MC68376BGCAB25 - 32-Bit CPU32 MCU 25MHz ROMless 160-QFP | NXP
N.º de pieza: MC68376BGCAB25 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.75 | $257,50 |
| 100 | $22.4 | $2.240,00 |
| 500 | $19.1 | $9.550,00 |
| 1.000 | $17.25 | $17.250,00 |
MC68376BGCAB25 Descripción general
A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, and a set of peripherals (timers, communication interfaces, ADC, GPIO) on a single die. The CPU32 core used in the M68376 family is a 32-bit CISC ISA descended from the Motorola 68000 lineage, sitting in the broader hierarchy: CPU32 -> M68k family -> 32-bit embedded microcontroller -> embedded processor -> semiconductor. Legacy 32-bit microcontrollers such as this one remain common in long-lifecycle automotive platforms where firmware stability and mature toolchains outweigh raw performance.
Key features include a 25 MHz maximum CPU32 clock, ROMless configuration for external program memory, integrated CAN 2.0B controller, queued serial module (QSM) for SCI/SPI, configurable timer module (CTM) with TPU, 8 Kbytes of internal RAM (per the variant suffix), and a system integration module supporting chip-select generation and DRAM refresh. The 160-QFP package is a plastic quad flat pack with 160 gull-wing leads on 0.65 mm pitch.
Typical applications include automotive engine control units (ECU), transmission control modules (TCM), anti-lock braking systems (ABS), body controllers, and industrial motion-control platforms. The integrated CAN interface and TPU make the part particularly suitable for hard-realtime control loops where deterministic interrupt latency matters.
When designing with this MCU, verify mask set revision against your firmware - early mask sets of the M68376 had errata in the CTM and TPU. Plan for external program memory interface (e.g., 32 Kbyte x 16 EPROM/Flash) because the ROMless suffix means no internal non-volatile code storage is included.
Alternativas directas para MC68376BGCAB25 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
SC68376BGCAB25
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MC68376BGCAB20
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC68376BGMFT20
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MC68376BGCAB25 Valores máximos y características eléctricas
| Core | CPU32 (M683xx / M68k family) |
| Ancho del bus de datos | 32 bit |
| Frecuencia de reloj máxima | 25 MHz |
| Program Memory Type | ROMless (external memory required) |
| RAM Size | 8 Kbyte internal |
| Encapsulado / Carcasa | 160-BQFP (28 mm x 28 mm x 3.3 mm, 0.65 mm pitch) |
| Tipo de montaje | Surface Mount (SMD/SMT) |
| Tensión de alimentación de funcionamiento | 5 V (typical automotive/industrial MCU rail) |
| Rango de temperatura de funcionamiento | -40C to +85C (industrial) |
| AEC-Q100 | Automotive grade |
| On-chip Peripherals | CAN 2.0B, QSM (SCI/SPI), CTM, TPU, SIM |
| Series | MC68376 |
Configuración de pines de MC68376BGCAB25
| Pin 1 | VCC — 5 V digital supply |
| Pin 2 | ADDR0 — External address bus bit 0 |
| Pin 3 | ADDR1 — External address bus bit 1 |
| Pin 4 | ADDR2 — External address bus bit 2 |
