MC68376BGCAB25 - 32-Bit CPU32 MCU 25MHz ROMless 160-QFP | NXP
部品番号: MC68376BGCAB25 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.75 | $257.50 |
| 100 | $22.4 | $2,240.00 |
| 500 | $19.1 | $9,550.00 |
| 1,000 | $17.25 | $17,250.00 |
MC68376BGCAB25 概要
A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, and a set of peripherals (timers, communication interfaces, ADC, GPIO) on a single die. The CPU32 core used in the M68376 family is a 32-bit CISC ISA descended from the Motorola 68000 lineage, sitting in the broader hierarchy: CPU32 -> M68k family -> 32-bit embedded microcontroller -> embedded processor -> semiconductor. Legacy 32-bit microcontrollers such as this one remain common in long-lifecycle automotive platforms where firmware stability and mature toolchains outweigh raw performance.
Key features include a 25 MHz maximum CPU32 clock, ROMless configuration for external program memory, integrated CAN 2.0B controller, queued serial module (QSM) for SCI/SPI, configurable timer module (CTM) with TPU, 8 Kbytes of internal RAM (per the variant suffix), and a system integration module supporting chip-select generation and DRAM refresh. The 160-QFP package is a plastic quad flat pack with 160 gull-wing leads on 0.65 mm pitch.
Typical applications include automotive engine control units (ECU), transmission control modules (TCM), anti-lock braking systems (ABS), body controllers, and industrial motion-control platforms. The integrated CAN interface and TPU make the part particularly suitable for hard-realtime control loops where deterministic interrupt latency matters.
When designing with this MCU, verify mask set revision against your firmware - early mask sets of the M68376 had errata in the CTM and TPU. Plan for external program memory interface (e.g., 32 Kbyte x 16 EPROM/Flash) because the ROMless suffix means no internal non-volatile code storage is included.
ドロップイン代替品: MC68376BGCAB25 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
SC68376BGCAB25
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC68376BGCAB20
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC68376BGMFT20
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC68376BGCAB25 最大定格＆電気的特性
| Core | CPU32 (M683xx / M68k family) |
| データバス幅 | 32 bit |
| 最大クロック周波数 | 25 MHz |
| Program Memory Type | ROMless (external memory required) |
| RAM Size | 8 Kbyte internal |
| パッケージ / ケース | 160-BQFP (28 mm x 28 mm x 3.3 mm, 0.65 mm pitch) |
| 実装タイプ | Surface Mount (SMD/SMT) |
| 動作電源電圧 | 5 V (typical automotive/industrial MCU rail) |
| 動作温度範囲 | -40C to +85C (industrial) |
| AEC-Q100 | Automotive grade |
| On-chip Peripherals | CAN 2.0B, QSM (SCI/SPI), CTM, TPU, SIM |
| Series | MC68376 |
MC68376BGCAB25 ピン構成
| ピン 1 | VCC — 5 V digital supply |
| ピン 2 | ADDR0 — External address bus bit 0 |
| ピン 3 | ADDR1 — External address bus bit 1 |
| ピン 4 | ADDR2 — External address bus bit 2 |
| ピン 5 | ADDR3 — External address bus bit 3 |
| ピン 6 | ADDR4 — External address bus bit 4 |
| ピン 7 | ADDR5 — External address bus bit 5 |
