MK50DN512CLQ10 - Kinetis K50 100MHz Cortex-M4 MCU 512KB | NXP
부품 번호: MK50DN512CLQ10 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $16.92 | $16.92 |
| 10 | $15.23 | $152.30 |
| 100 | $13.55 | $1,355.00 |
| 500 | $11.89 | $5,945.00 |
| 1,000 | $10.21 | $10,210.00 |
MK50DN512CLQ10 개요
A Kinetis microcontroller is a member of NXP's Cortex-M4 MCU family that combines deterministic interrupt response with DSP extensions, signal-conditioning analog front ends, and low-power peripherals. Within the broader taxonomy, MK50DN512CLQ10 is a microcontroller -> 32-bit MCU -> ARM Cortex-M MCU -> Kinetis K-series, designed for mixed-signal measurement and precision sensor interfacing. The K50 sub-family specifically adds an analog measurement engine that integrates operational amplifiers and high-resolution ADCs, enabling direct connection to low-level analog sensors without external signal chain components.
Key features include 100 MHz Cortex-M4 core with single-precision FPU and DSP instructions at 1.25 Dhrystone MIPS per MHz, 512 KB flash with flash write voltage range of 1.71 V to 3.6 V matching supply, 128 KB SRAM, an integrated USB full-speed controller with on-chip transceiver, dual 16-bit SAR ADCs with up to 24-bit effective resolution through oversampling, 12-bit DAC, programmable gain amplifiers, and hardware cryptographic acceleration. The 144-pin LQFP package exposes 96 GPIO with multiple low-power modes.
Architecturally, the Kinetis K50 MCU uses a Cortex-M4 core with nested vector interrupt controller, low-latency memory bus matrix, dual-bank flash with EEPROM-like emulation, and a peripheral-rich subsystem. The integrated analog engine reduces BOM by collapsing op-amp + ADC + DAC chains onto the silicon, while the FPU and DSP extensions enable on-chip DSP for sensor fusion without external accelerators.
Typical applications include medical instrumentation such as blood-glucose meters, pulse oximeters, and ECG front ends; industrial process sensors with 4-20 mA loops; precision weigh scales; data acquisition systems; and USB-connected measurement instruments that benefit from the integrated full-speed USB and high-resolution ADC chain.
Designers should evaluate total analog input offset drift vs sensor bandwidth, then size the internal PGA gain stage and select the appropriate averaging factor for the chosen ADC sample rate; the integrated op-amps typically drive only a few mA and are intended for high-impedance sources, requiring external buffers for low-impedance loads.
This page synthesizes distributor pricing, Kinetis K50 family drop-in alternatives, and practical design notes for the MK50DN512CLQ10 not aggregated on the manufacturer product page.
드롭인 대체품: MK50DN512CLQ10 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MK50DN512CLQ10 (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, DAC, Operating Temperature Range, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MK50DN512ZCLQ10
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MK51DN512CLQ10
✅ 드롭인✓ 재고 있음
$9.45 / 개
데이터시트 보기 →MK52DN512CLQ10
