MC9S12DG256BVPV - 16-bit 25MHz HCS12 MCU 256KB Flash | NXP
N.º da peça: MC9S12DG256BVPV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $22.45 | $22,45 |
| 10 | $20.18 | $201,80 |
| 100 | $17.92 | $1.792,00 |
| 250 | $16.75 | $4.187,50 |
| 500 | $15.6 | $7.800,00 |
MC9S12DG256BVPV Visão geral
An HCS12 microcontroller is a 16-bit CISC MCU family built around the CPU12 core, a successor to the HC11 with enhanced addressing, indexed operations, and a background debug mode (BDM) interface. The MC9S12D sub-family extends the architecture with modular memory and peripheral options so that designers can scale software across pin-compatible derivatives from 128 KB up to 512 KB Flash. This positioning places the HCS12 between 8-bit automotive MCUs (HC08) and 32-bit Power Architecture/ARM parts, offering CAN connectivity and rich analog in a low-cost, well-understood toolchain.
Key features include 256 KB Flash (organized as 256K x 8), 4 KB EEPROM, 12 KB RAM, two 10-bit ADC modules, an 8-channel enhanced capture timer, eight PWM channels, two SCI, one SPI, one I2C, one CAN 2.0 A/B controller, and a BDM debug port. The device operates from 5 V (with 2.5 V internal regulator) across the -40 C to +85 C industrial temperature range. Programmable interrupt controller and PLL clock generation support flexible system timing.
The architecture uses a 16-bit CPU12 core with a hardware multiply/divide accelerator and a unified memory map, enabling C-compiler-friendly code generation. The internal 2.5 V regulator powers the core while the I/O ring stays at 5 V for noise-tolerant automotive signaling. The CAN module is M_CAN compatible and supports both standard and extended identifiers, easing integration with automotive body and chassis networks.
Typical applications include automotive body controllers, instrument clusters, HVAC panels, seat and mirror modules, industrial CAN nodes, and any 16-bit embedded control design with CAN connectivity. The wide operating voltage and industrial temperature rating also suit building automation and heavy-equipment telematics. When migrating from an HC08 design, the HCS12 preserves peripheral and toolchain compatibility while adding more memory and CAN hardware.
Alternativas drop-in para MC9S12DG256BVPV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12DG256BVPV (mesmo formato e footprint) — diferindo em Package, ADC, Supply Voltage, Operating Temperature, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12DG256CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DG256BCPV
✅ Drop-In✓ Em estoque
$22.4 / unidade
Ver ficha técnica →MC9S12DT256BVPV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12A256CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DG256MPVE
✅ Drop-In✓ Em estoque
$75.08 / unidade
Ver ficha técnica →MC9S12DG256BVPV Classificações máximas e características elétricas
| Core Processor | HCS12 (CPU12) |
| Core Size | 16-bit |
| Maximum Clock Speed | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 12 KB |
| EEPROM Size | 4 KB |
| Encapsulamento | 112-LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| Tensão de alimentação de operação | 2.5 V core / 5 V I/O (single 5 V supply with internal regulator) |
| Temperatura de operação | -40 C to +85 C |
| Number of I/O | 91 |
| ADC | 2 x 8-channel 10-bit |
| PWM Channels | 8 |
| Communication Interfaces | CAN, I2C, SCI, SPI |
| Connectivity | CAN 2.0 A/B, I2C, SPI, 2x SCI |
| Peripherals | PWM, WDT, POR, LVD, BDM debug |
| Data Converters | A/D 16x10b |