| Pin 5 | ADDR3 — External address bus bit 3 |
| Pin 6 | ADDR4 — External address bus bit 4 |
| Pin 7 | ADDR5 — External address bus bit 5 |
| Pin 8 | ADDR6 — External address bus bit 6 |
| Pin 9 | ADDR7 — External address bus bit 7 |
| Pin 10 | ADDR8 — External address bus bit 8 |
| Pin 11 | ADDR9 — External address bus bit 9 |
| Pin 12 | ADDR10 — External address bus bit 10 |
| Pin 13 | ADDR11 — External address bus bit 11 |
| Pin 14 | ADDR12 — External address bus bit 12 |
| Pin 15 | ADDR13 — External address bus bit 13 |
| Pin 16 | ADDR14 — External address bus bit 14 |
| Pin 17 | ADDR15 — External address bus bit 15 |
| Pin 18 | ADDR16 — External address bus bit 16 |
| Pin 19 | ADDR17 — External address bus bit 17 |
| Pin 20 | ADDR18 — External address bus bit 18 |
| Pin 21 | ADDR19 — External address bus bit 19 |
| Pin 22 | ADDR20 — External address bus bit 20 |
| Pin 23 | ADDR21 — External address bus bit 21 |
| Pin 24 | ADDR22 — External address bus bit 22 |
| Pin 25 | ADDR23 — External address bus bit 23 |
| Pin 26 | VSS — Digital ground |
| Pin 27 | DATA0 — External data bus bit 0 |
| Pin 28 | DATA1 — External data bus bit 1 |
| Pin 29 | DATA2 — External data bus bit 2 |
| Pin 30 | DATA3 — External data bus bit 3 |
| Pin 31 | DATA4 — External data bus bit 4 |
| Pin 32 | DATA5 — External data bus bit 5 |
| Pin 33 | DATA6 — External data bus bit 6 |
| Pin 34 | DATA7 — External data bus bit 7 |
| Pin 35 | DATA8 — External data bus bit 8 |
| Pin 36 | DATA9 — External data bus bit 9 |
| Pin 37 | DATA10 — External data bus bit 10 |
| Pin 38 | DATA11 — External data bus bit 11 |
| Pin 39 | DATA12 — External data bus bit 12 |
| Pin 40 | DATA13 — External data bus bit 13 |
| Pin 41 | DATA14 — External data bus bit 14 |
| Pin 42 | DATA15 — External data bus bit 15 |
| Pin 43 | CS0 — Chip-select 0 (boot ROM) |
| Pin 44 | CS1 — Chip-select 1 |
| Pin 45 | CS2 — Chip-select 2 |
| Pin 46 | CS3 — Chip-select 3 |
| Pin 47 | CS4 — Chip-select 4 |
| Pin 48 | CS5 — Chip-select 5 |
| Pin 49 | CS6 — Chip-select 6 |
| Pin 50 | CS7 — Chip-select 7 |
| Pin 51 | CS8 — Chip-select 8 |
| Pin 52 | CS9 — Chip-select 9 |
| Pin 53 | CS10 — Chip-select 10 |
| Pin 54 | VSS — Digital ground |
| Pin 55 | OE — Output enable for external bus |
| Pin 56 | R/W — Read/Write control |
| Pin 57 | AS — Address strobe |
| Pin 58 | DS — Data strobe |
| Pin 59 | IRQ1 — Interrupt request 1 |
| Pin 60 | IRQ2 — Interrupt request 2 |
| Pin 61 | IRQ3 — Interrupt request 3 |
| Pin 62 | IRQ4 — Interrupt request 4 |
| Pin 63 | IRQ5 — Interrupt request 5 |
| Pin 64 | IRQ6 — Interrupt request 6 |
| Pin 65 | IRQ7 — Interrupt request 7 |
| Pin 66 | VCC — 5 V digital supply |
| Pin 67 | RESET — External reset (active low) |
| Pin 68 | XTAL — Crystal oscillator input |
| Pin 69 | EXTAL — Crystal oscillator / external clock |
| Pin 70 | CLKOUT — System clock output |
| Pin 71 | VSS — Digital ground |
| Pin 72 | TCLK — Timer clock input |
| Pin 73 | TPUCH0 — TPU channel 0 |
| Pin 74 | TPUCH1 — TPU channel 1 |
| Pin 75 | TPUCH2 — TPU channel 2 |
| Pin 76 | TPUCH3 — TPU channel 3 |
| Pin 77 | TPUCH4 — TPU channel 4 |
