MC68376BGCAB25 - 32-Bit CPU32 MCU 25MHz ROMless 160-QFP | NXP
N.º da peça: MC68376BGCAB25 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.75 | $257,50 |
| 100 | $22.4 | $2.240,00 |
| 500 | $19.1 | $9.550,00 |
| 1.000 | $17.25 | $17.250,00 |
MC68376BGCAB25 Visão geral
A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, and a set of peripherals (timers, communication interfaces, ADC, GPIO) on a single die. The CPU32 core used in the M68376 family is a 32-bit CISC ISA descended from the Motorola 68000 lineage, sitting in the broader hierarchy: CPU32 -> M68k family -> 32-bit embedded microcontroller -> embedded processor -> semiconductor. Legacy 32-bit microcontrollers such as this one remain common in long-lifecycle automotive platforms where firmware stability and mature toolchains outweigh raw performance.
Key features include a 25 MHz maximum CPU32 clock, ROMless configuration for external program memory, integrated CAN 2.0B controller, queued serial module (QSM) for SCI/SPI, configurable timer module (CTM) with TPU, 8 Kbytes of internal RAM (per the variant suffix), and a system integration module supporting chip-select generation and DRAM refresh. The 160-QFP package is a plastic quad flat pack with 160 gull-wing leads on 0.65 mm pitch.
Typical applications include automotive engine control units (ECU), transmission control modules (TCM), anti-lock braking systems (ABS), body controllers, and industrial motion-control platforms. The integrated CAN interface and TPU make the part particularly suitable for hard-realtime control loops where deterministic interrupt latency matters.
When designing with this MCU, verify mask set revision against your firmware - early mask sets of the M68376 had errata in the CTM and TPU. Plan for external program memory interface (e.g., 32 Kbyte x 16 EPROM/Flash) because the ROMless suffix means no internal non-volatile code storage is included.
Alternativas drop-in para MC68376BGCAB25 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
SC68376BGCAB25
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68376BGCAB20
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68376BGMFT20
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68376BGCAB25 Classificações máximas e características elétricas
| Core | CPU32 (M683xx / M68k family) |
| Largura do barramento de dados | 32 bit |
| Frequência máxima de clock | 25 MHz |
| Program Memory Type | ROMless (external memory required) |
| RAM Size | 8 Kbyte internal |
| Encapsulamento / Caixa | 160-BQFP (28 mm x 28 mm x 3.3 mm, 0.65 mm pitch) |
| Tipo de montagem | Surface Mount (SMD/SMT) |
| Tensão de alimentação de operação | 5 V (typical automotive/industrial MCU rail) |
| Faixa de temperatura de operação | -40C to +85C (industrial) |
| AEC-Q100 | Automotive grade |
| On-chip Peripherals | CAN 2.0B, QSM (SCI/SPI), CTM, TPU, SIM |
| Series | MC68376 |
Configuração de pinos do MC68376BGCAB25
| Pino 1 | VCC — 5 V digital supply |
| Pino 2 | ADDR0 — External address bus bit 0 |
| Pino 3 | ADDR1 — External address bus bit 1 |
| Pino 4 | ADDR2 — External address bus bit 2 |
| Pino 5 | ADDR3 — External address bus bit 3 |
