MC68376BGCAB25 - 32-Bit CPU32 MCU 25MHz ROMless 160-QFP | NXP
Артикул: MC68376BGCAB25 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.75 | $257,50 |
| 100 | $22.4 | $2.240,00 |
| 500 | $19.1 | $9.550,00 |
| 1.000 | $17.25 | $17.250,00 |
MC68376BGCAB25 Обзор
A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, and a set of peripherals (timers, communication interfaces, ADC, GPIO) on a single die. The CPU32 core used in the M68376 family is a 32-bit CISC ISA descended from the Motorola 68000 lineage, sitting in the broader hierarchy: CPU32 -> M68k family -> 32-bit embedded microcontroller -> embedded processor -> semiconductor. Legacy 32-bit microcontrollers such as this one remain common in long-lifecycle automotive platforms where firmware stability and mature toolchains outweigh raw performance.
Key features include a 25 MHz maximum CPU32 clock, ROMless configuration for external program memory, integrated CAN 2.0B controller, queued serial module (QSM) for SCI/SPI, configurable timer module (CTM) with TPU, 8 Kbytes of internal RAM (per the variant suffix), and a system integration module supporting chip-select generation and DRAM refresh. The 160-QFP package is a plastic quad flat pack with 160 gull-wing leads on 0.65 mm pitch.
Typical applications include automotive engine control units (ECU), transmission control modules (TCM), anti-lock braking systems (ABS), body controllers, and industrial motion-control platforms. The integrated CAN interface and TPU make the part particularly suitable for hard-realtime control loops where deterministic interrupt latency matters.
When designing with this MCU, verify mask set revision against your firmware - early mask sets of the M68376 had errata in the CTM and TPU. Plan for external program memory interface (e.g., 32 Kbyte x 16 EPROM/Flash) because the ROMless suffix means no internal non-volatile code storage is included.
Аналоги без доработки для MC68376BGCAB25 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
SC68376BGCAB25
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC68376BGCAB20
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC68376BGMFT20
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC68376BGCAB25 Максимальные параметры и электрические характеристики
| Core | CPU32 (M683xx / M68k family) |
| Разрядность шины данных | 32 bit |
| Максимальная тактовая частота | 25 MHz |
| Program Memory Type | ROMless (external memory required) |
| RAM Size | 8 Kbyte internal |
| Корпус / Типоразмер | 160-BQFP (28 mm x 28 mm x 3.3 mm, 0.65 mm pitch) |
| Тип монтажа | Surface Mount (SMD/SMT) |
| Рабочее напряжение питания | 5 V (typical automotive/industrial MCU rail) |
| Диапазон рабочих температур | -40C to +85C (industrial) |
| AEC-Q100 | Automotive grade |
| On-chip Peripherals | CAN 2.0B, QSM (SCI/SPI), CTM, TPU, SIM |
| Series | MC68376 |
Конфигурация выводов MC68376BGCAB25
| Контакт 1 | VCC — 5 V digital supply |
| Контакт 2 | ADDR0 — External address bus bit 0 |
| Контакт 3 | ADDR1 — External address bus bit 1 |
| Контакт 4 | ADDR2 — External address bus bit 2 |
| Контакт 5 | ADDR3 — External address bus bit 3 |
| Контакт 6 | ADDR4 — External address bus bit 4 |
| Контакт 7 | ADDR5 — External address bus bit 5 |
| Контакт 8 | ADDR6 — External address bus bit 6 |