| Oscillator Type | Internal PLL + external crystal |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Configuração de pinos do MC9S12DG256BVPV
| Pino 1 | PAD0 — Port AD input/output bit 0 |
| Pino 2 | PAD1 — Port AD input/output bit 1 |
| Pino 3 | PAD2 — Port AD input/output bit 2 |
| Pino 4 | PAD3 — Port AD input/output bit 3 |
| Pino 5 | PAD4 — Port AD input/output bit 4 |
| Pino 6 | PAD5 — Port AD input/output bit 5 |
| Pino 7 | PAD6 — Port AD input/output bit 6 |
| Pino 8 | PAD7 — Port AD input/output bit 7 |
| Pino 9 | VDDR — Voltage reference for Port AD |
| Pino 10 | VSS — Digital ground |
| Pino 11 | VDD — Digital 5 V supply |
| Pino 12 | PAD8 — Port AD input/output bit 8 |
| Pino 13 | PAD9 — Port AD input/output bit 9 |
| Pino 14 | PAD10 — Port AD input/output bit 10 |
| Pino 15 | PAD11 — Port AD input/output bit 11 |
| Pino 16 | PAD12 — Port AD input/output bit 12 |
| Pino 17 | PAD13 — Port AD input/output bit 13 |
| Pino 18 | PAD14 — Port AD input/output bit 14 |
| Pino 19 | PAD15 — Port AD input/output bit 15 |
| Pino 20 | BKGD — Background Debug Mode interface |
| Pino 21 | RESET — Active-low reset input |
| Pino 22 | VDDPLL — PLL supply voltage |
| Pino 23 | VSSPLL — PLL ground |
| Pino 24 | EXTAL — External clock/crystal input |
| Pino 25 | XTAL — Crystal output |
| Pino 26 | MODC — Mode select input |
| Pino 27 | PAD16 — Port AD input/output bit 16 / AN0 |
| Pino 28 | PAD17 — Port AD input/output bit 17 / AN1 |
| Pino 29 | PAD18 — Port AD input/output bit 18 / AN2 |
| Pino 30 | PAD19 — Port AD input/output bit 19 / AN3 |
| Pino 31 | PAD20 — Port AD input/output bit 20 / AN4 |
| Pino 32 | PAD21 — Port AD input/output bit 21 / AN5 |
| Pino 33 | PAD22 — Port AD input/output bit 22 / AN6 |
| Pino 34 | PAD23 — Port AD input/output bit 23 / AN7 |
| Pino 35 | VDDA — ADC supply voltage |
| Pino 36 | VSSA — ADC ground |
| Pino 37 | PWM0 — PWM channel 0 output |
| Pino 38 | PWM1 — PWM channel 1 output |
| Pino 39 | PWM2 — PWM channel 2 output |
| Pino 40 | PWM3 — PWM channel 3 output |
| Pino 41 | PWM4 — PWM channel 4 output |
| Pino 42 | PWM5 — PWM channel 5 output |
| Pino 43 | PWM6 — PWM channel 6 output |
| Pino 44 | PWM7 — PWM channel 7 output |
| Pino 45 | PP0 — Port P I/O bit 0 |
| Pino 46 | PP1 — Port P I/O bit 1 |
| Pino 47 | PP2 — Port P I/O bit 2 |
| Pino 48 | PP3 — Port P I/O bit 3 |
| Pino 49 | PP4 — Port P I/O bit 4 |
| Pino 50 | PP5 — Port P I/O bit 5 |
| Pino 51 | PP6 — Port P I/O bit 6 |
| Pino 52 | PP7 — Port P I/O bit 7 |
| Pino 53 | PT0 — Port T I/O bit 0 |
| Pino 54 | PT1 — Port T I/O bit 1 |
| Pino 55 | PT2 — Port T I/O bit 2 |
| Pino 56 | PT3 — Port T I/O bit 3 |
| Pino 57 | PT4 — Port T I/O bit 4 |
| Pino 58 | PT5 — Port T I/O bit 5 |
| Pino 59 | PT6 — Port T I/O bit 6 |
| Pino 60 | PT7 — Port T I/O bit 7 |
| Pino 61 | PS0 — Port S I/O bit 0 / RXD0 |
| Pino 62 | PS1 — Port S I/O bit 1 / TXD0 |
| Pino 63 | PS2 — Port S I/O bit 2 / RXD1 |
| Pino 64 | PS3 — Port S I/O bit 3 / TXD1 |
| Pino 65 | PS4 — Port S I/O bit 4 / MOSI |
| Pino 66 | PS5 — Port S I/O bit 5 / MISO |
| Pino 67 | PS6 — Port S I/O bit 6 / SPSCK |
| Pino 68 | PS7 — Port S I/O bit 7 / SS |
| Pino 69 | PJ0 — Port J I/O bit 0 / SDA |
| Pino 70 | PJ1 — Port J I/O bit 1 / SCL |
| Pino 71 | PJ2 — Port J I/O bit 2 |
| Pino 72 | PJ3 — Port J I/O bit 3 |
| Pino 73 | PJ4 — Port J I/O bit 4 |
| Pino 74 | PJ5 — Port J I/O bit 5 |
| Pino 75 | PJ6 — Port J I/O bit 6 |
| Pino 76 | PJ7 — Port J I/O bit 7 |
| Pino 77 | PM0 — Port M I/O bit 0 / CAN0TX |
