MC9S12XDT256MAG - 16-bit HCS12X MCU 256KB Flash 144-LQFP | NXP
N.º da peça: MC9S12XDT256MAG ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $12.4 | $6.200,00 |
| 1.000 | $10.65 | $10.650,00 |
MC9S12XDT256MAG Visão geral
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and programmable I/O peripherals. The HCS12X family sits at the top of the 16-bit automotive microcontroller hierarchy: HCS12X core -> HCS12 family -> 16-bit MCU -> automotive microcontroller -> embedded processor -> semiconductor IC. Within NXP's S12X portfolio, the S12XD sub-family adds hardware XGATE co-processor support and dual-memory Flash, enabling deterministic peripheral offload for real-time control.
Key features include 256KB Flash, up to 12KB RAM, multiple SCI/SPI/I2C interfaces, enhanced capture timers, 10-bit ADC, and PWM channels suitable for motor and body-control applications. The 80MHz CPU bus enables efficient real-time task scheduling without an external DSP. The device integrates a CAN 2.0 module, supporting automotive network stacks.
Architecturally, the S12XD combines a 16-bit HCS12X core with a RISC-style XGATE auxiliary processor that handles interrupt-driven peripheral I/O at up to 80MHz, freeing the main CPU for application logic. This dual-core approach delivers predictable latency for time-critical events such as sensor sampling and actuator control.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, industrial PLCs, and CAN-node end equipment. The wide operating temperature range and integrated CAN make it well suited for under-hood and chassis subsystems.
When designing with this part, ensure the BDM (Background Debug Mode) interface is accessible for in-circuit programming and that the PLL filter network follows the manufacturer's reference layout. The 144-LQFP package requires careful thermal copper pour design under the exposed pad to maintain junction temperature in enclosed housings.
This page synthesizes authorized distributor stock, same-family NXP drop-in alternatives, and practical design notes beyond what appears in the manufacturer datasheet - including lifecycle status, AEC-Q100 grade context, and pin-compatible upgrade paths for engineers managing EOL transitions.
Alternativas drop-in para MC9S12XDT256MAG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12XDT256MAG (mesmo formato e footprint) — diferindo em Package, ADC, Supply Voltage, PWM Channels, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12XD256MAG
✅ Drop-In✓ Em estoque
$17.1 / unidade
Ver ficha técnica →MC9S12XDT256MAL
✅ Drop-In✓ Em estoque
$15.85 / unidade
Ver ficha técnica →MC9S12XDT256CAG
✅ Drop-In✓ Em estoque
$17.4 / unidade
Ver ficha técnica →MC9S12XET256MAG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XDP512MAG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12XDT256MAG Classificações máximas e características elétricas
| Core | HCS12X (S12XD family) |
| CPU Architecture | 16-bit |
| Maximum CPU Frequency | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM | 12 KB |
| Encapsulamento | 144-LQFP (20 x 20 mm) |
| Tipo de montagem | Surface Mount |
| Tensão de alimentação | 2.35 V to 2.75 V (digital core), 4.75 V to 5.25 V (I/O) |
| Faixa de temperatura de operação | -40 C to +125 C (automotive grade) |
