M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip
料号： M1AFS250-FGG256 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $124.14 | $124.14 |
| 10 | $118 | $1,180.00 |
| 100 | $104.51 | $10,451.00 |
| 500 | $96 | $48,000.00 |
| 1,000 | $88 | $88,000.00 |
M1AFS250-FGG256 概述
A mixed-signal FPGA is a programmable logic device that combines digital fabric with configurable analog blocks and flash memory on a single monolithic die. In the system hierarchy, the M1AFS250 belongs to the Fusion family -> flash-based FPGA -> programmable SoC class of semiconductors, sitting alongside Microchip's ProASIC3 and Igloo device families.
Key features include flash-based, live-at-power-up programmability that eliminates external configuration PROMs and provides instant-on behavior, configurable analog peripherals for voltage and temperature monitoring, comprehensive on-chip clock generation and management circuitry, and a maximum clock frequency of 350 MHz according to distributor data. The device is fabricated in CMOS technology and operates from a single supply architecture typical of the Fusion family.
The architecture integrates the ARM Cortex-M1 processor, large flash memory blocks, analog conditioning and monitoring circuitry, and the Versatile fabric of lookup-table-based logic, enabling single-chip designs that previously required separate MCU, FPGA, voltage-monitor, and nonvolatile memory components.
Typical applications include industrial automation and motor control, power-supply supervision and smart power management, portable and battery-operated instrumentation, and aerospace/defense subsystems where flash-based, single-chip integration and low profile reduce BOM cost and board area.
A key design consideration is power and thermal budgeting: the 256-ball BGA must dissipate heat through the PCB, so adequate via arrays and copper pour under the package are recommended. Verify I/O bank voltage assignments early, since mixed-signal pin planning constrains floorplanning.
This page synthesizes distributor pricing from five sources, drop-in alternatives within the Fusion family, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： M1AFS250-FGG256 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： M1AFS250-FGG256 （相同外形与封装尺寸） ——差异在于 System Gates, Package, Configuration Memory, RoHS Status, Series.
快速对比工具——选择替代料号进行并排对比：
M1AFS250-FGG256I
✅ 直接替换✓ 有现货
$49.5 / 个
查看数据手册 →M1AFS250-FGG256Y
✅ 直接替换📋 参考替代料（不在目录中）
M1AFS250-2FGG256I
✅ 直接替换✓ 有现货
$83.12 / 个
查看数据手册 →M1AFS250-2FGG256
✅ 直接替换✓ 有现货
$83.12 / 个
查看数据手册 →M1AFS250-1FGG256Y
✅ 直接替换📋 参考替代料（不在目录中）
M1AFS250-FGG256 最大额定值与电气特性
| Family | Fusion (M1 series, mixed-signal FPGA) |
| System Gates | 250,000 |
| Logic Cells | 6144 |
| User I/O | 114 |
| Embedded Processor | ARM Cortex-M1 (M1 variants) |
| 最大时钟频率 | 350 MHz |
| Configuration Memory | Flash-based, live at power-up |
| Flash Memory Bits | 36864 |
| Technology | CMOS |
| 封装 | 256-LBGA (FGG256), 1.0 mm ball pitch |
| 安装类型 | Surface Mount |
| RoHS 状态 | RoHS Compliant |
| Lead Free Status | Lead Free |
| Analog Peripherals | Configurable analog (voltage/temperature monitoring) |
| Clock Management | On-chip clock generation and management circuitry |
M1AFS250-FGG256 256-lbga (fgg256), 1.0 mm ball pitch 引脚配置指南
M1AFS250-FGG256（256-lbga (fgg256), 1.0 mm ball pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： M1AFS250-FGG256.
请参阅 数据手册 以查看完整引脚配置。
典型应用
M1AFS250-FGG256 适用于 6 应用s: Industrial Automation and Motor Control, Smart Power Management and Supply Supervision, Portable and Battery-Powered Instrumentation, Aerospace and Defense Subsystems, Test and Measurement Equipment, Building Automation and IoT Gateways.
