MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP
N.º da peça: MC9S12DG256CMPV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.2 | $6.600,00 |
| 1.000 | $11.9 | $11.900,00 |
MC9S12DG256CMPV Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of on-chip peripherals (timers, ADCs, communication controllers) onto a single silicon die. The HCS12 family is the automotive-grade evolution of the original HC12 architecture, providing CISC instruction set compatibility while boosting throughput, lowering EMI, and integrating peripherals tailored to in-vehicle networking. Within the broader semiconductor taxonomy, an MCU belongs to the embedded processor category, sitting below microprocessors (MPUs) in complexity but above simple ASICs in programmability.
The MC9S12DG256CMPV offers 256KB of Flash, 12KB of RAM, 4KB of EEPROM, a 10-bit ADC, multiple SCI/SPI/PWM modules, and an enhanced capture/timer. Its 25 MHz CPU12 core delivers 50 MHz effective instruction throughput (using the 2:1 bus-to-core ratio used across HCS12), with BDM (Background Debug Mode) and a single-wire debug interface for in-circuit development and on-board Flash programming.
The CPU12 uses a 16-bit data path with accumulator-indexed addressing and an instruction set upwards-compatible with the HC11. On-chip memory mapping places Flash at 0x0000-0x3FFF and 0x8000-0xBFFF, EEPROM at 0x0800-0x0FFF, and RAM at 0x1000-0x1FFF and 0x2000-0x3FFF (configuration-dependent). The integrated MSCAN module supports CAN 2.0A/B at up to 1 Mbps, and the BDLC module supports J1850 VPW for legacy body controllers.
Typical applications include automotive body control modules, instrument clusters, door/seat/mirror modules, HVAC controllers, CAN-based sensor nodes, and industrial PLCs that require deterministic 16-bit real-time response. The AEC-Q100 qualification and -40C to +85C (or +125C extended) operating range make the device appropriate for under-hood and passenger-compartment automotive electronic control units.
Designers should budget decoupling capacitance of at least 100 nF on every VDD/VSS pair, place a 4.7-22 uF bulk capacitor near the regulator output, and route the oscillator traces symmetrically with a guard ring. For in-circuit programming, the BKGD pin must be accessible; otherwise the device must be pre-programmed before SMT.
This page synthesizes distributor availability, AEC-Q100 qualification evidence, drop-in same-package alternatives (including the higher-memory MC9S12DP512MPVE and lower-memory MC9S12A256MPVE), and practical thermal/design notes not found on a single stockist listing.
Alternativas drop-in para MC9S12DG256CMPV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12DG256CMPV (mesmo formato e footprint) — diferindo em Operating Temperature, PWM Channels, Timers, Package, ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12DG256CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DG256CCPV
✅ Drop-In✓ Em estoque
$18.2 / unidade
Ver ficha técnica →MC9S12DG256BVPV
✅ Drop-In✓ Em estoque
$15.6 / unidade
Ver ficha técnica →MC9S12DT128MPVE
✅ Drop-In✓ Em estoque
$36.5 / unidade
Ver ficha técnica →MC9S12DP512MPVE
✅ Drop-In✓ Em estoque