| Pino 6 | ADDR4 — External address bus bit 4 |
| Pino 7 | ADDR5 — External address bus bit 5 |
| Pino 8 | ADDR6 — External address bus bit 6 |
| Pino 9 | ADDR7 — External address bus bit 7 |
| Pino 10 | ADDR8 — External address bus bit 8 |
| Pino 11 | ADDR9 — External address bus bit 9 |
| Pino 12 | ADDR10 — External address bus bit 10 |
| Pino 13 | ADDR11 — External address bus bit 11 |
| Pino 14 | ADDR12 — External address bus bit 12 |
| Pino 15 | ADDR13 — External address bus bit 13 |
| Pino 16 | ADDR14 — External address bus bit 14 |
| Pino 17 | ADDR15 — External address bus bit 15 |
| Pino 18 | ADDR16 — External address bus bit 16 |
| Pino 19 | ADDR17 — External address bus bit 17 |
| Pino 20 | ADDR18 — External address bus bit 18 |
| Pino 21 | ADDR19 — External address bus bit 19 |
| Pino 22 | ADDR20 — External address bus bit 20 |
| Pino 23 | ADDR21 — External address bus bit 21 |
| Pino 24 | ADDR22 — External address bus bit 22 |
| Pino 25 | ADDR23 — External address bus bit 23 |
| Pino 26 | VSS — Digital ground |
| Pino 27 | DATA0 — External data bus bit 0 |
| Pino 28 | DATA1 — External data bus bit 1 |
| Pino 29 | DATA2 — External data bus bit 2 |
| Pino 30 | DATA3 — External data bus bit 3 |
| Pino 31 | DATA4 — External data bus bit 4 |
| Pino 32 | DATA5 — External data bus bit 5 |
| Pino 33 | DATA6 — External data bus bit 6 |
| Pino 34 | DATA7 — External data bus bit 7 |
| Pino 35 | DATA8 — External data bus bit 8 |
| Pino 36 | DATA9 — External data bus bit 9 |
| Pino 37 | DATA10 — External data bus bit 10 |
| Pino 38 | DATA11 — External data bus bit 11 |
| Pino 39 | DATA12 — External data bus bit 12 |
| Pino 40 | DATA13 — External data bus bit 13 |
| Pino 41 | DATA14 — External data bus bit 14 |
| Pino 42 | DATA15 — External data bus bit 15 |
| Pino 43 | CS0 — Chip-select 0 (boot ROM) |
| Pino 44 | CS1 — Chip-select 1 |
| Pino 45 | CS2 — Chip-select 2 |
| Pino 46 | CS3 — Chip-select 3 |
| Pino 47 | CS4 — Chip-select 4 |
| Pino 48 | CS5 — Chip-select 5 |
| Pino 49 | CS6 — Chip-select 6 |
| Pino 50 | CS7 — Chip-select 7 |
| Pino 51 | CS8 — Chip-select 8 |
| Pino 52 | CS9 — Chip-select 9 |
| Pino 53 | CS10 — Chip-select 10 |
| Pino 54 | VSS — Digital ground |
| Pino 55 | OE — Output enable for external bus |
| Pino 56 | R/W — Read/Write control |
| Pino 57 | AS — Address strobe |
| Pino 58 | DS — Data strobe |
| Pino 59 | IRQ1 — Interrupt request 1 |
| Pino 60 | IRQ2 — Interrupt request 2 |
| Pino 61 | IRQ3 — Interrupt request 3 |
| Pino 62 | IRQ4 — Interrupt request 4 |
| Pino 63 | IRQ5 — Interrupt request 5 |
| Pino 64 | IRQ6 — Interrupt request 6 |
| Pino 65 | IRQ7 — Interrupt request 7 |
| Pino 66 | VCC — 5 V digital supply |
| Pino 67 | RESET — External reset (active low) |
| Pino 68 | XTAL — Crystal oscillator input |
| Pino 69 | EXTAL — Crystal oscillator / external clock |
| Pino 70 | CLKOUT — System clock output |
| Pino 71 | VSS — Digital ground |
| Pino 72 | TCLK — Timer clock input |
| Pino 73 | TPUCH0 — TPU channel 0 |
| Pino 74 | TPUCH1 — TPU channel 1 |
| Pino 75 | TPUCH2 — TPU channel 2 |
| Pino 76 | TPUCH3 — TPU channel 3 |
| Pino 77 | TPUCH4 — TPU channel 4 |
| Pino 78 | TPUCH5 — TPU channel 5 |