✅ 드롭인✓ 재고 있음
$13.02 / 개
데이터시트 보기 →MK53DX256ZCLQ10
✅ 드롭인✓ 재고 있음
$11.45 / 개
데이터시트 보기 →MK60DN512ZVMC10
✅ 드롭인✓ 재고 있음
$7.94 / 개
데이터시트 보기 →MK60DN512ZVLQ10
✅ 드롭인✓ 재고 있음
$9.3 / 개
데이터시트 보기 →MK50DN512CLQ10 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-M4 with FPU and DSP |
| Maximum CPU Frequency | 100 MHz |
| Dhrystone Performance | 1.25 MIPS per MHz |
| Program Flash Memory | 512 KB |
| SRAM | 128 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| 동작 온도 범위 | -40 C to +85 C (industrial) |
| GPIO Count | 96 I/O |
| USB Controller | USB 2.0 Full-Speed, on-chip transceiver |
| ADC Resolution | Dual 16-bit SAR with up to 24-bit effective via oversampling |
| DAC Resolution | 12-bit |
| Integrated Amplifiers | Operational amplifiers and trans-impedance amplifiers |
| 패키지 | 144-pin LQFP (20 x 20 mm) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
MK50DN512CLQ10 핀 구성
| 핀 1 | PTC0 — GPIO / Touch sensing channel 0 |
| 핀 2 | PTC1 — GPIO / Touch sensing channel 1 |
| 핀 3 | PTC2 — GPIO / Touch sensing channel 2 |
| 핀 4 | PTC3 — GPIO / Touch sensing channel 3 |
| 핀 5 | PTC4 — GPIO / Touch sensing channel 4 |
| 핀 6 | PTC5 — GPIO / Touch sensing channel 5 |
| 핀 7 | PTC6 — GPIO / Touch sensing channel 6 |
| 핀 8 | PTC7 — GPIO / Touch sensing channel 7 |
| 핀 9 | PTC8 — GPIO / Touch sensing channel 8 |
| 핀 10 | PTC9 — GPIO / Touch sensing channel 9 |
| 핀 11 | PTC10 — GPIO / Touch sensing channel 10 |
| 핀 12 | PTC11 — GPIO / Touch sensing channel 11 |
| 핀 13 | PTC12 — GPIO / Touch sensing channel 12 |
| 핀 14 | PTC13 — GPIO / Touch sensing channel 13 |
| 핀 15 | PTC14 — GPIO / Touch sensing channel 14 |
| 핀 16 | PTC15 — GPIO / Touch sensing channel 15 |
| 핀 17 | PTC16 — GPIO / Touch sensing channel 16 |
| 핀 18 | PTC17 — GPIO / Touch sensing channel 17 |
| 핀 19 | PTC18 — GPIO / Touch sensing channel 18 |
| 핀 20 | PTC19 — GPIO / Touch sensing channel 19 |
| 핀 21 | PTD0 — GPIO (general purpose) |
| 핀 22 | PTD1 — GPIO / SPI0 PCS for ADC communication |
| 핀 23 | PTD2 — GPIO / SPI0 SCK |
| 핀 24 | PTD3 — GPIO / SPI0 MOSI |
| 핀 25 | PTD4 — GPIO / SPI0 MISO |
| 핀 26 | PTD5 — GPIO / SPI1 PCS for DAC communication |
| 핀 27 | PTD6 — GPIO / SPI1 SCK for DAC |
| 핀 28 | PTD7 — GPIO / SPI1 MOSI for DAC |
| 핀 29 | PTH0 — GPIO |
| 핀 30 | PTH1 — GPIO |
| 핀 31 | PTH2 — GPIO |
| 핀 32 | PTH3 — GPIO |
| 핀 33 | PTH4 — GPIO |
| 핀 34 | PTH5 — GPIO |
| 핀 35 | PTH6 — GPIO |
| 핀 36 | PTH7 — GPIO / I2C0 SDA |
| 핀 37 | PTH8 — GPIO / I2C0 SCL |
| 핀 38 | PTH9 — GPIO |
| 핀 39 | PTH10 — GPIO |
| 핀 40 | PTH11 — GPIO |
| 핀 41 | PTH12 — GPIO |
| 핀 42 | PTH13 — GPIO |
| 핀 43 | PTH14 — GPIO |
| 핀 44 | PTH15 — GPIO |
| 핀 45 | PTH16 — GPIO |
| 핀 46 | PTH17 — GPIO |
| 핀 47 | PTF0 — GPIO |
| 핀 48 | PTF1 — GPIO |
| 핀 49 | PTF2 — GPIO |
| 핀 50 | PTF3 — GPIO |
| 핀 51 | PTF4 — GPIO |
| 핀 52 | PTF5 — GPIO |
| 핀 53 | PTF6 — GPIO |
| 핀 54 | PTF7 — GPIO |
| 핀 55 | PTF8 — GPIO |
| 핀 56 | PTF9 — GPIO |
| 핀 57 | PTF10 — GPIO |
| 핀 58 | PTF11 — GPIO |
| 핀 59 | PTF12 — GPIO |
| 핀 60 | PTF13 — GPIO |
| 핀 61 | PTF14 — GPIO |
| 핀 62 | PTF15 — GPIO |
| 핀 63 | PTF16 — GPIO |