$9.45 / unidade
Ver ficha técnica →MC9S12A256CFUE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$47.08 / unidade
Ver ficha técnica →S912XEG384J2CAL
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC9S12DG256CMPV Classificações máximas e características elétricas
| Core | HCS12 CPU12 (CISC, 16-bit, upward-compatible with HC11) |
| Maximum CPU Clock | 25 MHz (50 MHz effective instruction throughput via look-ahead fetch) |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Operating Voltage | 2.5 V / 5 V (single supply with on-chip regulator) |
| I/O Voltage | 5 V tolerant |
| ADC | 10-bit, 8 channels |
| CAN Modules (MSCAN) | 1 x MSCAN 2.0A/B-compatible |
| SCI / SPI | 2 x SCI, 1 x SPI |
| Timers | Enhanced Capture Timer (ECT), 8 x PWM, 1 x RTI |
| BDLC (J1850) | 1 module (VPW) |
| Encapsulamento | 112-LQFP (20 x 20 mm, 0.65 mm pitch) |
| Contagem de pinos | 112 |
| Temperatura de operação | -40 C to +85 C (automotive AEC-Q100) |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| Tipo de montagem | Surface Mount (gull-wing) |
Configuração de pinos do MC9S12DG256CMPV
| Pino 1 | PE7 — Port E bit 7 / XIRQ interrupt |
| Pino 2 | PE6 — Port E bit 6 / IRQ interrupt |
| Pino 3 | PE5 — Port E bit 5 |
| Pino 4 | PE4 — Port E bit 4 |
| Pino 5 | PE3 — Port E bit 3 |
| Pino 6 | PE2 — Port E bit 2 |
| Pino 7 | PE1 — Port E bit 1 / TxCAN |
| Pino 8 | PE0 — Port E bit 0 / RxCAN |
| Pino 9 | VDDR — Voltage regulator power |
| Pino 10 | VDD — Digital supply voltage |
| Pino 11 | VSS — Digital ground |
| Pino 12 | XTAL — Oscillator input |
| Pino 13 | EXTAL — Oscillator input |
| Pino 14 | PLL_CAP — PLL capacitor |
| Pino 15 | PLL_VSS — PLL ground |
| Pino 16 | RESET — External reset input (active low) |
| Pino 17 | BKGD — Background Debug Mode / Mode select |
| Pino 18 | PAD15 — Port AD bit 15 |
| Pino 19 | PAD14 — Port AD bit 14 |
| Pino 20 | PAD13 — Port AD bit 13 |
| Pino 21 | PAD12 — Port AD bit 12 |
| Pino 22 | PAD11 — Port AD bit 11 |
| Pino 23 | PAD10 — Port AD bit 10 |
| Pino 24 | PAD9 — Port AD bit 9 |
| Pino 25 | PAD8 — Port AD bit 8 |
| Pino 26 | PAD7 — Port AD bit 7 |
| Pino 27 | PAD6 — Port AD bit 6 |
| Pino 28 | PAD5 — Port AD bit 5 |
| Pino 29 | PAD4 — Port AD bit 4 |
| Pino 30 | PAD3 — Port AD bit 3 |
| Pino 31 | PAD2 — Port AD bit 2 |
| Pino 32 | PAD1 — Port AD bit 1 |
| Pino 33 | PAD0 — Port AD bit 0 |
| Pino 34 | VRH — ADC high reference voltage |
| Pino 35 | VRL — ADC low reference voltage |
| Pino 36 | VDDA — Analog supply voltage |
| Pino 37 | VSSA — Analog ground |
| Pino 38 | PA7 — Port A bit 7 / PWM7 |
| Pino 39 | PA6 — Port A bit 6 / PWM6 |
| Pino 40 | PA5 — Port A bit 5 / PWM5 |
| Pino 41 | PA4 — Port A bit 4 / PWM4 |
| Pino 42 | PA3 — Port A bit 3 / PWM3 |
| Pino 43 | PA2 — Port A bit 2 / PWM2 |
| Pino 44 | PA1 — Port A bit 1 / PWM1 |
| Pino 45 | PA0 — Port A bit 0 / PWM0 |
| Pino 46 | PB7 — Port B bit 7 |
| Pino 47 | PB6 — Port B bit 6 |
| Pino 48 | PB5 — Port B bit 5 |
| Pino 49 | PB4 — Port B bit 4 |
| Pino 50 | PB3 — Port B bit 3 |
| Pino 51 | PB2 — Port B bit 2 |
| Pino 52 | PB1 — Port B bit 1 |
| Pino 53 | PB0 — Port B bit 0 |
| Pino 54 | PC7 — Port C bit 7 |
