGA configuration buses plus JTAG chains for in-system programming of both devices. Non-volatile storage of golden configuration bitstreams in the 8 Kbit UFM enables recovery from failed FPGAs. With 8.7 ns tPD1 the CPLD can assert DONE-to-LOGIC-READY handshakes deterministically across the full industrial temperature range.
Recomendado
LED Display Row/Column Driver
The EPM570T144I5N drives small-to-medium LED matrix displays because its 112 user I/O pins and 570 logic elements handle multiplexed row/column scanning, brightness PWM generation, and serial-to-parallel data conversion. The 304 MHz fCNT clock supports high-refresh-rate PWM at kHz frequencies for flicker-free dimming. The TQFP-144 package distributes I/O on all four sides, simplifying PCB routing to dense LED arrays. The 8 Kbit UFM stores frame-buffer patterns or animation sequences without external memory, reducing BOM cost versus MCU-driven alternatives.
Recomendado
Industrial Glue Logic Replacement
Replacing dozens of 74-series discrete logic gates with the EPM570T144I5N consolidates board area, lowers power, and simplifies ECO cycles because all logic is implemented in programmable AND/OR arrays. A typical 74LS138 + 74LS245 + 74LS374 + 74LS08 design replaces with a single TQFP-144 CPLD consuming roughly 30-50 mA quiescent. The JTAG ISP interface enables in-system updates during manufacturing without IC desoldering. Industrial -40C to +100C operation matches the requirements of factory automation, transportation, and outdoor-telecom cabinets. The 8.7 ns tPD1 timing replicates standard 74LS propagation delays within tolerance.
Recomendado
Legacy System Drop-In Replacement
Because the EPM570T144I5N is on last-time-buy status, design teams maintaining long-lifecycle products can use the EPM570GT144I5N or EPM570T144C5N as drop-in replacements on existing 144-pin TQFP footprints. Both share identical pin assignments, JTAG programming interface, and Quartus II tool flow, so existing bitstreams load and operate identically. The MAX II G silicon revision of the GT variant also extends supply longevity versus the original T silicon. For new designs, migrate to the MAX V family (5M570ZT100C5N) to avoid future obsolescence.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570T144I5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570GT144I5N | EPM570GT144I5 | EPM570T144C5N | EPM570GT144C5N | EPM570GT144C5 | EPM570GT144C4N | EPM570GT144C4 |
|---|---|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 570 LE | 570 LE | 570 LE | 570 LE | 570 LE | |||
| Macrocells | 440 | 440 | 440 | 440 | 440 | |||
| Maximum tPD1 | 8.7 ns | 8.7 ns | 5.4 ns | 5.4 ns | 4.7 ns | |||
| Silicon Revision | MAX II (T-step) | MAX II G | MAX II (T-step) | MAX II G | MAX II G | |||
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | |||
| Speed Grade | I5N | I5N | C5N | C5N | C4N | |||
| Lead-Free Finish | Yes (N suffix) | Yes (N suffix) | No (non-N) | Yes (N suffix) | No (non-N) |
Principais diferenciais
- 570 LE / 440 macrocell density in TQFP-144 with industrial -40C to +100C operation (vs EPM570GT144C5N)
- Pin-compatible with refreshed MAX II G silicon drop-in (vs EPM570GT144I5N)
- 8.7 ns tPD1 I5N industrial speed grade timing bin (vs EPM570T144C5N)
- 112 user I/O pins across 8 MultiVolt I/O banks (vs EPM570T100I5N)
Notas de projeto
The EPM570T144I5N requires two distinct supply rails: VCCINT (3.3 V nominal, range 3.0 V to 3.6 V) for the internal core, and per-bank VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V) for the user I/O. Per the MAX II family datasheet, each VCCIO bank must be decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of the package pins, and all VCCINT pins must be tied together with a common 3.3 V plane. Sequence VCCINT before or simultaneously with VCCIO; never power VCCIO before VCCINT as it can trigger I/O latch-up. Add a bulk 47 uF tantalum or polymer cap on the 3.3 V rail for inrush current during configuration.
Estimated: in the TQFP-144 package with no heatsink and JEDEC EIA/JESD51 still-air test conditions, theta_JA is approximately 35 C/W. At maximum toggle rate (all 112 I/O at 50 MHz with 20 pF load), power dissipation can reach 0.8 W to 1.0 W, yielding a 28-35 C junction temperature rise above ambient. For sealed enclosures without airflow, derate output toggle rate or reduce VCCIO to 1.8 V on high-bank-count designs. Industrial -40C to +100C ambient operation is achievable with proper copper pour on all four TQFP sides for heat spreading.
JTAG chain integrity is critical for in-system programming of the EPM570T144I5N. Route TDI-TDO as a daisy chain with no stubs, place a 10 kohm pull-up on TCK and TMS to VCCIO of the JTAG bank, and add 33 ohm series termination on TCK if the JTAG cable exceeds 100 mm. Connect TRST (if present in your design) to ground through 1 kohm to enable TAP reset. For multi-device JTAG chains, place the EPM570T144I5N last so its TDO drives back to the programmer with minimal stub length. Always include a JTAG header footprint on prototype boards for in-field bitstream updates.
Three common EPM570T144I5N design pitfalls: (1) Floating JTAG pins - if TCK or TMS float, the TAP controller can enter random states and corrupt configuration; always pull them up. (2) I/O bank supply mixing - mixing 1.8 V and 3.3 V on the same bank causes output driver damage; verify each bank's VCCIO matches the connected logic. (3) Missing CONF_DONE pull-up - the CONF_DONE pin requires an external pull-up to 3.3 V or it will never de-assert to indicate configuration completion. The Quartus II software programmer reports configuration failure as 'CONF_DONE low' if this pull-up is omitted.
Informações de conformidade
RoHS compliant per Arrow and DigiKey product listings. N suffix denotes lead-free (Pb-free) finish per Altera/Intel ordering information. AEC-Q100 not applicable - this is a commercial/industrial CPLD, not automotive-qualified. Halogen-free and conflict-mineral declarations not present in verified data - marked unknown.