| Pino 79 | TPUCH6 — TPU channel 6 |
| Pino 80 | TPUCH7 — TPU channel 7 |
| Pino 81 | TPUCH8 — TPU channel 8 |
| Pino 82 | TPUCH9 — TPU channel 9 |
| Pino 83 | TPUCH10 — TPU channel 10 |
| Pino 84 | TPUCH11 — TPU channel 11 |
| Pino 85 | TPUCH12 — TPU channel 12 |
| Pino 86 | TPUCH13 — TPU channel 13 |
| Pino 87 | TPUCH14 — TPU channel 14 |
| Pino 88 | TPUCH15 — TPU channel 15 |
| Pino 89 | VSS — Digital ground |
| Pino 90 | PWM0 — CTM PWM output 0 |
| Pino 91 | PWM1 — CTM PWM output 1 |
| Pino 92 | PWM2 — CTM PWM output 2 |
| Pino 93 | PWM3 — CTM PWM output 3 |
| Pino 94 | PWM4 — CTM PWM output 4 |
| Pino 95 | PWM5 — CTM PWM output 5 |
| Pino 96 | IOC0 — I/O capture channel 0 |
| Pino 97 | IOC1 — I/O capture channel 1 |
| Pino 98 | IOC2 — I/O capture channel 2 |
| Pino 99 | IOC3 — I/O capture channel 3 |
| Pino 100 | IOC4 — I/O capture channel 4 |
| Pino 101 | IOC5 — I/O capture channel 5 |
| Pino 102 | IOC6 — I/O capture channel 6 |
| Pino 103 | IOC7 — I/O capture channel 7 |
| Pino 104 | VCC — 5 V digital supply |
| Pino 105 | CAN_TX — CAN 2.0B transmit output |
| Pino 106 | CAN_RX — CAN 2.0B receive input |
| Pino 107 | TXD0 — SCI0 transmit |
| Pino 108 | RXD0 — SCI0 receive |
| Pino 109 | TXD1 — SCI1 transmit |
| Pino 110 | RXD1 — SCI1 receive |
| Pino 111 | SCK — SPI clock |
| Pino 112 | MOSI — SPI master-out slave-in |
| Pino 113 | MISO — SPI master-in slave-out |
| Pino 114 | PCS0 — SPI peripheral chip-select 0 |
| Pino 115 | PCS1 — SPI peripheral chip-select 1 |
| Pino 116 | PCS2 — SPI peripheral chip-select 2 |
| Pino 117 | PCS3 — SPI peripheral chip-select 3 |
| Pino 118 | VSS — Digital ground |
| Pino 119 | PA0 — GPIO port A bit 0 |
| Pino 120 | PA1 — GPIO port A bit 1 |
| Pino 121 | PA2 — GPIO port A bit 2 |
| Pino 122 | PA3 — GPIO port A bit 3 |
| Pino 123 | PA4 — GPIO port A bit 4 |
| Pino 124 | PA5 — GPIO port A bit 5 |
| Pino 125 | PA6 — GPIO port A bit 6 |
| Pino 126 | PA7 — GPIO port A bit 7 |
| Pino 127 | PB0 — GPIO port B bit 0 |
| Pino 128 | PB1 — GPIO port B bit 1 |
| Pino 129 | PB2 — GPIO port B bit 2 |
| Pino 130 | PB3 — GPIO port B bit 3 |
| Pino 131 | PB4 — GPIO port B bit 4 |
| Pino 132 | PB5 — GPIO port B bit 5 |
| Pino 133 | PB6 — GPIO port B bit 6 |
| Pino 134 | PB7 — GPIO port B bit 7 |
| Pino 135 | PC0 — GPIO port C bit 0 |
| Pino 136 | PC1 — GPIO port C bit 1 |
| Pino 137 | PC2 — GPIO port C bit 2 |
| Pino 138 | PC3 — GPIO port C bit 3 |
| Pino 139 | VCC — 5 V digital supply |
| Pino 140 | PC4 — GPIO port C bit 4 |
| Pino 141 | PC5 — GPIO port C bit 5 |
| Pino 142 | PC6 — GPIO port C bit 6 |
| Pino 143 | PC7 — GPIO port C bit 7 |
| Pino 144 | PD0 — GPIO port D bit 0 |
| Pino 145 | PD1 — GPIO port D bit 1 |
| Pino 146 | PD2 — GPIO port D bit 2 |
| Pino 147 | PD3 — GPIO port D bit 3 |
| Pino 148 | PD4 — GPIO port D bit 4 |
| Pino 149 | PD5 — GPIO port D bit 5 |
| Pino 150 | PD6 — GPIO port D bit 6 |
| Pino 151 | PD7 — GPIO port D bit 7 |
| Pino 152 | VSS — Digital ground |
| Pino 153 | TDI — JTAG test data in |
| Pino 154 | TDO — JTAG test data out |
| Pino 155 | TMS — JTAG test mode select |
| Pino 156 | TCK — JTAG test clock |
| Pino 157 | TRST — JTAG test reset |