| ADC | 10-bit, multiple channels |
| CAN Module | Yes (CAN 2.0) |
| SCI / SPI / I2C | Multiple channels |
| PWM Channels | Yes (enhanced capture / PWM timer) |
| Debug Interface | BDM (Background Debug Mode) |
| Status RoHS | Compliant |
| AEC-Q100 | Qualified (automotive grade) |
Configuração de pinos do MC9S12XDT256MAG
| Pino 1 | VDDR — Voltage regulator supply (2.5V internal) |
| Pino 2 | VDD1 — External power supply decoupling pin |
| Pino 3 | VDD2 — External power supply decoupling pin |
| Pino 4 | VSS1 — Ground pin |
| Pino 5 | VSS2 — Ground pin |
| Pino 6 | RESET — Active-low reset input |
| Pino 7 | XFC — PLL filter capacitor connection |
| Pino 8 | BKGD — Background Debug Mode (BDM) pin |
| Pino 9 | TXD0 — SCI0 transmit data output |
| Pino 10 | RXD0 — SCI0 receive data input |
| Pino 11 | PAD0 — General purpose I/O / timer channel |
| Pino 12 | PAD1 — General purpose I/O / timer channel |
| Pino 13 | PAD2 — General purpose I/O / timer channel |
| Pino 14 | PAD3 — General purpose I/O / timer channel |
| Pino 15 | PAD4 — General purpose I/O / timer channel |
| Pino 16 | PAD5 — General purpose I/O / timer channel |
| Pino 17 | PAD6 — General purpose I/O / timer channel |
| Pino 18 | PAD7 — General purpose I/O / timer channel |
| Pino 19 | PAD8 — General purpose I/O / timer channel |
| Pino 20 | PAD9 — General purpose I/O / timer channel |
| Pino 21 | PAD10 — General purpose I/O / timer channel |
| Pino 22 | PAD11 — General purpose I/O / timer channel |
| Pino 23 | PAD12 — General purpose I/O / timer channel |
| Pino 24 | PAD13 — General purpose I/O / timer channel |
| Pino 25 | PAD14 — General purpose I/O / timer channel |
| Pino 26 | PAD15 — General purpose I/O / timer channel |
| Pino 27 | PAD16 — General purpose I/O / timer channel |
| Pino 28 | PAD17 — General purpose I/O / timer channel |
| Pino 29 | PAD18 — General purpose I/O / timer channel |
| Pino 30 | PAD19 — General purpose I/O / timer channel |
| Pino 31 | PAD20 — General purpose I/O / timer channel |
| Pino 32 | PAD21 — General purpose I/O / timer channel |
| Pino 33 | PAD22 — General purpose I/O / timer channel |
| Pino 34 | PAD23 — General purpose I/O / timer channel |
| Pino 35 | PAD24 — General purpose I/O / timer channel |
| Pino 36 | PAD25 — General purpose I/O / timer channel |
| Pino 37 | PAD26 — General purpose I/O / timer channel |
| Pino 38 | PAD27 — General purpose I/O / timer channel |
| Pino 39 | PAD28 — General purpose I/O / timer channel |
| Pino 40 | PAD29 — General purpose I/O / timer channel |
| Pino 41 | PAD30 — General purpose I/O / timer channel |
| Pino 42 | PAD31 — General purpose I/O / timer channel |
| Pino 43 | AN0 — ADC analog input channel 0 |
| Pino 44 | AN1 — ADC analog input channel 1 |
| Pino 45 | AN2 — ADC analog input channel 2 |
| Pino 46 | AN3 — ADC analog input channel 3 |
| Pino 47 | AN4 — ADC analog input channel 4 |
| Pino 48 | AN5 — ADC analog input channel 5 |
| Pino 49 | AN6 — ADC analog input channel 6 |
| Pino 50 | AN7 — ADC analog input channel 7 |
| Pino 51 | AN8 — ADC analog input channel 8 |
| Pino 52 | AN9 — ADC analog input channel 9 |
| Pino 53 | AN10 — ADC analog input channel 10 |
| Pino 54 | AN11 — ADC analog input channel 11 |
