MK50DN512CLQ10 - Kinetis K50 100MHz Cortex-M4 MCU 512KB | NXP
N.º da peça: MK50DN512CLQ10 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $16.92 | $16,92 |
| 10 | $15.23 | $152,30 |
| 100 | $13.55 | $1.355,00 |
| 500 | $11.89 | $5.945,00 |
| 1.000 | $10.21 | $10.210,00 |
MK50DN512CLQ10 Visão geral
A Kinetis microcontroller is a member of NXP's Cortex-M4 MCU family that combines deterministic interrupt response with DSP extensions, signal-conditioning analog front ends, and low-power peripherals. Within the broader taxonomy, MK50DN512CLQ10 is a microcontroller -> 32-bit MCU -> ARM Cortex-M MCU -> Kinetis K-series, designed for mixed-signal measurement and precision sensor interfacing. The K50 sub-family specifically adds an analog measurement engine that integrates operational amplifiers and high-resolution ADCs, enabling direct connection to low-level analog sensors without external signal chain components.
Key features include 100 MHz Cortex-M4 core with single-precision FPU and DSP instructions at 1.25 Dhrystone MIPS per MHz, 512 KB flash with flash write voltage range of 1.71 V to 3.6 V matching supply, 128 KB SRAM, an integrated USB full-speed controller with on-chip transceiver, dual 16-bit SAR ADCs with up to 24-bit effective resolution through oversampling, 12-bit DAC, programmable gain amplifiers, and hardware cryptographic acceleration. The 144-pin LQFP package exposes 96 GPIO with multiple low-power modes.
Architecturally, the Kinetis K50 MCU uses a Cortex-M4 core with nested vector interrupt controller, low-latency memory bus matrix, dual-bank flash with EEPROM-like emulation, and a peripheral-rich subsystem. The integrated analog engine reduces BOM by collapsing op-amp + ADC + DAC chains onto the silicon, while the FPU and DSP extensions enable on-chip DSP for sensor fusion without external accelerators.
Typical applications include medical instrumentation such as blood-glucose meters, pulse oximeters, and ECG front ends; industrial process sensors with 4-20 mA loops; precision weigh scales; data acquisition systems; and USB-connected measurement instruments that benefit from the integrated full-speed USB and high-resolution ADC chain.
Designers should evaluate total analog input offset drift vs sensor bandwidth, then size the internal PGA gain stage and select the appropriate averaging factor for the chosen ADC sample rate; the integrated op-amps typically drive only a few mA and are intended for high-impedance sources, requiring external buffers for low-impedance loads.
This page synthesizes distributor pricing, Kinetis K50 family drop-in alternatives, and practical design notes for the MK50DN512CLQ10 not aggregated on the manufacturer product page.
Alternativas drop-in para MK50DN512CLQ10 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MK50DN512CLQ10 (mesmo formato e footprint) — diferindo em Package, ADC, DAC, Operating Temperature Range, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MK50DN512ZCLQ10
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK51DN512CLQ10
✅ Drop-In✓ Em estoque
$9.45 / unidade
Ver ficha técnica →MK52DN512CLQ10
✅ Drop-In✓ Em estoque
$13.02 / unidade
Ver ficha técnica →MK53DX256ZCLQ10
✅ Drop-In✓ Em estoque
$11.45 / unidade
Ver ficha técnica →MK60DN512ZVMC10