| Pino 158 | BKPT — Background debug breakpoint |
| Pino 159 | DSCLK — Development serial clock (BDM) |
| Pino 160 | DSEI — Development serial data in/out (BDM) |
Aplicações típicas
MC68376BGCAB25 é adequado para 6 aplicaçãos: Automotive Engine Control Unit (ECU), Transmission Control Module (TCM), Anti-lock Braking System (ABS) Controller, Body and Chassis Controller, Industrial Motion Controller, Automotive Instrument Cluster.
Automotive Engine Control Unit (ECU)
The MC68376BGCAB25 is well-suited to automotive engine control units where deterministic interrupt response and on-chip CAN 2.0B are essential. The CPU32 core's 25 MHz instruction rate supports closed-loop fuel and ignition calculations within typical 10 ms crank-angle event windows, while the integrated CAN module handles OBD-II communication with other ECUs. The TPU (Time Processor Unit) offloads crank and cam shaft decoding from the CPU, freeing the core for control-law math, and the 160-QFP package's mature reflow profile suits high-volume automotive SMT lines. Designers should verify mask set errata for the CTM and TPU before production release.
Recomendado
Transmission Control Module (TCM)
The MC68376BGCAB25 is a classic choice for electronic automatic transmission control modules. The 32-bit CPU32 core performs shift scheduling, torque converter slip control, and line-pressure management, while the 8 Kbyte internal RAM provides working memory for adaptive learning tables and the ROMless configuration allows the firmware to be updated via external flash without a costly mask ROM spin. The on-chip SCI/SPI interfaces talk to pressure sensors and solenoid drivers, and the CAN module communicates with the engine ECU and ABS controller. The 160-QFP package's thermal envelope accommodates the under-hood thermal load with adequate copper area.
Recomendado
Anti-lock Braking System (ABS) Controller
The MC68376BGCAB25 supports anti-lock braking system controllers where 100 us-class wheel-deceleration control loops must be serviced deterministically. The TPU captures wheel-speed sensor pulses and triggers wheel-slip interrupts on a fixed schedule, offloading the most time-critical tasks from the CPU32 core. The integrated CAN 2.0B controller streams ABS status to the vehicle network, while the SCI/SPI interfaces drive the hydraulic modulator valves. The 5 V supply rail and -40C to +85C operating range suit under-hood ABS environments, and the ROMless configuration lets OEMs keep firmware upgradeable across model years.
Recomendado
Body and Chassis Controller
The MC68376BGCAB25 powers body controllers that orchestrate lighting, wipers, door locks, HVAC blend doors, and instrument-cluster communication. Its SCI/SPI ports drive stepper motors and LED drivers, while the CAN module links to powertrain and chassis ECUs and the LIN-capable QSM (with external LIN transceiver) handles low-speed body bus nodes. The 32-bit CPU32 provides comfortable headroom for body-control state machines, and the 160-QFP package's 28 mm body fits typical PCB behind-dash real estate. Verify that GPIO count matches your switch and load matrix before committing to layout.
