K4B4G1646D-BFMA - 4Gb DDR3 SDRAM x16 96FBGA | Samsung
N.º da peça: K4B4G1646D-BFMA ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.2 | $720,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.5 | $6.500,00 |
K4B4G1646D-BFMA Visão geral
DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random Access Memory) is a type of volatile memory that transfers data on both edges of the clock, doubling the data rate of its predecessor DDR2. It is widely used in PCs, servers, and embedded systems due to its high bandwidth and low power consumption. The K4B4G1646D-BFMA is part of Samsung's D-die family, offering improved performance and reliability.
Key features include a 16-bit I/O width, 8 internal banks, and support for burst lengths of 8 and 4 (with burst chop). It features on-die termination (ODT), programmable CAS latency, and a temperature-compensated self-refresh (TCSR) mode. The device is packaged in a 96-ball FBGA (Fine-Pitch Ball Grid Array) with a 0.8mm ball pitch, enabling compact PCB designs.
The K4B4G1646D-BFMA uses a 4Gb D-die architecture with a 1.5V core and I/O supply, achieving a typical operating current of and standby current of . It supports a wide operating temperature range of 0°C to 95°C (case temperature), making it suitable for industrial and consumer environments.
Typical applications include DDR3 memory modules for desktop and laptop computers, networking equipment, set-top boxes, and automotive infotainment systems. Its high density and speed make it ideal for systems requiring large memory capacity with moderate power consumption.
When designing with this device, ensure proper signal integrity by following the layout guidelines in the datasheet, including controlled impedance traces and adequate decoupling capacitors near the VDD and VDDQ pins. The device requires a 1.5V supply and a separate VREFCA and VREFDQ reference voltage, which should be generated with low-noise sources.
Alternativas drop-in para K4B4G1646D-BFMA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com K4B4G1646D-BFMA (mesmo formato e footprint) — diferindo em CAS Latency, Data Rate, Supply Voltage, Package, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K4B4G1646E-BYK0
✅ Drop-In✓ Em estoque
$1.8 / unidade
Ver ficha técnica →K4B4G1646D-BCK00
✅ Drop-In✓ Em estoque
$5.9 / unidade
Ver ficha técnica →K4B4G1646D-BHMA
✅ Drop-In✓ Em estoque
$2.9 / unidade
Ver ficha técnica →K4B4G1646Q
✅ Drop-In✓ Em estoque
$6.5 / unidade
Ver ficha técnica →AS4C256M16D3C-12BCN
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →K4B4G1646D-BFMA Classificações máximas e características elétricas
| Tipo de memória | DDR3 SDRAM |
| Density | 4Gb |
| Organização da memória | 256M x 16 |
| Taxa de dados | 1866 Mbps |
| Tensão de alimentação | 1.5V |
| Encapsulamento | 96-ball FBGA |
| Ball Pitch | 0.8mm |
| Number of Banks | 8 |
| Burst Length | 8 and 4 (with burst chop) |
| Latência CAS | Programmable |
| On-Die Termination | Yes |
| Temperature Range | 0°C to 95°C (case) |
| RoHS | Compliant |
| Lead-Free | Yes |
| Livre de halogênio | Yes |
Configuração de pinos do K4B4G1646D-BFMA
| Pino A1 | VDD — Power supply |
| Pino A2 | VSS — Ground |
| Pino A3 | DQ0 — Data input/output 0 |
| Pino A4 | DQ1 — Data input/output 1 |
| Pino A5 | VDDQ — I/O power supply |
| Pino A6 | VSSQ — I/O ground |
| Pino A7 | DQ2 — Data input/output 2 |
| Pino A8 | DQ3 — Data input/output 3 |
| Pino A9 | VDD — Power supply |
| Pino A10 | VSS — Ground |
| Pino B1 | CK — Clock |
| Pino B2 | CK# — Complementary clock |
| Pino B3 | CKE — Clock enable |
| Pino B4 | CS# — Chip select |
| Pino B5 | RAS# — Row address strobe |
| Pino B6 | CAS# — Column address strobe |
| Pino B7 | WE# — Write enable |
| Pino B8 | ODT — On-die termination |
| Pino B9 | A0 — Address input 0 |
| Pino B10 | A1 — Address input 1 |
Aplicações típicas
K4B4G1646D-BFMA é adequado para 6 aplicaçãos: Desktop and Laptop Memory Modules, Networking Equipment, Set-Top Boxes and Consumer Electronics, Automotive Infotainment Systems, Industrial Control Systems, Medical Devices.