✅ Drop-In✓ Em estoque
$7.94 / unidade
Ver ficha técnica →MK60DN512ZVLQ10
✅ Drop-In✓ Em estoque
$9.3 / unidade
Ver ficha técnica →MK50DN512CLQ10 Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4 with FPU and DSP |
| Maximum CPU Frequency | 100 MHz |
| Dhrystone Performance | 1.25 MIPS per MHz |
| Program Flash Memory | 512 KB |
| SRAM | 128 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| Faixa de temperatura de operação | -40 C to +85 C (industrial) |
| GPIO Count | 96 I/O |
| USB Controller | USB 2.0 Full-Speed, on-chip transceiver |
| ADC Resolution | Dual 16-bit SAR with up to 24-bit effective via oversampling |
| DAC Resolution | 12-bit |
| Integrated Amplifiers | Operational amplifiers and trans-impedance amplifiers |
| Encapsulamento | 144-pin LQFP (20 x 20 mm) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do MK50DN512CLQ10
| Pino 1 | PTC0 — GPIO / Touch sensing channel 0 |
| Pino 2 | PTC1 — GPIO / Touch sensing channel 1 |
| Pino 3 | PTC2 — GPIO / Touch sensing channel 2 |
| Pino 4 | PTC3 — GPIO / Touch sensing channel 3 |
| Pino 5 | PTC4 — GPIO / Touch sensing channel 4 |
| Pino 6 | PTC5 — GPIO / Touch sensing channel 5 |
| Pino 7 | PTC6 — GPIO / Touch sensing channel 6 |
| Pino 8 | PTC7 — GPIO / Touch sensing channel 7 |
| Pino 9 | PTC8 — GPIO / Touch sensing channel 8 |
| Pino 10 | PTC9 — GPIO / Touch sensing channel 9 |
| Pino 11 | PTC10 — GPIO / Touch sensing channel 10 |
| Pino 12 | PTC11 — GPIO / Touch sensing channel 11 |
| Pino 13 | PTC12 — GPIO / Touch sensing channel 12 |
| Pino 14 | PTC13 — GPIO / Touch sensing channel 13 |
| Pino 15 | PTC14 — GPIO / Touch sensing channel 14 |
| Pino 16 | PTC15 — GPIO / Touch sensing channel 15 |
| Pino 17 | PTC16 — GPIO / Touch sensing channel 16 |
| Pino 18 | PTC17 — GPIO / Touch sensing channel 17 |
| Pino 19 | PTC18 — GPIO / Touch sensing channel 18 |
| Pino 20 | PTC19 — GPIO / Touch sensing channel 19 |
| Pino 21 | PTD0 — GPIO (general purpose) |
| Pino 22 | PTD1 — GPIO / SPI0 PCS for ADC communication |
| Pino 23 | PTD2 — GPIO / SPI0 SCK |
| Pino 24 | PTD3 — GPIO / SPI0 MOSI |
| Pino 25 | PTD4 — GPIO / SPI0 MISO |
| Pino 26 | PTD5 — GPIO / SPI1 PCS for DAC communication |
| Pino 27 | PTD6 — GPIO / SPI1 SCK for DAC |
| Pino 28 | PTD7 — GPIO / SPI1 MOSI for DAC |
| Pino 29 | PTH0 — GPIO |
| Pino 30 | PTH1 — GPIO |
| Pino 31 | PTH2 — GPIO |
| Pino 32 | PTH3 — GPIO |
| Pino 33 | PTH4 — GPIO |
| Pino 34 | PTH5 — GPIO |
| Pino 35 | PTH6 — GPIO |
| Pino 36 | PTH7 — GPIO / I2C0 SDA |
| Pino 37 | PTH8 — GPIO / I2C0 SCL |
| Pino 38 | PTH9 — GPIO |
| Pino 39 | PTH10 — GPIO |
| Pino 40 | PTH11 — GPIO |
| Pino 41 | PTH12 — GPIO |
| Pino 42 | PTH13 — GPIO |
| Pino 43 | PTH14 — GPIO |
| Pino 44 | PTH15 — GPIO |
| Pino 45 | PTH16 — GPIO |
| Pino 46 | PTH17 — GPIO |
| Pino 47 | PTF0 — GPIO |
| Pino 48 | PTF1 — GPIO |
| Pino 49 | PTF2 — GPIO |
| Pino 50 | PTF3 — GPIO |
| Pino 51 | PTF4 — GPIO |
| Pino 52 | PTF5 — GPIO |
| Pino 53 | PTF6 — GPIO |
| Pino 54 | PTF7 — GPIO |
| Pino 55 | PTF8 — GPIO |
| Pino 56 | PTF9 — GPIO |
| Pino 57 | PTF10 — GPIO |
| Pino 58 | PTF11 — GPIO |
| Pino 59 | PTF12 — GPIO |
| Pino 60 | PTF13 — GPIO |
| Pino 61 | PTF14 — GPIO |
| Pino 62 | PTF15 — GPIO |
| Pino 63 | PTF16 — GPIO |
| Pino 64 | PTF17 — GPIO |
| Pino 65 | PTF18 — GPIO |
