NXP Semiconductors

MK60FN1M0VMD12 - 1MB Flash Cortex-M4F Kinetis MCU | NXP

料号: MK60FN1M0VMD12 ✓ 量产中
有现货 1-3 个工作日内发货
1.71 V to 3.6 V Vdss 144-MAPBGA 13x13 mm Package 120 MHz Speed 1 MB (1024 KB) Memory
低至 $11.2 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-08
批量定价
数量 单价 小计
1 $18.45 $18.45
10 $16.82 $168.20
100 $14.91 $1,491.00
500 $12.74 $6,370.00
1,000 $11.2 $11,200.00
ℹ️ 所有价格均以 USD 计价

MK60FN1M0VMD12 概述

The NXP MK60FN1M0VMD12 is a Kinetis K60 series 32-bit ARM Cortex-M4F microcontroller delivering 120 MHz CPU performance with 1 MB of on-chip Flash and 128 KB of SRAM in a 144-pin MAPBGA (13x13 mm) package. It integrates dual USB (Full-Speed + High-Speed), 10/100 Ethernet MAC, and a rich peripheral set including FlexBus, SDRAM controller, and motor-control timers, making it a high-end member of the K60 sub-family.

A Kinetis K60 MCU is an ARM Cortex-M4F microcontroller from NXP's Kinetis family of Cortex-M based devices. Kinetis microcontrollers span low-power K0/K1 (Cortex-M0+), mainstream K2x (Cortex-M4), high-performance K6x (Cortex-M4F with FPU + DSP), and application-specific K7x/K8x variants. The K60 specifically targets industrial control, connectivity-rich embedded designs, and human-machine interface (HMI) applications where Ethernet, USB, and graphics LCD support are required.

Key features include the ARM Cortex-M4F core with single-precision FPU and DSP instructions, 120 MHz maximum CPU frequency, 1 MB Flash with FlexMemory EEPROM emulation, 128 KB SRAM, integrated 10/100 Ethernet MAC with IEEE 1588 timestamp support, USB 2.0 Full-Speed on-the-go plus USB 2.0 High-Speed PHY, and a 16-bit SAR ADC. Operating voltage is 1.71 V to 3.6 V with industrial temperature range of -40C to +105C.

The MK60FN1M0VMD12 is fabricated in 90 nm TFS technology, providing deterministic interrupt latency and low-power run modes down to approximately 200 uA/MHz. Its Cortex-M4F DSP extensions enable efficient audio decoding and sensor fusion on-chip without external DSP ICs. The integrated 144-pin MAPBGA exposes 16 ADC channels, two FlexCAN modules, three SPI, three I2C, and two UART peripherals for broad system connectivity.

Typical applications include industrial Ethernet-connected PLCs, USB-equipped HMI panels, building automation gateways, motor-control inverters, and audio-enabled point-of-sale terminals. The combination of Ethernet + dual USB + large memory uniquely fits IoT gateways and factory-automation controllers.

Designers should plan for a 4-layer PCB with impedance-controlled USB differential routing when using the integrated HS-USB PHY, and follow NXP's K60 hardware design guidelines for SDRAM interface layout. An external 25 MHz or 50 MHz crystal is required for the Ethernet PHY reference clock. Free development is supported via MCUXpresso IDE with the older KSDK 1.x for this 120 MHz K60 sub-family.

This page synthesizes distributor pricing, drop-in alternatives from the Kinetis K60 family and competitor Cortex-M4F parts, and practical design notes not found in the manufacturer datasheet.

直接替换替代料: MK60FN1M0VMD12 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MK60FN1M0VMD12 (相同外形与封装尺寸) ——差异在于 Package, Core Architecture, DAC, ADC, Operating Temperature Range.

NXP Semiconductors
Package: 144-MAPBGA (13 x 13 mm)
Core Architecture: ARM Cortex-M4 with FPU and DSP
DAC: Two 12-bit DAC
对比 MK60FN1M0VMD12 →
NXP Semiconductors
Core Architecture: ARM Cortex-M4 with FPU + DSP
DAC: 12-bit
ADC: 16-bit, up to 24 single-ended channels
对比 MK60FN1M0VMD12 →
NXP Semiconductors
Package: 144-LQFP, 20 x 20 mm
对比 MK60FN1M0VMD12 →
NXP Semiconductors
Package: 144-MAPBGA (13x13 mm)
Core Architecture: 32-bit RISC with FPU and DSP
DAC: 12-bit
对比 MK60FN1M0VMD12 →

