MC9S12H256VFVE - 16-Bit 256KB Flash HCS12 MCU | NXP | 144-LQFP (Tape & Reel)
N.º da peça: MC9S12H256VFVE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $10.95 | $10.950,00 |
MC9S12H256VFVE Visão geral
What is an HCS12 microcontroller? The HCS12 is NXP's (originally Motorola/Freescale) 16-bit CISC microcontroller family targeting automotive body, chassis and gateway applications. It belongs to the broader MCU hierarchy of microcontroller -> embedded MCU -> 16-bit MCU -> automotive-grade MCU -> semiconductor IC. The HCS12 architecture evolved from the HC11 and HC12 families and is widely second-sourced in automotive designs because of its mature toolchain and proven reliability.
Key features include 256KB of in-application programmable FLASH, 4KB EEPROM emulation, 12KB RAM, 99 digital I/O pins routed to the LQFP-144 footprint, and an integrated LCD driver capable of supporting segment displays. The dual-CAN interface enables gateway and body-control networks, while the on-chip LCD module reduces BOM in instrument-cluster designs.
Typical applications for this part include automotive instrument clusters, body controllers, HVAC panels, gateway modules, industrial CAN nodes, and LCD-based human-machine interfaces. The automotive AEC-Q100 qualification and 2.5V/5V dual-voltage I/O make it suitable for 12V automotive power systems.
When designing with the MC9S12H256VFVE, ensure the VREG is bypassed with a 100 nF + 4.7 uF combination as recommended in the Freescale/NXP device user guide, and that the PLL loop filter network follows the reference schematic to keep jitter within spec.
This page synthesizes verified distributor pricing, AEC-Q100-qualified alternatives, and PCB-layout notes not always present in the device user guide - giving procurement engineers and firmware developers a single source for evaluating this part against its HCS12 siblings.
Alternativas drop-in para MC9S12H256VFVE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12H256VFVE (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Core Processor, PWM Channels, RAM Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
S9S12H256J2VFVER
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12H256VPVE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$17.25 / unidade
Ver ficha técnica →MC9S12DT128MPVE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$36.5 / unidade
Ver ficha técnica →MC9S12DG128MPV
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12XDT256CAG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$17.4 / unidade
Ver ficha técnica →MC9S12XEQ384CAG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12H256VFVE Classificações máximas e características elétricas
| Core Processor | HCS12 CPU12 |
| Core Size | 16-Bit |
| Core Architecture | CISC |
| Frequência máxima de clock | 16 MHz |
| Program Memory Size | 256 KB (256K x 8) FLASH |
| Data RAM | 12 KB |
| EEPROM | 4 KB |
| Number of I/O Pins | 99 |
| Tensão de alimentação | 2.5 V core / 5 V I/O |
| Temperatura de operação | -40 C to +105 C (automotive) |
| Encapsulamento | 144-LQFP (20 x 20 mm) |
| Tipo de montagem | Surface Mount |
| Connectivity | CANbus (2x), I2C, SCI, SPI |
| Peripherals | LCD driver, POR, PWM, WDT |
| Automotive Qualification | AEC-Q100 |
| Nível MSL | 3 (168 hours) |
Guia de Configuração de Pinos do MC9S12H256VFVE 144-lqfp (20 x 20 mm)
Configuração de pinos para MC9S12H256VFVE (pacote 144-lqfp (20 x 20 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MC9S12H256VFVE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MC9S12H256VFVE é adequado para 6 aplicaçãos: Automotive Instrument Cluster, Automotive Body Controller Module (BCM), HVAC Control Module, CAN Gateway Module, Industrial CAN Node, LCD-Based Human-Machine Interface.
Automotive Instrument Cluster
The MC9S12H256VFVE is an excellent fit for analog/digital instrument-cluster mainboards thanks to its on-chip LCD segment driver, 256KB FLASH for full cluster graphics plus warning text, and dual MSCAN controllers for receiving vehicle-bus data from the body and chassis CAN networks. Its 99 GPIO allow direct drive of cluster telltale LEDs and stepper-motor gauge outputs without external expander ICs. The 16 MHz HCS12 CPU12 core executes typical cluster refresh loops at 50-100 Hz with comfortable margin, while the 12KB RAM supports trip-computer and odometer state without external memory. AEC-Q100 Grade 2 qualification and -40 C to +105 C operation satisfy dashboard thermal requirements.
Recomendado
Automotive Body Controller Module (BCM)
Body controllers require multiple LIN/CAN interfaces, abundant GPIO for lighting/door/window loads, and AEC-Q100 reliability - all met by the MC9S12H256VFVE's dual MSCAN, 99 I/O pins, and Grade 2 qualification. The 256KB FLASH accommodates BCM application code plus UDS/NM stacks, while 4KB EEPROM stores variant coding, immobilizer pairing and learned trim positions. The HCS12 core's deterministic interrupt latency ensures wiper, lighting and central-locking responses within 10 ms, critical for vehicle comfort features. Its 2.5V core / 5V I/O dual rail simplifies integration with 12V battery feeds through the on-chip voltage regulator.
Recomendado
HVAC Control Module
HVAC modules need PWM for blower motor control, ADC for cabin-temperature sensing, and CAN for climate-status broadcasting - all natively supported by the MC9S12H256VFVE. The 8-channel PWM module drives blower and mode-door actuators without external motor-driver ICs, while the 16-channel 10-bit ADC scans thermistors, potentiometers and humidity sensors. The 256KB FLASH holds full climate-control state machines plus diagnostic UDS services, and 4KB EEPROM retains last-user-setpoint through battery disconnect. AEC-Q100 Grade 2 thermal rating supports mounting behind the dash near heater ducts.
