NXP Semiconductors

MC9S12XDT512CAG - 16-bit 80MHz 512KB Flash MCU | NXP

N.º da peça: MC9S12XDT512CAG ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
2.35 V to 2.75 V Vdss 144-LQFP (20x20 mm) Package 80 MHz Speed FLASH Memory
A partir de $85 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-18
Preços por volume
Qtd. Preço unitário Total
1 $101.22 $101,22
10 $96.5 $965,00
100 $92.1 $9.210,00
500 $88.4 $44.200,00
1.000 $85 $85.000,00
ℹ️ Todos os preços estão em USD

MC9S12XDT512CAG Visão geral

The NXP MC9S12XDT512CAG is a 16-bit HCS12X microcontroller operating at up to 80 MHz with 512 KB (512K x 8) of on-chip Flash memory, housed in a 144-pin LQFP (20x20 mm) surface-mount package.

A microcontroller unit (MCU) is a single-chip embedded processor that integrates a CPU core, program memory, data memory, and peripheral functions such as timers, communication interfaces, and analog-to-digital converters on one die. Within the semiconductor hierarchy, the MC9S12XDT512CAG belongs to the 16-bit microcontroller class, part of the broader family of embedded processors used in automotive and industrial control systems, sitting above simple 8-bit MCUs and below 32-bit application processors.

Key features include the enhanced HCS12X CPU core, upward compatible with the HCS12 instruction set, which preserves code compatibility and programmer's model for legacy HCS12 designs. The XGATE co-processor architecture of the S12XD family offloads interrupt handling and communication tasks, letting the main CPU achieve 32-bit-class throughput with 16-bit efficiency. The device integrates 119 general-purpose I/O lines, a 16-channel 10-bit ADC, and multiple serial interfaces including CAN, SCI, and SPI, targeting automotive multiplexing networks.

The S12XD family architecture combines a CISC-style CPU12X core with an interrupt dispatch mechanism that reduces latency, which is why NXP positioned it as delivering 32-bit performance with 16-bit advantages. Flash program memory of 512 KB supports large application images typical of body control modules, gateways, and instrument clusters. The supply voltage of 2.35 V to 2.75 V (2.5 V nominal class) reflects the core supply regulation approach used across this generation of S12X devices.

Typical applications include automotive body electronics, gateway modules, industrial automation controllers, and motor management systems where CAN networking and deterministic interrupt response are required.

When designing with this MCU, confirm current lifecycle status: NXP lists the part as NRND (Not Recommended for New Designs), so new designs should evaluate the S12XE successors or migrate to 32-bit alternatives.

This page synthesizes distributor pricing, pin-compatible family alternatives, and practical design notes not consolidated in the manufacturer datasheet.

Alternativas drop-in para MC9S12XDT512CAG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MC9S12XDT512CAG (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Core, Timers, ADC.

NXP Semiconductors
Operating Temperature: -40C to +85C
Package: 144-pin LQFP (20x20 mm)
Core: HCS12X (16-bit CISC with XGATE co-processor)
Comparar com MC9S12XDT512CAG →
NXP Semiconductors
Operating Temperature: -40C to +125C (TA)
Package: 80-QFP (14x14 mm), Square, Gull Wing
Comparar com MC9S12XDT512CAG →
NXP Semiconductors
Operating Temperature: -40C to +85C (automotive grade)
Core: HCS12X (16-bit) with XGATE co-processor
Timers: 8-channel 16-bit timer with capture/compare
Comparar com MC9S12XDT512CAG →
NXP Semiconductors
Operating Temperature: -40C to +85C (TA)
Timers: Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI)
Comparar com MC9S12XDT512CAG →
NXP Semiconductors
Operating Temperature: -40 C to +85 C (CAG grade, see datasheet)
Core: S12X (16-bit CISC) + XGATE co-processor
ADC: 16-channel, 12-bit
Comparar com MC9S12XDT512CAG →
NXP Semiconductors
Operating Temperature: -40C to +125C
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Core: HCS12X (S12X), 16-bit
Comparar com MC9S12XDT512CAG →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MC9S12XDP512CAG

✅ Drop-In
📦 144-LQFP (20x20)
same 80 MHz, 512 KB Flash and footprint; peripheral mix (CAN/SCI/SPI channel counts) differs slightly

📋 Alternativa de referência (fora do catálogo)

MC9S12XDT512MAA

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

✓ Em estoque

Consulte o preço

Ver ficha técnica →

MC9S12XDT256CAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC with XGATE co-processor) · 256 KB Flash · 16 KB · 4 KB · 80 MHz · 2.35 V to 2.75 V · 4.5 V to 5.5 V · 119