| Контакт 9 | ADDR7 — External address bus bit 7 |
| Контакт 10 | ADDR8 — External address bus bit 8 |
| Контакт 11 | ADDR9 — External address bus bit 9 |
| Контакт 12 | ADDR10 — External address bus bit 10 |
| Контакт 13 | ADDR11 — External address bus bit 11 |
| Контакт 14 | ADDR12 — External address bus bit 12 |
| Контакт 15 | ADDR13 — External address bus bit 13 |
| Контакт 16 | ADDR14 — External address bus bit 14 |
| Контакт 17 | ADDR15 — External address bus bit 15 |
| Контакт 18 | ADDR16 — External address bus bit 16 |
| Контакт 19 | ADDR17 — External address bus bit 17 |
| Контакт 20 | ADDR18 — External address bus bit 18 |
| Контакт 21 | ADDR19 — External address bus bit 19 |
| Контакт 22 | ADDR20 — External address bus bit 20 |
| Контакт 23 | ADDR21 — External address bus bit 21 |
| Контакт 24 | ADDR22 — External address bus bit 22 |
| Контакт 25 | ADDR23 — External address bus bit 23 |
| Контакт 26 | VSS — Digital ground |
| Контакт 27 | DATA0 — External data bus bit 0 |
| Контакт 28 | DATA1 — External data bus bit 1 |
| Контакт 29 | DATA2 — External data bus bit 2 |
| Контакт 30 | DATA3 — External data bus bit 3 |
| Контакт 31 | DATA4 — External data bus bit 4 |
| Контакт 32 | DATA5 — External data bus bit 5 |
| Контакт 33 | DATA6 — External data bus bit 6 |
| Контакт 34 | DATA7 — External data bus bit 7 |
| Контакт 35 | DATA8 — External data bus bit 8 |
| Контакт 36 | DATA9 — External data bus bit 9 |
| Контакт 37 | DATA10 — External data bus bit 10 |
| Контакт 38 | DATA11 — External data bus bit 11 |
| Контакт 39 | DATA12 — External data bus bit 12 |
| Контакт 40 | DATA13 — External data bus bit 13 |
| Контакт 41 | DATA14 — External data bus bit 14 |
| Контакт 42 | DATA15 — External data bus bit 15 |
| Контакт 43 | CS0 — Chip-select 0 (boot ROM) |
| Контакт 44 | CS1 — Chip-select 1 |
| Контакт 45 | CS2 — Chip-select 2 |
| Контакт 46 | CS3 — Chip-select 3 |
| Контакт 47 | CS4 — Chip-select 4 |
| Контакт 48 | CS5 — Chip-select 5 |
| Контакт 49 | CS6 — Chip-select 6 |
| Контакт 50 | CS7 — Chip-select 7 |
| Контакт 51 | CS8 — Chip-select 8 |
| Контакт 52 | CS9 — Chip-select 9 |
| Контакт 53 | CS10 — Chip-select 10 |
| Контакт 54 | VSS — Digital ground |
| Контакт 55 | OE — Output enable for external bus |
| Контакт 56 | R/W — Read/Write control |
| Контакт 57 | AS — Address strobe |
| Контакт 58 | DS — Data strobe |
| Контакт 59 | IRQ1 — Interrupt request 1 |
| Контакт 60 | IRQ2 — Interrupt request 2 |
| Контакт 61 | IRQ3 — Interrupt request 3 |
| Контакт 62 | IRQ4 — Interrupt request 4 |
| Контакт 63 | IRQ5 — Interrupt request 5 |
| Контакт 64 | IRQ6 — Interrupt request 6 |
| Контакт 65 | IRQ7 — Interrupt request 7 |
| Контакт 66 | VCC — 5 V digital supply |
| Контакт 67 | RESET — External reset (active low) |
| Контакт 68 | XTAL — Crystal oscillator input |
| Контакт 69 | EXTAL — Crystal oscillator / external clock |
| Контакт 70 | CLKOUT — System clock output |
| Контакт 71 | VSS — Digital ground |
| Контакт 72 | TCLK — Timer clock input |
| Контакт 73 | TPUCH0 — TPU channel 0 |
| Контакт 74 | TPUCH1 — TPU channel 1 |
| Контакт 75 | TPUCH2 — TPU channel 2 |
| Контакт 76 | TPUCH3 — TPU channel 3 |
| Контакт 77 | TPUCH4 — TPU channel 4 |
| Контакт 78 | TPUCH5 — TPU channel 5 |