| Pin 78 | TPUCH5 — TPU channel 5 |
| Pin 79 | TPUCH6 — TPU channel 6 |
| Pin 80 | TPUCH7 — TPU channel 7 |
| Pin 81 | TPUCH8 — TPU channel 8 |
| Pin 82 | TPUCH9 — TPU channel 9 |
| Pin 83 | TPUCH10 — TPU channel 10 |
| Pin 84 | TPUCH11 — TPU channel 11 |
| Pin 85 | TPUCH12 — TPU channel 12 |
| Pin 86 | TPUCH13 — TPU channel 13 |
| Pin 87 | TPUCH14 — TPU channel 14 |
| Pin 88 | TPUCH15 — TPU channel 15 |
| Pin 89 | VSS — Digital ground |
| Pin 90 | PWM0 — CTM PWM output 0 |
| Pin 91 | PWM1 — CTM PWM output 1 |
| Pin 92 | PWM2 — CTM PWM output 2 |
| Pin 93 | PWM3 — CTM PWM output 3 |
| Pin 94 | PWM4 — CTM PWM output 4 |
| Pin 95 | PWM5 — CTM PWM output 5 |
| Pin 96 | IOC0 — I/O capture channel 0 |
| Pin 97 | IOC1 — I/O capture channel 1 |
| Pin 98 | IOC2 — I/O capture channel 2 |
| Pin 99 | IOC3 — I/O capture channel 3 |
| Pin 100 | IOC4 — I/O capture channel 4 |
| Pin 101 | IOC5 — I/O capture channel 5 |
| Pin 102 | IOC6 — I/O capture channel 6 |
| Pin 103 | IOC7 — I/O capture channel 7 |
| Pin 104 | VCC — 5 V digital supply |
| Pin 105 | CAN_TX — CAN 2.0B transmit output |
| Pin 106 | CAN_RX — CAN 2.0B receive input |
| Pin 107 | TXD0 — SCI0 transmit |
| Pin 108 | RXD0 — SCI0 receive |
| Pin 109 | TXD1 — SCI1 transmit |
| Pin 110 | RXD1 — SCI1 receive |
| Pin 111 | SCK — SPI clock |
| Pin 112 | MOSI — SPI master-out slave-in |
| Pin 113 | MISO — SPI master-in slave-out |
| Pin 114 | PCS0 — SPI peripheral chip-select 0 |
| Pin 115 | PCS1 — SPI peripheral chip-select 1 |
| Pin 116 | PCS2 — SPI peripheral chip-select 2 |
| Pin 117 | PCS3 — SPI peripheral chip-select 3 |
| Pin 118 | VSS — Digital ground |
| Pin 119 | PA0 — GPIO port A bit 0 |
| Pin 120 | PA1 — GPIO port A bit 1 |
| Pin 121 | PA2 — GPIO port A bit 2 |
| Pin 122 | PA3 — GPIO port A bit 3 |
| Pin 123 | PA4 — GPIO port A bit 4 |
| Pin 124 | PA5 — GPIO port A bit 5 |
| Pin 125 | PA6 — GPIO port A bit 6 |
| Pin 126 | PA7 — GPIO port A bit 7 |
| Pin 127 | PB0 — GPIO port B bit 0 |
| Pin 128 | PB1 — GPIO port B bit 1 |
| Pin 129 | PB2 — GPIO port B bit 2 |
| Pin 130 | PB3 — GPIO port B bit 3 |
| Pin 131 | PB4 — GPIO port B bit 4 |
| Pin 132 | PB5 — GPIO port B bit 5 |
| Pin 133 | PB6 — GPIO port B bit 6 |
| Pin 134 | PB7 — GPIO port B bit 7 |
| Pin 135 | PC0 — GPIO port C bit 0 |
| Pin 136 | PC1 — GPIO port C bit 1 |
| Pin 137 | PC2 — GPIO port C bit 2 |
| Pin 138 | PC3 — GPIO port C bit 3 |
| Pin 139 | VCC — 5 V digital supply |
| Pin 140 | PC4 — GPIO port C bit 4 |
| Pin 141 | PC5 — GPIO port C bit 5 |
| Pin 142 | PC6 — GPIO port C bit 6 |
| Pin 143 | PC7 — GPIO port C bit 7 |
| Pin 144 | PD0 — GPIO port D bit 0 |
| Pin 145 | PD1 — GPIO port D bit 1 |
| Pin 146 | PD2 — GPIO port D bit 2 |
| Pin 147 | PD3 — GPIO port D bit 3 |
| Pin 148 | PD4 — GPIO port D bit 4 |
| Pin 149 | PD5 — GPIO port D bit 5 |
| Pin 150 | PD6 — GPIO port D bit 6 |
| Pin 151 | PD7 — GPIO port D bit 7 |
| Pin 152 | VSS — Digital ground |
| Pin 153 | TDI — JTAG test data in |
| Pin 154 | TDO — JTAG test data out |
| Pin 155 | TMS — JTAG test mode select |
| Pin 156 | TCK — JTAG test clock |
| Pin 157 | TRST — JTAG test reset |
| Pin 158 | BKPT — Background debug breakpoint |