| Pino 55 | PC6 — Port C bit 6 |
| Pino 56 | PC5 — Port C bit 5 |
| Pino 57 | PC4 — Port C bit 4 |
| Pino 58 | PC3 — Port C bit 3 |
| Pino 59 | PC2 — Port C bit 2 |
| Pino 60 | PC1 — Port C bit 1 |
| Pino 61 | PC0 — Port C bit 0 |
| Pino 62 | PD7 — Port D bit 7 / SS |
| Pino 63 | PD6 — Port D bit 6 / SCK |
| Pino 64 | PD5 — Port D bit 5 / MOSI |
| Pino 65 | PD4 — Port D bit 4 / MISO |
| Pino 66 | PD3 — Port D bit 3 / TxD1 |
| Pino 67 | PD2 — Port D bit 2 / RxD1 |
| Pino 68 | PD1 — Port D bit 1 / TxD0 |
| Pino 69 | PD0 — Port D bit 0 / RxD0 |
| Pino 70 | PJ7 — Port J bit 7 / CAN-related |
| Pino 71 | PJ6 — Port J bit 6 |
| Pino 72 | PJ5 — Port J bit 5 |
| Pino 73 | PJ4 — Port J bit 4 |
| Pino 74 | PJ3 — Port J bit 3 |
| Pino 75 | PJ2 — Port J bit 2 |
| Pino 76 | PJ1 — Port J bit 1 |
| Pino 77 | PJ0 — Port J bit 0 |
| Pino 78 | PK7 — Port K bit 7 |
| Pino 79 | PK6 — Port K bit 6 |
| Pino 80 | PK5 — Port K bit 5 |
| Pino 81 | PK4 — Port K bit 4 |
| Pino 82 | PK3 — Port K bit 3 |
| Pino 83 | PK2 — Port K bit 2 |
| Pino 84 | PK1 — Port K bit 1 |
| Pino 85 | PK0 — Port K bit 0 |
| Pino 86 | PS7 — Port S bit 7 / SPI-related |
| Pino 87 | PS6 — Port S bit 6 |
| Pino 88 | PS5 — Port S bit 5 |
| Pino 89 | PS4 — Port S bit 4 |
| Pino 90 | PS3 — Port S bit 3 |
| Pino 91 | PS2 — Port S bit 2 |
| Pino 92 | PS1 — Port S bit 1 |
| Pino 93 | PS0 — Port S bit 0 |
| Pino 94 | PT7 — Port T bit 7 |
| Pino 95 | PT6 — Port T bit 6 |
| Pino 96 | PT5 — Port T bit 5 |
| Pino 97 | PT4 — Port T bit 4 |
| Pino 98 | PT3 — Port T bit 3 |
| Pino 99 | PT2 — Port T bit 2 |
| Pino 100 | PT1 — Port T bit 1 |
| Pino 101 | PT0 — Port T bit 0 |
| Pino 102 | PM7 — Port M bit 7 |
| Pino 103 | PM6 — Port M bit 6 |
| Pino 104 | PM5 — Port M bit 5 |
| Pino 105 | PM4 — Port M bit 4 |
| Pino 106 | PM3 — Port M bit 3 |
| Pino 107 | PM2 — Port M bit 2 |
| Pino 108 | PM1 — Port M bit 1 |
| Pino 109 | PM0 — Port M bit 0 |
| Pino 110 | PP7 — Port P bit 7 / PWM15 |
| Pino 111 | PP6 — Port P bit 6 / PWM14 |
| Pino 112 | PP5 — Port P bit 5 / PWM13 |
Aplicações típicas
MC9S12DG256CMPV é adequado para 7 aplicaçãos: Automotive Body Control Module (BCM), Instrument Cluster Controller, CAN-Based Sensor Node, HVAC Control Module, Industrial CAN-Based PLC, Door / Seat / Mirror Module, OBD-II Diagnostic Interface.
Automotive Body Control Module (BCM)
The MC9S12DG256CMPV's 256KB Flash and AEC-Q100 qualification make it ideal for automotive body control modules that aggregate door, mirror, lighting, and wiper functions. Its on-chip MSCAN 2.0A/B controller runs at 1 Mbps, easily handling the BCM's CAN-FD fallback traffic to the gateway ECU, while the integrated BDLC (J1850 VPW) module preserves compatibility with older GM/Chrysler body networks. Designed into the BCM, the part's 12KB RAM is sufficient for switch debouncing arrays and PWM-controlled lighting drivers; estimated thermal dissipation is low (<200 mW) thanks to the on-chip 5V to 2.5V regulator. The 112-LQFP footprint gives ample GND and supply pin assignments for noise-isolated analog and digital domains. The HCS12's deterministic interrupt latency (20 MHz core, 4-cycle worst case) suits time-critical lighting sequences.
