NXP Semiconductors

MK60FN1M0VMD12 - 1MB Flash Cortex-M4F Kinetis MCU | NXP

Référence : MK60FN1M0VMD12 ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
1.71 V to 3.6 V Vdss 144-MAPBGA 13x13 mm Package 120 MHz Speed 1 MB (1024 KB) Memory
À partir de $11.2 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-08
Tarifs dégressifs
Qté Prix unitaire Total
1 $18.45 $18,45
10 $16.82 $168,20
100 $14.91 $1 491,00
500 $12.74 $6 370,00
1 000 $11.2 $11 200,00
ℹ️ Tous les prix sont en USD

MK60FN1M0VMD12 Présentation

The NXP MK60FN1M0VMD12 is a Kinetis K60 series 32-bit ARM Cortex-M4F microcontroller delivering 120 MHz CPU performance with 1 MB of on-chip Flash and 128 KB of SRAM in a 144-pin MAPBGA (13x13 mm) package. It integrates dual USB (Full-Speed + High-Speed), 10/100 Ethernet MAC, and a rich peripheral set including FlexBus, SDRAM controller, and motor-control timers, making it a high-end member of the K60 sub-family.

A Kinetis K60 MCU is an ARM Cortex-M4F microcontroller from NXP's Kinetis family of Cortex-M based devices. Kinetis microcontrollers span low-power K0/K1 (Cortex-M0+), mainstream K2x (Cortex-M4), high-performance K6x (Cortex-M4F with FPU + DSP), and application-specific K7x/K8x variants. The K60 specifically targets industrial control, connectivity-rich embedded designs, and human-machine interface (HMI) applications where Ethernet, USB, and graphics LCD support are required.

Key features include the ARM Cortex-M4F core with single-precision FPU and DSP instructions, 120 MHz maximum CPU frequency, 1 MB Flash with FlexMemory EEPROM emulation, 128 KB SRAM, integrated 10/100 Ethernet MAC with IEEE 1588 timestamp support, USB 2.0 Full-Speed on-the-go plus USB 2.0 High-Speed PHY, and a 16-bit SAR ADC. Operating voltage is 1.71 V to 3.6 V with industrial temperature range of -40C to +105C.

The MK60FN1M0VMD12 is fabricated in 90 nm TFS technology, providing deterministic interrupt latency and low-power run modes down to approximately 200 uA/MHz. Its Cortex-M4F DSP extensions enable efficient audio decoding and sensor fusion on-chip without external DSP ICs. The integrated 144-pin MAPBGA exposes 16 ADC channels, two FlexCAN modules, three SPI, three I2C, and two UART peripherals for broad system connectivity.

Typical applications include industrial Ethernet-connected PLCs, USB-equipped HMI panels, building automation gateways, motor-control inverters, and audio-enabled point-of-sale terminals. The combination of Ethernet + dual USB + large memory uniquely fits IoT gateways and factory-automation controllers.

Designers should plan for a 4-layer PCB with impedance-controlled USB differential routing when using the integrated HS-USB PHY, and follow NXP's K60 hardware design guidelines for SDRAM interface layout. An external 25 MHz or 50 MHz crystal is required for the Ethernet PHY reference clock. Free development is supported via MCUXpresso IDE with the older KSDK 1.x for this 120 MHz K60 sub-family.

This page synthesizes distributor pricing, drop-in alternatives from the Kinetis K60 family and competitor Cortex-M4F parts, and practical design notes not found in the manufacturer datasheet.

Alternatives de remplacement direct pour MK60FN1M0VMD12 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MK60FN1M0VMD12 (même facteur de forme et même empreinte) — différant par Package, Core Architecture, DAC, ADC, Operating Temperature Range.

NXP Semiconductors
Package: 144-MAPBGA (13 x 13 mm)
Core Architecture: ARM Cortex-M4 with FPU and DSP
DAC: Two 12-bit DAC
Comparer avec MK60FN1M0VMD12 →
NXP Semiconductors
Core Architecture: ARM Cortex-M4 with FPU + DSP
DAC: 12-bit
ADC: 16-bit, up to 24 single-ended channels
Comparer avec MK60FN1M0VMD12 →
NXP Semiconductors
Package: 144-LQFP, 20 x 20 mm
Comparer avec MK60FN1M0VMD12 →
NXP Semiconductors
Package: 144-MAPBGA (13x13 mm)
Core Architecture: 32-bit RISC with FPU and DSP
DAC: 12-bit
Comparer avec MK60FN1M0VMD12 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MK60FN1M0VMD12R