| Pino 78 | PM1 — Port M I/O bit 1 / CAN0RX |
| Pino 79 | PM2 — Port M I/O bit 2 |
| Pino 80 | PM3 — Port M I/O bit 3 |
| Pino 81 | PM4 — Port M I/O bit 4 |
| Pino 82 | PM5 — Port M I/O bit 5 |
| Pino 83 | PM6 — Port M I/O bit 6 |
| Pino 84 | PM7 — Port M I/O bit 7 |
| Pino 85 | PE0 — Port E I/O bit 0 / IRQ |
| Pino 86 | PE1 — Port E I/O bit 1 / XIRQ |
| Pino 87 | PE2 — Port E I/O bit 2 |
| Pino 88 | PE3 — Port E I/O bit 3 |
| Pino 89 | PE4 — Port E I/O bit 4 |
| Pino 90 | PE5 — Port E I/O bit 5 |
| Pino 91 | PE6 — Port E I/O bit 6 |
| Pino 92 | PE7 — Port E I/O bit 7 |
| Pino 93 | VDDX — I/O supply voltage |
| Pino 94 | VSSX — I/O ground |
| Pino 95 | PK0 — Port K I/O bit 0 |
| Pino 96 | PK1 — Port K I/O bit 1 |
| Pino 97 | PK2 — Port K I/O bit 2 |
| Pino 98 | PK3 — Port K I/O bit 3 |
| Pino 99 | PK4 — Port K I/O bit 4 |
| Pino 100 | PK5 — Port K I/O bit 5 |
| Pino 101 | PK6 — Port K I/O bit 6 |
| Pino 102 | PK7 — Port K I/O bit 7 |
| Pino 103 | PH0 — Port H I/O bit 0 |
| Pino 104 | PH1 — Port H I/O bit 1 |
| Pino 105 | PH2 — Port H I/O bit 2 |
| Pino 106 | PH3 — Port H I/O bit 3 |
| Pino 107 | PH4 — Port H I/O bit 4 |
| Pino 108 | PH5 — Port H I/O bit 5 |
| Pino 109 | PH6 — Port H I/O bit 6 |
| Pino 110 | PH7 — Port H I/O bit 7 |
| Pino 111 | VDD — Digital 5 V supply |
| Pino 112 | VSS — Digital ground |
Aplicações típicas
MC9S12DG256BVPV é adequado para 6 aplicaçãos: Automotive Body Controller, Instrument Cluster, HVAC Control Module, Industrial CAN Node, Seat and Mirror Module, Building Automation Controller.
Automotive Body Controller
The MC9S12DG256BVPV is a strong fit for automotive body controllers because of its on-chip CAN 2.0 A/B controller (msCAN), 5 V I/O tolerance, and 91 general-purpose I/O lines that drive lamps, motors, and switches without external glue logic. The 256 KB Flash holds bootloader plus body-control firmware with margin for feature growth, while the 12 KB RAM comfortably accommodates CAN message buffers and task stacks. Designers typically place the part between a 12 V-to-5 V regulator and the load-driver stages, using the 8-channel PWM to modulate LED dimming and the 10-bit ADC to read battery voltage and thermistor inputs. Industrial-grade temperature rating (-40 C to +85 C) is sufficient for cabin modules.
Recomendado
Instrument Cluster
An automotive instrument cluster benefits from the MC9S12DG256BVPV's 8-channel PWM for gauge pointer control and its dual 10-bit ADC modules for fuel-level and temperature sensing. The 256 KB Flash supports a real-time operating system plus graphics libraries for segment or small dot-matrix LCDs, and the 5 V I/O ring interfaces directly to stepper-motor drivers and warning-LED arrays. The CPU12 core's efficient C-compiled code keeps pointer updates jitter-free at the 25 MHz bus rate, while the msCAN module receives vehicle-speed and engine-RPM data from the powertrain CAN bus.
Recomendado
HVAC Control Module
The MC9S12DG256BVPV suits HVAC control modules that demand multiple PWM outputs for blower-speed control and mode doors, plus ADC channels for cabin and ambient temperature. The on-chip SPI can drive a character-LCD or small TFT panel for the climate display, while the I2C bus talks to digital temperature sensors and EEPROM for trim storage. The internal 2.5 V regulator simplifies the power tree to a single 5 V rail, and the BDM interface speeds firmware calibration on the production line. Pin-compatible migration to 512 KB Flash derivatives is possible if HVAC software grows.
