MC9S12D64CPVE - 16-Bit HCS12 MCU, 64KB Flash, 25MHz, 112-LQFP | NXP
Référence : MC9S12D64CPVE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1 495,00 |
| 500 | $13.2 | $6 600,00 |
| 1 000 | $11.5 | $11 500,00 |
MC9S12D64CPVE Présentation
A microcontroller (MCU) is a single-chip computer that combines a CPU core, program memory, data memory, and peripherals such as timers, ADCs, and communication interfaces. The HCS12 is a 16-bit CISC architecture that targets automotive body controllers, instrument clusters, and industrial control where deterministic interrupt response and rich on-chip peripherals matter more than raw MHz. Within the broader taxonomy, the MC9S12D64 sits in the family HCS12 -> 16-bit MCU -> microcontroller -> embedded processor -> semiconductor.
Key features of the MC9S12D64CPVE include 91 general-purpose I/O lines, two asynchronous serial communication interfaces (SCI), one SPI, one I2C, and a CANbus controller for in-vehicle networking. The peripheral set also contains two 8-channel 10-bit analog-to-digital converters (ATD), an 8-channel enhanced capture timer (ECT) with input-capture/output-compare capability, an 8-channel pulse-width modulator (PWM), and a watchdog timer (WDT). On-chip oscillator, PLL, and reset/clock-generation logic simplify board-level design by removing many external components.
Typical applications include automotive body controllers, HVAC control modules, instrument clusters, lighting controllers, seat-control modules, and CAN node endpoints in vehicle networks. The 5 V-tolerant I/O and integrated CAN transceiver-friendly timing make this part well-suited to 12 V/24 V vehicle electrical systems where robust communication and EMI tolerance are required.
When designing with this device, use the Freescale/NXP CodeWarrior or Cosmic/SofTec toolchains and the standard HCS12 background-debug-mode (BDM) interface for flash programming and debug. Confirm the NRND lifecycle status with your NXP representative before committing to new production, and qualify a recommended replacement such as the S12Z or S12G family for new programs. This page consolidates distributor stock, lifecycle status, and drop-in alternatives that are not present in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC9S12D64CPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12D64CPVE (même facteur de forme et même empreinte) — différant par ADC, Operating Temperature, Supply Voltage, Debug Interface, EEPROM Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12E64CPVE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12DG128CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DT256MPVE
✅ Remplacement direct✓ En stock
$14.36 / unité
Voir la fiche technique →MC9S12DJ64MFUE
✅ Remplacement direct✓ En stock
$8.2 / unité
Voir la fiche technique →MC9S12A128CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12D64CPV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12D64CPVE Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| Architecture | CISC |
| Maximum CPU Frequency | 25 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| EEPROM Size | 1 KB (1K x 8) |
| Number of I/O | 91 |
| Tension d'alimentation | 2.5 V / 5 V |
| Connectivity | CANbus, I2C, SCI, SPI |
| Peripherals | PWM, WDT, ECT, ATD |
| ADC | 8-channel, 10-bit (x2 ATD modules) |
| PWM Channels | 8 |
| Boîtier | 112-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (industrial) |
