MK60FN1M0VMD12 - 1MB Flash Cortex-M4F Kinetis MCU | NXP
N.º da peça: MK60FN1M0VMD12 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $16.82 | $168,20 |
| 100 | $14.91 | $1.491,00 |
| 500 | $12.74 | $6.370,00 |
| 1.000 | $11.2 | $11.200,00 |
MK60FN1M0VMD12 Visão geral
A Kinetis K60 MCU is an ARM Cortex-M4F microcontroller from NXP's Kinetis family of Cortex-M based devices. Kinetis microcontrollers span low-power K0/K1 (Cortex-M0+), mainstream K2x (Cortex-M4), high-performance K6x (Cortex-M4F with FPU + DSP), and application-specific K7x/K8x variants. The K60 specifically targets industrial control, connectivity-rich embedded designs, and human-machine interface (HMI) applications where Ethernet, USB, and graphics LCD support are required.
Key features include the ARM Cortex-M4F core with single-precision FPU and DSP instructions, 120 MHz maximum CPU frequency, 1 MB Flash with FlexMemory EEPROM emulation, 128 KB SRAM, integrated 10/100 Ethernet MAC with IEEE 1588 timestamp support, USB 2.0 Full-Speed on-the-go plus USB 2.0 High-Speed PHY, and a 16-bit SAR ADC. Operating voltage is 1.71 V to 3.6 V with industrial temperature range of -40C to +105C.
The MK60FN1M0VMD12 is fabricated in 90 nm TFS technology, providing deterministic interrupt latency and low-power run modes down to approximately 200 uA/MHz. Its Cortex-M4F DSP extensions enable efficient audio decoding and sensor fusion on-chip without external DSP ICs. The integrated 144-pin MAPBGA exposes 16 ADC channels, two FlexCAN modules, three SPI, three I2C, and two UART peripherals for broad system connectivity.
Typical applications include industrial Ethernet-connected PLCs, USB-equipped HMI panels, building automation gateways, motor-control inverters, and audio-enabled point-of-sale terminals. The combination of Ethernet + dual USB + large memory uniquely fits IoT gateways and factory-automation controllers.
Designers should plan for a 4-layer PCB with impedance-controlled USB differential routing when using the integrated HS-USB PHY, and follow NXP's K60 hardware design guidelines for SDRAM interface layout. An external 25 MHz or 50 MHz crystal is required for the Ethernet PHY reference clock. Free development is supported via MCUXpresso IDE with the older KSDK 1.x for this 120 MHz K60 sub-family.
This page synthesizes distributor pricing, drop-in alternatives from the Kinetis K60 family and competitor Cortex-M4F parts, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para MK60FN1M0VMD12 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MK60FN1M0VMD12 (mesmo formato e footprint) — diferindo em Package, Core Architecture, DAC, ADC, Operating Temperature Range.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MK60FN1M0VMD12R
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK60FN1M0VMD15
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK60DN512VMD10
✅ Drop-In✓ Em estoque
$8.12 / unidade
Ver ficha técnica →MK60FN1M0VMD12R
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK20FN1M0VMD12