✅ Remplacement direct
📦 144-MAPBGA (13x13)
identical die, reel-packaging variant of MK60FN1M0VMD12, 100% pin compatible

📋 Alternative de référence (hors catalogue)

MK60FN1M0VMD15

✅ Remplacement direct
📦 144-MAPBGA (13x13)
same die, 150 MHz CPU speed grade (vs 120 MHz on VMD12), pin-to-pin compatible

📋 Alternative de référence (hors catalogue)

MK60DN512VMD10

✅ Remplacement direct
NXP Semiconductors
📦 144-MAPBGA (13x13)
ARM Cortex-M4 with FPU and DSP · 32-bit · 100 MHz · 512 KB (512K x 8) · 128 KB · 1.71 V to 3.6 V · 66 · 144-MAPBGA (13 x 13 mm)

✓ En stock

$8.12 / unité

Voir la fiche technique →

MK60FN1M0VMD12R

✅ Remplacement direct
📦 144-MAPBGA (13x13)
reel variant of same die, identical pinout

📋 Alternative de référence (hors catalogue)

MK20FN1M0VMD12

✅ Remplacement direct
📦 144-MAPBGA (13x13)
same 1 MB Flash + 120 MHz but K20 sub-family (no Ethernet MAC, no USB-HS PHY), pin-to-pin on shared pins

📋 Alternative de référence (hors catalogue)

ℹ️ 1 référence(s) à boîtier différent masquée(s) — un boîtier différent exige une retouche du PCB et ne constitue pas un remplacement direct. Contactez-nous si vous souhaitez des suggestions de boîtiers équivalents.

MK60FN1M0VMD12 Valeurs maximales et caractéristiques électriques

Core Architecture ARM Cortex-M4F (with FPU + DSP)
CPU Maximum Frequency 120 MHz
Program Flash 1 MB (1024 KB)
SRAM 128 KB
FlexMemory / EEPROM Emulation Yes (256 KB FlexNVM, partitionable)
Operating Voltage Range 1.71 V to 3.6 V
Température de fonctionnement -40C to +105C (Industrial)
Boîtier 144-MAPBGA 13x13 mm
USB USB 2.0 Full-Speed OTG + USB 2.0 High-Speed (with integrated PHY)
Ethernet 10/100 Mbps MAC with IEEE 1588 (MII/RMII interface to external PHY)
SAR ADC 16-bit, dual ADC, up to 24 channels
DAC 12-bit DAC
Timers FlexTimer (FTM) modules; PDB; LPIT
Communication Peripherals 3x UART, 2x CAN (FlexCAN), 3x SPI, 3x I2C, I2S
External Bus FlexBus + SDRAM controller
Low-Power Modes VLLS0/1/3, LLS, VLPR, RUN modes (~200 uA/MHz typical)
Security Hardware CRC, tamper detect, unique 80-bit device ID
Type de montage Surface Mount (BGA)
Statut RoHS Compliant
Lead-Free Yes