快速对比工具——选择替代料号进行并排对比:

MK60FN1M0VMD12R

✅ 直接替换
📦 144-MAPBGA (13x13)
identical die, reel-packaging variant of MK60FN1M0VMD12, 100% pin compatible

📋 参考替代料(不在目录中)

MK60FN1M0VMD15

✅ 直接替换
📦 144-MAPBGA (13x13)
same die, 150 MHz CPU speed grade (vs 120 MHz on VMD12), pin-to-pin compatible

📋 参考替代料(不在目录中)

MK60DN512VMD10

✅ 直接替换
NXP Semiconductors
📦 144-MAPBGA (13x13)
ARM Cortex-M4 with FPU and DSP · 32-bit · 100 MHz · 512 KB (512K x 8) · 128 KB · 1.71 V to 3.6 V · 66 · 144-MAPBGA (13 x 13 mm)

✓ 有现货

$8.12 / 个

查看数据手册 →

MK60FN1M0VMD12R

✅ 直接替换
📦 144-MAPBGA (13x13)
reel variant of same die, identical pinout

📋 参考替代料(不在目录中)

MK20FN1M0VMD12

✅ 直接替换
📦 144-MAPBGA (13x13)
same 1 MB Flash + 120 MHz but K20 sub-family (no Ethernet MAC, no USB-HS PHY), pin-to-pin on shared pins

📋 参考替代料(不在目录中)

ℹ️ 1 个跨封装料号已隐藏——不同封装需要 PCB 改动,并非真正的直接替换。 联系我们 如果您需要跨封装建议。

MK60FN1M0VMD12 最大额定值与电气特性

Core Architecture ARM Cortex-M4F (with FPU + DSP)
CPU Maximum Frequency 120 MHz
Program Flash 1 MB (1024 KB)
SRAM 128 KB
FlexMemory / EEPROM Emulation Yes (256 KB FlexNVM, partitionable)
Operating Voltage Range 1.71 V to 3.6 V
工作温度 -40C to +105C (Industrial)
封装 144-MAPBGA 13x13 mm
USB USB 2.0 Full-Speed OTG + USB 2.0 High-Speed (with integrated PHY)
Ethernet 10/100 Mbps MAC with IEEE 1588 (MII/RMII interface to external PHY)
SAR ADC 16-bit, dual ADC, up to 24 channels
DAC 12-bit DAC
Timers FlexTimer (FTM) modules; PDB; LPIT
Communication Peripherals 3x UART, 2x CAN (FlexCAN), 3x SPI, 3x I2C, I2S
External Bus FlexBus + SDRAM controller
Low-Power Modes VLLS0/1/3, LLS, VLPR, RUN modes (~200 uA/MHz typical)
Security Hardware CRC, tamper detect, unique 80-bit device ID
安装类型 Surface Mount (BGA)
RoHS 状态 Compliant
Lead-Free Yes

