K4B4G1646I-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung
N.º da peça: K4B4G1646I-BYK0 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.52 | $2,52 |
| 10 | $2.35 | $23,50 |
| 100 | $2.1 | $210,00 |
| 500 | $1.9 | $950,00 |
| 1.000 | $1.75 | $1.750,00 |
K4B4G1646I-BYK0 Visão geral
DDR3L SDRAM (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory that operates at 1.35V, reducing power consumption by about 20% compared to standard 1.5V DDR3. It is part of the DDR3 memory family, which uses double data rate signaling to transfer data on both edges of the clock, and is widely used in laptops, servers, and embedded systems where power efficiency is critical.
Key features include a 4Gb density, 16-bit I/O width, 1.35V core voltage, and support for data rates up to 1866 Mbps. The device features on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4. It also includes auto-refresh and self-refresh modes for power saving, making it suitable for battery-powered devices.
The K4B4G1646I-BYK0 uses a high-performance CMOS process and a bank architecture of 8 banks, enabling high-speed random access. The FBGA-96 package provides excellent thermal and electrical performance, with a ball pitch of 0.8mm. The device supports a temperature range of 0°C to 95°C (case temperature), ensuring reliable operation in various environments.
Typical applications include mobile devices, embedded computing, networking equipment, and industrial automation. Its low voltage and high density make it ideal for memory-intensive applications where space and power are constrained.
When designing with this memory, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable 1.35V supply and a reference voltage (VREF) for the I/O.
Alternativas drop-in para K4B4G1646I-BYK0 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com K4B4G1646I-BYK0 (mesmo formato e footprint) — diferindo em Package, Supply Voltage, Burst Length, CAS Latency, Data Rate.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K4B4G1646E-BYK0
✅ Drop-In✓ Em estoque
$1.8 / unidade
Ver ficha técnica →K4B4G1646D-BYK0
✅ Drop-In✓ Em estoque
$2.9 / unidade
Ver ficha técnica →K4B4G1646E-BYK000
✅ Drop-In✓ Em estoque
$0.5619 / unidade
Ver ficha técnica →MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →H5TQ4G63AFR-PBA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
K4B4G1646I-BYK0 Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Tamanho da memória | 4 Gb |
| Organização da memória | 256M x 16 |
| Tensão de alimentação | 1.35 V |
| Taxa de dados | 1866 Mbps |
| Clock Frequency | 933 MHz |
| Encapsulamento | FBGA-96 |
| Temperatura de operação | 0°C to 95°C (Tc) |
| Interface | Parallel |
| Number of Banks | 8 |
| Burst Length | 8, 4 |
| RoHS | Compliant |
| Tipo de montagem | Surface Mount |
| Lead-Free | Yes |
Configuração de pinos do K4B4G1646I-BYK0
| Pino A1 | VDD — Power supply (1.35V) |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino B1 | VSS — Ground |
| Pino B2 | DQ2 — Data input/output 2 |
| Pino B3 | DQ3 — Data input/output 3 |
| Pino C1 | VDDQ — I/O power supply |
| Pino C2 | DQ4 — Data input/output 4 |
| Pino C3 | DQ5 — Data input/output 5 |
| Pino D1 | VSSQ — I/O ground |
| Pino D2 | DQ6 — Data input/output 6 |
| Pino D3 | DQ7 — Data input/output 7 |
| Pino E1 | DQS0 — Data strobe 0 |
| Pino E2 | DQS#0 — Data strobe complement 0 |
| Pino E3 | VSS — Ground |
Aplicações típicas
K4B4G1646I-BYK0 é adequado para 6 aplicaçãos: Mobile Devices, Embedded Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Data Storage Systems.
Mobile Devices
The K4B4G1646I-BYK0's low 1.35V operation and 4Gb density make it ideal for smartphones and tablets. Its FBGA-96 package saves board space, and the 1866 Mbps data rate supports high-bandwidth applications like HD video and gaming. Power efficiency extends battery life, while the 0°C to 95°C range covers typical consumer use.
Recomendado
Embedded Computing
In embedded systems, the K4B4G1646I-BYK0 provides high-density volatile storage for data logging, real-time processing, and OS operation. Its 1.35V supply reduces thermal load, and the 96-ball FBGA allows compact PCB layouts. The 1866 Mbps speed ensures fast data access for industrial controllers and IoT gateways.
Recomendado
Networking Equipment
Routers, switches, and network appliances require fast, reliable memory for packet buffering and routing tables. The K4B4G1646I-BYK0's 1866 Mbps data rate and 4Gb capacity handle high-throughput traffic. Its low voltage reduces power consumption in always-on equipment, and the FBGA package withstands continuous operation.
Recomendado
Industrial Automation
Industrial controllers and PLCs use the K4B4G1646I-BYK0 for program storage and data buffering. Its 0°C to 95°C temperature range suits factory environments, and the 1.35V operation minimizes heat generation. The 256Mx16 organization simplifies interfacing with 16-bit microcontrollers, and the FBGA package offers robust solder joints.
Recomendado
Consumer Electronics
Smart TVs, set-top boxes, and gaming consoles use DDR3L for system memory. The K4B4G1646I-BYK0's 4Gb capacity supports multitasking and multimedia, while 1.35V reduces power consumption. Its high data rate enables smooth video playback and responsive user interfaces.
Recomendado
Data Storage Systems
In SSDs and network-attached storage, the K4B4G1646I-BYK0 serves as cache memory. Its low latency and high bandwidth improve read/write performance. The 1.35V supply reduces power in data centers, and the FBGA package supports high-density board designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K4B4G1646I-BYK0 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K4B4G1646E-BYK0 | K4B4G1646D-BYK0 | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | FBGA-96 | FBGA-96 | FBGA-96 | FBGA-96 |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Memory Size | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps |
| Operating Temperature | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Low voltage operation (vs MT41K256M16HA-125)
- High density in small package (vs K4B2G1646F-BYK0)
- Newer die revision (vs K4B4G1646E-BYK0)
Notas de projeto
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Use a solid ground plane and minimize trace lengths for DQ and DQS signals to reduce noise and signal integrity issues.
The FBGA-96 package has a thermal resistance of approximately 20°C/W. At 1.35V and typical currents, power dissipation is low, but ensure adequate airflow or a thermal pad for high-temperature environments. Monitor case temperature to stay within 95°C.
Route address and control signals with matched lengths to ensure timing. Use series termination resistors (22-33 ohm) for DQ and DQS lines. Follow the layout guidelines in the Samsung datasheet for optimal performance.
Informações de conformidade
RoHS compliant per distributor listings. AEC-Q100 not applicable for memory ICs.