| Pino 66 | PTF19 — GPIO |
| Pino 67 | PTA0 — GPIO / UART0 CTS |
| Pino 68 | PTA1 — GPIO / UART0 RX |
| Pino 69 | PTA2 — GPIO / UART0 TX |
| Pino 70 | PTA3 — GPIO / UART0 RTS |
| Pino 71 | PTA4 — GPIO |
| Pino 72 | PTA5 — GPIO |
| Pino 73 | PTA6 — GPIO |
| Pino 74 | PTA7 — GPIO |
| Pino 75 | PTA8 — GPIO |
| Pino 76 | PTA9 — GPIO |
| Pino 77 | PTA10 — GPIO |
| Pino 78 | PTA11 — GPIO |
| Pino 79 | PTA12 — GPIO |
| Pino 80 | PTA13 — GPIO |
| Pino 81 | PTA14 — GPIO |
| Pino 82 | PTA15 — GPIO |
| Pino 83 | PTA16 — GPIO |
| Pino 84 | PTA17 — GPIO |
| Pino 85 | PTA18 — GPIO |
| Pino 86 | PTA19 — GPIO |
| Pino 87 | PTB0 — GPIO / ADC0 channel 0 |
| Pino 88 | PTB1 — GPIO / ADC0 channel 1 |
| Pino 89 | PTB2 — GPIO / ADC0 channel 2 |
| Pino 90 | PTB3 — GPIO / ADC0 channel 3 |
| Pino 91 | PTB4 — GPIO / ADC0 channel 4 |
| Pino 92 | PTB5 — GPIO / ADC0 channel 5 |
| Pino 93 | PTB6 — GPIO / ADC0 channel 6 |
| Pino 94 | PTB7 — GPIO / ADC0 channel 7 |
| Pino 95 | PTB8 — GPIO / ADC0 channel 8 |
| Pino 96 | PTB9 — GPIO / ADC0 channel 9 |
| Pino 97 | PTB10 — GPIO / ADC0 channel 10 |
| Pino 98 | PTB11 — GPIO / ADC0 channel 11 |
| Pino 99 | PTB12 — GPIO / ADC0 channel 12 |
| Pino 100 | PTB13 — GPIO / ADC0 channel 13 |
| Pino 101 | PTB14 — GPIO / ADC0 channel 14 |
| Pino 102 | PTB15 — GPIO / ADC0 channel 15 |
| Pino 103 | PTB16 — GPIO / ADC0 channel 16 |
| Pino 104 | PTB17 — GPIO / ADC0 channel 17 |
| Pino 105 | PTB18 — GPIO / ADC0 channel 18 |
| Pino 106 | PTB19 — GPIO / ADC0 channel 19 |
| Pino 107 | PTE0 — GPIO |
| Pino 108 | PTE1 — GPIO |
| Pino 109 | PTE2 — GPIO |
| Pino 110 | PTE3 — GPIO |
| Pino 111 | PTE4 — GPIO |
| Pino 112 | PTE5 — GPIO |
| Pino 113 | PTE6 — GPIO |
| Pino 114 | PTE7 — GPIO |
| Pino 115 | PTE8 — GPIO |
| Pino 116 | PTE9 — GPIO |
| Pino 117 | PTE10 — GPIO / LLWU_P10 |
| Pino 118 | PTE11 — GPIO / LLWU_P11 |
| Pino 119 | PTE12 — GPIO |
| Pino 120 | PTE13 — GPIO |
| Pino 121 | PTE14 — GPIO |
| Pino 122 | PTE15 — GPIO |
| Pino 123 | PTE16 — GPIO |
| Pino 124 | PTE17 — GPIO |
| Pino 125 | PTE18 — GPIO |
| Pino 126 | PTE19 — GPIO |
| Pino 127 | USB0_DP — USB Full-Speed data plus |
| Pino 128 | USB0_DM — USB Full-Speed data minus |
| Pino 129 | VOUT33 — USB regulator 3.3V output |
| Pino 130 | VDDA — Analog supply voltage |
| Pino 131 | VSS — Ground |
| Pino 132 | VREFH — ADC reference voltage high |
| Pino 133 | VREFL — ADC reference voltage low |
| Pino 134 | VDD — Main digital supply voltage |
| Pino 135 | VSS — Ground |
| Pino 136 | RTC_XTAL32 — 32 kHz crystal input (RTC) |
| Pino 137 | RTC_XTAL32B — 32 kHz crystal output (RTC) |
| Pino 138 | EXTAL0 — External crystal/oscillator input (system clock) |
| Pino 139 | XTAL0 — External crystal output (system clock) |
| Pino 140 | RESET_b — Active-low reset input |
| Pino 141 | NMI_b — Non-maskable interrupt input |
| Pino 142 | PTG0 — GPIO / SWD clock for debug |
| Pino 143 | PTG1 — GPIO / SWD I/O for debug |
| Pino 144 | PTG2 — GPIO |
Aplicações típicas
MK50DN512CLQ10 é adequado para 6 aplicaçãos: Medical Instrumentation and Diagnostic Devices, Industrial Process Sensors and 4-20 mA Loops, USB-Connected Measurement Instruments, Precision Weigh Scales and Load-Cell Readouts, Data Acquisition Systems and Modular Sensor Hubs, Industrial Battery-Powered Sensor Nodes.