MK60FN1M0VMD12 引脚配置

BGA-144 Package Pinout Diagram BGA-144 13x13mm, 12x12, P0.8mm, JEDEC MO-192. A1 BGA-144 12x12 grid
引脚 A1 VSS — Ground
引脚 A2 VDD — Core logic supply (1.71 V to 3.6 V)
引脚 A3 PTA0 — GPIO / UART0_CTS / FTM0_CH0
引脚 A4 PTA1 — GPIO / UART0_RX / FTM0_CH1
引脚 A5 PTA2 — GPIO / UART0_TX / FTM0_CH2
引脚 A6 PTA3 — GPIO / UART0_RTS / FTM0_CH3
引脚 A7 PTA4 — GPIO / UART1_CTS / FTM0_FLT1
引脚 B1 PTA5 — GPIO / UART1_RX
引脚 B2 PTA6 — GPIO / UART1_TX
引脚 B3 PTA7 — GPIO / I2S0_MCLK
引脚 B4 PTB0 — GPIO / I2C0_SCL
引脚 B5 PTB1 — GPIO / I2C0_SDA
引脚 B6 PTB2 — GPIO / I2C0_SCL (alt)
引脚 B7 PTB3 — GPIO / I2C0_SDA (alt)
引脚 C1 VDDA — Analog supply (3.3 V typical)
引脚 C2 VREFH — ADC reference voltage high
引脚 C3 VREFL — ADC reference voltage low
引脚 C4 PTB4 — GPIO / FTM1_CH0 / SDHC0_D4
引脚 C5 PTB5 — GPIO / FTM1_CH1 / SDHC0_D5
引脚 C6 PTB6 — GPIO / FTM1_CH2 / SDHC0_D6
引脚 C7 PTB7 — GPIO / FTM1_CH3 / SDHC0_D7
引脚 D1 PTC0 — GPIO / FTM2_CH0 / I2S0_TXD0
引脚 D2 PTC1 — GPIO / FTM2_CH1 / I2S0_TX_FS
引脚 D3 PTC2 — GPIO / FTM2_CH2 / I2S0_TX_BCLK
引脚 D4 PTC3 — GPIO / FTM2_CH3 / I2S0_RXD0
引脚 D5 PTC4 — GPIO / FTM2_FLT0 / I2S0_RX_BCLK
引脚 D6 PTC5 — GPIO / FTM2_FLT1 / I2S0_RX_FS
引脚 D7 PTC6 — GPIO / CMP0_OUT / I2S0_MCLK (alt)
引脚 E1 PTC7 — GPIO / CMP1_OUT / SDHC0_CLK
引脚 E2 PTD0 — GPIO / FTM3_CH0 / SPI0_PCS0
引脚 E3 PTD1 — GPIO / FTM3_CH1 / SPI0_SCK
引脚 E4 PTD2 — GPIO / FTM3_CH2 / SPI0_SOUT
引脚 E5 PTD3 — GPIO / FTM3_CH3 / SPI0_SIN
引脚 E6 PTD4 — GPIO / FTM0_CH4 / SPI1_PCS0
引脚 E7 PTD5 — GPIO / FTM0_CH5 / SPI1_SCK
引脚 F1 PTD6 — GPIO / FTM0_CH6 / SPI1_SOUT
引脚 F2 PTD7 — GPIO / FTM0_CH7 / SPI1_SIN
引脚 F3 PTE0 — GPIO / UART1_CTS / SDHC0_D1
引脚 F4 PTE1 — GPIO / UART1_RX / SDHC0_D0
引脚 F5 PTE2 — GPIO / UART1_TX / SDHC0_D2
引脚 F6 PTE3 — GPIO / UART1_RTS / SDHC0_D3
引脚 F7 PTE4 — GPIO / I2C1_SCL / SDHC0_CMD
引脚 G1 PTE5 — GPIO / I2C1_SDA / SDHC0_D4
引脚 G2 PTE6 — GPIO / CAN0_RX
引脚 G3 PTE7 — GPIO / CAN0_TX
引脚 G4 PTF0 — GPIO / FTM2_CH0 / UART3_RX
引脚 G5 PTF1 — GPIO / FTM2_CH1 / UART3_TX
引脚 G6 PTF2 — GPIO / FTM2_CH2 / I2C2_SCL
引脚 G7 PTF3 — GPIO / FTM2_CH3 / I2C2_SDA
引脚 H1 PTF4 — GPIO / FTM2_FLT0 / SDHC0_D5
引脚 H2 PTF5 — GPIO / FTM2_FLT1 / SDHC0_D6
引脚 H3 PTF6 — GPIO / CMP2_OUT / SDHC0_D7
引脚 H4 PTF7 — GPIO / UART2_RX / SDHC0_CLK
引脚 H5 PTG0 — GPIO / UART2_TX / SDHC0_CMD
引脚 H6 PTG1 — GPIO / I2C0_SCL / SPI1_PCS1
引脚 H7 PTG2 — GPIO / I2C0_SDA / SPI1_PCS2
引脚 J1 PTG3 — GPIO / FTM1_CH4 / SDHC0_D4
引脚 J2 PTG4 — GPIO / FTM1_CH5 / SDHC0_D5
引脚 J3 PTG5 — GPIO / FTM1_CH6 / SDHC0_D6
引脚 J4 PTG6 — GPIO / FTM1_CH7 / SDHC0_D7
引脚 J5 PTG7 — GPIO / FTM2_CH4 / SDHC0_CLK
引脚 J6 PTH0 — GPIO / FTM2_CH5 / SDHC0_CMD
引脚 J7 PTH1 — GPIO / FTM2_CH6 / SDHC0_D0
引脚 K1 PTH2 — GPIO / FTM2_CH7 / SDHC0_D1
引脚 K2 PTH3 — GPIO / SPI2_PCS0 / SDHC0_D2
引脚 K3 PTH4 — GPIO / SPI2_SCK / SDHC0_D3
引脚 K4 PTH5 — GPIO / SPI2_SOUT / SDHC0_D4
引脚 K5 PTH6 — GPIO / SPI2_SIN / SDHC0_D5
引脚 K6 PTH7 — GPIO / UART3_RX / SDHC0_D6
引脚 K7 PTI0 — GPIO / UART3_TX / SDHC0_D7
引脚 L1 PTI1 — GPIO / FTM0_CH4 / CAN0_RX (alt)
引脚 L2 PTI2 — GPIO / FTM0_CH5 / CAN0_TX (alt)
引脚 L3 PTI3 — GPIO / FTM0_CH6 / I2C1_SCL (alt)
引脚 L4 PTI4 — GPIO / FTM0_CH7 / I2C1_SDA (alt)
引脚 L5 PTI5 — GPIO / CMP0_OUT / FTM1_FLT0
引脚 L6 PTI6 — GPIO / CMP1_OUT / FTM1_FLT1
引脚 L7 PTJ0 — GPIO / FTM2_FLT2
引脚 M1 PTJ1 — GPIO / FTM2_FLT3
引脚 M2 RESET_b — External reset input (active low)
引脚 M3 EXTAL — External crystal / clock input
引脚 M4 XTAL — External crystal output
引脚 M5 VBAT — Battery supply for RTC
引脚 M6 TDI — JTAG test data in
引脚 M7 TDO — JTAG test data out
引脚 N1 USB0_DP — USB 2.0 Full-Speed D+
引脚 N2 USB0_DM — USB 2.0 Full-Speed D-
引脚 N3 USB1_DP — USB 2.0 High-Speed D+
引脚 N4 USB1_DM — USB 2.0 High-Speed D-
引脚 N5 VREGIN — USB regulator input (5 V)
引脚 N6 TCK — JTAG test clock
引脚 N7 TMS — JTAG test mode select
引脚 P1 NC — Not connected (per datasheet)
引脚 P2 NC — Not connected (per datasheet)
引脚 P3 NC — Not connected (per datasheet)
引脚 P4 NC — Not connected (per datasheet)
引脚 P5 NC — Not connected (per datasheet)
引脚 P6 NC — Not connected (per datasheet)
引脚 P7 NC — Not connected (per datasheet)