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK60FN1M0VMD12 Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4F (with FPU + DSP) |
| CPU Maximum Frequency | 120 MHz |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 128 KB |
| FlexMemory / EEPROM Emulation | Yes (256 KB FlexNVM, partitionable) |
| Operating Voltage Range | 1.71 V to 3.6 V |
| Temperatura de operação | -40C to +105C (Industrial) |
| Encapsulamento | 144-MAPBGA 13x13 mm |
| USB | USB 2.0 Full-Speed OTG + USB 2.0 High-Speed (with integrated PHY) |
| Ethernet | 10/100 Mbps MAC with IEEE 1588 (MII/RMII interface to external PHY) |
| SAR ADC | 16-bit, dual ADC, up to 24 channels |
| DAC | 12-bit DAC |
| Timers | FlexTimer (FTM) modules; PDB; LPIT |
| Communication Peripherals | 3x UART, 2x CAN (FlexCAN), 3x SPI, 3x I2C, I2S |
| External Bus | FlexBus + SDRAM controller |
| Low-Power Modes | VLLS0/1/3, LLS, VLPR, RUN modes (~200 uA/MHz typical) |
| Security | Hardware CRC, tamper detect, unique 80-bit device ID |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do MK60FN1M0VMD12
| Pino A1 | VSS — Ground |
| Pino A2 | VDD — Core logic supply (1.71 V to 3.6 V) |
| Pino A3 | PTA0 — GPIO / UART0_CTS / FTM0_CH0 |
| Pino A4 | PTA1 — GPIO / UART0_RX / FTM0_CH1 |
| Pino A5 | PTA2 — GPIO / UART0_TX / FTM0_CH2 |
| Pino A6 | PTA3 — GPIO / UART0_RTS / FTM0_CH3 |
| Pino A7 | PTA4 — GPIO / UART1_CTS / FTM0_FLT1 |
| Pino B1 | PTA5 — GPIO / UART1_RX |
| Pino B2 | PTA6 — GPIO / UART1_TX |
| Pino B3 | PTA7 — GPIO / I2S0_MCLK |
| Pino B4 | PTB0 — GPIO / I2C0_SCL |
| Pino B5 | PTB1 — GPIO / I2C0_SDA |
| Pino B6 | PTB2 — GPIO / I2C0_SCL (alt) |
| Pino B7 | PTB3 — GPIO / I2C0_SDA (alt) |
| Pino C1 | VDDA — Analog supply (3.3 V typical) |
| Pino C2 | VREFH — ADC reference voltage high |
| Pino C3 | VREFL — ADC reference voltage low |
| Pino C4 | PTB4 — GPIO / FTM1_CH0 / SDHC0_D4 |
| Pino C5 | PTB5 — GPIO / FTM1_CH1 / SDHC0_D5 |
| Pino C6 | PTB6 — GPIO / FTM1_CH2 / SDHC0_D6 |
| Pino C7 | PTB7 — GPIO / FTM1_CH3 / SDHC0_D7 |
| Pino D1 | PTC0 — GPIO / FTM2_CH0 / I2S0_TXD0 |
| Pino D2 | PTC1 — GPIO / FTM2_CH1 / I2S0_TX_FS |
| Pino D3 | PTC2 — GPIO / FTM2_CH2 / I2S0_TX_BCLK |
| Pino D4 | PTC3 — GPIO / FTM2_CH3 / I2S0_RXD0 |
| Pino D5 | PTC4 — GPIO / FTM2_FLT0 / I2S0_RX_BCLK |
| Pino D6 | PTC5 — GPIO / FTM2_FLT1 / I2S0_RX_FS |
| Pino D7 | PTC6 — GPIO / CMP0_OUT / I2S0_MCLK (alt) |
| Pino E1 | PTC7 — GPIO / CMP1_OUT / SDHC0_CLK |
| Pino E2 | PTD0 — GPIO / FTM3_CH0 / SPI0_PCS0 |
| Pino E3 | PTD1 — GPIO / FTM3_CH1 / SPI0_SCK |
| Pino E4 | PTD2 — GPIO / FTM3_CH2 / SPI0_SOUT |
| Pino E5 | PTD3 — GPIO / FTM3_CH3 / SPI0_SIN |
| Pino E6 | PTD4 — GPIO / FTM0_CH4 / SPI1_PCS0 |
| Pino E7 | PTD5 — GPIO / FTM0_CH5 / SPI1_SCK |
| Pino F1 | PTD6 — GPIO / FTM0_CH6 / SPI1_SOUT |
| Pino F2 | PTD7 — GPIO / FTM0_CH7 / SPI1_SIN |
| Pino F3 | PTE0 — GPIO / UART1_CTS / SDHC0_D1 |
| Pino F4 | PTE1 — GPIO / UART1_RX / SDHC0_D0 |
| Pino F5 | PTE2 — GPIO / UART1_TX / SDHC0_D2 |
| Pino F6 | PTE3 — GPIO / UART1_RTS / SDHC0_D3 |
