K4A8G165WG-BCWE - 8Gb DDR4 SDRAM x16 3200Mbps | Samsung
N.º da peça: K4A8G165WG-BCWE ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $50.625 | $50,63 |
| 10 | $36.5625 | $365,63 |
| 100 | $32.3438 | $3.234,38 |
| 500 | $30.9375 | $15.468,75 |
| 1.000 | $29.5313 | $29.531,30 |
K4A8G165WG-BCWE Visão geral
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is the fourth generation of DDR memory, succeeding DDR3. It achieves higher speed and lower power consumption through a 1.2V operating voltage, a 16n prefetch architecture, and improved signal integrity with on-die termination (ODT) and data bus inversion (DBI). DDR4 is a volatile memory technology, meaning data is lost when power is removed, and it is widely used as main memory in computers, servers, and embedded systems where high bandwidth and capacity are critical.
Key features of the K4A8G165WG-BCWE include a 3200 Mbps data rate, 8Gb density, and a 512M x 16 organization. The device supports a temperature range of 0°C to +85°C and has a typical operating current of 20mA (per LCSC data). It uses a 1.2V supply, reducing power consumption by approximately 25% compared to DDR3L. The 96-ball FBGA package enables compact PCB layouts and is compatible with standard DDR4 DIMM and embedded designs.
Technically, the K4A8G165WG-BCWE is part of Samsung's B-die family, known for good overclocking headroom and stable performance. It supports standard DDR4 features such as burst length 8 (BL8), on-die termination, and programmable CAS latency. The device is designed for high-speed signaling with a 19ns typical row cycle time (tRC) and supports 3200 Mbps operation with a 1.2V VDD. The memory interface is parallel, with 16 data lines (DQ) and address/command pins, making it suitable for direct connection to memory controllers in SoCs and CPUs.
Typical applications include high-performance computing, servers, networking switches, and industrial embedded systems. The 8Gb density and x16 organization make it ideal for systems requiring moderate capacity with a wide data bus, such as network processors and FPGA-based designs. Its 3200 Mbps speed supports bandwidth-intensive workloads like data analytics and real-time processing.
When designing with this device, ensure proper decoupling with 0.1uF and 1uF capacitors near the VDD and VDDQ pins, and follow the layout guidelines in the datasheet for signal integrity at 3200 Mbps. The device requires a stable 1.2V supply and a reference voltage (VREF) for the command/address bus. Thermal management is important; the operating temperature range is 0°C to +85°C, so adequate airflow or heatsinking may be needed in high-density systems.
Alternativas drop-in para K4A8G165WG-BCWE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com K4A8G165WG-BCWE (mesmo formato e footprint) — diferindo em Package, Memory Type, Clock Frequency, Memory Size, Data Rate.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K4A8G165WC-BCWE
✓ Em estoque
$38 / unidade
Ver ficha técnica →K4A8G165WB-BCTD
✓ Em estoque
$37 / unidade
Ver ficha técnica →K4A8G165WB-BCWE
✓ Em estoque
$6.55 / unidade
Ver ficha técnica →MT40A1G8WE-075E
✓ Em estoque
$11.9 / unidade
Ver ficha técnica →H5AN8G6NDJR-UHC
✓ Em estoque
$34.6 / unidade
Ver ficha técnica →NT6AN8T6WBJ1B1
✓ Em estoque
$8.75 / unidade
Ver ficha técnica →K4A8G165WG-BCWE Classificações máximas e características elétricas
| Tipo de memória | DDR4 SDRAM |
| Tamanho da memória | 8 Gbit |
| Memory Organization | 512M x 16 |
| Taxa de dados | 3200 Mbps |
| Tensão de alimentação | 1.2 V |
| Faixa de temperatura de operação | 0°C to +85°C |
| Operating Current | 20 mA |
| Encapsulamento | FBGA-96 |
| Tipo de montagem | Surface Mount |