典型应用

MK60FN1M0VMD12 适用于 6 应用s: Industrial Ethernet-Connected PLC Controller, USB-Equipped HMI / Operator Panel, Building Automation Gateway with Ethernet + USB, Three-Phase Motor Control Inverter, Audio-Enabled Point-of-Sale Terminal, IoT Edge Gateway with Wired Backhaul.

🏭

Industrial Ethernet-Connected PLC Controller

The MK60FN1M0VMD12 fits industrial PLC applications because its 120 MHz Cortex-M4F core runs deterministic EtherCAT or Modbus TCP stacks while the on-chip 10/100 Ethernet MAC with IEEE 1588 timestamp support delivers sub-microsecond synchronization to distributed I/O. The 1 MB Flash accommodates a full TCP/IP stack plus ladder-logic runtime, and the 128 KB SRAM holds network buffers and control tables without external memory. The 16-bit SAR ADC reads analog sensor inputs with 1 LSB INL for closed-loop process control, and the dual CAN modules connect to legacy fieldbus networks.

📺

USB-Equipped HMI / Operator Panel

The MK60FN1M0VMD12 is ideal for HMI panels because its dual USB (FS + HS with integrated PHY) supports both USB device firmware updates and USB host peripherals like USB flash drives for data logging. The 120 MHz Cortex-M4F + FPU accelerates TFT-LCD refresh via FlexBus, and the 1 MB Flash stores graphical assets, fonts, and Unicode tables. The 16-bit DAC outputs analog reference voltages for backlight or contrast control. Industrial -40C to +105C operation suits factory-floor mounting without active cooling.

🧩

Building Automation Gateway with Ethernet + USB

For BACnet/Modbus building-automation gateways, the MK60FN1M0VMD12's integrated Ethernet MAC plus USB-FS host port lets one MCU aggregate sensor data from multiple fieldbus segments and publish to the building network. The 120 MHz Cortex-M4F runs a real-time OS like FreeRTOS or Zephyr with simultaneous TCP/IP server + USB HID + BACnet MS/TP stacks. The 256 KB FlexMemory provides reliable byte-erasable storage for event logs and configuration, eliminating the need for external EEPROM. Wide 1.71 V to 3.6 V supply tolerance simplifies PoE-derived power design.