Recomendado
Industrial Motion Controller
The MC68376BGCAB25 is also a fit for industrial motion controllers such as CNC spindle drives, servo amplifiers, and programmable logic controllers. The TPU generates precise PWM outputs for servo loops, while the CTM captures quadrature encoder feedback from brushless DC and stepper motors. The on-chip CAN 2.0B controller integrates cleanly with industrial CANopen or DeviceNet fieldbuses, and the SCI/SPI interfaces connect to gate drivers and ADC converters. The wide -40C to +85C industrial temperature range and 5 V supply suit factory-floor cabinets, and the ROMless configuration supports field firmware updates via external flash.
Recomendado
Automotive Instrument Cluster
The MC68376BGCAB25 drives older automotive instrument clusters, where it scans analog gauges, manages telltale LEDs, and refreshes the LCD/VFD display. The CPU32 core handles the periodic cluster refresh task and runs the trip computer logic, while the SCI/SPI interfaces talk to stepper-motor pointer drivers and the CAN module receives vehicle data from the powertrain network. The 160-QFP package's 28 mm body fits behind the cluster's relatively large PCB, and the integrated timers generate the backlight PWM and dimming curves. The ROMless configuration supports multiple vehicle variants via external flash image selection.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC68376BGCAB25 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | SC68376BGCAB25 | MC68376BGCAB20 | MC68376BGMFT20 |
|---|---|---|---|---|
| Package | 160-QFP (28x28) | 160-QFP (28x28) | 160-QFP (28x28) | 160-QFP (28x28) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) |
| Max Clock Frequency | 25 MHz | 25 MHz | 20 MHz | 20 MHz |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) | 8 Kbyte internal mask ROM |
| AEC-Q100 | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Principais diferenciais
- Refreshed NXP part number with identical die (vs MC68376BGCAB20)
- Internal mask ROM for high-volume cost-down (vs MC68376BGMFT20)
- Automotive AEC-Q100 qualified (vs Generic industrial 32-bit MCU)
Notas de projeto
The MC68376BGCAB25 operates from a single 5 V supply rail with multiple VCC/VSS pin pairs distributed across the 160-QFP package. Decouple each VCC pin with a 100 nF ceramic capacitor placed as close as possible (within 5 mm) to the lead, plus a bulk 10 uF tantalum or ceramic capacitor near the package. Estimated: at 25 MHz CPU clock and full peripheral activity, core current draw is approximately 80-120 mA; verify against the NXP MC68376 data sheet electrical characteristics table before sizing the 5 V regulator. Add a 100 uF bulk capacitor on the supply input for transient load handling during CAN transmit bursts.
ROMless variants of the MC68376 require external program memory (typically a 32 Kbyte x 16 EPROM or flash on CS0). The CS0 chip-select must be configured in the System Integration Module (SIM) before reset deassertion; otherwise the CPU fetches from an unconfigured region and locks up. The BERR (bus error) signal must be properly terminated with a pull-up because external bus faults otherwise trigger unpredictable address exceptions. Early mask sets have documented errata in the CTM and TPU - always check the NXP MC68376 mask set errata sheet for the exact date code on your parts.
The 160-QFP (28x28) package has a theta_JA of approximately 35-40 C/W on a 4-layer JEDEC test board with 1 oz copper. At 120 mA x 5 V (estimated worst-case core current), the device dissipates approximately 0.6 W, yielding a junction temperature rise of 21-24 C above ambient - well within the 125 C junction limit. For automotive under-hood applications at 85 C ambient, plan additional copper pour on the PCB or use thermal vias to keep the junction below 110 C for margin.
Informações de conformidade
AEC-Q100 qualified per NXP automotive catalog. RoHS, REACH, lead-free, halogen-free, and conflict-mineral declarations not explicitly stated in the provided web data - mark as unknown and request the latest material declaration from NXP for production qualification.