| Pino F7 | PTE4 — GPIO / I2C1_SCL / SDHC0_CMD |
| Pino G1 | PTE5 — GPIO / I2C1_SDA / SDHC0_D4 |
| Pino G2 | PTE6 — GPIO / CAN0_RX |
| Pino G3 | PTE7 — GPIO / CAN0_TX |
| Pino G4 | PTF0 — GPIO / FTM2_CH0 / UART3_RX |
| Pino G5 | PTF1 — GPIO / FTM2_CH1 / UART3_TX |
| Pino G6 | PTF2 — GPIO / FTM2_CH2 / I2C2_SCL |
| Pino G7 | PTF3 — GPIO / FTM2_CH3 / I2C2_SDA |
| Pino H1 | PTF4 — GPIO / FTM2_FLT0 / SDHC0_D5 |
| Pino H2 | PTF5 — GPIO / FTM2_FLT1 / SDHC0_D6 |
| Pino H3 | PTF6 — GPIO / CMP2_OUT / SDHC0_D7 |
| Pino H4 | PTF7 — GPIO / UART2_RX / SDHC0_CLK |
| Pino H5 | PTG0 — GPIO / UART2_TX / SDHC0_CMD |
| Pino H6 | PTG1 — GPIO / I2C0_SCL / SPI1_PCS1 |
| Pino H7 | PTG2 — GPIO / I2C0_SDA / SPI1_PCS2 |
| Pino J1 | PTG3 — GPIO / FTM1_CH4 / SDHC0_D4 |
| Pino J2 | PTG4 — GPIO / FTM1_CH5 / SDHC0_D5 |
| Pino J3 | PTG5 — GPIO / FTM1_CH6 / SDHC0_D6 |
| Pino J4 | PTG6 — GPIO / FTM1_CH7 / SDHC0_D7 |
| Pino J5 | PTG7 — GPIO / FTM2_CH4 / SDHC0_CLK |
| Pino J6 | PTH0 — GPIO / FTM2_CH5 / SDHC0_CMD |
| Pino J7 | PTH1 — GPIO / FTM2_CH6 / SDHC0_D0 |
| Pino K1 | PTH2 — GPIO / FTM2_CH7 / SDHC0_D1 |
| Pino K2 | PTH3 — GPIO / SPI2_PCS0 / SDHC0_D2 |
| Pino K3 | PTH4 — GPIO / SPI2_SCK / SDHC0_D3 |
| Pino K4 | PTH5 — GPIO / SPI2_SOUT / SDHC0_D4 |
| Pino K5 | PTH6 — GPIO / SPI2_SIN / SDHC0_D5 |
| Pino K6 | PTH7 — GPIO / UART3_RX / SDHC0_D6 |
| Pino K7 | PTI0 — GPIO / UART3_TX / SDHC0_D7 |
| Pino L1 | PTI1 — GPIO / FTM0_CH4 / CAN0_RX (alt) |
| Pino L2 | PTI2 — GPIO / FTM0_CH5 / CAN0_TX (alt) |
| Pino L3 | PTI3 — GPIO / FTM0_CH6 / I2C1_SCL (alt) |
| Pino L4 | PTI4 — GPIO / FTM0_CH7 / I2C1_SDA (alt) |
| Pino L5 | PTI5 — GPIO / CMP0_OUT / FTM1_FLT0 |
| Pino L6 | PTI6 — GPIO / CMP1_OUT / FTM1_FLT1 |
| Pino L7 | PTJ0 — GPIO / FTM2_FLT2 |
| Pino M1 | PTJ1 — GPIO / FTM2_FLT3 |
| Pino M2 | RESET_b — External reset input (active low) |
| Pino M3 | EXTAL — External crystal / clock input |
| Pino M4 | XTAL — External crystal output |
| Pino M5 | VBAT — Battery supply for RTC |
| Pino M6 | TDI — JTAG test data in |
| Pino M7 | TDO — JTAG test data out |
| Pino N1 | USB0_DP — USB 2.0 Full-Speed D+ |
| Pino N2 | USB0_DM — USB 2.0 Full-Speed D- |
| Pino N3 | USB1_DP — USB 2.0 High-Speed D+ |
| Pino N4 | USB1_DM — USB 2.0 High-Speed D- |
| Pino N5 | VREGIN — USB regulator input (5 V) |
| Pino N6 | TCK — JTAG test clock |
| Pino N7 | TMS — JTAG test mode select |
| Pino P1 | NC — Not connected (per datasheet) |
| Pino P2 | NC — Not connected (per datasheet) |
| Pino P3 | NC — Not connected (per datasheet) |
| Pino P4 | NC — Not connected (per datasheet) |
| Pino P5 | NC — Not connected (per datasheet) |
| Pino P6 | NC — Not connected (per datasheet) |
| Pino P7 | NC — Not connected (per datasheet) |
Aplicações típicas
MK60FN1M0VMD12 é adequado para 6 aplicaçãos: Industrial Ethernet-Connected PLC Controller, USB-Equipped HMI / Operator Panel, Building Automation Gateway with Ethernet + USB, Three-Phase Motor Control Inverter, Audio-Enabled Point-of-Sale Terminal, IoT Edge Gateway with Wired Backhaul.