| 핀 64 | PTF17 — GPIO |
| 핀 65 | PTF18 — GPIO |
| 핀 66 | PTF19 — GPIO |
| 핀 67 | PTA0 — GPIO / UART0 CTS |
| 핀 68 | PTA1 — GPIO / UART0 RX |
| 핀 69 | PTA2 — GPIO / UART0 TX |
| 핀 70 | PTA3 — GPIO / UART0 RTS |
| 핀 71 | PTA4 — GPIO |
| 핀 72 | PTA5 — GPIO |
| 핀 73 | PTA6 — GPIO |
| 핀 74 | PTA7 — GPIO |
| 핀 75 | PTA8 — GPIO |
| 핀 76 | PTA9 — GPIO |
| 핀 77 | PTA10 — GPIO |
| 핀 78 | PTA11 — GPIO |
| 핀 79 | PTA12 — GPIO |
| 핀 80 | PTA13 — GPIO |
| 핀 81 | PTA14 — GPIO |
| 핀 82 | PTA15 — GPIO |
| 핀 83 | PTA16 — GPIO |
| 핀 84 | PTA17 — GPIO |
| 핀 85 | PTA18 — GPIO |
| 핀 86 | PTA19 — GPIO |
| 핀 87 | PTB0 — GPIO / ADC0 channel 0 |
| 핀 88 | PTB1 — GPIO / ADC0 channel 1 |
| 핀 89 | PTB2 — GPIO / ADC0 channel 2 |
| 핀 90 | PTB3 — GPIO / ADC0 channel 3 |
| 핀 91 | PTB4 — GPIO / ADC0 channel 4 |
| 핀 92 | PTB5 — GPIO / ADC0 channel 5 |
| 핀 93 | PTB6 — GPIO / ADC0 channel 6 |
| 핀 94 | PTB7 — GPIO / ADC0 channel 7 |
| 핀 95 | PTB8 — GPIO / ADC0 channel 8 |
| 핀 96 | PTB9 — GPIO / ADC0 channel 9 |
| 핀 97 | PTB10 — GPIO / ADC0 channel 10 |
| 핀 98 | PTB11 — GPIO / ADC0 channel 11 |
| 핀 99 | PTB12 — GPIO / ADC0 channel 12 |
| 핀 100 | PTB13 — GPIO / ADC0 channel 13 |
| 핀 101 | PTB14 — GPIO / ADC0 channel 14 |
| 핀 102 | PTB15 — GPIO / ADC0 channel 15 |
| 핀 103 | PTB16 — GPIO / ADC0 channel 16 |
| 핀 104 | PTB17 — GPIO / ADC0 channel 17 |
| 핀 105 | PTB18 — GPIO / ADC0 channel 18 |
| 핀 106 | PTB19 — GPIO / ADC0 channel 19 |
| 핀 107 | PTE0 — GPIO |
| 핀 108 | PTE1 — GPIO |
| 핀 109 | PTE2 — GPIO |
| 핀 110 | PTE3 — GPIO |
| 핀 111 | PTE4 — GPIO |
| 핀 112 | PTE5 — GPIO |
| 핀 113 | PTE6 — GPIO |
| 핀 114 | PTE7 — GPIO |
| 핀 115 | PTE8 — GPIO |
| 핀 116 | PTE9 — GPIO |
| 핀 117 | PTE10 — GPIO / LLWU_P10 |
| 핀 118 | PTE11 — GPIO / LLWU_P11 |
| 핀 119 | PTE12 — GPIO |
| 핀 120 | PTE13 — GPIO |
| 핀 121 | PTE14 — GPIO |
| 핀 122 | PTE15 — GPIO |
| 핀 123 | PTE16 — GPIO |
| 핀 124 | PTE17 — GPIO |
| 핀 125 | PTE18 — GPIO |
| 핀 126 | PTE19 — GPIO |
| 핀 127 | USB0_DP — USB Full-Speed data plus |
| 핀 128 | USB0_DM — USB Full-Speed data minus |
| 핀 129 | VOUT33 — USB regulator 3.3V output |
| 핀 130 | VDDA — Analog supply voltage |
| 핀 131 | VSS — Ground |
| 핀 132 | VREFH — ADC reference voltage high |
| 핀 133 | VREFL — ADC reference voltage low |
| 핀 134 | VDD — Main digital supply voltage |
| 핀 135 | VSS — Ground |
| 핀 136 | RTC_XTAL32 — 32 kHz crystal input (RTC) |
| 핀 137 | RTC_XTAL32B — 32 kHz crystal output (RTC) |
| 핀 138 | EXTAL0 — External crystal/oscillator input (system clock) |
| 핀 139 | XTAL0 — External crystal output (system clock) |
| 핀 140 | RESET_b — Active-low reset input |
| 핀 141 | NMI_b — Non-maskable interrupt input |
| 핀 142 | PTG0 — GPIO / SWD clock for debug |
| 핀 143 | PTG1 — GPIO / SWD I/O for debug |
| 핀 144 | PTG2 — GPIO |
일반적인 애플리케이션
MK50DN512CLQ10 적합 용도: 6 애플리케이션s: Medical Instrumentation and Diagnostic Devices, Industrial Process Sensors and 4-20 mA Loops, USB-Connected Measurement Instruments, Precision Weigh Scales and Load-Cell Readouts, Data Acquisition Systems and Modular Sensor Hubs, Industrial Battery-Powered Sensor Nodes.