Medical Instrumentation and Diagnostic Devices
The MK50DN512CLQ10 is purpose-built for medical electronics such as blood-glucose meters, pulse oximeters, ECG front ends, and bedside patient monitors. The integrated operational and trans-impedance amplifiers feed the dual 16-bit SAR ADCs at low latency, allowing direct connection to biopotential electrodes without external instrumentation amplifiers. The Cortex-M4 with single-precision FPU runs on-chip DSP filter and FFT routines for heart-rate variability and SpO2 calculation, while 128 KB SRAM accommodates waveform buffers. USB full-speed enables tethered firmware updates and patient-data sync to a host PC; 512 KB flash stores application code, calibration tables, and lookup arrays. The 144-LQFP package supports the 96 GPIO count needed for display, keypad, and serial sensor expansion.
Recomendado
Industrial Process Sensors and 4-20 mA Loops
The Kinetis K50 analog front end makes MK50DN512CLQ10 ideal for industrial process sensors: pressure transmitters, flow meters, RTD-based temperature probes, and weigh-scale load cells. The integrated op-amps implement programmable-gain and trans-impedance stages; the 16-bit ADCs oversampled to 24-bit effective resolution handle millivolt-level sensor outputs directly. The Cortex-M4 DSP extensions convert raw ADC samples into filtered engineering units, while 512 KB flash stores calibration coefficients and lookup tables. The 96 GPIO fan-out supports parallel keypad, LCD, and HART modem interfaces. Robustness for factory environments is addressed by the -40 C to +85 C industrial temperature range and 1.71 V to 3.6 V supply tolerance accommodating 24V loop-powered rails down to 3.6V regulated rails.
Recomendado
USB-Connected Measurement Instruments
The MK50DN512CLQ10 integrates a USB full-speed controller with on-chip transceiver, eliminating external PHY chips and reducing BOM for tethered laboratory instruments. With 100 MHz Cortex-M4 and floating-point DSP, the part acquires signals from bench DMMs, oscilloscope front ends, and USB data loggers, then streams processed data over USB to a host PC. The 512 KB flash accommodates firmware with USB class drivers, lookup tables, and calibration matrices, while 128 KB SRAM buffers packet transfers. The integrated op-amp/ADC chain allows direct sensing of thermocouples, strain gauges, and photodiodes. The 144-LQFP package provides 96 GPIO for front-panel encoder switches, function keys, and segment displays commonly found in bench instruments.
Recomendado
Precision Weigh Scales and Load-Cell Readouts
Load-cell signal chains typically require low-noise amplifiers and a high-resolution ADC. The MK50DN512CLQ10 combines both on-chip: trans-impedance op-amps condition microvolt-class load-cell signals and the dual 16-bit SAR ADCs operate with averaging to achieve 24-bit effective resolution. The Cortex-M4 DSP performs digital filtering, linearization against calibration weights, and tare computation in real time. 512 KB flash stores application code, country-specific firmware locales, and calibration coefficients; 128 KB SRAM buffers the rolling display refresh. The 144-LQFP with 96 GPIO accommodates LCD segment drivers, keypad matrices, and serial ports for retail-POS integration, while the industrial -40 C to +85 C temperature range withstands harsh weighing environments.
Recomendado
Data Acquisition Systems and Modular Sensor Hubs
Modular data acquisition systems aggregate analog and digital sensor inputs over USB or CAN interfaces. The MK50DN512CLQ10's analog measurement engine supports up to a dozen sensor channels per device through the GPIO-driven external analog multiplexer; the 12-bit DAC outputs excitation signals for strain gauges and RTDs. USB full-speed connectivity to a host PC is built in, removing the external PHY cost that single-channel ADCs often require. The 100 MHz Cortex-M4 core runs SPI, I2C, and UART stacks simultaneously for sensor networking. 512 KB flash and 128 KB SRAM cover complex protocol stacks (USB, I2C device drivers, CANopen, Modbus) in production modules.