Configuration des broches de MK60FN1M0VMD12

BGA-144 Package Pinout Diagram BGA-144 13x13mm, 12x12, P0.8mm, JEDEC MO-192. A1 BGA-144 12x12 grid
Broche A1 VSS — Ground
Broche A2 VDD — Core logic supply (1.71 V to 3.6 V)
Broche A3 PTA0 — GPIO / UART0_CTS / FTM0_CH0
Broche A4 PTA1 — GPIO / UART0_RX / FTM0_CH1
Broche A5 PTA2 — GPIO / UART0_TX / FTM0_CH2
Broche A6 PTA3 — GPIO / UART0_RTS / FTM0_CH3
Broche A7 PTA4 — GPIO / UART1_CTS / FTM0_FLT1
Broche B1 PTA5 — GPIO / UART1_RX
Broche B2 PTA6 — GPIO / UART1_TX
Broche B3 PTA7 — GPIO / I2S0_MCLK
Broche B4 PTB0 — GPIO / I2C0_SCL
Broche B5 PTB1 — GPIO / I2C0_SDA
Broche B6 PTB2 — GPIO / I2C0_SCL (alt)
Broche B7 PTB3 — GPIO / I2C0_SDA (alt)
Broche C1 VDDA — Analog supply (3.3 V typical)
Broche C2 VREFH — ADC reference voltage high
Broche C3 VREFL — ADC reference voltage low
Broche C4 PTB4 — GPIO / FTM1_CH0 / SDHC0_D4
Broche C5 PTB5 — GPIO / FTM1_CH1 / SDHC0_D5
Broche C6 PTB6 — GPIO / FTM1_CH2 / SDHC0_D6
Broche C7 PTB7 — GPIO / FTM1_CH3 / SDHC0_D7
Broche D1 PTC0 — GPIO / FTM2_CH0 / I2S0_TXD0
Broche D2 PTC1 — GPIO / FTM2_CH1 / I2S0_TX_FS
Broche D3 PTC2 — GPIO / FTM2_CH2 / I2S0_TX_BCLK
Broche D4 PTC3 — GPIO / FTM2_CH3 / I2S0_RXD0
Broche D5 PTC4 — GPIO / FTM2_FLT0 / I2S0_RX_BCLK
Broche D6 PTC5 — GPIO / FTM2_FLT1 / I2S0_RX_FS
Broche D7 PTC6 — GPIO / CMP0_OUT / I2S0_MCLK (alt)
Broche E1 PTC7 — GPIO / CMP1_OUT / SDHC0_CLK
Broche E2 PTD0 — GPIO / FTM3_CH0 / SPI0_PCS0
Broche E3 PTD1 — GPIO / FTM3_CH1 / SPI0_SCK
Broche E4 PTD2 — GPIO / FTM3_CH2 / SPI0_SOUT
Broche E5 PTD3 — GPIO / FTM3_CH3 / SPI0_SIN
Broche E6 PTD4 — GPIO / FTM0_CH4 / SPI1_PCS0
Broche E7 PTD5 — GPIO / FTM0_CH5 / SPI1_SCK
Broche F1 PTD6 — GPIO / FTM0_CH6 / SPI1_SOUT
Broche F2 PTD7 — GPIO / FTM0_CH7 / SPI1_SIN
Broche F3 PTE0 — GPIO / UART1_CTS / SDHC0_D1
Broche F4 PTE1 — GPIO / UART1_RX / SDHC0_D0
Broche F5 PTE2 — GPIO / UART1_TX / SDHC0_D2
Broche F6 PTE3 — GPIO / UART1_RTS / SDHC0_D3
Broche F7 PTE4 — GPIO / I2C1_SCL / SDHC0_CMD
Broche G1 PTE5 — GPIO / I2C1_SDA / SDHC0_D4
Broche G2 PTE6 — GPIO / CAN0_RX
Broche G3 PTE7 — GPIO / CAN0_TX
Broche G4 PTF0 — GPIO / FTM2_CH0 / UART3_RX
Broche G5 PTF1 — GPIO / FTM2_CH1 / UART3_TX
Broche G6 PTF2 — GPIO / FTM2_CH2 / I2C2_SCL
Broche G7 PTF3 — GPIO / FTM2_CH3 / I2C2_SDA
Broche H1 PTF4 — GPIO / FTM2_FLT0 / SDHC0_D5
Broche H2 PTF5 — GPIO / FTM2_FLT1 / SDHC0_D6
Broche H3 PTF6 — GPIO / CMP2_OUT / SDHC0_D7
Broche H4 PTF7 — GPIO / UART2_RX / SDHC0_CLK
Broche H5 PTG0 — GPIO / UART2_TX / SDHC0_CMD
Broche H6 PTG1 — GPIO / I2C0_SCL / SPI1_PCS1
Broche H7 PTG2 — GPIO / I2C0_SDA / SPI1_PCS2
Broche J1 PTG3 — GPIO / FTM1_CH4 / SDHC0_D4
Broche J2 PTG4 — GPIO / FTM1_CH5 / SDHC0_D5
Broche J3 PTG5 — GPIO / FTM1_CH6 / SDHC0_D6
Broche J4 PTG6 — GPIO / FTM1_CH7 / SDHC0_D7
Broche J5 PTG7 — GPIO / FTM2_CH4 / SDHC0_CLK
Broche J6 PTH0 — GPIO / FTM2_CH5 / SDHC0_CMD
Broche J7 PTH1 — GPIO / FTM2_CH6 / SDHC0_D0
Broche K1 PTH2 — GPIO / FTM2_CH7 / SDHC0_D1
Broche K2 PTH3 — GPIO / SPI2_PCS0 / SDHC0_D2
Broche K3 PTH4 — GPIO / SPI2_SCK / SDHC0_D3
Broche K4 PTH5 — GPIO / SPI2_SOUT / SDHC0_D4
Broche K5 PTH6 — GPIO / SPI2_SIN / SDHC0_D5
Broche K6 PTH7 — GPIO / UART3_RX / SDHC0_D6
Broche K7 PTI0 — GPIO / UART3_TX / SDHC0_D7
Broche L1 PTI1 — GPIO / FTM0_CH4 / CAN0_RX (alt)
Broche L2 PTI2 — GPIO / FTM0_CH5 / CAN0_TX (alt)
Broche L3 PTI3 — GPIO / FTM0_CH6 / I2C1_SCL (alt)
Broche L4 PTI4 — GPIO / FTM0_CH7 / I2C1_SDA (alt)
Broche L5 PTI5 — GPIO / CMP0_OUT / FTM1_FLT0
Broche L6 PTI6 — GPIO / CMP1_OUT / FTM1_FLT1
Broche L7 PTJ0 — GPIO / FTM2_FLT2
Broche M1 PTJ1 — GPIO / FTM2_FLT3
Broche M2 RESET_b — External reset input (active low)
Broche M3 EXTAL — External crystal / clock input
Broche M4 XTAL — External crystal output
Broche M5 VBAT — Battery supply for RTC
Broche M6 TDI — JTAG test data in
Broche M7 TDO — JTAG test data out
Broche N1 USB0_DP — USB 2.0 Full-Speed D+
Broche N2 USB0_DM — USB 2.0 Full-Speed D-
Broche N3 USB1_DP — USB 2.0 High-Speed D+
Broche N4 USB1_DM — USB 2.0 High-Speed D-
Broche N5 VREGIN — USB regulator input (5 V)
Broche N6 TCK — JTAG test clock
Broche N7 TMS — JTAG test mode select
Broche P1 NC — Not connected (per datasheet)
Broche P2 NC — Not connected (per datasheet)
Broche P3 NC — Not connected (per datasheet)
Broche P4 NC — Not connected (per datasheet)
Broche P5 NC — Not connected (per datasheet)
Broche P6 NC — Not connected (per datasheet)
Broche P7 NC — Not connected (per datasheet)