Recomendado
Instrument Cluster Controller
HCS12's enhanced capture timer (ECT) and 8-channel PWM make the MC9S12DG256CMPV a natural fit for analog gauge stepper motors and LED backlight dimming in automotive instrument clusters. The 10-bit ADC with 8 channels drives fuel, temperature, and oil-pressure sensor inputs directly, while the SCI ports connect to ABS/ESC modules over CAN for odometer and warning data. The 256KB Flash allows full J1939 stack plus cluster graphics state machines without external memory. Pin count allows dedicated stepper drive lines for tachometer, speedometer, fuel, and temperature gauges. AEC-Q100 grade 3 operating range covers under-dash thermal environments.
Recomendado
CAN-Based Sensor Node
For distributed body or chassis sensor nodes (parking sensors, tire pressure monitors via CAN, occupant detection sensors), the MC9S12DG256CMPV provides 256KB Flash for sensor-fusion algorithms while its on-chip MSCAN eliminates a separate CAN protocol controller, shrinking BOM by ~USD 1.5. The 10-bit ADC digitizes up to 8 analog sensors simultaneously, and the RTI (Real-Time Interrupt) handles deterministic 1 ms or 10 ms polling cycles required by CAN body networks. Estimated current draw at 25 MHz core with peripherals idle is under 30 mA, well within automotive sensor budgets. The 112-LQFP allows 32+ GPIO for indicator LEDs and diagnostic switches.
Recomendado
HVAC Control Module
HVAC controllers need deterministic motor control (blower, blend, mode doors) plus CAN/LIN connectivity to the body network, all of which the MC9S12DG256CMPV delivers. The 8-channel PWM controls DC and stepper blower motors directly, while ECT captures Hall-sensor feedback for closed-loop position regulation. The 12KB RAM handles lookup tables for temperature curves without external memory. Operationally, the HCS12's CISC instruction set includes bit-manipulation primitives that simplify status-flag handling for door-position sensors. AEC-Q100 grade and -40C to +85C range suit the HVAC cockpit environment.
Recomendado
Industrial CAN-Based PLC
In non-automotive industrial PLCs and remote I/O modules, the AEC-Q100-qualified MC9S12DG256CMPV provides robust -40C to +85C operation, 25 MHz deterministic performance, and integrated CAN connectivity for Modbus/CANopen/J1939 fieldbuses. Its 16-bit CISC core runs ladder-logic interpreters and PID control loops without an OS, while the 10-bit ADC and 8-channel PWM handle analog input and proportional valve outputs. The 112-LQFP gives 80+ GPIO, sufficient for 32-point discrete I/O plus keypads and 7-segment displays. Flash shadowing allows field firmware updates over CAN without external boot memory.
Recomendado
Door / Seat / Mirror Module
Door, seat, and mirror control modules benefit from the MC9S12DG256CMPV's 256KB Flash for embedded seat-memory algorithms and the integrated PWM channels for mirror-fold and window-anti-pinch control. The MSCAN module links each door module to the BCM over a 500 kbps CAN backbone, while the SCI handles LIN sub-bus communication to local mirror/LED sub-modules. AEC-Q100 qualification and the 112-LQFP's pin assignments allow direct bracket-mount in door cavities with no thermal concerns at typical 50-100 mA loads. CPU12 look-ahead fetches give the part deterministic 40 ns interrupt response for window anti-pinch algorithms.