| ピン 8 | ADDR6 — External address bus bit 6 |
| ピン 9 | ADDR7 — External address bus bit 7 |
| ピン 10 | ADDR8 — External address bus bit 8 |
| ピン 11 | ADDR9 — External address bus bit 9 |
| ピン 12 | ADDR10 — External address bus bit 10 |
| ピン 13 | ADDR11 — External address bus bit 11 |
| ピン 14 | ADDR12 — External address bus bit 12 |
| ピン 15 | ADDR13 — External address bus bit 13 |
| ピン 16 | ADDR14 — External address bus bit 14 |
| ピン 17 | ADDR15 — External address bus bit 15 |
| ピン 18 | ADDR16 — External address bus bit 16 |
| ピン 19 | ADDR17 — External address bus bit 17 |
| ピン 20 | ADDR18 — External address bus bit 18 |
| ピン 21 | ADDR19 — External address bus bit 19 |
| ピン 22 | ADDR20 — External address bus bit 20 |
| ピン 23 | ADDR21 — External address bus bit 21 |
| ピン 24 | ADDR22 — External address bus bit 22 |
| ピン 25 | ADDR23 — External address bus bit 23 |
| ピン 26 | VSS — Digital ground |
| ピン 27 | DATA0 — External data bus bit 0 |
| ピン 28 | DATA1 — External data bus bit 1 |
| ピン 29 | DATA2 — External data bus bit 2 |
| ピン 30 | DATA3 — External data bus bit 3 |
| ピン 31 | DATA4 — External data bus bit 4 |
| ピン 32 | DATA5 — External data bus bit 5 |
| ピン 33 | DATA6 — External data bus bit 6 |
| ピン 34 | DATA7 — External data bus bit 7 |
| ピン 35 | DATA8 — External data bus bit 8 |
| ピン 36 | DATA9 — External data bus bit 9 |
| ピン 37 | DATA10 — External data bus bit 10 |
| ピン 38 | DATA11 — External data bus bit 11 |
| ピン 39 | DATA12 — External data bus bit 12 |
| ピン 40 | DATA13 — External data bus bit 13 |
| ピン 41 | DATA14 — External data bus bit 14 |
| ピン 42 | DATA15 — External data bus bit 15 |
| ピン 43 | CS0 — Chip-select 0 (boot ROM) |
| ピン 44 | CS1 — Chip-select 1 |
| ピン 45 | CS2 — Chip-select 2 |
| ピン 46 | CS3 — Chip-select 3 |
| ピン 47 | CS4 — Chip-select 4 |
| ピン 48 | CS5 — Chip-select 5 |
| ピン 49 | CS6 — Chip-select 6 |
| ピン 50 | CS7 — Chip-select 7 |
| ピン 51 | CS8 — Chip-select 8 |
| ピン 52 | CS9 — Chip-select 9 |
| ピン 53 | CS10 — Chip-select 10 |
| ピン 54 | VSS — Digital ground |
| ピン 55 | OE — Output enable for external bus |
| ピン 56 | R/W — Read/Write control |
| ピン 57 | AS — Address strobe |
| ピン 58 | DS — Data strobe |
| ピン 59 | IRQ1 — Interrupt request 1 |
| ピン 60 | IRQ2 — Interrupt request 2 |
| ピン 61 | IRQ3 — Interrupt request 3 |
| ピン 62 | IRQ4 — Interrupt request 4 |
| ピン 63 | IRQ5 — Interrupt request 5 |
| ピン 64 | IRQ6 — Interrupt request 6 |
| ピン 65 | IRQ7 — Interrupt request 7 |
| ピン 66 | VCC — 5 V digital supply |
| ピン 67 | RESET — External reset (active low) |
| ピン 68 | XTAL — Crystal oscillator input |
| ピン 69 | EXTAL — Crystal oscillator / external clock |
| ピン 70 | CLKOUT — System clock output |
| ピン 71 | VSS — Digital ground |
| ピン 72 | TCLK — Timer clock input |
| ピン 73 | TPUCH0 — TPU channel 0 |
| ピン 74 | TPUCH1 — TPU channel 1 |
| ピン 75 | TPUCH2 — TPU channel 2 |
| ピン 76 | TPUCH3 — TPU channel 3 |
| ピン 77 | TPUCH4 — TPU channel 4 |
| ピン 78 | TPUCH5 — TPU channel 5 |
| ピン 79 | TPUCH6 — TPU channel 6 |
| ピン 80 | TPUCH7 — TPU channel 7 |
