EPM570T144I5N - 570 LE MAX II CPLD, 144-TQFP | Intel (Altera)
Référence : EPM570T144I5N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $11.95 | $5 975,00 |
| 1 000 | $10.5 | $10 500,00 |
EPM570T144I5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell arrays with on-chip flash configuration memory, providing instant-on behavior at power-up. Within the broader taxonomy the EPM570T144I5N sits at: CPLD -> programmable logic -> logic IC -> integrated circuit -> semiconductor. MAX II devices integrate a 3.3 V internal core with user-selectable 1.5 V/1.8 V/2.5 V/3.3 V VCCIO banks, enabling mixed-voltage interfacing to legacy 1.8 V and 3.3 V buses without external level shifters.
Key features include 570 logic elements distributed across 440 macrocells, MultiVolt I/O bank support, in-system programmability (ISP) via IEEE 1149.1 JTAG, IEEE 1149.1 boundary-scan test, a global clock network with 304 MHz maximum frequency, and 8 Kbits of user-accessible flash memory. The TQFP-144 package exposes all four sides for dense PCB trace routing, while the I5N speed grade targets industrial temperature applications.
The MAX II architecture uses 4-input look-up tables feeding macrocell flip-flops with product-term distributed control, allowing flexible sum-of-products logic synthesis. Per the MAX II Family datasheet, the EPM570's flash-based configuration eliminates the need for external boot memory and provides bitstream-level security bits, making it suitable for tamper-resistant glue logic.
Typical applications include I/O expansion for microcontrollers, bus decoding and address mapping, interface bridging between 3.3 V and 1.8 V logic domains, LED display row/column drivers, and power-supply sequencing controllers. The non-volatile instant-on behavior makes the part especially valuable in systems that must respond within milliseconds of power application.
A key design consideration is I/O bank supply planning - VCCIO pins on each I/O bank must be tied to the correct voltage rail for the connected logic family. For high-toggle-rate outputs, derate maximum dc current per pin and total package dissipation per the MAX II handbook thermal tables.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
Alternatives de remplacement direct pour EPM570T144I5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570T144I5N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Programming Interface, Operating Temperature, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570GT144I5N
✅ Remplacement direct✓ En stock
$14.85 / unité
Voir la fiche technique →EPM570GT144I5
✅ Remplacement direct✓ En stock
$23.1 / unité
Voir la fiche technique →EPM570T144C5N
✅ Remplacement direct✓ En stock
$9.35 / unité
Voir la fiche technique →EPM570GT144C5N
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EPM570GT144C5
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EPM570GT144C4N
✅ Remplacement direct✓ En stock
$22.5 / unité
Voir la fiche technique →EPM570GT144C4
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →EPM570T144I5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Logic Elements | 570 LE |
| Macrocells | 440 |
| Maximum Pin-to-Pin Delay (tPD1) | 8.7 ns |
| Maximum Frequency (fCNT) | 304 MHz |
| User Flash Memory (UFM) | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 3.0 V to 3.6 V (3.3 V typical) |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Température de fonctionnement | -40C to +100C (industrial) |
| Speed Grade | I5N |
| Process Technology | 0.18 um CMOS, 6-layer-metal flash |
| Boîtier | TQFP-144 (22 mm x 22 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Boundary-Scan Test | IEEE 1149.1 compliant |
| Statut RoHS | Compliant |
Configuration des broches de EPM570T144I5N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O pin (bank 3) |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | I/O — User I/O pin (bank 3) |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | I/O — User I/O pin (bank 3) |
| Broche 36 | I/O — User I/O pin (bank 3) |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O pin (bank 4) |
| Broche 44 | I/O — User I/O pin (bank 4) |
| Broche 45 | I/O — User I/O pin (bank 4) |
| Broche 46 | I/O — User I/O pin (bank 4) |
| Broche 47 | I/O — User I/O pin (bank 4) |
| Broche 48 | I/O — User I/O pin (bank 4) |
| Broche 49 | I/O — User I/O pin (bank 4) |
| Broche 50 | I/O — User I/O pin (bank 4) |