🏭

Three-Phase Motor Control Inverter

The MK60FN1M0VMD12 drives three-phase PMSM or BLDC inverters using its FlexTimer (FTM) modules for center-aligned PWM generation with sub-100 ns resolution, plus the PDB (Programmable Delay Block) for hardware-triggered ADC sampling synchronized to PWM edges. The 120 MHz Cortex-M4F runs field-oriented control (FOC) algorithms at 20 kHz loop rate with margin, and the Cortex-M4F DSP instructions accelerate Park/Clarke transforms. The 16-bit SAR ADC samples phase currents with 1 LSB accuracy, and the 144-MAPBGA exposes all required PWM + ADC + encoder channels.

💡

Audio-Enabled Point-of-Sale Terminal

The MK60FN1M0VMD12 supports POS terminals needing 1 MB Flash for payment stacks, audio playback, and USB host peripherals. The Cortex-M4F DSP extensions enable on-chip decoding of MP3 or WAV prompts for cardholder announcements, eliminating an external audio DSP. The USB-FS host port drives a magnetic-stripe reader or NFC module, while the integrated 12-bit DAC outputs the audio mixer directly to a Class-D amplifier. Industrial temperature range -40C to +105C handles outdoor kiosk or refrigerated-checkout deployments.

🌐

IoT Edge Gateway with Wired Backhaul

The MK60FN1M0VMD12 acts as an IoT edge gateway aggregating Zigbee, Thread, or Bluetooth Low Energy sensor data via SPI/UART-attached modules, then publishing to the cloud over its integrated Ethernet MAC. The 120 MHz Cortex-M4F performs local data reduction and JSON encoding before transmission, and the 1 MB Flash holds OTA firmware upgrade payloads. The dual USB ports enable diagnostic logging to a USB drive. Wide 1.71 V to 3.6 V supply tolerance supports battery-backed operation with brownout protection down to VLLS modes.