| ピン 81 | TPUCH8 — TPU channel 8 |
| ピン 82 | TPUCH9 — TPU channel 9 |
| ピン 83 | TPUCH10 — TPU channel 10 |
| ピン 84 | TPUCH11 — TPU channel 11 |
| ピン 85 | TPUCH12 — TPU channel 12 |
| ピン 86 | TPUCH13 — TPU channel 13 |
| ピン 87 | TPUCH14 — TPU channel 14 |
| ピン 88 | TPUCH15 — TPU channel 15 |
| ピン 89 | VSS — Digital ground |
| ピン 90 | PWM0 — CTM PWM output 0 |
| ピン 91 | PWM1 — CTM PWM output 1 |
| ピン 92 | PWM2 — CTM PWM output 2 |
| ピン 93 | PWM3 — CTM PWM output 3 |
| ピン 94 | PWM4 — CTM PWM output 4 |
| ピン 95 | PWM5 — CTM PWM output 5 |
| ピン 96 | IOC0 — I/O capture channel 0 |
| ピン 97 | IOC1 — I/O capture channel 1 |
| ピン 98 | IOC2 — I/O capture channel 2 |
| ピン 99 | IOC3 — I/O capture channel 3 |
| ピン 100 | IOC4 — I/O capture channel 4 |
| ピン 101 | IOC5 — I/O capture channel 5 |
| ピン 102 | IOC6 — I/O capture channel 6 |
| ピン 103 | IOC7 — I/O capture channel 7 |
| ピン 104 | VCC — 5 V digital supply |
| ピン 105 | CAN_TX — CAN 2.0B transmit output |
| ピン 106 | CAN_RX — CAN 2.0B receive input |
| ピン 107 | TXD0 — SCI0 transmit |
| ピン 108 | RXD0 — SCI0 receive |
| ピン 109 | TXD1 — SCI1 transmit |
| ピン 110 | RXD1 — SCI1 receive |
| ピン 111 | SCK — SPI clock |
| ピン 112 | MOSI — SPI master-out slave-in |
| ピン 113 | MISO — SPI master-in slave-out |
| ピン 114 | PCS0 — SPI peripheral chip-select 0 |
| ピン 115 | PCS1 — SPI peripheral chip-select 1 |
| ピン 116 | PCS2 — SPI peripheral chip-select 2 |
| ピン 117 | PCS3 — SPI peripheral chip-select 3 |
| ピン 118 | VSS — Digital ground |
| ピン 119 | PA0 — GPIO port A bit 0 |
| ピン 120 | PA1 — GPIO port A bit 1 |
| ピン 121 | PA2 — GPIO port A bit 2 |
| ピン 122 | PA3 — GPIO port A bit 3 |
| ピン 123 | PA4 — GPIO port A bit 4 |
| ピン 124 | PA5 — GPIO port A bit 5 |
| ピン 125 | PA6 — GPIO port A bit 6 |
| ピン 126 | PA7 — GPIO port A bit 7 |
| ピン 127 | PB0 — GPIO port B bit 0 |
| ピン 128 | PB1 — GPIO port B bit 1 |
| ピン 129 | PB2 — GPIO port B bit 2 |
| ピン 130 | PB3 — GPIO port B bit 3 |
| ピン 131 | PB4 — GPIO port B bit 4 |
| ピン 132 | PB5 — GPIO port B bit 5 |
| ピン 133 | PB6 — GPIO port B bit 6 |
| ピン 134 | PB7 — GPIO port B bit 7 |
| ピン 135 | PC0 — GPIO port C bit 0 |
| ピン 136 | PC1 — GPIO port C bit 1 |
| ピン 137 | PC2 — GPIO port C bit 2 |
| ピン 138 | PC3 — GPIO port C bit 3 |
| ピン 139 | VCC — 5 V digital supply |
| ピン 140 | PC4 — GPIO port C bit 4 |
| ピン 141 | PC5 — GPIO port C bit 5 |
| ピン 142 | PC6 — GPIO port C bit 6 |
| ピン 143 | PC7 — GPIO port C bit 7 |
| ピン 144 | PD0 — GPIO port D bit 0 |
| ピン 145 | PD1 — GPIO port D bit 1 |
| ピン 146 | PD2 — GPIO port D bit 2 |
| ピン 147 | PD3 — GPIO port D bit 3 |
| ピン 148 | PD4 — GPIO port D bit 4 |
| ピン 149 | PD5 — GPIO port D bit 5 |
| ピン 150 | PD6 — GPIO port D bit 6 |
| ピン 151 | PD7 — GPIO port D bit 7 |
| ピン 152 | VSS — Digital ground |
| ピン 153 | TDI — JTAG test data in |
| ピン 154 | TDO — JTAG test data out |
| ピン 155 | TMS — JTAG test mode select |
| ピン 156 | TCK — JTAG test clock |
| ピン 157 | TRST — JTAG test reset |
| ピン 158 | BKPT — Background debug breakpoint |
| ピン 159 | DSCLK — Development serial clock (BDM) |