Industrial Ethernet-Connected PLC Controller
The MK60FN1M0VMD12 fits industrial PLC applications because its 120 MHz Cortex-M4F core runs deterministic EtherCAT or Modbus TCP stacks while the on-chip 10/100 Ethernet MAC with IEEE 1588 timestamp support delivers sub-microsecond synchronization to distributed I/O. The 1 MB Flash accommodates a full TCP/IP stack plus ladder-logic runtime, and the 128 KB SRAM holds network buffers and control tables without external memory. The 16-bit SAR ADC reads analog sensor inputs with 1 LSB INL for closed-loop process control, and the dual CAN modules connect to legacy fieldbus networks.
Recomendado
USB-Equipped HMI / Operator Panel
The MK60FN1M0VMD12 is ideal for HMI panels because its dual USB (FS + HS with integrated PHY) supports both USB device firmware updates and USB host peripherals like USB flash drives for data logging. The 120 MHz Cortex-M4F + FPU accelerates TFT-LCD refresh via FlexBus, and the 1 MB Flash stores graphical assets, fonts, and Unicode tables. The 16-bit DAC outputs analog reference voltages for backlight or contrast control. Industrial -40C to +105C operation suits factory-floor mounting without active cooling.
Recomendado
Building Automation Gateway with Ethernet + USB
For BACnet/Modbus building-automation gateways, the MK60FN1M0VMD12's integrated Ethernet MAC plus USB-FS host port lets one MCU aggregate sensor data from multiple fieldbus segments and publish to the building network. The 120 MHz Cortex-M4F runs a real-time OS like FreeRTOS or Zephyr with simultaneous TCP/IP server + USB HID + BACnet MS/TP stacks. The 256 KB FlexMemory provides reliable byte-erasable storage for event logs and configuration, eliminating the need for external EEPROM. Wide 1.71 V to 3.6 V supply tolerance simplifies PoE-derived power design.
Recomendado
Three-Phase Motor Control Inverter
The MK60FN1M0VMD12 drives three-phase PMSM or BLDC inverters using its FlexTimer (FTM) modules for center-aligned PWM generation with sub-100 ns resolution, plus the PDB (Programmable Delay Block) for hardware-triggered ADC sampling synchronized to PWM edges. The 120 MHz Cortex-M4F runs field-oriented control (FOC) algorithms at 20 kHz loop rate with margin, and the Cortex-M4F DSP instructions accelerate Park/Clarke transforms. The 16-bit SAR ADC samples phase currents with 1 LSB accuracy, and the 144-MAPBGA exposes all required PWM + ADC + encoder channels.
Recomendado
Audio-Enabled Point-of-Sale Terminal
The MK60FN1M0VMD12 supports POS terminals needing 1 MB Flash for payment stacks, audio playback, and USB host peripherals. The Cortex-M4F DSP extensions enable on-chip decoding of MP3 or WAV prompts for cardholder announcements, eliminating an external audio DSP. The USB-FS host port drives a magnetic-stripe reader or NFC module, while the integrated 12-bit DAC outputs the audio mixer directly to a Class-D amplifier. Industrial temperature range -40C to +105C handles outdoor kiosk or refrigerated-checkout deployments.
