MC9S08GB32ACFUE - 8-bit S08 MCU, 40MHz, 32KB Flash | NXP
N.º da peça: MC9S08GB32ACFUE ✗ Fim de vida| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MC9S08GB32ACFUE Visão geral
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program flash, RAM, oscillators and peripheral modules such as timers, serial interfaces and analog-to-digital converters. Within the embedded systems hierarchy, the S08 family sits in the general-purpose 8-bit controller class, sitting above simple timer-based MCUs and below 16-bit and 32-bit parts, and forms a complete power-management-friendly embedded control solution when paired with only a decoupling network and reset circuitry.
Key features include the S08 CISC core with background debug mode (BDM) for non-intrusive flash programming, 40 MHz bus operation, 32KB (32K x 8) in-system reprogrammable flash, and a wide 2.08V to 3.6V operating supply that supports battery-powered designs. The 64-pin LQFP package exposes up to 56 I/O ports, giving designers extensive parallel control capability in a 10x10 mm surface-mount footprint.
Architecturally, the device belongs to NXP's S08 (formerly Freescale HC08 successor) family, which uses an enhanced 68HC08-compatible instruction set, single-wire background debugging, and a rich peripheral set including serial communication interfaces, timers and ADC channels. The industrial temperature grade supports -40C to +85C environments per distributor listings.
Typical applications include industrial control panels, appliance and HVAC controllers, motor-driven consumer products, battery chargers and instrumentation front ends where 8-bit cost efficiency, moderate 40 MHz performance and generous I/O count are priorities.
A key design consideration: NXP has marked this part NRND (Not Recommended for New Designs), so new designs should evaluate pin-compatible S08 family alternatives while legacy production continues through last-time-buy channels.
This page synthesizes distributor inventory data, drop-in alternatives, and NRND lifecycle guidance not found in the manufacturer datasheet.
Alternativas drop-in para MC9S08GB32ACFUE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08GB32ACFUE (mesmo formato e footprint) — diferindo em Core Processor, RAM Size, Package, Debug Interface, Program Memory Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08GB60CFUE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.05 / unidade
Ver ficha técnica →MC9S08AW60CPUE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08DZ32AMLH
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →MC908GZ32VFUE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.15 / unidade
Ver ficha técnica →MC9S08GT32ACBE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.1 / unidade
Ver ficha técnica →MC9S08GB32ACFUE Classificações máximas e características elétricas
| Core Processor | S08 |
| Core Size | 8-Bit |
| Architecture | CISC |
| Clock Speed | 40 MHz |
| Flash Memory | 32KB (32K x 8) |
| RAM Size | 4KB |
| Supply Voltage Range | 2.08 V to 3.6 V |
| Nominal Supply Voltage | 2.5 V / 3.3 V |
| I/O Count | 56 |
| Encapsulamento | 64-LQFP (10x10 mm) |
| Terminal Form | Gull Wing |
| Tipo de montagem | Surface Mount |
| Temperature Grade | Industrial |
| Status do ciclo de vida | NRND (Not Recommended for New Designs) |
| Program Memory Type | FLASH |
Guia de Configuração de Pinos do MC9S08GB32ACFUE 64-lqfp (10x10 mm)
Configuração de pinos para MC9S08GB32ACFUE (pacote 64-lqfp (10x10 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC9S08GB32ACFUE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC9S08GB32ACFUE é adequado para 6 aplicaçãos: Industrial Control Panels, Appliance and HVAC Controllers, Battery-Powered Portable Instruments, Motor Control Subsystems, Building Automation Nodes, Legacy Product Sustainment.
Industrial Control Panels
The MC9S08GB32ACFUE's 56 general-purpose I/O lines and 40 MHz S08 bus make it well suited to industrial panel controllers that must read many switches, sensors and interlocks while driving relays, indicators and annunciators. Its 32KB flash accommodates state-machine logic, communication stacks and diagnostics, and the 4KB RAM supports buffering of Modus-class serial traffic. Operating from a 2.08V to 3.6V supply at industrial temperature grade, it fits 3.3V control backplanes directly. Because it is NRND, use it for sustaining existing panels; new panel designs should migrate to an active S08-family device with the same 64-LQFP footprint to reuse the PCB.
Recomendado
Appliance and HVAC Controllers
White-goods and HVAC boards need low-cost 8-bit control with many I/O for keypad scanning, temperature sensing, fan and compressor relay drive. The MC9S08GB32ACFUE provides 56 I/O lines and a 40 MHz bus that easily time-multiplexes these tasks, while its in-system programmable 32KB flash allows firmware updates for new appliance feature sets without board changes. The 2.08V to 3.6V supply range supports 3.3V regulated boards, and single-wire background debug enables fast production programming. As the part is NRND, appliance makers should qualify MC9S08GB60CFUE or other active S08 parts for future production ramps.