| AEC-Q100 | Qualified (automotive) |
| Lead-Free / RoHS | Compliant per NXP product page |
Configuration des broches de MC9S12D64CPVE
| Broche 1 | BKGD — Background Debug Mode |
| Broche 2 | VDDR — Voltage regulator supply |
| Broche 3 | VSS — Ground |
| Broche 4 | XTAL — Crystal oscillator input |
| Broche 5 | EXTAL — External clock / crystal output |
| Broche 6 | RESET — Reset input (active low) |
| Broche 7 | TEST — Test mode (must be tied VSS for normal operation) |
| Broche 8 | PAD0 — Port AD bit 0 / AN0 |
| Broche 9 | PAD1 — Port AD bit 1 / AN1 |
| Broche 10 | PAD2 — Port AD bit 2 / AN2 |
| Broche 11 | PAD3 — Port AD bit 3 / AN3 |
| Broche 12 | PAD4 — Port AD bit 4 / AN4 |
| Broche 13 | PAD5 — Port AD bit 5 / AN5 |
| Broche 14 | PAD6 — Port AD bit 6 / AN6 |
| Broche 15 | PAD7 — Port AD bit 7 / AN7 |
| Broche 16 | VDDX — Digital I/O supply |
| Broche 17 | VSSX — Digital I/O ground |
| Broche 18 | PA0 — Port A bit 0 |
| Broche 19 | PA1 — Port A bit 1 |
| Broche 20 | PA2 — Port A bit 2 |
| Broche 21 | PA3 — Port A bit 3 |
| Broche 22 | PA4 — Port A bit 4 |
| Broche 23 | PA5 — Port A bit 5 |
| Broche 24 | PA6 — Port A bit 6 |
| Broche 25 | PA7 — Port A bit 7 |
| Broche 26 | PB0 — Port B bit 0 |
| Broche 27 | PB1 — Port B bit 1 |
| Broche 28 | PB2 — Port B bit 2 |
| Broche 29 | PB3 — Port B bit 3 |
| Broche 30 | PB4 — Port B bit 4 |
| Broche 31 | PB5 — Port B bit 5 |
| Broche 32 | PB6 — Port B bit 6 |
| Broche 33 | PB7 — Port B bit 7 |
| Broche 34 | PE0 — Port E bit 0 / IRQ |
| Broche 35 | PE1 — Port E bit 1 / XIRQ |
| Broche 36 | PE2 — Port E bit 2 |
| Broche 37 | PE3 — Port E bit 3 |
| Broche 38 | PE4 — Port E bit 4 |
| Broche 39 | PE5 — Port E bit 5 |
| Broche 40 | PE6 — Port E bit 6 |
| Broche 41 | PE7 — Port E bit 7 |
| Broche 42 | PH0 — Port H bit 0 / PWM0 |
| Broche 43 | PH1 — Port H bit 1 / PWM1 |
| Broche 44 | PH2 — Port H bit 2 / PWM2 |
| Broche 45 | PH3 — Port H bit 3 / PWM3 |
| Broche 46 | PH4 — Port H bit 4 / PWM4 |
| Broche 47 | PH5 — Port H bit 5 / PWM5 |
| Broche 48 | PH6 — Port H bit 6 / PWM6 |
| Broche 49 | PH7 — Port H bit 7 / PWM7 |
| Broche 50 | PJ0 — Port J bit 0 |
| Broche 51 | PJ1 — Port J bit 1 |
| Broche 52 | PJ2 — Port J bit 2 |
| Broche 53 | PJ3 — Port J bit 3 |
| Broche 54 | PJ4 — Port J bit 4 |
| Broche 55 | PJ5 — Port J bit 5 |
| Broche 56 | PJ6 — Port J bit 6 |
| Broche 57 | PJ7 — Port J bit 7 |
| Broche 58 | PK0 — Port K bit 0 |
| Broche 59 | PK1 — Port K bit 1 |
| Broche 60 | PK2 — Port K bit 2 |
| Broche 61 | PK3 — Port K bit 3 |
| Broche 62 | PK4 — Port K bit 4 |
| Broche 63 | PK5 — Port K bit 5 |
| Broche 64 | PK6 — Port K bit 6 |
| Broche 65 | PK7 — Port K bit 7 |
| Broche 66 | PM0 — Port M bit 0 |
| Broche 67 | PM1 — Port M bit 1 |
| Broche 68 | PM2 — Port M bit 2 |
| Broche 69 | PM3 — Port M bit 3 |
| Broche 70 | PM4 — Port M bit 4 |
| Broche 71 | PM5 — Port M bit 5 |
| Broche 72 | PM6 — Port M bit 6 |
| Broche 73 | PM7 — Port M bit 7 |
| Broche 74 | PP0 — Port P bit 0 / PWM / IOC |
| Broche 75 | PP1 — Port P bit 1 / PWM / IOC |
| Broche 76 | PP2 — Port P bit 2 / PWM / IOC |
| Broche 77 | PP3 — Port P bit 3 / PWM / IOC |
| Broche 78 | PP4 — Port P bit 4 / PWM / IOC |
| Broche 79 | PP5 — Port P bit 5 / PWM / IOC |
| Broche 80 | PP6 — Port P bit 6 / PWM / IOC |
| Broche 81 | PP7 — Port P bit 7 / PWM / IOC |
| Broche 82 | PS0 — Port S bit 0 / SCI0 |
| Broche 83 | PS1 — Port S bit 1 / SCI0 |
| Broche 84 | PS2 — Port S bit 2 / SPI0 |