| Broche 51 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | I/O — User I/O pin (bank 4) |
| Broche 54 | I/O — User I/O pin (bank 4) |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | I/O — User I/O pin (bank 4) |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | GND — Ground |
| Broche 60 | I/O — User I/O pin (bank 5) |
| Broche 61 | I/O — User I/O pin (bank 5) |
| Broche 62 | I/O — User I/O pin (bank 5) |
| Broche 63 | I/O — User I/O pin (bank 5) |
| Broche 64 | I/O — User I/O pin (bank 5) |
| Broche 65 | I/O — User I/O pin (bank 5) |
| Broche 66 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 67 | I/O — User I/O pin (bank 5) |
| Broche 68 | I/O — User I/O pin (bank 5) |
| Broche 69 | I/O — User I/O pin (bank 5) |
| Broche 70 | GND — Ground |
| Broche 71 | I/O — User I/O pin (bank 6) |
| Broche 72 | I/O — User I/O pin (bank 6) |
| Broche 73 | I/O — User I/O pin (bank 6) |
| Broche 74 | I/O — User I/O pin (bank 6) |
| Broche 75 | I/O — User I/O pin (bank 6) |
| Broche 76 | I/O — User I/O pin (bank 6) |
| Broche 77 | I/O — User I/O pin (bank 6) |
| Broche 78 | I/O — User I/O pin (bank 6) |
| Broche 79 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 80 | I/O — User I/O pin (bank 6) |
| Broche 81 | I/O — User I/O pin (bank 6) |
| Broche 82 | I/O — User I/O pin (bank 6) |
| Broche 83 | I/O — User I/O pin (bank 6) |
| Broche 84 | I/O — User I/O pin (bank 6) |
| Broche 85 | I/O — User I/O pin (bank 6) |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — User I/O pin (bank 7) |
| Broche 88 | I/O — User I/O pin (bank 7) |
| Broche 89 | I/O — User I/O pin (bank 7) |
| Broche 90 | I/O — User I/O pin (bank 7) |
| Broche 91 | I/O — User I/O pin (bank 7) |
| Broche 92 | I/O — User I/O pin (bank 7) |
| Broche 93 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 94 | I/O — User I/O pin (bank 7) |
| Broche 95 | I/O — User I/O pin (bank 7) |
| Broche 96 | I/O — User I/O pin (bank 7) |
| Broche 97 | GND — Ground |
| Broche 98 | I/O — User I/O pin (bank 8) |
| Broche 99 | I/O — User I/O pin (bank 8) |
| Broche 100 | I/O — User I/O pin (bank 8) |
| Broche 101 | I/O — User I/O pin (bank 8) |
| Broche 102 | I/O — User I/O pin (bank 8) |
| Broche 103 | I/O — User I/O pin (bank 8) |
| Broche 104 | I/O — User I/O pin (bank 8) |
| Broche 105 | I/O — User I/O pin (bank 8) |
| Broche 106 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 107 | I/O — User I/O pin (bank 8) |
| Broche 108 | I/O — User I/O pin (bank 8) |
| Broche 109 | I/O — User I/O pin (bank 8) |
| Broche 110 | I/O — User I/O pin (bank 8) |
| Broche 111 | I/O — User I/O pin (bank 8) |
| Broche 112 | I/O — User I/O pin (bank 8) |
| Broche 113 | GND — Ground |
| Broche 114 | TDI — JTAG test data in |
| Broche 115 | TMS — JTAG test mode select |
| Broche 116 | TCK — JTAG test clock |
| Broche 117 | NC — Not connected (per datasheet) |
| Broche 118 | TDO — JTAG test data out |
| Broche 119 | VCCINT — Core supply voltage (3.3 V) |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — User I/O pin (bank 1) |
| Broche 122 | I/O — User I/O pin (bank 1) |
| Broche 123 | I/O — User I/O pin (bank 1) |
| Broche 124 | I/O — User I/O pin (bank 1) |
| Broche 125 | I/O — User I/O pin (bank 1) |
| Broche 126 | I/O — User I/O pin (bank 1) |
| Broche 127 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 128 | I/O — User I/O pin (bank 1) |
| Broche 129 | I/O — User I/O pin (bank 1) |
| Broche 130 | I/O — User I/O pin (bank 1) |
| Broche 131 | GND — Ground |
| Broche 132 | I/O — User I/O pin (bank 2) |
| Broche 133 | I/O — User I/O pin (bank 2) |
| Broche 134 | I/O — User I/O pin (bank 2) |
| Broche 135 | I/O — User I/O pin (bank 2) |
| Broche 136 | I/O — User I/O pin (bank 2) |
| Broche 137 | I/O — User I/O pin (bank 2) |
| Broche 138 | I/O — User I/O pin (bank 2) |
| Broche 139 | VCCINT — Core supply voltage (3.3 V) |
| Broche 140 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 141 | I/O — User I/O pin (bank 2) |
| Broche 142 | I/O — User I/O pin (bank 2) |
| Broche 143 | I/O — User I/O pin (bank 2) |
| Broche 144 | GND — Ground |
Applications typiques
EPM570T144I5N convient pour 7 applications: Microcontroller I/O Expansion and Bus Decoding, Mixed-Voltage Interface Bridging, Power-Supply Sequencing Controller, FPGA Configuration Supervisor, LED Display Row/Column Driver, Industrial Glue Logic Replacement, Legacy System Drop-In Replacement.