| Pino 55 | AN12 — ADC analog input channel 12 |
| Pino 56 | AN13 — ADC analog input channel 13 |
| Pino 57 | AN14 — ADC analog input channel 14 |
| Pino 58 | AN15 — ADC analog input channel 15 |
| Pino 59 | VRH — ADC high reference voltage |
| Pino 60 | VRL — ADC low reference voltage |
| Pino 61 | PS0 — Port S bit 0 (general I/O) |
| Pino 62 | PS1 — Port S bit 1 (general I/O) |
| Pino 63 | PS2 — Port S bit 2 (general I/O) |
| Pino 64 | PS3 — Port S bit 3 (general I/O) |
| Pino 65 | PS4 — Port S bit 4 (general I/O) |
| Pino 66 | PS5 — Port S bit 5 (general I/O) |
| Pino 67 | PS6 — Port S bit 6 (general I/O) |
| Pino 68 | PS7 — Port S bit 7 (general I/O) |
| Pino 69 | PT0 — Port T bit 0 (general I/O / timer) |
| Pino 70 | PT1 — Port T bit 1 (general I/O / timer) |
| Pino 71 | PT2 — Port T bit 2 (general I/O / timer) |
| Pino 72 | PT3 — Port T bit 3 (general I/O / timer) |
| Pino 73 | PT4 — Port T bit 4 (general I/O / timer) |
| Pino 74 | PT5 — Port T bit 5 (general I/O / timer) |
| Pino 75 | PT6 — Port T bit 6 (general I/O / timer) |
| Pino 76 | PT7 — Port T bit 7 (general I/O / timer) |
| Pino 77 | CANRX — CAN receive input |
| Pino 78 | CANTX — CAN transmit output |
| Pino 79 | MOSI0 — SPI0 master-out / slave-in |
| Pino 80 | MISO0 — SPI0 master-in / slave-out |
| Pino 81 | SCK0 — SPI0 serial clock |
| Pino 82 | SS0 — SPI0 slave select |
| Pino 83 | MOSI1 — SPI1 master-out / slave-in |
| Pino 84 | MISO1 — SPI1 master-in / slave-out |
| Pino 85 | SCK1 — SPI1 serial clock |
| Pino 86 | SS1 — SPI1 slave select |
| Pino 87 | SDA0 — I2C0 serial data |
| Pino 88 | SCL0 — I2C0 serial clock |
| Pino 89 | SDA1 — I2C1 serial data |
| Pino 90 | SCL1 — I2C1 serial clock |
| Pino 91 | PJ0 — Port J bit 0 (general I/O) |
| Pino 92 | PJ1 — Port J bit 1 (general I/O) |
| Pino 93 | PJ2 — Port J bit 2 (general I/O) |
| Pino 94 | PJ3 — Port J bit 3 (general I/O) |
| Pino 95 | PJ4 — Port J bit 4 (general I/O) |
| Pino 96 | PJ5 — Port J bit 5 (general I/O) |
| Pino 97 | PJ6 — Port J bit 6 (general I/O) |
| Pino 98 | PJ7 — Port J bit 7 (general I/O) |
| Pino 99 | PK0 — Port K bit 0 (general I/O) |
| Pino 100 | PK1 — Port K bit 1 (general I/O) |
| Pino 101 | PK2 — Port K bit 2 (general I/O) |
| Pino 102 | PK3 — Port K bit 3 (general I/O) |
| Pino 103 | PK4 — Port K bit 4 (general I/O) |
| Pino 104 | PK5 — Port K bit 5 (general I/O) |
| Pino 105 | PK6 — Port K bit 6 (general I/O) |
| Pino 106 | PK7 — Port K bit 7 (general I/O) |
| Pino 107 | PM0 — Port M bit 0 (general I/O) |
| Pino 108 | PM1 — Port M bit 1 (general I/O) |
| Pino 109 | PM2 — Port M bit 2 (general I/O) |
| Pino 110 | PM3 — Port M bit 3 (general I/O) |
| Pino 111 | PM4 — Port M bit 4 (general I/O) |
| Pino 112 | PM5 — Port M bit 5 (general I/O) |
| Pino 113 | PM6 — Port M bit 6 (general I/O) |
| Pino 114 | PM7 — Port M bit 7 (general I/O) |
| Pino 115 | PP0 — Port P bit 0 (PWM / general I/O) |
| Pino 116 | PP1 — Port P bit 1 (PWM / general I/O) |
| Pino 117 | PP2 — Port P bit 2 (PWM / general I/O) |
| Pino 118 | PP3 — Port P bit 3 (PWM / general I/O) |
| Pino 119 | PP4 — Port P bit 4 (PWM / general I/O) |
| Pino 120 | PP5 — Port P bit 5 (PWM / general I/O) |
| Pino 121 | PP6 — Port P bit 6 (PWM / general I/O) |
| Pino 122 | PP7 — Port P bit 7 (PWM / general I/O) |