| Broche 85 | PS3 — Port S bit 3 / SPI0 |
| Broche 86 | PS4 — Port S bit 4 / SCI1 |
| Broche 87 | PS5 — Port S bit 5 / SCI1 |
| Broche 88 | PS6 — Port S bit 6 / I2C |
| Broche 89 | PS7 — Port S bit 7 / I2C |
| Broche 90 | PT0 — Port T bit 0 / IOC0 / ECT |
| Broche 91 | PT1 — Port T bit 1 / IOC1 / ECT |
| Broche 92 | PT2 — Port T bit 2 / IOC2 / ECT |
| Broche 93 | PT3 — Port T bit 3 / IOC3 / ECT |
| Broche 94 | PT4 — Port T bit 4 / IOC4 / ECT |
| Broche 95 | PT5 — Port T bit 5 / IOC5 / ECT |
| Broche 96 | PT6 — Port T bit 6 / IOC6 / ECT |
| Broche 97 | PT7 — Port T bit 7 / IOC7 / ECT |
| Broche 98 | CANRX — CAN receive pin (MSCAN) |
| Broche 99 | CANTX — CAN transmit pin (MSCAN) |
| Broche 100 | VDDPLL — PLL supply |
| Broche 101 | VSSPLL — PLL ground |
| Broche 102 | XFC — PLL loop filter capacitor |
| Broche 103 | VDDA — ADC supply |
| Broche 104 | VSSA — ADC ground |
| Broche 105 | VRL — ADC reference low |
| Broche 106 | VRH — ADC reference high |
| Broche 107 | AN0 — ADC channel 0 (alternate mapping) |
| Broche 108 | AN1 — ADC channel 1 (alternate mapping) |
| Broche 109 | AN2 — ADC channel 2 (alternate mapping) |
| Broche 110 | AN3 — ADC channel 3 (alternate mapping) |
| Broche 111 | TCLK — ECT external clock input |
| Broche 112 | MODC — Mode select for BDM/normal |
Applications typiques
MC9S12D64CPVE convient pour 6 applications: Automotive Body Control Module, HVAC Control Module, Instrument Cluster, CAN Node Endpoint / Sensor Interface, Industrial Control / 5 V Automation, Seat and Mirror Control Module.
Automotive Body Control Module
The MC9S12D64CPVE fits automotive body-control modules because it integrates one CANbus controller, two SCI (UART), SPI, I2C, 91 GPIO, 8-channel PWM, and two 8-channel 10-bit ADCs in a single 112-LQFP. The on-chip CAN peripheral handles OBD-II/body-CAN traffic without an external transceiver controller, and the 64 KB Flash easily stores typical BCM firmware plus bootloader. AEC-Q100 qualification and 5 V-tolerant I/O align with 12 V vehicle electrical rails. Compared with newer S12G parts, the D64CPVE remains a low-risk choice for cost-sensitive platforms already on HCS12 toolchains.
Recommandé
HVAC Control Module
The 8-channel PWM of the MC9S12D64CPVE drives blower motors and mode doors directly, while its two 10-bit ADC banks read temperature sensors, potentiometers, and pressure transducers with adequate resolution for climate-loop control. CANbus connectivity talks to the vehicle body network, and the 64 KB Flash holds HVAC application code plus calibration tables. Industrial temperature grade (-40C to +85C) covers cabin and engine-bay environments, and AEC-Q100 qualification is required by most OEMs. The 112-LQFP provides sufficient GPIO for blend-door actuators and backlight drivers in a single chip.
Recommandé
Instrument Cluster
An instrument cluster benefits from the MC9S12D64CPVE's 91 GPIO lines to drive stepper motors, indicator LEDs, and LCD segment drivers while the HCS12 core runs the gauge-sweep, warning-logic, and CAN-message-decode tasks. The 25 MHz HCS12 provides deterministic interrupt response needed for cluster refresh rates, and 64 KB Flash holds the full cluster firmware including telltale logic. The two SCI channels enable LIN or K-line diagnostics, and the 8-channel PWM can drive backlight brightness. AEC-Q100 qualification and -40C to +85C operation cover cabin thermal requirements.