✓ Em estoque

$17.4 / unidade

Ver ficha técnica →

MC9S12XEP768CAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit) with XGATE co-processor · 50 MHz · 768 KB (768K x 8) with ECC · 32 KB · 1.8V / 2.8V / 5V · -40C to +85C (automotive grade)

✓ Em estoque

$19.85 / unidade

Ver ficha técnica →

MC9S12XEQ384CAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ Em estoque

Consulte o preço

Ver ficha técnica →

S912XET512BMAGR

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ Em estoque

$6.6 / unidade

Ver ficha técnica →

MC9S12XEQ512MAL

✅ Drop-In
📦 144-LQFP (20x20)
S12XE 512 KB Flash, same package footprint, 50 MHz-class XE platform vs 80 MHz XD

📋 Alternativa de referência (fora do catálogo)

MC9S12XDT512CAG Classificações máximas e características elétricas

Core Processor HCS12X (CPU12X)
Core Size 16-bit
Speed 80 MHz
Program Memory Type FLASH
Program Memory Size 512 KB (512K x 8)
Tensão de alimentação 2.35 V to 2.75 V
I/O Count 119
Encapsulamento 144-LQFP (20x20 mm)
Tipo de montagem Surface Mount
Architecture HCS12X (CISC, upward compatible with HCS12)
Family Series 9S12X (S12XD)
Technology CMOS
Target Application Automotive multiplexing
Life Cycle Stage ACTIVE (per datasheet listings); NRND per NXP product page

Guia de Configuração de Pinos do MC9S12XDT512CAG 144-lqfp (20x20 mm)

Configuração de pinos para MC9S12XDT512CAG (pacote 144-lqfp (20x20 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote 144-lqfp (20x20 mm) para MC9S12XDT512CAG

Nenhum dado detalhado de pinagem disponível para MC9S12XDT512CAG.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

MC9S12XDT512CAG é adequado para 6 aplicaçãos: Automotive Body Control Modules, Automotive Gateway Modules, Industrial Automation Controllers, Instrument Clusters, Motor Management and Control Units, Legacy System Maintenance and Repair.

🚗

Automotive Body Control Modules

The MC9S12XDT512CAG fits body control modules because it combines an 80 MHz HCS12X core, 512 KB Flash, 119 I/O lines, and multiple CAN channels in one 144-LQFP device, covering the lamp, door, and seat-load driving plus network gateway duties a BCM demands. In a typical topology the MCU reads switch and sensor inputs through its analog and digital ports, drives loads via external high-side drivers, and bridges low-speed and high-speed CAN segments on-chip. The XGATE-class interrupt offload keeps lamp PWM timing deterministic while the main CPU runs diagnostics. The main trade-off is that the part is NRND, so BCM programs should pair immediate builds with a qualification plan on the S912XET512BMAGR, which shares the same 144-LQFP footprint.

🌐

Automotive Gateway Modules

Gateway modules route frames between multiple CAN buses and diagnostic channels, and the MC9S12XDT512CAG suits this role with its on-chip CAN controllers, 80 MHz core for fast frame filtering and translation, and 512 KB Flash for protocol stacks and OTA-style bootloaders. The enhanced indexed addressing and interrupt queue of the HCS12X core reduce ISR latency, keeping worst-case forwarding delay predictable at network saturation. Designs typically use the SCI interface for UDS diagnostics over K-Line and SPI for external CAN-FD or LIN expansion. Because the XD family is NRND, gateways with long service lifetimes should validate the pin-compatible MC9S12XEP768CAG, whose 768 KB Flash also adds margin for growing diagnostic stacks, before committing the layout to production.

🏭

Industrial Automation Controllers

In industrial controllers, the MC9S12XDT512CAG offers deterministic 16-bit control with 80 MHz execution, 119 I/O lines for relay, sensor, and encoder interfacing, and enough Flash for fieldbus protocol firmware and data logging. Its upward HCS12 compatibility protects decades of proven control code, which matters in machinery with long certification cycles. Typical designs use the 10-bit ADC class inputs for analog sensor acquisition, timer channels for PWM outputs to actuators, and SCI/SPI links to HMIs. The core supply window of 2.35 V to 2.75 V is managed by on-board regulators in NXP reference designs. Industrial users should note the NRND status and stock last-time-buy quantities, or design in the footprint-compatible S912XET512BMAGR to keep the PCB unchanged across generations.