Recomendado
CAN Gateway Module
Automotive gateways bridge powertrain CAN (500 kbps), body CAN (125 kbps) and infotainment CAN-FD buses; the MC9S12H256VFVE's two MSCAN controllers and 256KB FLASH make it a low-cost gateway candidate for entry-level vehicles. The HCS12 CPU12 can route messages with sub-millisecond latency, and the 12KB RAM buffers bus traffic during diagnostic flash reprogramming. The on-chip LCD driver supports a small status display for gateway health. Production designs at higher message rates should migrate to S12Z or S32K1 families.
Recomendado
Industrial CAN Node
Outside automotive, the MC9S12H256VFVE serves rugged industrial CANopen and DeviceNet nodes such as PLC I/O slices, motor-control daughter boards and remote telemetry units. Its -40 C to +105 C rating and 5V I/O tolerance simplify integration with 24V industrial bus rails through external DC-DCs. The on-chip EEPROM stores node-ID and baud-rate configuration, and the BDM interface allows in-field firmware updates via standard Multilink programmers. Designers benefit from the mature HCS12 toolchain and abundant reference code for CANopen CiA 401 profiles.
Recomendado
LCD-Based Human-Machine Interface
White-goods appliances, industrial control panels and small medical displays use the MC9S12H256VFVE's integrated LCD segment driver to drive 4x40-character or 128-segment displays without external driver ICs. The 256KB FLASH accommodates full multilingual menu trees plus diagnostics, and 12KB RAM is sufficient for input debouncing and menu navigation stacks. The 99 GPIO allow direct drive of keypads, rotary encoders and status LEDs. AEC-Q100 qualification is overkill for white goods but harmless; industrial variants without AEC-Q100 are available on request from NXP sales.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12H256VFVE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S9S12H256J2VFVER | MC9S12H256VPVE | MC9S12DT128MPVE | MC9S12XDT256CAG | MC9S12XEQ384CAG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Core | HCS12 CPU12 16-bit | HCS12 CPU12 16-bit | HCS12 CPU12 16-bit | HCS12 CPU12 16-bit | HCS12X 16-bit (with XGATE) | HCS12X 16-bit (with XGATE) |
| Max Clock Frequency | 16 MHz | 16 MHz | 16 MHz | 25 MHz | 40 MHz | 50 MHz |
| FLASH Memory | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB | 384 KB |
| RAM | 12 KB | 12 KB | 12 KB | 8 KB | 12 KB | 20 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 2 KB | 4 KB | 4 KB |
| CAN Controllers | 2 (MSCAN) | 2 (MSCAN) | 2 (MSCAN) | 1 (MSCAN) | 3 (MSCAN) | 3 (MSCAN) |
| LCD Driver | Yes (on-chip) | Yes (on-chip) | Yes (on-chip) | No | No | No |
| AEC-Q100 | Yes (Grade 2) | Yes (Grade 2) | Yes (Grade 2) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) |
Principais diferenciais
- Integrated on-chip LCD segment driver (vs MC9S12DT128MPVE)
- Two MSCAN controllers vs one (vs MC9S12DT128MPVE)
- 256 KB FLASH at 16 MHz for cost-sensitive designs (vs MC9S12XDT256CAG)
- Active successor available in same package (vs S9S12H256J2VFVER)
Notas de projeto
The MC9S12H256VFVE's on-chip voltage regulator (VREG) generates the 2.5V core supply from the 5V VDDR rail. Per the device user guide, place a 100 nF ceramic decoupling cap on each VDD/VSS pair, plus a 4.7 uF bulk capacitor on VDDR. Power-on-reset (POR) behavior is valid only when VDDA and VDDX ramp together; design the 12V->5V LDO so that both rails track within 100 mV during cold-crank transients.
Route the EXTAL/XTAL traces as short, impedance-matched differential pairs (~10 mm maximum) with a continuous ground guard ring on both sides. Place the PLL loop filter (XFC pin) cap network within 5 mm of the IC, using a star-ground connection to the AGND pin. Avoid routing noisy CAN, PWM or backlight signals across the XFC island to minimize jitter. The 144-LQFP exposed pad (where present) should be soldered to a copper pour tied to digital ground for thermal spreading.
CAN bus edge rates of 1 Mbps require careful termination: use 120 ohm split termination with 10 nF caps to ground at each node, and ensure stub lengths stay under 1/10 of the bit-cell length (~30 mm at 1 Mbps). The MSCAN TX output has limited drive strength, so use a dedicated CAN transceiver (TJA1050, TJA1043) for off-board buses. For in-cabin CAN, add a common-mode choke to suppress ESD-radiated EMI.
Do not leave the BKGD pin floating during reset - it must be pulled up to VDDA through 4.7 kohm to ensure correct BDM mode entry. When erasing/reprogramming FLASH via BDM, the security bytes (FSEC) must be configured last to avoid accidentally locking the MCU. The PLL filter capacitor must be a low-leakage COG/NP0 ceramic, not X7R, to prevent frequency drift at high temperatures.
Informações de conformidade
AEC-Q100 Grade 2 qualified per NXP product certification. RoHS and REACH compliant. Lead-free and halogen-free per NXP material declarations.