K4A8G165WB-BCWE - 8Gb DDR4 3200Mbps 96FBGA DRAM | Samsung
N.º da peça: K4A8G165WB-BCWE ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.61 | $7,61 |
| 10 | $7.3 | $73,00 |
| 100 | $6.95 | $695,00 |
| 500 | $6.6 | $3.300,00 |
| 1.000 | $6.25 | $6.250,00 |
K4A8G165WB-BCWE Visão geral
DRAM (Dynamic Random Access Memory) is the mainstream volatile working memory used in virtually every computing system, sitting below CPU caches in speed but far above storage in bandwidth. DDR4 SDRAM, the fourth generation of Double Data Rate synchronous DRAM defined by the JEDEC DDR4 standard, doubles the internal prefetch of DDR3 to 8n, lowers the operating voltage from 1.5V to 1.2V, and increases bank groups to improve effective bandwidth. Within the system hierarchy, DRAM sits between the processor and non-volatile storage (NAND flash), providing the primary working set for operating systems and applications.
Key features of this device include the 8 Gb B-die architecture in a x16 organization, a 3200 Mbps/pin data rate yielding up to 6.4 GB/s per device, and 1.2 V core operation that consumes up to 25% less power than comparable DDR3 parts. The x16 bus width simplifies interface routing for embedded controllers, and the commercial 0C to +85C temperature grade suits consumer, networking, and industrial-computing environments.
Technically, the WB B-die uses an 8n prefetch DDR4 core with bank-group architecture, on-die termination (ODT), DLL for output timing, and programmable CAS latency per the DDR4 JEDEC interface. Power management features include a dedicated VPP rail for word-line boosting and self-refresh modes for standby power reduction.
Typical applications include embedded controller memory subsystems, networking and communication equipment line cards, industrial PCs, set-top boxes, smart TVs, and desktop/commercial computing modules where a soldered-down x16 DDR4 device is preferred over a DIMM module.
When designing with this device, the memory controller must support DDR4-3200 timing at 1.2 V, and signal integrity demands length-matched routing, on-die termination tuning, and VREF training per the controller calibration sequence.
This page synthesizes distributor pricing, pin-compatible Samsung family alternatives, comparison tables, and practical DDR4 layout guidance not found in a single manufacturer datasheet.
Alternativas drop-in para K4A8G165WB-BCWE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K4A8G165WB-BCTD
✓ Em estoque
$37 / unidade
Ver ficha técnica →K4A8G165WB-BCRC
✓ Em estoque
$12.57 / unidade
Ver ficha técnica →K4A8G165WB-BCPB
✓ Em estoque
$2.3 / unidade
Ver ficha técnica →K4A8G165WC-BCWE
✓ Em estoque
$38 / unidade
Ver ficha técnica →K4A8G165WG-BCWE
✓ Em estoque
$29.5313 / unidade
Ver ficha técnica →MT40A512M16HA-083E:B
📋 Alternativa de referência (fora do catálogo)
K4A8G165WB-BCWE Classificações máximas e características elétricas
| Tipo de memória | DDR4 SDRAM |
| Tamanho da memória | 8 Gb |
| Memory Organization | 512M x 16 |
| Taxa de dados | 3200 Mbps/pin |
| Tensão de alimentação | 1.2 V |
| Access Time | 19 ns |
| Interface | Parallel |
| Encapsulamento | 96FBGA |
| Temperatura de operação | 0C to +85C |
| Tipo de montagem | Surface Mount |
| Memory Format | DRAM (volatile) |
| Technology | DDR4 SDRAM B-die |
| Prefetch | 8n |
| Refresh | Self-refresh supported |
| Termination | On-die termination (ODT) |
Guia de Configuração de Pinos do K4A8G165WB-BCWE 96fbga
Configuração de pinos para K4A8G165WB-BCWE (pacote 96fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para K4A8G165WB-BCWE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
K4A8G165WB-BCWE é adequado para 6 aplicaçãos: Networking and Communication Equipment, Embedded Industrial Computing, Consumer Electronics and Smart TV, Desktop and Commercial Computing Modules, Video Surveillance and NVR Systems, Test and Measurement Instrumentation.
Networking and Communication Equipment
The K4A8G165WB-BCWE fits router, switch, and gateway line cards that need sustained DDR4-3200 bandwidth for packet buffering and lookup tables. Its 8Gb density in a single 96FBGA device lets designers place 1-2 GB of soldered memory without SO-DIMM sockets, improving reliability in fanless equipment. The x16 organization halves device count versus x8, reducing address/control bus loading and simplifying fly-by routing to the memory controller. The 1.2V rail keeps total board power low for thermally constrained telecom enclosures, while 0C to +85C grading covers typical equipment-room ambient conditions with margin.
Recomendado
Embedded Industrial Computing
Industrial PCs, HMIs, and edge controllers use soldered-down DDR4 like the K4A8G165WB-BCWE to avoid connector vibration failures. The 8Gb 512M x 16 device provides working memory for Linux-based controllers at DDR4-3200, enough bandwidth for multi-protocol stacks and local analytics. Its 1.2V operation cuts memory subsystem power versus DDR3 by roughly 25%, easing fanless thermal budgets. The commercial 0C to +85C range suits enclosed cabinets; for cold storage floors below 0C, select an industrial temperature variant. Soldered FBGA mounting also removes mechanical stress on memory modules in high-shock environments.