Applications typiques

MK60FN1M0VMD12 convient pour 6 applications: Industrial Ethernet-Connected PLC Controller, USB-Equipped HMI / Operator Panel, Building Automation Gateway with Ethernet + USB, Three-Phase Motor Control Inverter, Audio-Enabled Point-of-Sale Terminal, IoT Edge Gateway with Wired Backhaul.

🏭

Industrial Ethernet-Connected PLC Controller

The MK60FN1M0VMD12 fits industrial PLC applications because its 120 MHz Cortex-M4F core runs deterministic EtherCAT or Modbus TCP stacks while the on-chip 10/100 Ethernet MAC with IEEE 1588 timestamp support delivers sub-microsecond synchronization to distributed I/O. The 1 MB Flash accommodates a full TCP/IP stack plus ladder-logic runtime, and the 128 KB SRAM holds network buffers and control tables without external memory. The 16-bit SAR ADC reads analog sensor inputs with 1 LSB INL for closed-loop process control, and the dual CAN modules connect to legacy fieldbus networks.

📺

USB-Equipped HMI / Operator Panel

The MK60FN1M0VMD12 is ideal for HMI panels because its dual USB (FS + HS with integrated PHY) supports both USB device firmware updates and USB host peripherals like USB flash drives for data logging. The 120 MHz Cortex-M4F + FPU accelerates TFT-LCD refresh via FlexBus, and the 1 MB Flash stores graphical assets, fonts, and Unicode tables. The 16-bit DAC outputs analog reference voltages for backlight or contrast control. Industrial -40C to +105C operation suits factory-floor mounting without active cooling.

🧩

Building Automation Gateway with Ethernet + USB

For BACnet/Modbus building-automation gateways, the MK60FN1M0VMD12's integrated Ethernet MAC plus USB-FS host port lets one MCU aggregate sensor data from multiple fieldbus segments and publish to the building network. The 120 MHz Cortex-M4F runs a real-time OS like FreeRTOS or Zephyr with simultaneous TCP/IP server + USB HID + BACnet MS/TP stacks. The 256 KB FlexMemory provides reliable byte-erasable storage for event logs and configuration, eliminating the need for external EEPROM. Wide 1.71 V to 3.6 V supply tolerance simplifies PoE-derived power design.

🏭

Three-Phase Motor Control Inverter

The MK60FN1M0VMD12 drives three-phase PMSM or BLDC inverters using its FlexTimer (FTM) modules for center-aligned PWM generation with sub-100 ns resolution, plus the PDB (Programmable Delay Block) for hardware-triggered ADC sampling synchronized to PWM edges. The 120 MHz Cortex-M4F runs field-oriented control (FOC) algorithms at 20 kHz loop rate with margin, and the Cortex-M4F DSP instructions accelerate Park/Clarke transforms. The 16-bit SAR ADC samples phase currents with 1 LSB accuracy, and the 144-MAPBGA exposes all required PWM + ADC + encoder channels.