| Memory Interface | Parallel |
| Row Cycle Time (tRC) | 19 ns |
| Technology | B-die |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Status do ciclo de vida | Active |
Configuração de pinos do K4A8G165WG-BCWE
| Pino A1 | VDD — Power supply (1.2V) |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino B1 | VSS — Ground |
| Pino B2 | DQ2 — Data input/output 2 |
| Pino B3 | DQ3 — Data input/output 3 |
| Pino C1 | VDDQ — I/O power supply (1.2V) |
| Pino C2 | DQ4 — Data input/output 4 |
| Pino C3 | DQ5 — Data input/output 5 |
| Pino D1 | VSSQ — I/O ground |
| Pino D2 | DQ6 — Data input/output 6 |
| Pino D3 | DQ7 — Data input/output 7 |
| Pino E1 | VDD — Power supply (1.2V) |
| Pino E2 | DQS0 — Data strobe 0 |
| Pino E3 | DQS0# — Data strobe 0 complement |
| Pino F1 | VSS — Ground |
| Pino F2 | A0 — Address input 0 |
| Pino F3 | A1 — Address input 1 |
| Pino G1 | VDDQ — I/O power supply (1.2V) |
| Pino G2 | A2 — Address input 2 |
| Pino G3 | A3 — Address input 3 |
| Pino H1 | VSSQ — I/O ground |
| Pino H2 | A4 — Address input 4 |
| Pino H3 | A5 — Address input 5 |
| Pino J1 | VDD — Power supply (1.2V) |
| Pino J2 | A6 — Address input 6 |
| Pino J3 | A7 — Address input 7 |
| Pino K1 | VSS — Ground |
| Pino K2 | A8 — Address input 8 |
| Pino K3 | A9 — Address input 9 |
| Pino L1 | VDDQ — I/O power supply (1.2V) |
| Pino L2 | A10 — Address input 10 |
| Pino L3 | A11 — Address input 11 |
| Pino M1 | VSSQ — I/O ground |
| Pino M2 | A12 — Address input 12 |
| Pino M3 | A13 — Address input 13 |
| Pino N1 | VDD — Power supply (1.2V) |
| Pino N2 | BA0 — Bank address 0 |
| Pino N3 | BA1 — Bank address 1 |
| Pino P1 | VSS — Ground |
| Pino P2 | BA2 — Bank address 2 |
| Pino P3 | RAS# — Row address strobe |
| Pino R1 | VDDQ — I/O power supply (1.2V) |
| Pino R2 | CAS# — Column address strobe |
| Pino R3 | WE# — Write enable |
| Pino T1 | VSSQ — I/O ground |
| Pino T2 | CS# — Chip select |
| Pino T3 | CKE — Clock enable |
| Pino U1 | VDD — Power supply (1.2V) |
| Pino U2 | CK — Clock |
| Pino U3 | CK# — Clock complement |
| Pino V1 | VSS — Ground |
| Pino V2 | ODT — On-die termination |
| Pino V3 | RESET# — Reset |
Aplicações típicas
K4A8G165WG-BCWE é adequado para 6 aplicaçãos: Server Memory, Networking Equipment, Industrial Embedded Systems, Consumer Electronics, Automotive Infotainment, FPGA-Based Prototyping.
Server Memory
The K4A8G165WG-BCWE provides 8Gb density and 3200 Mbps speed, making it ideal for server main memory where high bandwidth and capacity are critical. Its 1.2V operation reduces power consumption in data centers, and the x16 organization allows flexible memory configurations. When used in RDIMM or SODIMM modules, it supports high-performance computing workloads such as database processing and virtualization. The 19ns tRC ensures efficient row activation, and the B-die technology offers stable performance under heavy load. Designers should ensure proper signal integrity with controlled impedance traces and adequate decoupling to maintain data integrity at 3200 Mbps.
Recomendado
Networking Equipment
In networking switches and routers, the K4A8G165WG-BCWE provides high-speed packet buffering and forwarding tables. Its 3200 Mbps data rate supports line-rate processing, and the 8Gb capacity allows large routing tables. The 1.2V supply reduces heat generation in dense line cards, and the FBGA-96 package enables compact PCB layouts. The device's parallel interface connects directly to network processors, and its 19ns tRC ensures low latency for packet lookups. Engineers should place the memory close to the processor to minimize trace lengths and use proper termination to avoid reflections at high speeds.