Recomendado
Consumer Electronics and Smart TV
Set-top boxes, smart TVs, and streaming media players use 8Gb x16 DDR4 for video frame buffering and application memory. The K4A8G165WB-BCWE's 3200 Mbps rate supports 4K video decode pipelines where the SoC memory interface must sustain high sustained bandwidth for frame buffers. The x16 bus matches common TV SoC controllers, and the single-package solution allows compact, low-cost mainboards without memory sockets. 1.2V operation helps meet energy-star style standby targets, and the standard 96FBGA footprint enables a shared PCB design across multiple die revisions (WB/WC/WG) for supply flexibility.
Recomendado
Desktop and Commercial Computing Modules
Soldered-down DDR4 on COM Express or SoM carrier designs benefits from the K4A8G165WB-BCWE's compact 96FBGA footprint. Populating four devices yields 4GB of on-module memory at DDR4-3200, appropriate for Windows or Linux thin clients, POS terminals, and digital-signage players. The x16 organization lets the CPU's two 64-bit channels be populated with balanced ranks using fewer parts than x8 alternatives, trimming BOM cost. Memory training at 3200 Mbps on commercial chipsets is well supported, and the 1.2V rail integrates cleanly with the module's single high-efficiency buck regulator for the memory domain.
Recomendado
Video Surveillance and NVR Systems
Network video recorders and multi-channel IP camera hubs require large buffers for ingest and transcode streams, which the 8Gb K4A8G165WB-BCWE supplies at DDR4-3200 bandwidth. Multiple devices around an SoC deliver the multi-GB working sets needed for simultaneous H.265 encode/decode of 16+ channels. The 0C to +85C range fits indoor NVR enclosures, and the FBGA soldered design withstands 24/7 operation vibration better than SODIMMs. Power efficiency at 1.2V matters in always-on security hardware where cumulative energy cost is a purchase criterion, and x16 organization reduces controller routing complexity in dense layouts.
Recomendado
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and signal generators need deep capture memory and fast streaming buffers, which the K4A8G165WB-BCWE's 3200 Mbps interface supports. FPGA- or ASIC-based acquisition engines train DDR4-3200 links to sustain continuous sample streaming to 1 GB or more of soldered DRAM. The x16 organization reduces the number of memory devices per instrument channel bank, shortening fly-by routing and easing timing closure on crowded acquisition boards. Bench instruments operate within 0C to +85C, so the commercial grade suffices, and the 96FBGA's known-good Samsung ball map simplifies FPGA memory-controller reuse across product families.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K4A8G165WB-BCWE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K4A8G165WB-BCTD | K4A8G165WB-BCRC | K4A8G165WC-BCWE | K4A8G165WG-BCWE | MT40A512M16HA-083E |
|---|---|---|---|---|---|---|
| Package | 96FBGA | 96FBGA - same | 96FBGA - same | 96FBGA - same | 96FBGA - same | B: 96-ball FBGA - JEDEC compatible |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | B: Micron Technology |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | B: 8 Gb |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | B: 512M x 16 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | B: 1.2 V |
Principais diferenciais
- Full 3200 Mbps speed grade (vs K4A8G165WB-BCRC)
- B-die architecture with broad sibling supply (vs K4A8G165WC-BCWE)
- Supply-chain resilience over cross-brand parts (vs MT40A512M16HA-083E:B)
Notas de projeto
The device requires a 1.2V VDD rail and a separate VPP rail per the DDR4 standard. Decouple with bulk capacitance (e.g. 47-100 uF per device group) plus 100 nF ceramics placed directly under the 96FBGA ball field on the PCB backside. Estimated: at DDR4-3200 burst currents, per-device peak currents can reach ampere-class transients, so design the VRM with adequate transient response and use a solid power plane rather than trace-level feeding.
At 3200 Mbps/pin, DQ-DQS skew budgets are tight. Length-match each DQ to its DQS pair within controller-specified tolerances, keep address/command matched to CK, and reference all high-speed nets to an unbroken ground plane. Tune on-die termination (ODT) and drive-strength settings during memory training; incorrect ODT is the most common cause of eye-diagram failures at DDR4-3200. Run post-layout SI simulation before tape-out, and re-run training across temperature corners.
Do not interchange speed-bin suffixes (WE/RC/PB/TD) without verifying that your memory controller's programmed CAS latency and tRFC timings match the procured bin - a mismatched bin causes boot failures or intermittent errors. Also confirm die revision (WB vs WC vs WG): the ball map is identical, but internal timing differs slightly. For x16 devices, ensure your controller supports the x16 DQS pair (single differential pair per byte lane pair) and 2x refresh behavior options.
Informações de conformidade
RoHS/REACH statements were not present in the retrieved web data; consult Samsung Semiconductor's official compliance documentation for K4A8G165WB-BCWE declarations.