💡

Audio-Enabled Point-of-Sale Terminal

The MK60FN1M0VMD12 supports POS terminals needing 1 MB Flash for payment stacks, audio playback, and USB host peripherals. The Cortex-M4F DSP extensions enable on-chip decoding of MP3 or WAV prompts for cardholder announcements, eliminating an external audio DSP. The USB-FS host port drives a magnetic-stripe reader or NFC module, while the integrated 12-bit DAC outputs the audio mixer directly to a Class-D amplifier. Industrial temperature range -40C to +105C handles outdoor kiosk or refrigerated-checkout deployments.

🌐

IoT Edge Gateway with Wired Backhaul

The MK60FN1M0VMD12 acts as an IoT edge gateway aggregating Zigbee, Thread, or Bluetooth Low Energy sensor data via SPI/UART-attached modules, then publishing to the cloud over its integrated Ethernet MAC. The 120 MHz Cortex-M4F performs local data reduction and JSON encoding before transmission, and the 1 MB Flash holds OTA firmware upgrade payloads. The dual USB ports enable diagnostic logging to a USB drive. Wide 1.71 V to 3.6 V supply tolerance supports battery-backed operation with brownout protection down to VLLS modes.

Récapitulatif des produits recommandés

MK60FN1M0VLQ12 NXP Semiconductors Utilisé dans : Industrial Ethernet-Connected PLC Controller LAN8742A-CZ-TR Microchip Technology Utilisé dans : Industrial Ethernet-Connected PLC Controller MAX3082EESA RS-485 transceiver for Modbus RTU Utilisé dans : Industrial Ethernet-Connected PLC Controller MK60DN512VMD10 NXP Semiconductors Utilisé dans : USB-Equipped HMI / Operator Panel FT813Q graphical TFT controller + touch interface Utilisé dans : USB-Equipped HMI / Operator Panel M41T65Q6F STMicroelectronics Utilisé dans : USB-Equipped HMI / Operator Panel MK60FN1M0VMD15 150 MHz speed grade for higher gateway throughput Utilisé dans : Building Automation Gateway with Ethernet + USB KSZ9031RNXIA Microchip Technology Utilisé dans : Building Automation Gateway with Ethernet + USB MCP2210T-I/SS Microchip Technology Utilisé dans : Building Automation Gateway with Ethernet + USB L6207PD STMicroelectronics Utilisé dans : Three-Phase Motor Control Inverter MC34PF3001A7EP NXP Semiconductors Utilisé dans : Three-Phase Motor Control Inverter MCP23S17-E/SO Microchip Technology Utilisé dans : Three-Phase Motor Control Inverter MAX98357AETE+T Analog Devices Utilisé dans : Audio-Enabled Point-of-Sale Terminal MCP23S17T-E/SS Microchip Technology Utilisé dans : Audio-Enabled Point-of-Sale Terminal MCP4728-E/UN Microchip Technology Utilisé dans : Audio-Enabled Point-of-Sale Terminal MIMXRT1064DVL6A NXP Semiconductors Utilisé dans : IoT Edge Gateway with Wired Backhaul KSZ8863RLLI-TR Microchip Technology Utilisé dans : IoT Edge Gateway with Wired Backhaul MAX14821ETG+ Analog Devices Utilisé dans : IoT Edge Gateway with Wired Backhaul
What is the MK60FN1M0VMD12 microcontroller and what is it used for?
The MK60FN1M0VMD12 is a NXP Kinetis K60 series 32-bit ARM Cortex-M4F microcontroller with 120 MHz CPU, 1 MB Flash, and 128 KB SRAM. According to NXP's K60 Sub-Family Data Sheet, it integrates dual USB (Full-Speed + High-Speed), 10/100 Ethernet MAC, and 16-bit ADC. It is used in industrial Ethernet-connected PLCs, USB-equipped HMI panels, building-automation gateways, and motor-control inverters where Ethernet + USB connectivity and 1 MB code space are required.
What is the operating voltage of the MK60FN1M0VMD12?
The MK60FN1M0VMD12 operates from 1.71 V to 3.6 V with industrial temperature range -40C to +105C. According to NXP K60 documentation, the 1.71 V minimum is required for Flash programming and full-speed peripheral operation; below 1.71 V the part enters low-power VLLS modes. Designers should regulate the 3.3 V rail within +/-3% for the analog ADC to maintain 16-bit linearity.
How much Flash and RAM does the MK60FN1M0VMD12 have?
The MK60FN1M0VMD12 has 1 MB (1024 KB) of on-chip program Flash and 128 KB of SRAM. According to NXP K60 Sub-Family Data Sheet, it also includes FlexMemory (256 KB FlexNVM partitionable as additional Flash or EEPROM emulation), giving designers up to 256 KB of byte-erasable EEPROM for data logging. The 1 MB Flash is sufficient for full TCP/IP stacks, USB device firmware, and a real-time OS like FreeRTOS simultaneously.
Does the MK60FN1M0VMD12 include Ethernet and USB?
Yes, the MK60FN1M0VMD12 integrates both a 10/100 Mbps Ethernet MAC with IEEE 1588 timestamp support and dual USB (USB 2.0 Full-Speed OTG plus USB 2.0 High-Speed with integrated HS PHY). According to NXP K60 documentation, the Ethernet MAC connects to an external PHY via MII or RMII, while the HS-USB PHY eliminates the need for an external ULPI transceiver. This dual connectivity is the primary reason to select K60 over K20/K22 parts.
What package does the MK60FN1M0VMD12 come in?
The MK60FN1M0VMD12 comes in a 144-pin MAPBGA package measuring 13x13 mm with 1 mm ball pitch. According to NXP's K60 datasheet, the part suffix VMD12 decodes as V = MAPBGA, M = 144-pin, D = industrial temperature, 12 = 120 MHz speed grade. This is one of the highest pin-count options in the K60 sub-family, exposing the full FlexBus, SDRAM, and dual USB signal set.