Recommandé
CAN Node Endpoint / Sensor Interface
As a CAN node endpoint, the MC9S12D64CPVE's on-chip MSCAN controller implements CAN 2.0A/B at up to 1 Mbps, while its ADC banks digitize sensor outputs and its PWM channels drive actuator loads. The 4 KB RAM buffers incoming CAN frames, and 64 KB Flash holds the CANopen, J1939, or OEM-proprietary stack. Industrial temperature range and AEC-Q100 grade suit both industrial CANopen masters and automotive J1939 nodes. The 5 V I/O tolerance simplifies interfacing with 5 V sensors still common in industrial CAN nodes.
Recommandé
Industrial Control / 5 V Automation
Legacy 5 V industrial automation uses the MC9S12D64CPVE's 2.5 V/5 V supply tolerance to drop into existing 5 V backplanes without level shifters. The HCS12 core's CISC instruction set eases porting from older HC11/HCS12 designs, and the SCI/SPI/I2C channels talk to industrial sensors and motor drivers. The 91 GPIO and 8-channel PWM support multi-axis stepper or brushed-DC control, while the watchdog timer and reset-generation harden the design against field faults. AEC-Q100 over-qualifies for non-automotive use but signals high reliability.
Recommandé
Seat and Mirror Control Module
Seat and mirror modules need multiple PWM channels, abundant GPIO, and a CAN interface - all delivered by the MC9S12D64CPVE. The 8-channel PWM drives seat motors, mirror position, and heater pads while the two ADCs read position-feedback potentiometers. CANbus links the module to the body controller for memory-set recall and diagnostics, and 64 KB Flash holds the position-memory, anti-pinch, and calibration routines. AEC-Q100 grade and the 112-LQFP's compact 20x20 mm footprint fit inside seat-mounted enclosures with high vibration profiles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12D64CPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12E64CPVE | MC9S12DG128CPVE | MC9S12DT256MPVE | MC9S12DJ64MFUE | MC9S12A128CPVE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Core | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz |
| Flash Memory | 64 KB | 64 KB | 128 KB | 256 KB | 64 KB | 128 KB |
| RAM | 4 KB | 4 KB | 8 KB | 12 KB | 4 KB | 8 KB |
| EEPROM | 1 KB | Expanded | 2 KB | 4 KB | 1 KB | 2 KB |
| CAN Controllers | 1 (MSCAN) | 1 | 2 | 2 | 2 | 1 |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | Active | Active | Active | Active | Active |
Principaux différenciateurs
- AEC-Q100 automotive qualification with 5 V I/O tolerance (vs MC9S12E64CPVE)
- Same-footprint upgrade path to higher Flash densities (vs MC9S12DT256MPVE)
- HCS12 CISC toolchain compatibility (vs STM32F1 (Cortex-M3))
Notes de conception
Decouple the MC9S12D64CPVE with 100 nF ceramic capacitors on every VDDX pin and a bulk 4.7 uF to 10 uF tantalum or ceramic on the main supply. Place the PLL loop-filter capacitor on XFC as specified in the NXP datasheet to maintain oscillator stability. Route VDDR through a ferrite bead from VDDX to keep regulator noise out of the digital supply. The internal voltage regulator requires adequate copper area under the die for heat spreading.
Use a 4-layer PCB with a dedicated ground plane under the 112-LQFP footprint. Keep the BKGD and RESET traces short and away from PWM switching traces to avoid spurious debug-mode entry. Route the CANRX/CANTX differential pair with 120 ohm characteristic impedance and place a common-mode choke near the transceiver connector for automotive EMI robustness. The crystal/EXTAL traces must be short and guarded by ground.
Do not leave the TEST pin floating; tie it to VSS through a 10 kohm pull-down so the device enters normal mode instead of factory test mode. Confirm the BDM pod compatibility (P&E Multilink or USB-ML-12) before bringing up firmware. Verify the ordering-code breakdown because CPVE, CPV, MPVE suffixes denote different temperature and quality grades per NXP ordering codes. Always check the device errata sheet before releasing firmware.
Informations de conformité
AEC-Q100 qualified per NXP product page. RoHS and REACH compliant per NXP product page. Lifecycle status NRND - new designs should migrate to S12G/S12Z family.