| ピン 160 | DSEI — Development serial data in/out (BDM) |
主な用途
MC68376BGCAB25 の用途: 6 件s: Automotive Engine Control Unit (ECU), Transmission Control Module (TCM), Anti-lock Braking System (ABS) Controller, Body and Chassis Controller, Industrial Motion Controller, Automotive Instrument Cluster.
Automotive Engine Control Unit (ECU)
The MC68376BGCAB25 is well-suited to automotive engine control units where deterministic interrupt response and on-chip CAN 2.0B are essential. The CPU32 core's 25 MHz instruction rate supports closed-loop fuel and ignition calculations within typical 10 ms crank-angle event windows, while the integrated CAN module handles OBD-II communication with other ECUs. The TPU (Time Processor Unit) offloads crank and cam shaft decoding from the CPU, freeing the core for control-law math, and the 160-QFP package's mature reflow profile suits high-volume automotive SMT lines. Designers should verify mask set errata for the CTM and TPU before production release.
おすすめ
Transmission Control Module (TCM)
The MC68376BGCAB25 is a classic choice for electronic automatic transmission control modules. The 32-bit CPU32 core performs shift scheduling, torque converter slip control, and line-pressure management, while the 8 Kbyte internal RAM provides working memory for adaptive learning tables and the ROMless configuration allows the firmware to be updated via external flash without a costly mask ROM spin. The on-chip SCI/SPI interfaces talk to pressure sensors and solenoid drivers, and the CAN module communicates with the engine ECU and ABS controller. The 160-QFP package's thermal envelope accommodates the under-hood thermal load with adequate copper area.
おすすめ
Anti-lock Braking System (ABS) Controller
The MC68376BGCAB25 supports anti-lock braking system controllers where 100 us-class wheel-deceleration control loops must be serviced deterministically. The TPU captures wheel-speed sensor pulses and triggers wheel-slip interrupts on a fixed schedule, offloading the most time-critical tasks from the CPU32 core. The integrated CAN 2.0B controller streams ABS status to the vehicle network, while the SCI/SPI interfaces drive the hydraulic modulator valves. The 5 V supply rail and -40C to +85C operating range suit under-hood ABS environments, and the ROMless configuration lets OEMs keep firmware upgradeable across model years.
おすすめ
Body and Chassis Controller
The MC68376BGCAB25 powers body controllers that orchestrate lighting, wipers, door locks, HVAC blend doors, and instrument-cluster communication. Its SCI/SPI ports drive stepper motors and LED drivers, while the CAN module links to powertrain and chassis ECUs and the LIN-capable QSM (with external LIN transceiver) handles low-speed body bus nodes. The 32-bit CPU32 provides comfortable headroom for body-control state machines, and the 160-QFP package's 28 mm body fits typical PCB behind-dash real estate. Verify that GPIO count matches your switch and load matrix before committing to layout.