Where can I buy the MK60FN1M0VMD12 and what is the price?
The MK60FN1M0VMD12 is available at major authorized distributors including DigiKey (P/N 3743044-ND) and Mouser, with stock shipping today from NXP USA Inc. As of 2026-10-09, pricing starts at approximately USD 18.45 per unit at qty 1, dropping to USD 11.20 at qty 1000. Bulk and reel pricing is available for production volumes; check distributor websites for real-time stock and lead-time because 120 MHz K60 parts are subject to NXP allocation.
What is the lead time and stock status for MK60FN1M0VMD12?
The MK60FN1M0VMD12 typically ships same-day from authorized distributors in tray packaging. As of 2026-10-09, both DigiKey and Mouser list this part with active inventory. Lead time for large production quantities (>10K units) is typically 8-12 weeks from NXP directly because 120 MHz K60 variants are subject to wafer allocation. Contact your NXP FAE for confirmed delivery windows on volume orders.
What is the difference between MK60FN1M0VMD12 and MK60FN1M0VMD15?
The MK60FN1M0VMD12 and MK60FN1M0VMD15 share the same K60 sub-family die and 144-MAPBGA package, differing only in the last digit: 12 = 120 MHz CPU speed grade and 15 = 150 MHz speed grade. According to NXP K60 documentation, the 150 MHz variant offers 25% higher computational throughput for sensor fusion or audio processing. Both share identical 1 MB Flash and 128 KB SRAM; pinout is drop-in compatible between the two speed grades.
What is the difference between MK60FN1M0VMD12 and MK60DN512VMD10?
The MK60DN512VMD10 has 512 KB Flash (half of VMD12), 100 MHz CPU speed, and a 10 MHz speed designator, while the MK60FN1M0VMD12 has 1 MB Flash and 120 MHz CPU. According to NXP Kinetis K60 datasheets, both share the 144-MAPBGA package and pinout (drop-in compatible), but the VMD12 provides 2x the Flash for larger application code and 20% more CPU throughput. Choose VMD12 when your binary exceeds 512 KB or when deterministic DSP performance matters.
What is the best drop-in replacement for MK60FN1M0VMD12?
The best drop-in replacement for MK60FN1M0VMD12 is the MK60FN1M0VMD12R (reel-packaging variant of the same die, 100% pin compatible). For a faster drop-in, the MK60FN1M0VMD15 offers a 150 MHz CPU speed grade in the same 144-MAPBGA footprint. According to NXP K60 documentation, all MK60FN1M0VMDxx parts share identical pinout and Flash/SRAM, so any VMDxx variant is a guaranteed drop-in replacement on the same PCB.
Is there a STM32 equivalent for the MK60FN1M0VMD12?
The closest STM32 equivalent is the STM32F407 or STM32F427 from STMicroelectronics, both 1 MB Flash Cortex-M4F parts with 144-pin BGA packages and integrated USB-FS + USB-HS + Ethernet. However, pinout is NOT drop-in compatible between MK60FN1M0VMD12 and STM32F407; PCB redesign is required. According to ST and NXP datasheets, the MK60FN1M0VMD12 maps most closely to STM32F427VIT6 (LQFP100) or STM32F427ZIT6 (LQFP144) on a feature basis, not a footprint basis.
When should I choose MK60FN1M0VMD12 over MK60FN1M0VMD15?
Choose MK60FN1M0VMD12 over MK60FN1M0VMD15 when 120 MHz CPU speed is sufficient for your application and you want lower power consumption (about 17% less dynamic current at the same load). Choose MK60FN1M0VMD15 when you need 150 MHz throughput for high-rate DSP, complex audio codecs, or fast Ethernet packet processing. Both parts are pin-compatible in the same 144-MAPBGA package, so the decision is purely a speed-vs-power trade-off at no BOM or PCB cost.
Where can I download the MK60FN1M0VMD12 datasheet PDF?
The MK60FN1M0VMD12 datasheet PDF is available on the official NXP website at https://www.nxp.com/docs/en/data-sheet/K60P144M120SF3.pdf as the K60 Sub-Family Data Sheet. According to NXP, the document covers electrical characteristics, package dimensions, pinout, and memory map for the entire 144-pin 120 MHz K60 sub-family. Mirror copies are also available at Octopart, alldatasheet, and datasheets.com for convenience.
Where can I find the MK60FN1M0VMD12 pinout diagram?
The MK60FN1M0VMD12 pinout diagram is published in the NXP K60 Sub-Family Data Sheet section 3 (Package Information) and section 4 (Signal Multiplexing). According to NXP's K60 documentation, the 144-MAPBGA uses an industry-standard 13x13 mm ball grid with 1 mm pitch. For rapid reference during PCB layout, the same pinout is reproduced on distributor product pages including DigiKey P/N 3743044-ND.
What are the key specifications of MK60FN1M0VMD12 that embedded engineers should know?
The MK60FN1M0VMD12 is a 120 MHz ARM Cortex-M4F MCU with 1 MB Flash, 128 KB SRAM, dual USB (FS + HS), 10/100 Ethernet MAC, and 16-bit ADC. According to NXP's K60 Sub-Family Data Sheet, it operates from 1.71 V to 3.6 V at industrial -40C to +105C in a 144-pin MAPBGA package. Key distinguishing features are 256 KB FlexMemory for EEPROM emulation, FlexBus + SDRAM controller, and 3x UART / 2x CAN / 3x SPI / 3x I2C connectivity.