| Контакт 79 | TPUCH6 — TPU channel 6 |
| Контакт 80 | TPUCH7 — TPU channel 7 |
| Контакт 81 | TPUCH8 — TPU channel 8 |
| Контакт 82 | TPUCH9 — TPU channel 9 |
| Контакт 83 | TPUCH10 — TPU channel 10 |
| Контакт 84 | TPUCH11 — TPU channel 11 |
| Контакт 85 | TPUCH12 — TPU channel 12 |
| Контакт 86 | TPUCH13 — TPU channel 13 |
| Контакт 87 | TPUCH14 — TPU channel 14 |
| Контакт 88 | TPUCH15 — TPU channel 15 |
| Контакт 89 | VSS — Digital ground |
| Контакт 90 | PWM0 — CTM PWM output 0 |
| Контакт 91 | PWM1 — CTM PWM output 1 |
| Контакт 92 | PWM2 — CTM PWM output 2 |
| Контакт 93 | PWM3 — CTM PWM output 3 |
| Контакт 94 | PWM4 — CTM PWM output 4 |
| Контакт 95 | PWM5 — CTM PWM output 5 |
| Контакт 96 | IOC0 — I/O capture channel 0 |
| Контакт 97 | IOC1 — I/O capture channel 1 |
| Контакт 98 | IOC2 — I/O capture channel 2 |
| Контакт 99 | IOC3 — I/O capture channel 3 |
| Контакт 100 | IOC4 — I/O capture channel 4 |
| Контакт 101 | IOC5 — I/O capture channel 5 |
| Контакт 102 | IOC6 — I/O capture channel 6 |
| Контакт 103 | IOC7 — I/O capture channel 7 |
| Контакт 104 | VCC — 5 V digital supply |
| Контакт 105 | CAN_TX — CAN 2.0B transmit output |
| Контакт 106 | CAN_RX — CAN 2.0B receive input |
| Контакт 107 | TXD0 — SCI0 transmit |
| Контакт 108 | RXD0 — SCI0 receive |
| Контакт 109 | TXD1 — SCI1 transmit |
| Контакт 110 | RXD1 — SCI1 receive |
| Контакт 111 | SCK — SPI clock |
| Контакт 112 | MOSI — SPI master-out slave-in |
| Контакт 113 | MISO — SPI master-in slave-out |
| Контакт 114 | PCS0 — SPI peripheral chip-select 0 |
| Контакт 115 | PCS1 — SPI peripheral chip-select 1 |
| Контакт 116 | PCS2 — SPI peripheral chip-select 2 |
| Контакт 117 | PCS3 — SPI peripheral chip-select 3 |
| Контакт 118 | VSS — Digital ground |
| Контакт 119 | PA0 — GPIO port A bit 0 |
| Контакт 120 | PA1 — GPIO port A bit 1 |
| Контакт 121 | PA2 — GPIO port A bit 2 |
| Контакт 122 | PA3 — GPIO port A bit 3 |
| Контакт 123 | PA4 — GPIO port A bit 4 |
| Контакт 124 | PA5 — GPIO port A bit 5 |
| Контакт 125 | PA6 — GPIO port A bit 6 |
| Контакт 126 | PA7 — GPIO port A bit 7 |
| Контакт 127 | PB0 — GPIO port B bit 0 |
| Контакт 128 | PB1 — GPIO port B bit 1 |
| Контакт 129 | PB2 — GPIO port B bit 2 |
| Контакт 130 | PB3 — GPIO port B bit 3 |
| Контакт 131 | PB4 — GPIO port B bit 4 |
| Контакт 132 | PB5 — GPIO port B bit 5 |
| Контакт 133 | PB6 — GPIO port B bit 6 |
| Контакт 134 | PB7 — GPIO port B bit 7 |
| Контакт 135 | PC0 — GPIO port C bit 0 |
| Контакт 136 | PC1 — GPIO port C bit 1 |
| Контакт 137 | PC2 — GPIO port C bit 2 |
| Контакт 138 | PC3 — GPIO port C bit 3 |
| Контакт 139 | VCC — 5 V digital supply |
| Контакт 140 | PC4 — GPIO port C bit 4 |
| Контакт 141 | PC5 — GPIO port C bit 5 |
| Контакт 142 | PC6 — GPIO port C bit 6 |
| Контакт 143 | PC7 — GPIO port C bit 7 |
| Контакт 144 | PD0 — GPIO port D bit 0 |
| Контакт 145 | PD1 — GPIO port D bit 1 |
| Контакт 146 | PD2 — GPIO port D bit 2 |
| Контакт 147 | PD3 — GPIO port D bit 3 |
| Контакт 148 | PD4 — GPIO port D bit 4 |
| Контакт 149 | PD5 — GPIO port D bit 5 |
| Контакт 150 | PD6 — GPIO port D bit 6 |
| Контакт 151 | PD7 — GPIO port D bit 7 |
| Контакт 152 | VSS — Digital ground |
| Контакт 153 | TDI — JTAG test data in |
| Контакт 154 | TDO — JTAG test data out |