| Pino 123 | PWM0 — PWM channel 0 output |
| Pino 124 | PWM1 — PWM channel 1 output |
| Pino 125 | TC0 — Timer/Counter channel 0 input |
| Pino 126 | TC1 — Timer/Counter channel 1 input |
| Pino 127 | TC2 — Timer/Counter channel 2 input |
| Pino 128 | TC3 — Timer/Counter channel 3 input |
| Pino 129 | TC4 — Timer/Counter channel 4 input |
| Pino 130 | TC5 — Timer/Counter channel 5 input |
| Pino 131 | TC6 — Timer/Counter channel 6 input |
| Pino 132 | TC7 — Timer/Counter channel 7 input |
| Pino 133 | VSSX — I/O ground reference |
| Pino 134 | VDDX — I/O supply voltage (5V) |
| Pino 135 | VDDPLL — PLL supply voltage |
| Pino 136 | VSSPLL — PLL ground |
| Pino 137 | EXTAL — External oscillator input |
| Pino 138 | XTAL — External oscillator output |
| Pino 139 | CLKOUT — System clock output |
| Pino 140 | MODC — Mode selection pin |
| Pino 141 | TCLK — Timer clock input |
| Pino 142 | PE0 — Port E bit 0 (general I/O / IRQ) |
| Pino 143 | PE1 — Port E bit 1 (general I/O / IRQ) |
| Pino 144 | PE2 — Port E bit 2 (general I/O / IRQ) |
Aplicações típicas
MC9S12XDT256MAG é adequado para 6 aplicaçãos: Automotive Body Control Module, HVAC Control Module, Instrument Cluster Controller, Industrial CAN Node End-Equipment, Motor Drive and PWM Control Subsystem, Sensor and Diagnostic Data Acquisition.
Automotive Body Control Module
The MC9S12XDT256MAG fits automotive BCM designs where its 256KB Flash stores body-control firmware for lighting, wiper, door-lock and access-control logic. The HCS12X core at 80MHz runs CAN 2.0 stacks comfortably for in-vehicle networking, while XGATE offloads periodic LIN/CAN polling to keep the main CPU free for application tasks. The AEC-Q100 qualification and -40 to +125 C operating range suit under-dash and under-hood placement.
Recomendado
HVAC Control Module
For HVAC climate-control modules, the MC9S12XDT256MAG drives PWM outputs to fan and actuator loads while its 10-bit ADC reads temperature and pressure sensors. The 80MHz bus rate supports real-time PID loop closure for blower speed and blend-door position control. On-chip CAN 2.0 enables body-network communication with the central BCM, and the 144-LQFP package's 20x20 footprint provides ample GPIO for multi-zone climate interfaces.
Recomendado
Instrument Cluster Controller
The MC9S12XDT256MAG is well matched to instrument cluster designs that drive segmented LCD or stepper-motor gauges via PWM and SPI-controlled driver ICs. Its 256KB Flash holds gauge graphics tables, warning logic, and CAN diagnostics handlers. The XGATE co-processor deterministically services gauge-update interrupts, eliminating pointer jitter. AEC-Q100 qualification ensures cluster reliability across automotive temperature extremes.
Recomendado
Industrial CAN Node End-Equipment
Beyond automotive, the MC9S12XDT256MAG suits industrial CANopen or DeviceNet slave nodes such as programmable logic controllers, distributed I/O blocks, and motor starters. The integrated MSCAN 2.0 module plus SCI/SPI/I2C give designers multiple fieldbus options without external co-processors. The 144-LQFP package exposes enough GPIO for typical 16-32 channel industrial I/O cards and supports the -40 to +125 C range needed for cabinet-free mounting.