Recomendado
Industrial CAN Node
Industrial CAN nodes such as sensor aggregators and motor-control satellite modules can use the MC9S12DG256BVPV as a cost-effective 16-bit controller with hardware CAN. The 256 KB Flash accommodates a CANopen or DeviceNet stack alongside the application code, and the two SCI ports support RS-232/RS-485 service interfaces. The 10-bit ADC with 16 channels is enough for multi-sensor acquisition, and the 8-channel PWM can drive solenoids or LED indicators. The -40 C to +85 C range covers most factory-floor and outdoor enclosures.
Recomendado
Seat and Mirror Module
Seat and mirror modules need precise multi-channel PWM (for motor position) plus reliable CAN communication with the body controller, and the MC9S12DG256BVPV provides both. The 8-channel enhanced capture timer measures position feedback while the 8-channel PWM drives the drive motors in both directions through external H-bridges. The 256 KB Flash holds calibration tables for different vehicle variants, and the 12 KB RAM is ample for position tracking. BDM debug simplifies factory calibration, and the 5 V I/O ring eliminates level shifters to the motor-driver stages.
Recomendado
Building Automation Controller
Building-automation controllers (lighting panels, access-control readers, HVAC zoning) can leverage the MC9S12DG256BVPV's CAN or I2C backbone, 8-channel PWM for dimmer outputs, and 10-bit ADC for analog sensor inputs. The 256 KB Flash supports BACnet or Modbus stacks, and the 4 KB EEPROM stores configuration parameters across power cycles. The wide operating voltage and industrial temperature rating suit equipment rooms and rooftop installations. Pin compatibility with the broader HCS12 family enables designers to reuse firmware across multiple controller SKUs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12DG256BVPV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12DG256CPVE | MC9S12DG256BCPV | MC9S12DT256BVPV | MC9S12A256CPVE | MC9S12DG256MPVE |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) |
| Maximum Clock Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Size | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| RAM Size | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB |
| CAN Controllers | 1 x msCAN | 1 x msCAN | 1 x msCAN | 2 x msCAN | 1 x msCAN | 1 x msCAN |
| Temperature Grade | Industrial (-40C to +85C) | Extended automotive | Industrial | Industrial | Extended automotive | Industrial |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Industrial-grade temperature in the BVPV suffix variant (vs MC9S12DG256CPVE)
- Single msCAN + maximum pin compatibility (vs MC9S12DT256BVPV)
- 256 KB Flash without second CAN (vs MC9S12A256CPVE)
Notas de projeto
Decouple every VDD/VSS pair close to the IC with a 100 nF ceramic plus a bulk 4.7 uF tantalum or ceramic, and add a 1 uF + 10 nF pair on VDDA/VSSA to keep ADC noise low. Place the bulk capacitor within 25 mm of the supply pins and route a wide, low-impedance ground plane directly under the LQFP-112 footprint. The internal 2.5 V regulator still requires a stable 5 V input; add a Pi-filter (ferrite + cap) when sharing the 5 V rail with inductive loads.
Estimated: with a 4-layer PCB and the recommended footprint, theta_JA for the 112-LQFP-20 is approximately 45 C/W in still air. At 25 MHz with all peripherals active, power dissipation is roughly 250 mW, producing a self-heating rise of only 11 C above ambient - well within the 85 C ceiling. For sealed enclosures without airflow, derate the bus frequency or add a copper heat-spreader footprint under the exposed die paddle area.
Keep the BDM (BKGD) trace under 50 mm and protect it with a series 4.7 k resistor to avoid programming glitches. Place the EXTAL/XTAL crystal within 10 mm of the pins with a grounded guard ring to suppress crosstalk. The CAN bus traces should be a 120 ohm differential pair routed away from PWM edges to meet CAN 2.0 signal-integrity margins, and the analog inputs (AN0-AN7) should be guarded by a ground trace to reject switching noise.
Do not leave MODC floating - tie it to VDD or GND through a 10 k resistor to select the desired mode after reset. The MODC, BKGD, and RESET pins are critical for in-circuit programming and must be brought to test points if production-line firmware updates are planned. Verify the PLL filter components (R-C network on VDDPLL/VSSPLL) match the manufacturer reference design; incorrect values will prevent the bus from locking at 25 MHz.
Informações de conformidade
RoHS and REACH compliant per DigiKey product listing. The MC9S12DG256BVPV is the industrial-temperature grade; for AEC-Q100 automotive qualification choose the MC9S12DG256CPVE or equivalent Q-suffix variant. Halogen-free status not stated on the distributor page - verify with the manufacturer before halogen-sensitive designs.