Industrial Automation and Motor Control
The M1AFS250-FGG256 fits industrial automation nodes where programmable logic, system monitoring, and an embedded processor must coexist in one chip. Its 250,000 system gates and 6144 logic cells implement PWM generators, encoders, and state machines, while the ARM Cortex-M1 core handles protocol stacks such as CAN or Modbus. The configurable analog blocks monitor supply rails and motor temperature, replacing discrete supervisory ICs and saving board area on dense drives. Flash-based configuration makes the controller live at power-up with no external boot device, important for equipment that must respond within milliseconds of energization. The 114 user I/Os at 1.0 mm BGA pitch provide sufficient channels for sensor and actuator interfaces; designers should budget I/O bank voltages early since mixed-voltage assignments constrain routing.
推荐
Smart Power Management and Supply Supervision
Fusion's headline differentiator is integrated analog, making the M1AFS250-FGG256 well suited to smart power-management and power-supply supervision boards. The on-die configurable analog conditioning and monitoring circuitry tracks multiple voltage channels and on-chip temperature with programmable thresholds, closing control loops or flagging faults through the fabric without an external ADC or supervisor. The 36864-bit flash blocks store event logs and calibration data, while the Cortex-M1 executes housekeeping firmware. Because configuration is flash-based, monitoring begins essentially at power-up, eliminating the blind window of SRAM FPGAs that require configuration loading. The 256-ball BGA consolidates what would otherwise be an MCU, supervisor, ADC, and EEPROM cluster, reducing BOM count and improving mean time between failures in long-lived infrastructure power systems.
推荐
Portable and Battery-Powered Instrumentation
Handheld instruments benefit from the M1AFS250-FGG256's single-chip integration: logic glue, measurement sequencing, display interface, and firmware-controlled power gating all reside on one 1.0 mm-pitch BGA, minimizing board area and quiescent overhead compared with an MCU-plus-FPGA-plus-supervisor stack. The ARM Cortex-M1 sleeps while the fabric handles deterministic capture tasks, and the analog monitors watch battery voltage and die temperature with programmable alarms. Flash-based instant-on behavior lets the instrument be ready the instant the user presses power, an important usability trait. With 114 user I/Os there is room for keypads, LCD interfaces, and sensor front-ends. Designers should pay attention to the BGA's thermal path through the PCB, since portable enclosures limit airflow; adequate copper pour keeps junction temperature within the CMOS process envelope.
推荐
Aerospace and Defense Subsystems
Microsemi (now Microchip) FPGAs have a long heritage in aerospace programs, and the flash-based, single-chip M1AFS250 suits satellite payloads, avionics glue logic, and ground-support equipment where configuration-storage integrity matters. Flash cells retain configuration through radiation-induced SEU events affecting only registers, simplifying scrubbing architectures compared with SRAM FPGAs that lose their bitstream entirely. The integrated analog monitoring replaces external housekeeping circuitry, and the Cortex-M1 implements lightweight telemetry firmware. The 256-ball BGA's 1.0 mm pitch eases inspection for high-reliability assembly. Actel/Microchip also supplies space-grade relatives in the RTAX series available on XAIPART for radiation-critical missions. Verify program-specific screening flows (temperature grade, lot traceability) with the manufacturer, since commercial FGG256 parts differ in qualification level from dedicated aerospace orderable types.
推荐
Test and Measurement Equipment
Benchtop and modular instruments use the M1AFS250-FGG256 as a timing, interface, and housekeeping controller. The fabric's deterministic routing implements trigger engines, counters, and bus bridges, while the ARM Cortex-M1 manages SCPI command parsing and calibration routines. The 350 MHz maximum clock capability supports fast timing measurements, and on-chip clock generation and management circuitry simplifies distribution of a single reference to multiple clock domains, reducing jitter sources. Analog monitors watch internal rails and temperature, feeding self-test routines that lab instruments require. Flash configuration means the instrument is operational before an operator completes connection setup. With 114 I/Os, the device bridges front-panel peripherals, acquisition front-ends, and backplane interfaces in one monolithic CMOS die, cutting component count and improving long-term firmware maintainability.