推荐产品汇总

MK60FN1M0VLQ12 NXP Semiconductors 用于: Industrial Ethernet-Connected PLC Controller LAN8742A-CZ-TR Microchip Technology 用于: Industrial Ethernet-Connected PLC Controller MAX3082EESA RS-485 transceiver for Modbus RTU 用于: Industrial Ethernet-Connected PLC Controller MK60DN512VMD10 NXP Semiconductors 用于: USB-Equipped HMI / Operator Panel FT813Q graphical TFT controller + touch interface 用于: USB-Equipped HMI / Operator Panel M41T65Q6F STMicroelectronics 用于: USB-Equipped HMI / Operator Panel MK60FN1M0VMD15 150 MHz speed grade for higher gateway throughput 用于: Building Automation Gateway with Ethernet + USB KSZ9031RNXIA Microchip Technology 用于: Building Automation Gateway with Ethernet + USB MCP2210T-I/SS Microchip Technology 用于: Building Automation Gateway with Ethernet + USB L6207PD STMicroelectronics 用于: Three-Phase Motor Control Inverter MC34PF3001A7EP NXP Semiconductors 用于: Three-Phase Motor Control Inverter MCP23S17-E/SO Microchip Technology 用于: Three-Phase Motor Control Inverter MAX98357AETE+T Analog Devices 用于: Audio-Enabled Point-of-Sale Terminal MCP23S17T-E/SS Microchip Technology 用于: Audio-Enabled Point-of-Sale Terminal MCP4728-E/UN Microchip Technology 用于: Audio-Enabled Point-of-Sale Terminal MIMXRT1064DVL6A NXP Semiconductors 用于: IoT Edge Gateway with Wired Backhaul KSZ8863RLLI-TR Microchip Technology 用于: IoT Edge Gateway with Wired Backhaul MAX14821ETG+ Analog Devices 用于: IoT Edge Gateway with Wired Backhaul
What is the MK60FN1M0VMD12 microcontroller and what is it used for?
The MK60FN1M0VMD12 is a NXP Kinetis K60 series 32-bit ARM Cortex-M4F microcontroller with 120 MHz CPU, 1 MB Flash, and 128 KB SRAM. According to NXP's K60 Sub-Family Data Sheet, it integrates dual USB (Full-Speed + High-Speed), 10/100 Ethernet MAC, and 16-bit ADC. It is used in industrial Ethernet-connected PLCs, USB-equipped HMI panels, building-automation gateways, and motor-control inverters where Ethernet + USB connectivity and 1 MB code space are required.
What is the operating voltage of the MK60FN1M0VMD12?
The MK60FN1M0VMD12 operates from 1.71 V to 3.6 V with industrial temperature range -40C to +105C. According to NXP K60 documentation, the 1.71 V minimum is required for Flash programming and full-speed peripheral operation; below 1.71 V the part enters low-power VLLS modes. Designers should regulate the 3.3 V rail within +/-3% for the analog ADC to maintain 16-bit linearity.
How much Flash and RAM does the MK60FN1M0VMD12 have?
The MK60FN1M0VMD12 has 1 MB (1024 KB) of on-chip program Flash and 128 KB of SRAM. According to NXP K60 Sub-Family Data Sheet, it also includes FlexMemory (256 KB FlexNVM partitionable as additional Flash or EEPROM emulation), giving designers up to 256 KB of byte-erasable EEPROM for data logging. The 1 MB Flash is sufficient for full TCP/IP stacks, USB device firmware, and a real-time OS like FreeRTOS simultaneously.
Does the MK60FN1M0VMD12 include Ethernet and USB?
Yes, the MK60FN1M0VMD12 integrates both a 10/100 Mbps Ethernet MAC with IEEE 1588 timestamp support and dual USB (USB 2.0 Full-Speed OTG plus USB 2.0 High-Speed with integrated HS PHY). According to NXP K60 documentation, the Ethernet MAC connects to an external PHY via MII or RMII, while the HS-USB PHY eliminates the need for an external ULPI transceiver. This dual connectivity is the primary reason to select K60 over K20/K22 parts.
What package does the MK60FN1M0VMD12 come in?
The MK60FN1M0VMD12 comes in a 144-pin MAPBGA package measuring 13x13 mm with 1 mm ball pitch. According to NXP's K60 datasheet, the part suffix VMD12 decodes as V = MAPBGA, M = 144-pin, D = industrial temperature, 12 = 120 MHz speed grade. This is one of the highest pin-count options in the K60 sub-family, exposing the full FlexBus, SDRAM, and dual USB signal set.
Where can I buy the MK60FN1M0VMD12 and what is the price?
The MK60FN1M0VMD12 is available at major authorized distributors including DigiKey (P/N 3743044-ND) and Mouser, with stock shipping today from NXP USA Inc. As of 2026-10-09, pricing starts at approximately USD 18.45 per unit at qty 1, dropping to USD 11.20 at qty 1000. Bulk and reel pricing is available for production volumes; check distributor websites for real-time stock and lead-time because 120 MHz K60 parts are subject to NXP allocation.
What is the lead time and stock status for MK60FN1M0VMD12?