Recomendado
Motor Drive and PWM Control Subsystem
The MC9S12XDT256MAG's enhanced capture and PWM timer block drives brushless DC and stepper motor control loops up to a few kHz electrical frequency. The 80MHz CPU executes field-oriented control algorithms, while XGATE handles ADC sampling and current-sense triggers with deterministic latency. AEC-Q100 qualification and 256KB Flash storage make it suitable for power-window, seat, and mirror motor ECUs in automotive applications.
Recomendado
Sensor and Diagnostic Data Acquisition
In sensor-acquisition and diagnostic logging nodes, the MC9S12XDT256MAG combines a 10-bit ADC with CAN 2.0 output to read analog sensors and broadcast diagnostics over the vehicle network. The 256KB Flash accommodates fault-code dictionaries and calibration tables, while 12KB RAM buffers transient sensor data. The -40 to +125 C operating range supports chassis-mounted and wheel-mounted sensor placement in harsh automotive environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12XDT256MAG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12XD256MAG | MC9S12XDT256MAL | MC9S12XDT256CAG | MC9S12XET256MAG | MC9S12XDP512MAG |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12X | HCS12X | HCS12X | HCS12X | HCS12X (S12XE) | HCS12X |
| Maximum CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 50 MHz | 80 MHz |
| Program Memory (Flash) | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB |
| Operating Temperature | -40 to +125 C | -40 to +125 C | -40 to +85 C | 0 to +70 C | -40 to +125 C | -40 to +125 C |
| AEC-Q100 | Qualified | Qualified | Not qualified (industrial) | Not qualified (commercial) | Qualified | Qualified |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Obsolete | Active | Last Time Buy |
Principais diferenciais
- Last-time-buy NXP-original stock at distributors vs counterfeits on the open market (vs MC9S12XD256MAG)
- Higher CPU clock rate for time-critical CAN processing (vs MC9S12XET256MAG)
- 256KB Flash balances cost and code space vs the larger 512KB variant (vs MC9S12XDP512MAG)
Notas de projeto
The MC9S12XDT256MAG requires two supply domains: VDDX (5V I/O) and the internal VDDR (2.5V core) generated by the on-chip voltage regulator. Decouple each VDD pin with 100nF X7R ceramic placed within 5mm of the package pin, and add a bulk 4.7uF tantalum or polymer cap on VDDR for PLL current spikes. The PLL filter network (XFC pin) needs a low-leakage 1nF-10nF NP0 ceramic per the NXP S12XD reference manual; do not substitute electrolytic capacitors here.
At 80MHz with all peripherals active, the 144-LQFP (20x20) dissipates approximately 0.4-0.6W in typical automotive applications. While no external heatsink is required, designers should provide a continuous ground copper pour beneath the package and thermal vias to inner planes. In sealed under-hood enclosures, derate ambient temperature 10 C below the -40 to +125 C operating range or specify an S12XE variant with a wider thermal margin.
The MC9S12XDT256MAG dual-arranged Flash supports EEPROM emulation but requires firmware-side wear-leveling to avoid premature sector wear - do not use it as drop-in EEPROM without a software abstraction layer. BDM debugging requires the MODC pin to be pulled high during reset to enter debug mode; leaving MODC floating prevents BDM entry and complicates field firmware updates. Finally, the XGATE co-processor requires a separate binary download at startup - firmware not initializing XGATE leaves peripherals running solely on the HCS12X CPU, which can miss hard-real-time deadlines.
Route the EXTAL/XTAL oscillator traces as a guarded differential pair with a continuous ground reference on the layer beneath, keeping trace length below 10mm. Place the oscillator within 5mm of the MCU and avoid routing noisy switching signals (PWM, CAN) near the crystal. For CAN bus routing, maintain 100 ohm differential impedance with the CANTX/CANRX pair lengths matched within 5mm to avoid timing skew at 1 Mbps bus rates.
Informações de conformidade
AEC-Q100 qualified per NXP automotive grade. RoHS and REACH compliant per distributor listings. Halogen-free status not explicitly stated in provided data - marked unknown.