Recomendado
IoT Edge Gateway with Wired Backhaul
The MK60FN1M0VMD12 acts as an IoT edge gateway aggregating Zigbee, Thread, or Bluetooth Low Energy sensor data via SPI/UART-attached modules, then publishing to the cloud over its integrated Ethernet MAC. The 120 MHz Cortex-M4F performs local data reduction and JSON encoding before transmission, and the 1 MB Flash holds OTA firmware upgrade payloads. The dual USB ports enable diagnostic logging to a USB drive. Wide 1.71 V to 3.6 V supply tolerance supports battery-backed operation with brownout protection down to VLLS modes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MK60FN1M0VMD12 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MK60FN1M0VMD12R | MK60FN1M0VMD15 | MK60DN512VMD10 | MK60FN1M0VLQ12 | MK20FN1M0VMD12 |
|---|---|---|---|---|---|---|
| Package | 144-MAPBGA (13x13 mm) | 144-MAPBGA (13x13 mm) - same | 144-MAPBGA (13x13 mm) - same | 144-MAPBGA (13x13 mm) - same | 144-LQFP (20x20 mm) - different | 144-MAPBGA (13x13 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F |
| CPU Max Frequency | 120 MHz | 120 MHz | 150 MHz | 100 MHz | 120 MHz | 120 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 512 KB | 1 MB | 1 MB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Ethernet MAC | 10/100 + IEEE 1588 | 10/100 + IEEE 1588 | 10/100 + IEEE 1588 | 10/100 + IEEE 1588 | 10/100 + IEEE 1588 | None (K20 has no Ethernet) |
| USB | FS OTG + HS PHY | FS OTG + HS PHY | FS OTG + HS PHY | FS OTG + HS PHY | FS OTG + HS PHY | FS OTG only (no HS PHY) |
| Operating Temperature | -40C to +105C (Industrial) | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
Principais diferenciais
- Dual USB with integrated HS PHY (no external ULPI needed) (vs MK20FN1M0VMD12)
- 120 MHz CPU speed grade vs 100 MHz for lower-cost variant (vs MK60DN512VMD10)
- Industrial -40C to +105C temperature range from Freescale/NXP silicon (vs MK60FN1M0VMD12R)
Notas de projeto
The 144-MAPBGA 13x13 mm package has 1 mm ball pitch requiring 4-layer PCB with via-in-pad recommended for the inner ball array escape routing. Use ENIG surface finish to ensure reliable solder joint wetting on the BGA balls. According to NXP K60 hardware design guidelines, all VDD/VDDA/VREFH decoupling capacitors must be placed within 50 mils of their respective supply pins to minimize switching noise on the analog reference.
Power sequencing requires VDD (core) to ramp no later than VDDA (analog) to prevent latch-up of the internal ESD protection diodes. According to NXP K60 documentation, all VDD pins must be tied together and decoupled with at least 100 nF ceramic per pin plus a bulk 4.7 uF. For applications using the USB High-Speed PHY, the VREGIN pin must be supplied with 5 V from a low-noise LDO to meet USB electrical compliance.
Estimated: At maximum CPU load (120 MHz, all peripherals active, +105C ambient), the K60 silicon power dissipation is approximately 250 mW typical; the 144-MAPBGA junction-to-ambient thermal resistance theta_JA is approximately 35 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of about 9 C above ambient. Industrial parts are rated to +105C junction, so even at the ambient limit the junction stays within spec without a heatsink. For -40C cold-start operation, allow at least 10 ms for the internal bandgap reference to stabilize before ADC conversions are valid.
Common pitfalls when designing with the MK60FN1M0VMD12 include: (1) neglecting to enable the proper FlexMemory partition before using EEPROM emulation - this must be done once in factory firmware and is irreversible; (2) connecting the USB0_DM/DP lines without source-series ferrite beads for EMI suppression as recommended by USB-IF; (3) failing to configure the Ethernet reference clock for either 25 MHz or 50 MHz based on the external PHY requirement - mismatched clock frequency causes MII/RMII framing errors that are hard to debug.
The USB High-Speed D+/D- lines require 90 ohm differential impedance control with length matching within 150 mils. Route these signals on the top layer with a continuous ground plane beneath and keep them at least 5 mm away from any switching regulator or noisy digital signals. The Ethernet MII or RMII lines to the external PHY should be length-matched within 50 mils and routed as 50-ohm single-ended traces with reference to a ground plane; for RMII the 50 MHz reference clock trace must be matched within 1 inch.
Informações de conformidade
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - this part is industrial grade; for AEC-Q100 automotive grade, consult NXP automotive K60 variants. Lead-free BGA balls per JEDEC J-STD-020 MSL3 classification (peak reflow 260C).