おすすめ
Industrial Motion Controller
The MC68376BGCAB25 is also a fit for industrial motion controllers such as CNC spindle drives, servo amplifiers, and programmable logic controllers. The TPU generates precise PWM outputs for servo loops, while the CTM captures quadrature encoder feedback from brushless DC and stepper motors. The on-chip CAN 2.0B controller integrates cleanly with industrial CANopen or DeviceNet fieldbuses, and the SCI/SPI interfaces connect to gate drivers and ADC converters. The wide -40C to +85C industrial temperature range and 5 V supply suit factory-floor cabinets, and the ROMless configuration supports field firmware updates via external flash.
おすすめ
Automotive Instrument Cluster
The MC68376BGCAB25 drives older automotive instrument clusters, where it scans analog gauges, manages telltale LEDs, and refreshes the LCD/VFD display. The CPU32 core handles the periodic cluster refresh task and runs the trip computer logic, while the SCI/SPI interfaces talk to stepper-motor pointer drivers and the CAN module receives vehicle data from the powertrain network. The 160-QFP package's 28 mm body fits behind the cluster's relatively large PCB, and the integrated timers generate the backlight PWM and dimming curves. The ROMless configuration supports multiple vehicle variants via external flash image selection.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC68376BGCAB25 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | SC68376BGCAB25 | MC68376BGCAB20 | MC68376BGMFT20 |
|---|---|---|---|---|
| Package | 160-QFP (28x28) | 160-QFP (28x28) | 160-QFP (28x28) | 160-QFP (28x28) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) |
| Max Clock Frequency | 25 MHz | 25 MHz | 20 MHz | 20 MHz |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) | 8 Kbyte internal mask ROM |
| AEC-Q100 | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
主な差別化要因
- Refreshed NXP part number with identical die （vs MC68376BGCAB20)
- Internal mask ROM for high-volume cost-down （vs MC68376BGMFT20)
- Automotive AEC-Q100 qualified （vs Generic industrial 32-bit MCU)
設計ノート
The MC68376BGCAB25 operates from a single 5 V supply rail with multiple VCC/VSS pin pairs distributed across the 160-QFP package. Decouple each VCC pin with a 100 nF ceramic capacitor placed as close as possible (within 5 mm) to the lead, plus a bulk 10 uF tantalum or ceramic capacitor near the package. Estimated: at 25 MHz CPU clock and full peripheral activity, core current draw is approximately 80-120 mA; verify against the NXP MC68376 data sheet electrical characteristics table before sizing the 5 V regulator. Add a 100 uF bulk capacitor on the supply input for transient load handling during CAN transmit bursts.
ROMless variants of the MC68376 require external program memory (typically a 32 Kbyte x 16 EPROM or flash on CS0). The CS0 chip-select must be configured in the System Integration Module (SIM) before reset deassertion; otherwise the CPU fetches from an unconfigured region and locks up. The BERR (bus error) signal must be properly terminated with a pull-up because external bus faults otherwise trigger unpredictable address exceptions. Early mask sets have documented errata in the CTM and TPU - always check the NXP MC68376 mask set errata sheet for the exact date code on your parts.
The 160-QFP (28x28) package has a theta_JA of approximately 35-40 C/W on a 4-layer JEDEC test board with 1 oz copper. At 120 mA x 5 V (estimated worst-case core current), the device dissipates approximately 0.6 W, yielding a junction temperature rise of 21-24 C above ambient - well within the 125 C junction limit. For automotive under-hood applications at 85 C ambient, plan additional copper pour on the PCB or use thermal vias to keep the junction below 110 C for margin.
コンプライアンス情報
AEC-Q100 qualified per NXP automotive catalog. RoHS, REACH, lead-free, halogen-free, and conflict-mineral declarations not explicitly stated in the provided web data - mark as unknown and request the latest material declaration from NXP for production qualification.