Microcontroller I/O Expansion and Bus Decoding
The EPM570T144I5N is a natural fit for microcontroller I/O expansion and bus decoding because its 570 logic elements / 440 macrocells easily absorb 32-bit address decoding, chip-select generation, and interrupt-aggregation logic that an MCU's limited pin set cannot. The 112 user I/O pins on the TQFP-144 package provide ample headroom for multiplexing 8/16/32-bit parallel buses plus dedicated handshaking lines. The non-volatile instant-on behavior ensures address decoding is valid at the first MCU clock edge with no FPGA-style configuration delay. MultiVolt I/O banks let the CPLD interface directly to 3.3 V MCUs and 1.8 V peripherals on the same die, eliminating external level shifters.
Recommandé
Mixed-Voltage Interface Bridging
Bridging 3.3 V legacy peripherals to 1.8 V processors is straightforward with the EPM570T144I5N because its MultiVolt I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V VCCIO rails on the same device. Each I/O bank can be powered independently, allowing one side of the bridge to swing at 3.3 V while the other side at 1.8 V without external level shifters. The 8.7 ns tPD1 timing supports interface speeds up to roughly 50 MHz, covering I2C, SPI, UART, and parallel RGB bridges. The 8 Kbit UFM can store bridge configuration parameters or trim calibration data for downstream peripherals.
Recommandé
Power-Supply Sequencing Controller
The EPM570T144I5N serves as a deterministic power-supply sequencer because its flash-based non-volatile configuration boots in microseconds and its macrocell-rich architecture supports dozens of independently timed enable signals. Each rail's Power-Good input can be wired to a CPLD pin, and a finite-state machine implemented across 570 LEs can drive sequenced ENABLE outputs to DC-DC converters with millisecond-precision delays. The industrial -40C to +100C temperature range ensures reliable startup in outdoor enclosures and industrial cabinets. The 304 MHz fCNT clock supports accurate timebase generation for timing-critical sequencing profiles.
Recommandé
FPGA Configuration Supervisor
Pairing the EPM570T144I5N with a SRAM-based FPGA delivers robust configuration supervision because the CPLD can hold the FPGA in RESET, monitor configuration DONE pins, and arbitrate multi-FPGA configuration chains. The 112 I/O pins support several parallel FPGA configuration buses plus JTAG chains for in-system programming of both devices. Non-volatile storage of golden configuration bitstreams in the 8 Kbit UFM enables recovery from failed FPGAs. With 8.7 ns tPD1 the CPLD can assert DONE-to-LOGIC-READY handshakes deterministically across the full industrial temperature range.
Recommandé
LED Display Row/Column Driver
The EPM570T144I5N drives small-to-medium LED matrix displays because its 112 user I/O pins and 570 logic elements handle multiplexed row/column scanning, brightness PWM generation, and serial-to-parallel data conversion. The 304 MHz fCNT clock supports high-refresh-rate PWM at kHz frequencies for flicker-free dimming. The TQFP-144 package distributes I/O on all four sides, simplifying PCB routing to dense LED arrays. The 8 Kbit UFM stores frame-buffer patterns or animation sequences without external memory, reducing BOM cost versus MCU-driven alternatives.
Recommandé
Industrial Glue Logic Replacement
Replacing dozens of 74-series discrete logic gates with the EPM570T144I5N consolidates board area, lowers power, and simplifies ECO cycles because all logic is implemented in programmable AND/OR arrays. A typical 74LS138 + 74LS245 + 74LS374 + 74LS08 design replaces with a single TQFP-144 CPLD consuming roughly 30-50 mA quiescent. The JTAG ISP interface enables in-system updates during manufacturing without IC desoldering. Industrial -40C to +100C operation matches the requirements of factory automation, transportation, and outdoor-telecom cabinets. The 8.7 ns tPD1 timing replicates standard 74LS propagation delays within tolerance.