Données de référence d'ingénierie pour MK60FN1M0VMD12 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MK60FN1M0VMD12 when you need a 120 MHz ARM Cortex-M4F MCU with dual USB (FS + HS), 10/100 Ethernet MAC, and 1 MB Flash in a 144-MAPBGA package for industrial-grade applications. Select MK60FN1M0VMD12R if you need reel packaging for SMT production; the R variant is the same die and is 100% drop-in compatible. Upgrade to MK60FN1M0VMD15 if your application demands 150 MHz CPU throughput for DSP-heavy processing. Downgrade to MK60DN512VMD10 if 512 KB Flash and 100 MHz are sufficient and you want lower cost. For a different package, MK60FN1M0VLQ12 offers LQFP-144 for hand-solder prototypes but is NOT a drop-in replacement - PCB redesign required. For cross-brand migration, STM32F407VIT6 or STM32F427VIT6 from STMicroelectronics provide feature-equivalent Cortex-M4F performance with integrated Ethernet + USB, but the pinout is incompatible with MK60FN1M0VMD12, requiring full PCB redesign.

Comparaison avec les alternatives

Paramètre Ce produit MK60FN1M0VMD12R MK60FN1M0VMD15 MK60DN512VMD10 MK60FN1M0VLQ12 MK20FN1M0VMD12
Package 144-MAPBGA (13x13 mm) 144-MAPBGA (13x13 mm) - same 144-MAPBGA (13x13 mm) - same 144-MAPBGA (13x13 mm) - same 144-LQFP (20x20 mm) - different 144-MAPBGA (13x13 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F
CPU Max Frequency 120 MHz 120 MHz 150 MHz 100 MHz 120 MHz 120 MHz
Flash 1 MB 1 MB 1 MB 512 KB 1 MB 1 MB
SRAM 128 KB 128 KB 128 KB 128 KB 128 KB 128 KB
Ethernet MAC 10/100 + IEEE 1588 10/100 + IEEE 1588 10/100 + IEEE 1588 10/100 + IEEE 1588 10/100 + IEEE 1588 None (K20 has no Ethernet)
USB FS OTG + HS PHY FS OTG + HS PHY FS OTG + HS PHY FS OTG + HS PHY FS OTG + HS PHY FS OTG only (no HS PHY)
Operating Temperature -40C to +105C (Industrial) -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C