推荐
Building Automation and IoT Gateways
Smart-building controllers and compact IoT gateways leverage the M1AFS250-FGG256 to merge connectivity bridging, sensor aggregation, and system health monitoring on one chip. The Cortex-M1 runs lightweight network firmware while the fabric implements custom peripherals such as multi-UART clusters, PWM dimming channels, and bit-banged proprietary sensor interfaces that fixed-function MCUs cannot match. Configurable analog inputs supervise the 24V field bus and enclosure temperature, raising alerts before failures propagate. The 36864-bit flash stores device configuration and fault logs locally, and flash-based boot means the controller resumes operation instantly after outages, which matters for always-on HVAC and lighting systems. Its single-chip 256-ball BGA footprint (about 17 mm square class) fits compact DIN-rail and ceiling-module form factors where multiple ICs would not.
推荐
推荐产品汇总
工程参考数据： M1AFS250-FGG256 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | M1AFS250-FGG256I | M1AFS250-FGG256Y | M1AFS250-2FGG256I | M1AFS250-1FGG256Y |
|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256), 1.0 mm pitch | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 6144 | 6144 | 6144 | 6144 | 6144 |
| User I/O | 114 | 114 | 114 | 114 | 114 |
| Speed Grade | Standard | Standard | Standard | -2 (faster) | -1 (slower) |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 |
| Configuration Type | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up |
关键差异点
- Integrated ARM Cortex-M1 hard processor （对比 A3P600-1FG256I)
- Integrated analog monitoring replaces discrete supervisory ICs （对比 M1AFS250-FGG256I (digital spec-identical))
- Flash-based, live-at-power-up configuration （对比 SRAM FPGAs (e.g., Artix/Cyclone class))
设计说明
The FGG256 is a 256-ball BGA with 1.0 mm ball pitch. Typical routing for this pitch class uses 4-6 signal layers with via-in-pad or dogbone fanout; verify your fabricator's minimum BGA pitch capability before layout. Provide a solid ground plane under the package and a dense via array connecting ground balls to the plane for both power integrity and thermal dissipation, since a BGA has no exposed heatsink pad - the PCB is the primary heat path.
The Fusion family uses multiple supply rails (core, I/O banks, analog). Estimate power with Microchip/Microsemi Libero SoC power tools after place-and-route, before finalizing regulators. Because configuration is flash-based and live at power-up, ensure rail sequencing reaches the appropriate levels before fabric operation; consult the Fusion family datasheet power-up section for allowed ramp rates and sequencing constraints rather than assuming SRAM-FPGA behavior.
Assign I/O standards and bank voltages in Libero SoC early: the 114 user I/Os are grouped into banks whose supply defines compatible standards, and mixed 3.3V/2.5V/1.8V assignments must not span banks incorrectly. Keep analog monitoring input traces short, guarded, and away from switching signals, since the on-die analog block accuracy depends on clean external routing. Series terminate fast single-ended outputs when trace lengths exceed roughly 1/6 of the signal rise-time electrical length.
Do not confuse FGG256 with FG256 package orderables: both are 256-ball parts but with different pitch/naming (Findchips lists M1AFS250-FG256I and M1AFS250-FGG256I as distinct parts), and the footprints are not interchangeable. Also confirm speed-grade selection in your Libero SoC project matches the ordered MPN suffix; a timing-closed design on a -2 part may fail timing on a -1 part.
合规信息
RoHS Compliant and Lead Free per DigChip datasheet specification record. REACH, halogen-free, and conflict-minerals status not stated in provided data - request certificates from Microchip.