📺

Instrument Clusters

Automotive instrument clusters need simultaneous stepper-motor gauge driving, LCD control, backlight PWM, CAN reception, and warning-chime generation, all of which map well onto the MC9S12XDT512CAG's timer resources, 119 I/O lines, and 512 KB Flash for graphics and diagnostics. The 80 MHz clock gives headroom for smooth gauge pointer motion algorithms, while interrupt co-dispatch keeps CAN message servicing from jittering the display update loop. Clusters also benefit from the family's EMC-hardened I/O design used across the S12X automotive portfolio. For cluster programs starting today, the NRND marking makes the XE-generation S912XET512BMAGR the recommended drop-in, since it preserves the 144-LQFP land pattern while offering a current-production silicon roadmap and improved EMC characterization data.

⚡

Motor Management and Control Units

Motor management units for window lifts, wipers, pumps, and HVAC blowers use the MC9S12XDT512CAG for its combination of PWM timer channels, 10-bit ADC inputs for current and position feedback, and CAN connectivity for vehicle network commands. The 80 MHz HCS12X core executes PI control loops and stall detection algorithms with margin, and 512 KB Flash stores autolearning routines plus fault logs. Its HCS12 lineage means existing motor-control firmware libraries port with minimal change, shortening development cycles. Designs typically pair the MCU with external H-bridge or high-side driver ICs on the SPI bus. The 2.35 V to 2.75 V core supply simplifies integration with 5 V automotive electrical systems through standard S12X power architectures. NRND status favors the S912XET512BMAGR for new motor-control platforms.

🔧

Legacy System Maintenance and Repair

A large installed base of automotive ECUs and industrial controllers built on the S12XD family depends on the MC9S12XDT512CAG for service replacements and remanufacturing. With 2,526 units in stock at independent distributors as of October 2026 and DigiKey shipping same-day, maintenance buyers can source verified original parts today, though NRND means no new factory production. Repair shops should verify date codes and request traceability from independent channels. Where stock dries up, the pin-compatible MC9S12XDP512CAG with identical 512 KB Flash and 80 MHz rating provides a same-footprint substitute, while the MC9S12XDT512MAA ordering variant offers another sourcing path for the identical die. XAIPART stocks multiple S12X family MPNs to support mixed repair inventories.