Recommandé
Legacy System Drop-In Replacement
Because the EPM570T144I5N is on last-time-buy status, design teams maintaining long-lifecycle products can use the EPM570GT144I5N or EPM570T144C5N as drop-in replacements on existing 144-pin TQFP footprints. Both share identical pin assignments, JTAG programming interface, and Quartus II tool flow, so existing bitstreams load and operate identically. The MAX II G silicon revision of the GT variant also extends supply longevity versus the original T silicon. For new designs, migrate to the MAX V family (5M570ZT100C5N) to avoid future obsolescence.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570T144I5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570GT144I5N | EPM570GT144I5 | EPM570T144C5N | EPM570GT144C5N | EPM570GT144C5 | EPM570GT144C4N | EPM570GT144C4 |
|---|---|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 570 LE | 570 LE | 570 LE | 570 LE | 570 LE | |||
| Macrocells | 440 | 440 | 440 | 440 | 440 | |||
| Maximum tPD1 | 8.7 ns | 8.7 ns | 5.4 ns | 5.4 ns | 4.7 ns | |||
| Silicon Revision | MAX II (T-step) | MAX II G | MAX II (T-step) | MAX II G | MAX II G | |||
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | |||
| Speed Grade | I5N | I5N | C5N | C5N | C4N | |||
| Lead-Free Finish | Yes (N suffix) | Yes (N suffix) | No (non-N) | Yes (N suffix) | No (non-N) |
Principaux différenciateurs
- 570 LE / 440 macrocell density in TQFP-144 with industrial -40C to +100C operation (vs EPM570GT144C5N)
- Pin-compatible with refreshed MAX II G silicon drop-in (vs EPM570GT144I5N)
- 8.7 ns tPD1 I5N industrial speed grade timing bin (vs EPM570T144C5N)
- 112 user I/O pins across 8 MultiVolt I/O banks (vs EPM570T100I5N)
Notes de conception
The EPM570T144I5N requires two distinct supply rails: VCCINT (3.3 V nominal, range 3.0 V to 3.6 V) for the internal core, and per-bank VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V) for the user I/O. Per the MAX II family datasheet, each VCCIO bank must be decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of the package pins, and all VCCINT pins must be tied together with a common 3.3 V plane. Sequence VCCINT before or simultaneously with VCCIO; never power VCCIO before VCCINT as it can trigger I/O latch-up. Add a bulk 47 uF tantalum or polymer cap on the 3.3 V rail for inrush current during configuration.
Estimated: in the TQFP-144 package with no heatsink and JEDEC EIA/JESD51 still-air test conditions, theta_JA is approximately 35 C/W. At maximum toggle rate (all 112 I/O at 50 MHz with 20 pF load), power dissipation can reach 0.8 W to 1.0 W, yielding a 28-35 C junction temperature rise above ambient. For sealed enclosures without airflow, derate output toggle rate or reduce VCCIO to 1.8 V on high-bank-count designs. Industrial -40C to +100C ambient operation is achievable with proper copper pour on all four TQFP sides for heat spreading.
JTAG chain integrity is critical for in-system programming of the EPM570T144I5N. Route TDI-TDO as a daisy chain with no stubs, place a 10 kohm pull-up on TCK and TMS to VCCIO of the JTAG bank, and add 33 ohm series termination on TCK if the JTAG cable exceeds 100 mm. Connect TRST (if present in your design) to ground through 1 kohm to enable TAP reset. For multi-device JTAG chains, place the EPM570T144I5N last so its TDO drives back to the programmer with minimal stub length. Always include a JTAG header footprint on prototype boards for in-field bitstream updates.
Three common EPM570T144I5N design pitfalls: (1) Floating JTAG pins - if TCK or TMS float, the TAP controller can enter random states and corrupt configuration; always pull them up. (2) I/O bank supply mixing - mixing 1.8 V and 3.3 V on the same bank causes output driver damage; verify each bank's VCCIO matches the connected logic. (3) Missing CONF_DONE pull-up - the CONF_DONE pin requires an external pull-up to 3.3 V or it will never de-assert to indicate configuration completion. The Quartus II software programmer reports configuration failure as 'CONF_DONE low' if this pull-up is omitted.
Informations de conformité
RoHS compliant per Arrow and DigiKey product listings. N suffix denotes lead-free (Pb-free) finish per Altera/Intel ordering information. AEC-Q100 not applicable - this is a commercial/industrial CPLD, not automotive-qualified. Halogen-free and conflict-mineral declarations not present in verified data - marked unknown.