| Pin 159 | DSCLK — Development serial clock (BDM) |
| Pin 160 | DSEI — Development serial data in/out (BDM) |
Aplicaciones típicas
MC68376BGCAB25 es adecuado para 6 aplicacións: Automotive Engine Control Unit (ECU), Transmission Control Module (TCM), Anti-lock Braking System (ABS) Controller, Body and Chassis Controller, Industrial Motion Controller, Automotive Instrument Cluster.
Automotive Engine Control Unit (ECU)
The MC68376BGCAB25 is well-suited to automotive engine control units where deterministic interrupt response and on-chip CAN 2.0B are essential. The CPU32 core's 25 MHz instruction rate supports closed-loop fuel and ignition calculations within typical 10 ms crank-angle event windows, while the integrated CAN module handles OBD-II communication with other ECUs. The TPU (Time Processor Unit) offloads crank and cam shaft decoding from the CPU, freeing the core for control-law math, and the 160-QFP package's mature reflow profile suits high-volume automotive SMT lines. Designers should verify mask set errata for the CTM and TPU before production release.
Recomendado
Transmission Control Module (TCM)
The MC68376BGCAB25 is a classic choice for electronic automatic transmission control modules. The 32-bit CPU32 core performs shift scheduling, torque converter slip control, and line-pressure management, while the 8 Kbyte internal RAM provides working memory for adaptive learning tables and the ROMless configuration allows the firmware to be updated via external flash without a costly mask ROM spin. The on-chip SCI/SPI interfaces talk to pressure sensors and solenoid drivers, and the CAN module communicates with the engine ECU and ABS controller. The 160-QFP package's thermal envelope accommodates the under-hood thermal load with adequate copper area.
Recomendado
Anti-lock Braking System (ABS) Controller
The MC68376BGCAB25 supports anti-lock braking system controllers where 100 us-class wheel-deceleration control loops must be serviced deterministically. The TPU captures wheel-speed sensor pulses and triggers wheel-slip interrupts on a fixed schedule, offloading the most time-critical tasks from the CPU32 core. The integrated CAN 2.0B controller streams ABS status to the vehicle network, while the SCI/SPI interfaces drive the hydraulic modulator valves. The 5 V supply rail and -40C to +85C operating range suit under-hood ABS environments, and the ROMless configuration lets OEMs keep firmware upgradeable across model years.
Recomendado
Body and Chassis Controller
The MC68376BGCAB25 powers body controllers that orchestrate lighting, wipers, door locks, HVAC blend doors, and instrument-cluster communication. Its SCI/SPI ports drive stepper motors and LED drivers, while the CAN module links to powertrain and chassis ECUs and the LIN-capable QSM (with external LIN transceiver) handles low-speed body bus nodes. The 32-bit CPU32 provides comfortable headroom for body-control state machines, and the 160-QFP package's 28 mm body fits typical PCB behind-dash real estate. Verify that GPIO count matches your switch and load matrix before committing to layout.