Recomendado
Industrial Battery-Powered Sensor Nodes
The MK50DN512CLQ10's 1.71 V to 3.6 V supply range accommodates direct battery operation from a single lithium primary cell or two AA cells through end-of-life discharge. Low-leakage modes permit multi-year operation of remote gas detectors, water-quality probes, and structural-health monitors. The integrated op-amps and dual 16-bit ADCs digitize analog sensors at low quiescent current without external instrumentation amplifiers that would otherwise drain the battery. USB charging and diagnostics ports use the integrated full-speed USB controller for periodic tethered log retrieval, eliminating a discrete charge-management IC. The 144-LQFP package suits outdoor enclosures with adequate thermal mass, and the industrial -40 C to +85 C temperature range handles cold-start and high-ambient outdoor deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MK50DN512CLQ10 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MK50DN512ZCLQ10 | MK51DN512CLQ10 | MK52DN512CLQ10 | MK53DX256ZCLQ10 | MK60DN512ZVLQ10 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) |
| Core | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Integrated Op-Amps | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | No (K60 series) |
| Integrated Ethernet MAC | No | No | No | Yes (10/100 with MII/RMII) | No | Yes (10/100) |
| Approx. Price at qty-1000 (USD) | $10.21 | Similar to MK50DN512CLQ10 | Higher (crypto adds cost) | Higher (Ethernet adds cost) | Lower (smaller flash) | Higher (K60 features) |
Principais diferenciais
- Integrated analog measurement engine with op-amps and trans-impedance amplifiers (vs MK60DN512ZVLQ10)
- Same 144-LQFP pinout across K50/K51/K52 families (vs MK51DN512CLQ10)
- Drop-in tape-and-reel packaging variant (vs MK50DN512ZCLQ10)
Notas de projeto
Estimated: The K50 analog front end is sensitive to supply ripple; place a 0.1uF ceramic bypass capacitor within 5 mm of each VDDA pin and a 10uF bulk capacitor near VDD, with separate analog and digital ground returns joined at a single point under the MCU. USB VOUT33 pin requires a 1uF decoupling capacitor to ground; do not draw load current from VOUT33 other than MCU-internal use.
The 144-LQFP exposes analog and digital supply pins interspersed across the package; route VDDA traces as wide as possible to the analog section and keep ADC reference pins (VREFH/VREFL) guarded by a ground pour. Place external 32.768 kHz RTC crystal within 5 mm of the RTC_XTAL32 pins; load capacitors (10-20 pF typical) are mandatory and must be sized per crystal manufacturer datasheet, not generic values.
Do not exceed 3.6 V on any MCU pin including USB DP/DM - excessive voltage injects latch-up risk. When enabling AES or Ethernet on MK51/MK52 alternatives, ensure firmware re-validates the security/connectivity stacks during in-field firmware updates; the integrated op-amps have limited drive current (~1 mA) and must not be used to directly drive low-impedance loads like speakers or relay coils. The MCG (multipurpose clock generator) configuration must explicitly transition through FEI -> FBI -> FBE -> PBE states when switching to external reference; attempting a direct switch fails the lock detect.
Estimated: At maximum 100 MHz operation with all peripherals active and USB running, the 144-LQFP dissipates approximately 200-300 mW. The package has theta_JA of approximately 40-50 C/W on a 4-layer 2 oz PCB, yielding junction-to-ambient rise of 10-15 C - well within industrial -40 to +85 C ambient. For tight enclosure designs, allocate at least 100 mm² of unbroken copper ground plane under the MCU to keep junction rise below 10 C.
USB DP/DM traces must be routed as a 90-ohm differential pair with continuous reference plane, length-matched within 2 mm. Keep the pair away from switching regulators or RF traces - cross coupling on USB data lines causes enumeration failures and EN_GOOD errors. For low-impedance analog sensor inputs to the integrated op-amps, route differential traces together and place a low-pass RC filter (1 kohm + 1 nF typical) within 3 mm of the input pin for EMI suppression.
Informações de conformidade
RoHS compliant per NXP product page. Industrial temperature grade -40 C to +85 C. AEC-Q100 not applicable - this is an industrial part; choose KEA or S32K automotive MCU families for AEC-Q100 qualified parts.