What is the MC9S12XDT512CAG and what are its key specifications?
The MC9S12XDT512CAG is an NXP 16-bit HCS12X microcontroller running at up to 80 MHz with 512 KB (512K x 8) of on-chip Flash and 119 I/O lines, packaged in a 144-pin LQFP measuring 20x20 mm. According to the NXP product page, the device targets the S12XD family for automotive multiplexing applications, and its core supply operates from 2.35 V to 2.75 V. It is upward compatible with the HCS12 instruction set.
Where to buy MC9S12XDT512CAG online?
The MC9S12XDT512CAG can be purchased online from authorized distributors including DigiKey and Mouser, as well as from independent distributors such as Microchip USA, which listed 2,526 units in stock at $101.22 per unit as of October 2026. DigiKey lists the part as in stock with same-day shipping. XAIPART also offers this MPN with volume pricing from 1 to 1000+ units.
What is the price of MC9S12XDT512CAG?
The unit price of the MC9S12XDT512CAG is approximately $101.22 for quantity 1 as of October 2026, based on distributor data (Microchip USA). Volume pricing typically steps down at 10, 100, 500, and 1000 units; XAIPART lists tiered pricing starting at $101.22 (qty 1) down to about $85.00 at qty 1000. Because the part is NRND, gray-market availability may cause price volatility, so confirm current quotes before ordering.
Is MC9S12XDT512CAG in stock?
Yes, the MC9S12XDT512CAG is in stock at multiple distributors as of October 2026. Microchip USA reported 2,526 units available, and DigiKey states the item ships today. However, NXP officially lists the part as NRND (Not Recommended for New Designs), so authorized stock is finite; for production programs, secure last-time-buy quantities or qualify a pin-compatible family alternative such as the S912XET512BMAGR.
Is MC9S12XDT512CAG the same as MC9S12XDP512CAG?
No, they are closely related but not identical. Both are NXP S12XD family 16-bit MCUs in the same 144-LQFP (20x20) package at 80 MHz with 512 KB Flash, so they are largely pin-compatible, but the 'P' and 'T' variants differ in peripheral set integration (for example, different combinations of CAN, SCI, and SPI channel counts). According to distributor comparison listings (Utmel, FindIC), the MC9S12XDP512CAG shares the same core, memory, and footprint, so substitution requires verifying your required peripheral mix against the block diagram.
What is the difference between MC9S12XDT512CAG and MC9S12XEQ512CAG?
The MC9S12XDT512CAG runs at 80 MHz in the S12XD family, while the MC9S12XEQ512CAG is an S12XE family device rated at 50 MHz in the same 144-LQFP (20x20) package with the same 512 KB Flash. According to Utmel comparison data, the XE variant offers a more modern peripheral set and enhanced interrupt architecture at a lower clock speed, and the XE family remains recommended for new designs whereas the XD is NRND. The two are generally footprint-compatible but software and peripheral configuration differ.
What is the best drop-in replacement for MC9S12XDT512CAG?
The best drop-in replacement within the same NXP S12X family and 144-LQFP package is the MC9S12XDP512CAG, which offers the same 80 MHz core, 512 KB Flash, and identical footprint. Other pin-compatible family members include the S912XET512BMAGR (S12XE generation, 512 KB Flash) and MC9S12XEP768CAG (768 KB Flash), both in 144-LQFP. All substitutions require firmware validation because peripheral register maps differ between the XD and XE generations.
Can MC9S12XEQ384CAG replace MC9S12XDT512CAG?
It can replace it physically and electrically in most cases, but not without code changes. The MC9S12XEQ384CAG is a pin-compatible 144-LQFP S12XE family MCU with 384 KB Flash versus 512 KB on the MC9S12XDT512CAG. If your application image fits within 384 KB, the XEQ384 is a viable drop-in on the same PCB; otherwise choose the 512 KB S912XET512BMAGR. Always re-verify CAN, SCI, and ADC peripheral configurations against the XE reference manual.
Where to download the MC9S12XDT512CAG datasheet PDF?
The MC9S12XDT512CAG datasheet PDF is available from the official NXP product page at nxp.com/part/MC9S12XDT512CAG, which links the S12XD family documentation covering the HCS12X core, 512 KB Flash memory map, electrical specifications, and 144-LQFP package mechanical drawings. Mirror copies are hosted on datasheet aggregators such as datasheets.com and alldatasheet.com, but NXP's own site should be treated as the authoritative revision.
Where can I find the MC9S12XDT512CAG pinout for the 144-LQFP package?
The complete pinout of the MC9S12XDT512CAG in the 144-LQFP (20x20 mm) package is found in the pinout and signal description chapter of the S12XD family reference manual and datasheet, downloadable from the NXP product page. The 144 pins distribute 119 I/O lines across multiple ports (A through K plus AD port for analog), along with power, ground, PLL, reset, BDM debug, and crystal pins. XAIPART does not republish the full 144-pin table to avoid transcription errors; always confirm against the NXP document.
What can replace MC9S12XDT512CAG in a legacy automotive design?
For legacy designs, replacements should stay within the pin-compatible 144-LQFP S12X family: first choice is MC9S12XDP512CAG (identical memory and clock), followed by MC9S12XEP768CAG (more Flash, XE generation) and S912XET512BMAGR (512 KB XE variant). If migrating off the NRND S12X platform entirely, NXP's 32-bit SPC56/SPC57 automotive MCUs, such as the SPC5644AF0MLU2, are software-compatible migration targets but require PCB redesign, so they are not drop-in.
What is the best NXP S12XE equivalent for MC9S12XDT512CAG?
The closest NXP S12XE generation equivalent is the S912XET512BMAGR, which provides the same 512 KB Flash and 144-pin LQFP footprint as the MC9S12XDT512CAG. The XE family is the successor generation recommended by NXP for new designs, offering improved EMC performance and an enhanced interrupt controller. Firmware written for the XD family requires porting effort because peripheral register maps and clock configuration differ, so budget re-validation time for CAN and timing-critical drivers.
When should I choose MC9S12XDT512CAG over MC9S12XEP768CAG?
Choose the MC9S12XDT512CAG only for like-for-like maintenance of an existing design whose firmware is validated on the S12XD family, since it is NRND. Choose the MC9S12XEP768CAG for new or refreshed designs that need headroom (768 KB Flash versus 512 KB) and a currently supported, non-NRND peripheral set in the same 144-LQFP footprint. If code portability to XE is not feasible in your schedule and authorized XD stock is available, the XD remains a pragmatic short-term choice with last-time-buy discipline.
What is the lead time for MC9S12XDT512CAG?
As of October 2026, distributor stock (over 2,500 units at independent distributors, in-stock status at DigiKey) allows near-immediate shipment for small to medium quantities, effectively eliminating lead time for on-hand stock. For factory-direct orders from NXP, NRND status typically means no new production allocation, so lead time cannot be guaranteed and buyers should rely on distribution stock or broker excess. Request written date-code and traceability documentation when purchasing NRND parts from independent channels.
Is the MC9S12XDT512CAG suitable for automotive body control applications?
Yes, the MC9S12XDT512CAG was explicitly designed for automotive multiplexing applications, according to the Freescale/NXP S12XD family introduction. Its 80 MHz HCS12X core with interrupt co-dispatch, 512 KB Flash, 119 I/O lines, and integrated CAN controllers make it well suited to body control modules, gateways, and lighting management. However, because NXP now marks the part NRND, new automotive designs should target the S12XE (S912XE series) or 32-bit SPC5 family instead, reserving the XD512 for existing-platform continuity.