Desktop and Laptop Memory Modules
The K4B4G1646D-BFMA is ideal for DDR3 memory modules in desktop and laptop computers. Its 4Gb density and 1866 Mbps data rate provide high bandwidth for multitasking and gaming. The 1.5V supply is standard for DDR3, ensuring compatibility with existing memory controllers. The 96-FBGA package allows compact module designs, and the 0-95°C temperature range covers typical consumer operating conditions. When used in SO-DIMM or UDIMM modules, it delivers reliable performance for everyday computing tasks.
Recomendado
Networking Equipment
In networking equipment such as routers and switches, the K4B4G1646D-BFMA provides high-speed packet buffering and routing table storage. Its 1866 Mbps data rate ensures low-latency data transfer, critical for network performance. The 4Gb density allows for large routing tables and buffering of multiple data streams. The 1.5V supply is efficient for always-on networking devices. The 96-FBGA package is suitable for space-constrained line cards, and the 0-95°C range accommodates typical networking environments.
Recomendado
Set-Top Boxes and Consumer Electronics
The K4B4G1646D-BFMA is well-suited for set-top boxes and consumer electronics, providing memory for video decoding, user interfaces, and application processing. Its 4Gb density supports high-definition video streams and multiple applications. The 1866 Mbps data rate ensures smooth playback and responsive UI. The 1.5V supply is compatible with consumer power rails. The 96-FBGA package enables compact designs for slim devices. The 0-95°C temperature range covers typical home entertainment environments.
Recomendado
Automotive Infotainment Systems
In automotive infotainment systems, the K4B4G1646D-BFMA provides memory for navigation, media playback, and vehicle diagnostics. Its 4Gb density supports complex graphical interfaces and large map databases. The 1866 Mbps data rate ensures fast loading of applications. The 1.5V supply is suitable for automotive power systems. The 96-FBGA package is robust for vibration-prone environments. The 0-95°C temperature range covers automotive cabin conditions, though for extended temperature ranges, consider industrial-grade variants.
Recomendado
Industrial Control Systems
The K4B4G1646D-BFMA is used in industrial control systems for data logging, real-time processing, and HMI applications. Its 4Gb density allows for extensive data buffering and logging. The 1866 Mbps data rate supports real-time control loops. The 1.5V supply is common in industrial power designs. The 96-FBGA package is suitable for rugged PCBs. The 0-95°C temperature range covers most industrial environments, but for harsh conditions, verify the temperature grade of the specific variant.
Recomendado
Medical Devices
In medical devices such as patient monitors and diagnostic equipment, the K4B4G1646D-BFMA provides reliable memory for data acquisition and display. Its 4Gb density supports high-resolution imaging and continuous monitoring data. The 1866 Mbps data rate ensures real-time data processing. The 1.5V supply is suitable for medical power systems. The 96-FBGA package is compact for portable devices. The 0-95°C temperature range covers clinical environments. For medical certification, ensure the device meets required standards.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K4B4G1646D-BFMA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K4B4G1646E-BYK0 | K4B4G1646D-BCK0 | AS4C256M16D3C-12BCN | MT41K256M16HA-125 |
|---|---|---|---|---|---|
| Package | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Alliance Memory | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- High data rate of 1866 Mbps (vs K4B4G1646D-BCK0)
- D-die architecture with proven reliability (vs K4B4G1646E-BYK0)
- Wide temperature range of 0-95°C (vs K4B4G1646D-BHMA)
Notas de projeto
Ensure controlled impedance traces for DQ, DQS, and clock signals to maintain signal integrity. Use 50-ohm single-ended and 100-ohm differential routing. Keep trace lengths matched within 100 mils for data and address buses. Place decoupling capacitors (0.1uF and 1uF) close to VDD and VDDQ pins to minimize power supply noise.
The K4B4G1646D-BFMA operates up to 95°C case temperature. Ensure adequate airflow or heatsinking in high-ambient environments. The 96-FBGA package has a thermal resistance of approximately [DATA_NEEDED: theta_JA]. For high-density modules, consider thermal simulation to verify junction temperature stays within limits.
Do not exceed the maximum supply voltage of 1.575V. Ensure VREFCA and VREFDQ are generated with low-noise sources, as noise on these references can degrade signal integrity. Follow the layout guidelines in the datasheet for termination and routing to avoid reflections and crosstalk.
Informações de conformidade
RoHS compliant and lead-free/halogen-free per Samsung datasheet. AEC-Q100 not applicable for standard DDR3 SDRAM.