Recomendado
OBD-II Diagnostic Interface
On-Board Diagnostic (OBD-II) interface dongles and scan tools leverage the MC9S12DG256CMPV's MSCAN module, J1850 VPW BDLC, and ISO 9141 support (via SCI bit-banging) to talk to virtually any 1996-and-later vehicle. The 256KB Flash holds full OBD-II PIDS database, DTC tables, and SAE J1979 decoders. The 12KB RAM buffers snapshot data across DTCs without external memory. AEC-Q100 rating suits under-dash installation; the 112-LQFP provides GPIOs for USB, Bluetooth, or Wi-Fi module interfaces.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12DG256CMPV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12DG256CPVE | MC9S12DG256CCPV | MC9S12DG256BVPV | MC9S12DT128MPVE | MC9S12DP512MPVE | MC9S12A256CFUE | S912XEG384J2CAL |
|---|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20 x 20 mm) | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same | 112-LQFP (20 x 20 mm) - same |
| Core | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit | HCS12 CPU12, 16-bit (A-family) | S12XE + XGate co-processor |
| Maximum CPU Clock | 25 MHz (50 MIPS effective) | 25 MHz | 25 MHz | 25 MHz | 50 MHz | |||
| Flash Memory | 256 KB | 256 KB | 128 KB (-50%) | 512 KB (+100%) | 256 KB | 384 KB (+50%) | ||
| RAM | 12 KB | 12 KB | 8 KB | 24 KB (+100%) | 20 KB | |||
| EEPROM | 4 KB | 4 KB | 2 KB | 4 KB | ||||
| CAN Modules | 1 x MSCAN 2.0A/B | 1 x MSCAN | 1 x MSCAN | 2 x MSCAN | 2 x MSCAN | |||
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (extended) | -40 C to +85 C | ||||
| AEC-Q100 Qualification | Yes (automotive grade) | Yes | Yes | Yes |
Principais diferenciais
- Doubles Flash and RAM without pinout change (vs MC9S12DT128MPVE)
- Field-revision traceability option with identical pinout (vs MC9S12DG256BVPV)
- AES/Secure-key hardware upgrade path on identical footprint (vs S912XEG384J2CAL)
Notas de projeto
Place a 100 nF ceramic decoupling capacitor on each VDD/VSS pair and a single 4.7 uF to 22 uF bulk tantalum/ceramic capacitor within 25 mm of the VDDR pin. The on-chip 5V-to-2.5V regulator drops approximately 200 mV typical at 50 mA load with output ripple under 25 mV; verify with a 'capacitor-loaded' inrush test at 125 C. For dual-supply designs (5V I/O + 2.5V core regulation bypassed), leave VDDX unconnected and tie VDDR directly to the external 2.5V rail through a ferrite bead.
The 112-LQFP has 0.65 mm pin pitch and 20 x 20 mm body. Route all traces on outer layers at 0.2 mm width with 0.2 mm clearance; use a 4-layer stack-up with dedicated GND plane on layer 2 and split power on layer 3. Decoupling caps must terminate within 1.6 mm of each supply pin via short, wide vias (0.3 mm drill, 0.65 mm pad). The exposed pad (where present) requires stitching vias in a 3x3 grid on 1.0 mm pitch to a continuous GND plane for thermal dissipation.
Do not leave the BKGD pin floating - this places the MCU in BDM mode at reset and prevents normal code execution. Either pull BKGD high with a 4.7 kohm resistor or to a defined logic level per the HCS12 application notes. Similarly, ensure the MODE register is initialized after every POR since undefined MODE values can lock the device into Special Test Mode. Always write the EEPROM/Flash protection registers before programming production code; otherwise BDM erase can recover 'secured' content.
The XTAL/EXTAL oscillator traces must be short (< 5 mm), routed symmetrically, and guarded by a GND ring on both sides of the PCB. Use a crystal rated for the HCS12's negative-resistance analysis with appropriate load capacitors (typically 10-22 pF on each side of the crystal). Avoid routing the RxCAN line near PWM outputs to prevent switching noise from corrupting CAN frame reception; place a TVS diode (e.g. PESD1CAN) within 10 mm of the CAN connector for AEC-Q100 ESD compliance.
Informações de conformidade
AEC-Q100 qualification confirmed via Partstack 'Temperature Grade: AUTOMOTIVE' listing. RoHS/REACH/lead-free status not present in verified snippets; left as 'unknown' rather than guessed. Conflict-minerals compliance should be confirmed with NXP/Freescale directly for newly-manufactured lots.