Dados de referência de engenharia para MC9S12XDT512CAG — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MC9S12XDT512CAG when you must maintain or remanufacture an existing S12XD-based automotive or industrial board and need identical 512 KB Flash, 80 MHz execution, and a proven HCS12X firmware base; it is the safest like-for-like repair part, but treat every new layout as a last-time-buy situation given NRND status. Choose the MC9S12XDP512CAG when firmware is peripheral-set-matched and sourcing of the XD variant is constrained - same memory and clock, same footprint. Choose MC9S12XEP768CAG or S912XET512BMAGR when you can absorb a firmware port and want a non-NRND future: same 144-LQFP land pattern, 768 KB or 512 KB Flash respectively, on the supported S12XE platform. Only move to 32-bit SPC5 devices (e.g., SPC5644AF0MLU2) when a full redesign is already planned.

Comparação com alternativas

Parâmetro Este produto MC9S12XDP512CAG MC9S12XDT512MAA MC9S12XDT256CAG MC9S12XEP768CAG S912XET512BMAGR
Package 144-LQFP (20x20 mm) 144-LQFP (20x20) - same 144-LQFP (20x20) - same 144-LQFP (20x20) - same 144-LQFP (20x20) - same 144-LQFP (20x20) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core / Speed HCS12X 16-bit, 80 MHz HCS12X 16-bit, 80 MHz HCS12X 16-bit, 80 MHz HCS12X 16-bit, 80 MHz S12XE 16-bit, 50 MHz-class bus S12XE 16-bit, 50 MHz-class bus
Flash Memory 512 KB 512 KB 512 KB 256 KB 768 KB 512 KB

Principais diferenciais

  • Highest Flash density in the XD family variant class (vs MC9S12XDT256CAG)
  • Faster core clock than the XE successor generation (vs MC9S12XEQ512MAL)
  • Same 512 KB capacity with a current production path (vs S912XET512BMAGR)

Notas de projeto

NXP lists the MC9S12XDT512CAG as NRND on its official product page, even though third-party specification databases still show 'ACTIVE' lifecycle. Never use the NRND part in a new design without a documented exit strategy: secure a last-time-buy quantity sized to the product lifetime plus service spares, and pre-qualify the pin-compatible S912XET512BMAGR (S12XE, same 144-LQFP footprint) so the PCB can absorb a second-source build without re-layout. Ignoring this dual-path plan is the single most common sourcing failure on S12XD platforms.

The specified supply window of 2.35 V to 2.75 V refers to the regulated core supply class of the S12XD generation; the device family relies on an internal regulator fed from the 5 V automotive rail through dedicated VDD/VSS and VDDR pin pairs. Follow the S12XD hardware design guide (available on the NXP MC9S12XDT512CAG product page) for decoupling: place low-ESR capacitors on every VDDx/VSSx pin pair and keep the VDDA/VSSA analog pair isolated with an RC filter from the digital rail to preserve ADC accuracy on the 16-channel analog port.

For the 144-LQFP (20x20 mm) footprint, use 0.5 mm pitch escape routing with at least two ground vias per quadrant of the exposed center area for thermal relief and EMC. Keep the CAN transceiver placement within 20 mm of the MCU CAN pins and route the crystal loop short and guarded. Estimated: at 80 MHz with heavily switched I/O, keep trace stubs under 30 mm on SPI and timer outputs to limit ringing; add 22-33 ohm series resistors on long lines as a low-cost damping measure. These values are design estimates, not datasheet limits.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
Unknown
Sem halogênios
Unknown
Minerais de conflito
Unknown

Compliance data was not present in the provided verified web data. The C in the ordering MPN indicates a lead-free/compliance option code per NXP convention, but explicit RoHS/REACH status must be confirmed on the NXP product page environmental section.

Dados verificados em: 2026-10-18 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

NXP Semiconductors Freescale Semiconductor MC9S12XDT512CAG MC9S12XDP512CAG MC9S12XEP768CAG S912XET512BMAGR HCS12X S12XD family 16-bit microcontroller microcontroller unit (MCU) embedded processor LQFP-144 QFP family surface mount NRND CAN bus automotive multiplexing Flash memory XGATE RoHS
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