Recomendado
Battery-Powered Portable Instruments
Handheld meters and portable instruments benefit from the MC9S08GB32ACFUE's wide 2.08V to 3.6V operating range, which allows direct use of a 3.0V lithium coin cell across nearly its full discharge curve, and from the S08 core's low-power wait and stop modes for extended battery life. The 40 MHz bus delivers responsive user-interface and measurement processing when awake, while 32KB flash stores calibration tables and multi-language menus. The 64-LQFP 10x10 mm package keeps board area compact. Verify the exact stop/current figures in the NXP datasheet, and note the NRND status for any long-lifetime product plans.
Recomendado
Motor Control Subsystems
For DC and small BLDC motor control in consumer and light-industrial equipment, the MC9S08GB32ACFUE's 40 MHz S08 bus provides the timing resolution needed for PWM generation and commutation scheduling, while abundant I/O supports gate drive, current-sense conditioning inputs and fault interlocks. The industrial temperature grade covers equipment enclosures that heat during operation, and 32KB flash holds sensorless start-up algorithms and protection state machines. Designers should confirm the ADC channel count and timer capabilities in the datasheet. Because the device is NRND, new motor-control designs should target an active S08 or 16-bit NXP part instead.
Recomendado
Building Automation Nodes
Distributed building automation nodes - damper actuators, zone controllers and sensor aggregators - use the MC9S08GB32ACFUE's 56 I/O and 40 MHz core to handle local control loops while reserving serial interfaces for network uplinks. The 32KB in-system programmable flash allows field firmware updates across an installed base, reducing service cost, and the 4KB RAM buffers network messages and trend logs. The 2.08V to 3.6V supply suits 3.3V bus-powered nodes, and the gull-wing 64-LQFP survives standard industrial reflow. For new node designs, select an active S08-family part given the NRND classification of the GB32.
Recomendado
Legacy Product Sustainment
The primary current use case for the MC9S08GB32ACFUE is sustaining products already designed around it, since NXP lists the part as NRND. Manufacturers should inventory remaining authorized stock via DigiKey, Mouser, Arrow and broker channels such as Rochester Electronics, lock the current firmware baseline in the 32KB flash, and qualify a pin-compatible successor such as MC9S08GB60CFUE in the same 64-LQFP footprint before authorized stock depletes. Using the single-wire BDM interface, existing test fixtures and programming stations can be retained, keeping the transition cost focused on component qualification rather than tooling changes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08GB32ACFUE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08GB60CFUE | MC9S08AW60CPUE | MC9S08DZ32AMLH | MC908GZ32VFUE | MC9S08GT32ACBE |
|---|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-QFP - same family footprint | 64-QFP - same family footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Architecture | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | HC08 8-bit CISC | S08 8-bit CISC |
| Flash Memory | 32KB | 60KB | 60KB | 32KB | 32KB | 32KB |
Principais diferenciais
- Double the bus speed of typical 8-bit rivals (vs ATmega328P)
- More I/O in the same footprint class (vs MC9S08AW60CPUE)
- Same-family upgrade without PCB change (vs MC9S08GB60CFUE)
Notas de projeto
Treat the NRND status as a design constraint: NXP's product page marks MC9S08GB32ACFUE as Not Recommended for New Designs, which means authorized stock will eventually disappear and unit prices on broker channels will rise. For any existing design, build a lifetime buy quantity analysis from your annual usage and qualify MC9S08GB60CFUE (same GB family, 60KB flash, same 64-LQFP footprint) as a migration target before the last-time-buy window closes.
The 2.08V to 3.6V supply range means the device runs from 2.5V or 3.3V rails, but it is NOT 5V tolerant in that configuration - level-shift any 5V logic signals and never feed 5V into the ADC or I/O pins. Decouple every VDD pin with 0.1uF ceramics placed within a few millimeters of the pin, plus one bulk 4.7uF to 10uF capacitor near the supply entry, per standard S08 power practice in the manufacturer datasheet.
The 64-LQFP 10x10 mm gull-wing package has 0.5 mm pin pitch; use a land pattern matching the LQFP-64 footprint in the NXP datasheet with solder-mask-defined or non-solder-mask-defined pads verified against your assembly house capability. Leave the single-wire background debug (BDM) header routed to a 4-pin test point cluster on every production board - in-circuit flash programming and debug depend on this access and retrofitting it later is costly.
Estimated: at a typical 40 MHz S08 core draw in the tens-of-mA class on a 3.3V rail, power dissipation remains on the order of 100 mW or less, far below the LQFP-64 package capability; no heatsink or copper-pour thermal management is required. Confirm exact run and wait currents from the current-consumption tables in the NXP datasheet when designing battery-powered systems, and account for stop-mode current in battery-life calculations.
Informações de conformidade
The 'UE' package suffix in NXP part numbering convention typically denotes lead-free/RoHS-compliant packaging, but explicit compliance statements were not present in the verified web data; confirm on the NXP product page Environmental Quality section.