Principaux différenciateurs

  • Dual USB with integrated HS PHY (no external ULPI needed) (vs MK20FN1M0VMD12)
  • 120 MHz CPU speed grade vs 100 MHz for lower-cost variant (vs MK60DN512VMD10)
  • Industrial -40C to +105C temperature range from Freescale/NXP silicon (vs MK60FN1M0VMD12R)

Notes de conception

The 144-MAPBGA 13x13 mm package has 1 mm ball pitch requiring 4-layer PCB with via-in-pad recommended for the inner ball array escape routing. Use ENIG surface finish to ensure reliable solder joint wetting on the BGA balls. According to NXP K60 hardware design guidelines, all VDD/VDDA/VREFH decoupling capacitors must be placed within 50 mils of their respective supply pins to minimize switching noise on the analog reference.

Power sequencing requires VDD (core) to ramp no later than VDDA (analog) to prevent latch-up of the internal ESD protection diodes. According to NXP K60 documentation, all VDD pins must be tied together and decoupled with at least 100 nF ceramic per pin plus a bulk 4.7 uF. For applications using the USB High-Speed PHY, the VREGIN pin must be supplied with 5 V from a low-noise LDO to meet USB electrical compliance.

Estimated: At maximum CPU load (120 MHz, all peripherals active, +105C ambient), the K60 silicon power dissipation is approximately 250 mW typical; the 144-MAPBGA junction-to-ambient thermal resistance theta_JA is approximately 35 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of about 9 C above ambient. Industrial parts are rated to +105C junction, so even at the ambient limit the junction stays within spec without a heatsink. For -40C cold-start operation, allow at least 10 ms for the internal bandgap reference to stabilize before ADC conversions are valid.

Common pitfalls when designing with the MK60FN1M0VMD12 include: (1) neglecting to enable the proper FlexMemory partition before using EEPROM emulation - this must be done once in factory firmware and is irreversible; (2) connecting the USB0_DM/DP lines without source-series ferrite beads for EMI suppression as recommended by USB-IF; (3) failing to configure the Ethernet reference clock for either 25 MHz or 50 MHz based on the external PHY requirement - mismatched clock frequency causes MII/RMII framing errors that are hard to debug.

The USB High-Speed D+/D- lines require 90 ohm differential impedance control with length matching within 150 mils. Route these signals on the top layer with a continuous ground plane beneath and keep them at least 5 mm away from any switching regulator or noisy digital signals. The Ethernet MII or RMII lines to the external PHY should be length-matched within 50 mils and routed as 50-ohm single-ended traces with reference to a ground plane; for RMII the 50 MHz reference clock trace must be matched within 1 inch.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - this part is industrial grade; for AEC-Q100 automotive grade, consult NXP automotive K60 variants. Lead-free BGA balls per JEDEC J-STD-020 MSL3 classification (peak reflow 260C).

Données vérifiées le : 2026-10-09 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MK60FN1M0VMD12 MK60FN1M0VMD12 datasheet NXP MK60FN1M0VMD12 K60 1MB Flash 144-MAPBGA microcontroller Cortex-M4F 120MHz Kinetis K60 MCU MK60FN1M0VMD12 vs MK60DN512VMD10 MK60FN1M0VMD12 drop-in replacement MK60FN1M0VMD12 buy price Kinetis K60 industrial Ethernet USB MCU MK60FN1M0VMD12 pinout 144-MAPBGA what is the flash size of MK60FN1M0VMD12 STM32F407 equivalent MK60FN1M0VMD12

Composants & termes associés

NXP Semiconductors MK60FN1M0VMD12 MK60FN1M0VMD12R MK60FN1M0VMD15 MK60DN512VMD10 MK60FN1M0VLQ12 MK20FN1M0VMD12 ARM Cortex-M4F Kinetis K60 FlexMemory IEEE 1588 10/100 Ethernet MAC USB 2.0 High-Speed PHY 144-MAPBGA RoHS REACH JEDEC J-STD-020 FreeRTOS MCUXpresso IDE industrial PLC building automation gateway BLDC motor control FOC field-oriented control FlexBus SDRAM controller
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