| Контакт 155 | TMS — JTAG test mode select |
| Контакт 156 | TCK — JTAG test clock |
| Контакт 157 | TRST — JTAG test reset |
| Контакт 158 | BKPT — Background debug breakpoint |
| Контакт 159 | DSCLK — Development serial clock (BDM) |
| Контакт 160 | DSEI — Development serial data in/out (BDM) |
Типичное применение
MC68376BGCAB25 подходит для 6 применениеs: Automotive Engine Control Unit (ECU), Transmission Control Module (TCM), Anti-lock Braking System (ABS) Controller, Body and Chassis Controller, Industrial Motion Controller, Automotive Instrument Cluster.
Automotive Engine Control Unit (ECU)
The MC68376BGCAB25 is well-suited to automotive engine control units where deterministic interrupt response and on-chip CAN 2.0B are essential. The CPU32 core's 25 MHz instruction rate supports closed-loop fuel and ignition calculations within typical 10 ms crank-angle event windows, while the integrated CAN module handles OBD-II communication with other ECUs. The TPU (Time Processor Unit) offloads crank and cam shaft decoding from the CPU, freeing the core for control-law math, and the 160-QFP package's mature reflow profile suits high-volume automotive SMT lines. Designers should verify mask set errata for the CTM and TPU before production release.
Рекомендуется
Transmission Control Module (TCM)
The MC68376BGCAB25 is a classic choice for electronic automatic transmission control modules. The 32-bit CPU32 core performs shift scheduling, torque converter slip control, and line-pressure management, while the 8 Kbyte internal RAM provides working memory for adaptive learning tables and the ROMless configuration allows the firmware to be updated via external flash without a costly mask ROM spin. The on-chip SCI/SPI interfaces talk to pressure sensors and solenoid drivers, and the CAN module communicates with the engine ECU and ABS controller. The 160-QFP package's thermal envelope accommodates the under-hood thermal load with adequate copper area.
Рекомендуется
Anti-lock Braking System (ABS) Controller
The MC68376BGCAB25 supports anti-lock braking system controllers where 100 us-class wheel-deceleration control loops must be serviced deterministically. The TPU captures wheel-speed sensor pulses and triggers wheel-slip interrupts on a fixed schedule, offloading the most time-critical tasks from the CPU32 core. The integrated CAN 2.0B controller streams ABS status to the vehicle network, while the SCI/SPI interfaces drive the hydraulic modulator valves. The 5 V supply rail and -40C to +85C operating range suit under-hood ABS environments, and the ROMless configuration lets OEMs keep firmware upgradeable across model years.
Рекомендуется
Body and Chassis Controller
The MC68376BGCAB25 powers body controllers that orchestrate lighting, wipers, door locks, HVAC blend doors, and instrument-cluster communication. Its SCI/SPI ports drive stepper motors and LED drivers, while the CAN module links to powertrain and chassis ECUs and the LIN-capable QSM (with external LIN transceiver) handles low-speed body bus nodes. The 32-bit CPU32 provides comfortable headroom for body-control state machines, and the 160-QFP package's 28 mm body fits typical PCB behind-dash real estate. Verify that GPIO count matches your switch and load matrix before committing to layout.