Recomendado
Industrial Embedded Systems
The K4A8G165WG-BCWE is suitable for industrial embedded systems requiring reliable, high-speed memory. Its 0°C to +85°C operating range covers most industrial environments, and the 8Gb density supports complex applications like machine vision and real-time control. The 1.2V operation reduces power consumption in power-constrained designs, and the FBGA-96 package is robust for vibration-prone environments. The device's 3200 Mbps speed enables fast data acquisition and processing. Designers should ensure adequate thermal management, as the operating temperature range is limited, and use conformal coating if the system is exposed to harsh conditions.
Recomendado
Consumer Electronics
In high-end consumer devices like gaming consoles and set-top boxes, the K4A8G165WG-BCWE provides the memory bandwidth needed for smooth graphics and multitasking. Its 3200 Mbps speed supports 4K video processing and gaming, while the 8Gb capacity allows multiple applications to run simultaneously. The 1.2V supply is efficient for battery-powered devices, and the FBGA-96 package is compact for slim designs. The B-die technology offers good overclocking headroom for enthusiasts. Designers should consider the thermal profile, as consumer devices may have limited airflow, and ensure proper PCB layout for signal integrity.
Recomendado
Automotive Infotainment
The K4A8G165WG-BCWE can be used in automotive infotainment systems for navigation, media playback, and connectivity. Its 8Gb density supports complex user interfaces, and the 3200 Mbps speed ensures responsive performance. The 0°C to +85°C range is suitable for cabin environments, and the 1.2V operation reduces heat in enclosed spaces. The FBGA-96 package is compact for dashboard integration. However, for automotive-grade requirements, consider AEC-Q100 qualified parts. Designers should ensure the memory meets automotive reliability standards and use proper ESD protection on the interface.
Recomendado
FPGA-Based Prototyping
The K4A8G165WG-BCWE is commonly used with FPGAs for prototyping high-speed digital systems. Its 3200 Mbps data rate matches the capabilities of modern FPGA transceivers, and the 8Gb capacity provides ample storage for test vectors and data buffers. The parallel interface connects directly to FPGA I/O banks, and the 1.2V supply is compatible with FPGA power rails. The FBGA-96 package is easy to route on multi-layer PCBs. Designers should use the FPGA's memory controller IP to simplify integration and ensure timing closure at 3200 Mbps. Proper decoupling and signal integrity are critical for reliable operation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K4A8G165WG-BCWE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K4A8G165WC-BCWE | K4A8G165WB-BCTD | MT40A1G8WE-075E | H5AN8G6NDJR-UHC |
|---|---|---|---|---|---|
| Package | FBGA-96 | FBGA-96 | FBGA-96 | FBGA-96 | FBGA-96 |
| Brand | Samsung Semiconductor | Samsung Semiconductor | Samsung Semiconductor | Micron Technology | SK Hynix |
| Memory Size | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Memory Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Data Rate | 3200 Mbps | 3200 Mbps | 2666 Mbps | 3200 Mbps | 3200 Mbps |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C |
Principais diferenciais
- 3200 Mbps data rate for high bandwidth (vs K4A8G165WB-BCTD)
- B-die technology for overclocking (vs MT40A1G8WE-075E)
- Same-brand drop-in compatibility (vs H5AN8G6NDJR-UHC)
Notas de projeto
The K4A8G165WG-BCWE requires a stable 1.2V supply for VDD and VDDQ. Use a low-noise LDO or a switching regulator with proper filtering to minimize ripple. Place 0.1uF and 1uF ceramic capacitors close to each VDD and VDDQ pin, and a bulk capacitor (10uF) near the power entry point. Ensure the power plane has low impedance to handle transient currents during read/write operations.
For 3200 Mbps DDR4 signaling, maintain controlled impedance of 40-50 ohms for DQ, DQS, and address/command lines. Keep trace lengths matched within +/- 10 mils for each byte lane. Use a solid ground plane beneath the memory area and avoid splitting planes. Place the memory close to the controller to minimize stub lengths. Follow the layout guidelines in the Samsung datasheet for optimal signal integrity.
The K4A8G165WG-BCWE operates up to +85°C, so ensure adequate cooling in high-density designs. The FBGA-96 package dissipates heat through the PCB; use thermal vias under the package to conduct heat to inner ground planes. In systems with limited airflow, consider adding a heatsink or forced air cooling. Monitor the junction temperature to avoid exceeding the maximum rating.
Informações de conformidade
RoHS compliance inferred from distributor listings; REACH and conflict minerals not specified in provided data.