Medical Instrumentation and Diagnostic Devices
The MK50DN512CLQ10 is purpose-built for medical electronics such as blood-glucose meters, pulse oximeters, ECG front ends, and bedside patient monitors. The integrated operational and trans-impedance amplifiers feed the dual 16-bit SAR ADCs at low latency, allowing direct connection to biopotential electrodes without external instrumentation amplifiers. The Cortex-M4 with single-precision FPU runs on-chip DSP filter and FFT routines for heart-rate variability and SpO2 calculation, while 128 KB SRAM accommodates waveform buffers. USB full-speed enables tethered firmware updates and patient-data sync to a host PC; 512 KB flash stores application code, calibration tables, and lookup arrays. The 144-LQFP package supports the 96 GPIO count needed for display, keypad, and serial sensor expansion.
추천
Industrial Process Sensors and 4-20 mA Loops
The Kinetis K50 analog front end makes MK50DN512CLQ10 ideal for industrial process sensors: pressure transmitters, flow meters, RTD-based temperature probes, and weigh-scale load cells. The integrated op-amps implement programmable-gain and trans-impedance stages; the 16-bit ADCs oversampled to 24-bit effective resolution handle millivolt-level sensor outputs directly. The Cortex-M4 DSP extensions convert raw ADC samples into filtered engineering units, while 512 KB flash stores calibration coefficients and lookup tables. The 96 GPIO fan-out supports parallel keypad, LCD, and HART modem interfaces. Robustness for factory environments is addressed by the -40 C to +85 C industrial temperature range and 1.71 V to 3.6 V supply tolerance accommodating 24V loop-powered rails down to 3.6V regulated rails.
추천
USB-Connected Measurement Instruments
The MK50DN512CLQ10 integrates a USB full-speed controller with on-chip transceiver, eliminating external PHY chips and reducing BOM for tethered laboratory instruments. With 100 MHz Cortex-M4 and floating-point DSP, the part acquires signals from bench DMMs, oscilloscope front ends, and USB data loggers, then streams processed data over USB to a host PC. The 512 KB flash accommodates firmware with USB class drivers, lookup tables, and calibration matrices, while 128 KB SRAM buffers packet transfers. The integrated op-amp/ADC chain allows direct sensing of thermocouples, strain gauges, and photodiodes. The 144-LQFP package provides 96 GPIO for front-panel encoder switches, function keys, and segment displays commonly found in bench instruments.
추천
Precision Weigh Scales and Load-Cell Readouts
Load-cell signal chains typically require low-noise amplifiers and a high-resolution ADC. The MK50DN512CLQ10 combines both on-chip: trans-impedance op-amps condition microvolt-class load-cell signals and the dual 16-bit SAR ADCs operate with averaging to achieve 24-bit effective resolution. The Cortex-M4 DSP performs digital filtering, linearization against calibration weights, and tare computation in real time. 512 KB flash stores application code, country-specific firmware locales, and calibration coefficients; 128 KB SRAM buffers the rolling display refresh. The 144-LQFP with 96 GPIO accommodates LCD segment drivers, keypad matrices, and serial ports for retail-POS integration, while the industrial -40 C to +85 C temperature range withstands harsh weighing environments.
추천
Data Acquisition Systems and Modular Sensor Hubs
Modular data acquisition systems aggregate analog and digital sensor inputs over USB or CAN interfaces. The MK50DN512CLQ10's analog measurement engine supports up to a dozen sensor channels per device through the GPIO-driven external analog multiplexer; the 12-bit DAC outputs excitation signals for strain gauges and RTDs. USB full-speed connectivity to a host PC is built in, removing the external PHY cost that single-channel ADCs often require. The 100 MHz Cortex-M4 core runs SPI, I2C, and UART stacks simultaneously for sensor networking. 512 KB flash and 128 KB SRAM cover complex protocol stacks (USB, I2C device drivers, CANopen, Modbus) in production modules.