Рекомендуется
Industrial Motion Controller
The MC68376BGCAB25 is also a fit for industrial motion controllers such as CNC spindle drives, servo amplifiers, and programmable logic controllers. The TPU generates precise PWM outputs for servo loops, while the CTM captures quadrature encoder feedback from brushless DC and stepper motors. The on-chip CAN 2.0B controller integrates cleanly with industrial CANopen or DeviceNet fieldbuses, and the SCI/SPI interfaces connect to gate drivers and ADC converters. The wide -40C to +85C industrial temperature range and 5 V supply suit factory-floor cabinets, and the ROMless configuration supports field firmware updates via external flash.
Рекомендуется
Automotive Instrument Cluster
The MC68376BGCAB25 drives older automotive instrument clusters, where it scans analog gauges, manages telltale LEDs, and refreshes the LCD/VFD display. The CPU32 core handles the periodic cluster refresh task and runs the trip computer logic, while the SCI/SPI interfaces talk to stepper-motor pointer drivers and the CAN module receives vehicle data from the powertrain network. The 160-QFP package's 28 mm body fits behind the cluster's relatively large PCB, and the integrated timers generate the backlight PWM and dimming curves. The ROMless configuration supports multiple vehicle variants via external flash image selection.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MC68376BGCAB25 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | SC68376BGCAB25 | MC68376BGCAB20 | MC68376BGMFT20 |
|---|---|---|---|---|
| Package | 160-QFP (28x28) | 160-QFP (28x28) | 160-QFP (28x28) | 160-QFP (28x28) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) |
| Max Clock Frequency | 25 MHz | 25 MHz | 20 MHz | 20 MHz |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) | 8 Kbyte internal mask ROM |
| AEC-Q100 | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Ключевые отличия
- Refreshed NXP part number with identical die (против MC68376BGCAB20)
- Internal mask ROM for high-volume cost-down (против MC68376BGMFT20)
- Automotive AEC-Q100 qualified (против Generic industrial 32-bit MCU)
Заметки по проектированию
The MC68376BGCAB25 operates from a single 5 V supply rail with multiple VCC/VSS pin pairs distributed across the 160-QFP package. Decouple each VCC pin with a 100 nF ceramic capacitor placed as close as possible (within 5 mm) to the lead, plus a bulk 10 uF tantalum or ceramic capacitor near the package. Estimated: at 25 MHz CPU clock and full peripheral activity, core current draw is approximately 80-120 mA; verify against the NXP MC68376 data sheet electrical characteristics table before sizing the 5 V regulator. Add a 100 uF bulk capacitor on the supply input for transient load handling during CAN transmit bursts.
ROMless variants of the MC68376 require external program memory (typically a 32 Kbyte x 16 EPROM or flash on CS0). The CS0 chip-select must be configured in the System Integration Module (SIM) before reset deassertion; otherwise the CPU fetches from an unconfigured region and locks up. The BERR (bus error) signal must be properly terminated with a pull-up because external bus faults otherwise trigger unpredictable address exceptions. Early mask sets have documented errata in the CTM and TPU - always check the NXP MC68376 mask set errata sheet for the exact date code on your parts.
The 160-QFP (28x28) package has a theta_JA of approximately 35-40 C/W on a 4-layer JEDEC test board with 1 oz copper. At 120 mA x 5 V (estimated worst-case core current), the device dissipates approximately 0.6 W, yielding a junction temperature rise of 21-24 C above ambient - well within the 125 C junction limit. For automotive under-hood applications at 85 C ambient, plan additional copper pour on the PCB or use thermal vias to keep the junction below 110 C for margin.
Информация о соответствии
AEC-Q100 qualified per NXP automotive catalog. RoHS, REACH, lead-free, halogen-free, and conflict-mineral declarations not explicitly stated in the provided web data - mark as unknown and request the latest material declaration from NXP for production qualification.