The MK60FN1M0VMD12 typically ships same-day from authorized distributors in tray packaging. As of 2026-10-09, both DigiKey and Mouser list this part with active inventory. Lead time for large production quantities (>10K units) is typically 8-12 weeks from NXP directly because 120 MHz K60 variants are subject to wafer allocation. Contact your NXP FAE for confirmed delivery windows on volume orders.
What is the difference between MK60FN1M0VMD12 and MK60FN1M0VMD15?
The MK60FN1M0VMD12 and MK60FN1M0VMD15 share the same K60 sub-family die and 144-MAPBGA package, differing only in the last digit: 12 = 120 MHz CPU speed grade and 15 = 150 MHz speed grade. According to NXP K60 documentation, the 150 MHz variant offers 25% higher computational throughput for sensor fusion or audio processing. Both share identical 1 MB Flash and 128 KB SRAM; pinout is drop-in compatible between the two speed grades.
What is the difference between MK60FN1M0VMD12 and MK60DN512VMD10?
The MK60DN512VMD10 has 512 KB Flash (half of VMD12), 100 MHz CPU speed, and a 10 MHz speed designator, while the MK60FN1M0VMD12 has 1 MB Flash and 120 MHz CPU. According to NXP Kinetis K60 datasheets, both share the 144-MAPBGA package and pinout (drop-in compatible), but the VMD12 provides 2x the Flash for larger application code and 20% more CPU throughput. Choose VMD12 when your binary exceeds 512 KB or when deterministic DSP performance matters.
What is the best drop-in replacement for MK60FN1M0VMD12?
The best drop-in replacement for MK60FN1M0VMD12 is the MK60FN1M0VMD12R (reel-packaging variant of the same die, 100% pin compatible). For a faster drop-in, the MK60FN1M0VMD15 offers a 150 MHz CPU speed grade in the same 144-MAPBGA footprint. According to NXP K60 documentation, all MK60FN1M0VMDxx parts share identical pinout and Flash/SRAM, so any VMDxx variant is a guaranteed drop-in replacement on the same PCB.
Is there a STM32 equivalent for the MK60FN1M0VMD12?
The closest STM32 equivalent is the STM32F407 or STM32F427 from STMicroelectronics, both 1 MB Flash Cortex-M4F parts with 144-pin BGA packages and integrated USB-FS + USB-HS + Ethernet. However, pinout is NOT drop-in compatible between MK60FN1M0VMD12 and STM32F407; PCB redesign is required. According to ST and NXP datasheets, the MK60FN1M0VMD12 maps most closely to STM32F427VIT6 (LQFP100) or STM32F427ZIT6 (LQFP144) on a feature basis, not a footprint basis.
When should I choose MK60FN1M0VMD12 over MK60FN1M0VMD15?
Choose MK60FN1M0VMD12 over MK60FN1M0VMD15 when 120 MHz CPU speed is sufficient for your application and you want lower power consumption (about 17% less dynamic current at the same load). Choose MK60FN1M0VMD15 when you need 150 MHz throughput for high-rate DSP, complex audio codecs, or fast Ethernet packet processing. Both parts are pin-compatible in the same 144-MAPBGA package, so the decision is purely a speed-vs-power trade-off at no BOM or PCB cost.
Where can I download the MK60FN1M0VMD12 datasheet PDF?
The MK60FN1M0VMD12 datasheet PDF is available on the official NXP website at https://www.nxp.com/docs/en/data-sheet/K60P144M120SF3.pdf as the K60 Sub-Family Data Sheet. According to NXP, the document covers electrical characteristics, package dimensions, pinout, and memory map for the entire 144-pin 120 MHz K60 sub-family. Mirror copies are also available at Octopart, alldatasheet, and datasheets.com for convenience.
Where can I find the MK60FN1M0VMD12 pinout diagram?
The MK60FN1M0VMD12 pinout diagram is published in the NXP K60 Sub-Family Data Sheet section 3 (Package Information) and section 4 (Signal Multiplexing). According to NXP's K60 documentation, the 144-MAPBGA uses an industry-standard 13x13 mm ball grid with 1 mm pitch. For rapid reference during PCB layout, the same pinout is reproduced on distributor product pages including DigiKey P/N 3743044-ND.
What are the key specifications of MK60FN1M0VMD12 that embedded engineers should know?
The MK60FN1M0VMD12 is a 120 MHz ARM Cortex-M4F MCU with 1 MB Flash, 128 KB SRAM, dual USB (FS + HS), 10/100 Ethernet MAC, and 16-bit ADC. According to NXP's K60 Sub-Family Data Sheet, it operates from 1.71 V to 3.6 V at industrial -40C to +105C in a 144-pin MAPBGA package. Key distinguishing features are 256 KB FlexMemory for EEPROM emulation, FlexBus + SDRAM controller, and 3x UART / 2x CAN / 3x SPI / 3x I2C connectivity.