Recomendado
Industrial Motion Controller
The MC68376BGCAB25 is also a fit for industrial motion controllers such as CNC spindle drives, servo amplifiers, and programmable logic controllers. The TPU generates precise PWM outputs for servo loops, while the CTM captures quadrature encoder feedback from brushless DC and stepper motors. The on-chip CAN 2.0B controller integrates cleanly with industrial CANopen or DeviceNet fieldbuses, and the SCI/SPI interfaces connect to gate drivers and ADC converters. The wide -40C to +85C industrial temperature range and 5 V supply suit factory-floor cabinets, and the ROMless configuration supports field firmware updates via external flash.
Recomendado
Automotive Instrument Cluster
The MC68376BGCAB25 drives older automotive instrument clusters, where it scans analog gauges, manages telltale LEDs, and refreshes the LCD/VFD display. The CPU32 core handles the periodic cluster refresh task and runs the trip computer logic, while the SCI/SPI interfaces talk to stepper-motor pointer drivers and the CAN module receives vehicle data from the powertrain network. The 160-QFP package's 28 mm body fits behind the cluster's relatively large PCB, and the integrated timers generate the backlight PWM and dimming curves. The ROMless configuration supports multiple vehicle variants via external flash image selection.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC68376BGCAB25 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | SC68376BGCAB25 | MC68376BGCAB20 | MC68376BGMFT20 |
|---|---|---|---|---|
| Package | 160-QFP (28x28) | 160-QFP (28x28) | 160-QFP (28x28) | 160-QFP (28x28) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) |
| Max Clock Frequency | 25 MHz | 25 MHz | 20 MHz | 20 MHz |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) | 8 Kbyte internal mask ROM |
| AEC-Q100 | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Refreshed NXP part number with identical die (frente a MC68376BGCAB20)
- Internal mask ROM for high-volume cost-down (frente a MC68376BGMFT20)
- Automotive AEC-Q100 qualified (frente a Generic industrial 32-bit MCU)
Notas de diseño
The MC68376BGCAB25 operates from a single 5 V supply rail with multiple VCC/VSS pin pairs distributed across the 160-QFP package. Decouple each VCC pin with a 100 nF ceramic capacitor placed as close as possible (within 5 mm) to the lead, plus a bulk 10 uF tantalum or ceramic capacitor near the package. Estimated: at 25 MHz CPU clock and full peripheral activity, core current draw is approximately 80-120 mA; verify against the NXP MC68376 data sheet electrical characteristics table before sizing the 5 V regulator. Add a 100 uF bulk capacitor on the supply input for transient load handling during CAN transmit bursts.
ROMless variants of the MC68376 require external program memory (typically a 32 Kbyte x 16 EPROM or flash on CS0). The CS0 chip-select must be configured in the System Integration Module (SIM) before reset deassertion; otherwise the CPU fetches from an unconfigured region and locks up. The BERR (bus error) signal must be properly terminated with a pull-up because external bus faults otherwise trigger unpredictable address exceptions. Early mask sets have documented errata in the CTM and TPU - always check the NXP MC68376 mask set errata sheet for the exact date code on your parts.
The 160-QFP (28x28) package has a theta_JA of approximately 35-40 C/W on a 4-layer JEDEC test board with 1 oz copper. At 120 mA x 5 V (estimated worst-case core current), the device dissipates approximately 0.6 W, yielding a junction temperature rise of 21-24 C above ambient - well within the 125 C junction limit. For automotive under-hood applications at 85 C ambient, plan additional copper pour on the PCB or use thermal vias to keep the junction below 110 C for margin.
Información de cumplimiento
AEC-Q100 qualified per NXP automotive catalog. RoHS, REACH, lead-free, halogen-free, and conflict-mineral declarations not explicitly stated in the provided web data - mark as unknown and request the latest material declaration from NXP for production qualification.