추천
Industrial Battery-Powered Sensor Nodes
The MK50DN512CLQ10's 1.71 V to 3.6 V supply range accommodates direct battery operation from a single lithium primary cell or two AA cells through end-of-life discharge. Low-leakage modes permit multi-year operation of remote gas detectors, water-quality probes, and structural-health monitors. The integrated op-amps and dual 16-bit ADCs digitize analog sensors at low quiescent current without external instrumentation amplifiers that would otherwise drain the battery. USB charging and diagnostics ports use the integrated full-speed USB controller for periodic tethered log retrieval, eliminating a discrete charge-management IC. The 144-LQFP package suits outdoor enclosures with adequate thermal mass, and the industrial -40 C to +85 C temperature range handles cold-start and high-ambient outdoor deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: MK50DN512CLQ10 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MK50DN512ZCLQ10 | MK51DN512CLQ10 | MK52DN512CLQ10 | MK53DX256ZCLQ10 | MK60DN512ZVLQ10 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) |
| Core | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Integrated Op-Amps | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | No (K60 series) |
| Integrated Ethernet MAC | No | No | No | Yes (10/100 with MII/RMII) | No | Yes (10/100) |
| Approx. Price at qty-1000 (USD) | $10.21 | Similar to MK50DN512CLQ10 | Higher (crypto adds cost) | Higher (Ethernet adds cost) | Lower (smaller flash) | Higher (K60 features) |
주요 차별점
- Integrated analog measurement engine with op-amps and trans-impedance amplifiers (vs MK60DN512ZVLQ10)
- Same 144-LQFP pinout across K50/K51/K52 families (vs MK51DN512CLQ10)
- Drop-in tape-and-reel packaging variant (vs MK50DN512ZCLQ10)
설계 노트
Estimated: The K50 analog front end is sensitive to supply ripple; place a 0.1uF ceramic bypass capacitor within 5 mm of each VDDA pin and a 10uF bulk capacitor near VDD, with separate analog and digital ground returns joined at a single point under the MCU. USB VOUT33 pin requires a 1uF decoupling capacitor to ground; do not draw load current from VOUT33 other than MCU-internal use.
The 144-LQFP exposes analog and digital supply pins interspersed across the package; route VDDA traces as wide as possible to the analog section and keep ADC reference pins (VREFH/VREFL) guarded by a ground pour. Place external 32.768 kHz RTC crystal within 5 mm of the RTC_XTAL32 pins; load capacitors (10-20 pF typical) are mandatory and must be sized per crystal manufacturer datasheet, not generic values.
Do not exceed 3.6 V on any MCU pin including USB DP/DM - excessive voltage injects latch-up risk. When enabling AES or Ethernet on MK51/MK52 alternatives, ensure firmware re-validates the security/connectivity stacks during in-field firmware updates; the integrated op-amps have limited drive current (~1 mA) and must not be used to directly drive low-impedance loads like speakers or relay coils. The MCG (multipurpose clock generator) configuration must explicitly transition through FEI -> FBI -> FBE -> PBE states when switching to external reference; attempting a direct switch fails the lock detect.
Estimated: At maximum 100 MHz operation with all peripherals active and USB running, the 144-LQFP dissipates approximately 200-300 mW. The package has theta_JA of approximately 40-50 C/W on a 4-layer 2 oz PCB, yielding junction-to-ambient rise of 10-15 C - well within industrial -40 to +85 C ambient. For tight enclosure designs, allocate at least 100 mm² of unbroken copper ground plane under the MCU to keep junction rise below 10 C.
USB DP/DM traces must be routed as a 90-ohm differential pair with continuous reference plane, length-matched within 2 mm. Keep the pair away from switching regulators or RF traces - cross coupling on USB data lines causes enumeration failures and EN_GOOD errors. For low-impedance analog sensor inputs to the integrated op-amps, route differential traces together and place a low-pass RC filter (1 kohm + 1 nF typical) within 3 mm of the input pin for EMI suppression.
규정 준수 정보
RoHS compliant per NXP product page. Industrial temperature grade -40 C to +85 C. AEC-Q100 not applicable - this is an industrial part; choose KEA or S32K automotive MCU families for AEC-Q100 qualified parts.