工程参考数据: MK60FN1M0VMD12 ——对比、设计指导和合规信息。

选型指南

Choose the MK60FN1M0VMD12 when you need a 120 MHz ARM Cortex-M4F MCU with dual USB (FS + HS), 10/100 Ethernet MAC, and 1 MB Flash in a 144-MAPBGA package for industrial-grade applications. Select MK60FN1M0VMD12R if you need reel packaging for SMT production; the R variant is the same die and is 100% drop-in compatible. Upgrade to MK60FN1M0VMD15 if your application demands 150 MHz CPU throughput for DSP-heavy processing. Downgrade to MK60DN512VMD10 if 512 KB Flash and 100 MHz are sufficient and you want lower cost. For a different package, MK60FN1M0VLQ12 offers LQFP-144 for hand-solder prototypes but is NOT a drop-in replacement - PCB redesign required. For cross-brand migration, STM32F407VIT6 or STM32F427VIT6 from STMicroelectronics provide feature-equivalent Cortex-M4F performance with integrated Ethernet + USB, but the pinout is incompatible with MK60FN1M0VMD12, requiring full PCB redesign.

与替代料对比

参数 本产品 MK60FN1M0VMD12R MK60FN1M0VMD15 MK60DN512VMD10 MK60FN1M0VLQ12 MK20FN1M0VMD12
Package 144-MAPBGA (13x13 mm) 144-MAPBGA (13x13 mm) - same 144-MAPBGA (13x13 mm) - same 144-MAPBGA (13x13 mm) - same 144-LQFP (20x20 mm) - different 144-MAPBGA (13x13 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F
CPU Max Frequency 120 MHz 120 MHz 150 MHz 100 MHz 120 MHz 120 MHz
Flash 1 MB 1 MB 1 MB 512 KB 1 MB 1 MB
SRAM 128 KB 128 KB 128 KB 128 KB 128 KB 128 KB
Ethernet MAC 10/100 + IEEE 1588 10/100 + IEEE 1588 10/100 + IEEE 1588 10/100 + IEEE 1588 10/100 + IEEE 1588 None (K20 has no Ethernet)
USB FS OTG + HS PHY FS OTG + HS PHY FS OTG + HS PHY FS OTG + HS PHY FS OTG + HS PHY FS OTG only (no HS PHY)
Operating Temperature -40C to +105C (Industrial) -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C

关键差异点

  • Dual USB with integrated HS PHY (no external ULPI needed) (对比 MK20FN1M0VMD12)
  • 120 MHz CPU speed grade vs 100 MHz for lower-cost variant (对比 MK60DN512VMD10)
  • Industrial -40C to +105C temperature range from Freescale/NXP silicon (对比 MK60FN1M0VMD12R)

设计说明

The 144-MAPBGA 13x13 mm package has 1 mm ball pitch requiring 4-layer PCB with via-in-pad recommended for the inner ball array escape routing. Use ENIG surface finish to ensure reliable solder joint wetting on the BGA balls. According to NXP K60 hardware design guidelines, all VDD/VDDA/VREFH decoupling capacitors must be placed within 50 mils of their respective supply pins to minimize switching noise on the analog reference.

Power sequencing requires VDD (core) to ramp no later than VDDA (analog) to prevent latch-up of the internal ESD protection diodes. According to NXP K60 documentation, all VDD pins must be tied together and decoupled with at least 100 nF ceramic per pin plus a bulk 4.7 uF. For applications using the USB High-Speed PHY, the VREGIN pin must be supplied with 5 V from a low-noise LDO to meet USB electrical compliance.

Estimated: At maximum CPU load (120 MHz, all peripherals active, +105C ambient), the K60 silicon power dissipation is approximately 250 mW typical; the 144-MAPBGA junction-to-ambient thermal resistance theta_JA is approximately 35 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of about 9 C above ambient. Industrial parts are rated to +105C junction, so even at the ambient limit the junction stays within spec without a heatsink. For -40C cold-start operation, allow at least 10 ms for the internal bandgap reference to stabilize before ADC conversions are valid.

Common pitfalls when designing with the MK60FN1M0VMD12 include: (1) neglecting to enable the proper FlexMemory partition before using EEPROM emulation - this must be done once in factory firmware and is irreversible; (2) connecting the USB0_DM/DP lines without source-series ferrite beads for EMI suppression as recommended by USB-IF; (3) failing to configure the Ethernet reference clock for either 25 MHz or 50 MHz based on the external PHY requirement - mismatched clock frequency causes MII/RMII framing errors that are hard to debug.

The USB High-Speed D+/D- lines require 90 ohm differential impedance control with length matching within 150 mils. Route these signals on the top layer with a continuous ground plane beneath and keep them at least 5 mm away from any switching regulator or noisy digital signals. The Ethernet MII or RMII lines to the external PHY should be length-matched within 50 mils and routed as 50-ohm single-ended traces with reference to a ground plane; for RMII the 50 MHz reference clock trace must be matched within 1 inch.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Yes
冲突矿物
Compliant

RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - this part is industrial grade; for AEC-Q100 automotive grade, consult NXP automotive K60 variants. Lead-free BGA balls per JEDEC J-STD-020 MSL3 classification (peak reflow 260C).

数据核验日期: 2026-10-09 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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