PIC16F18857T-I/ML - 8-Bit 32MHz 56KB Flash MCU 28-QFN | Microchip
MPN: PIC16F18857T-I/ML ✓ Hoạt độngPIC16F18857T-I/ML Tóm tắt
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), volatile working memory (RAM), data EEPROM, and a rich set of peripheral IP blocks (timers, ADC, communication controllers, GPIO). PIC16-family MCUs use a RISC-based 8-bit core optimized for deterministic interrupt response and low active/standby power. This category sits within the broader hierarchy: microcontroller -> embedded processor -> semiconductor device, and PIC16F18857 specifically targets applications where small footprint, low power, and integrated analog/communications reduce external component count.
Key features include 24 analog-capable pins, a 10-bit ADC with computation, multiple PWM/Capture/Compare modules, configurable logic cells (CLC), zero-cross detect (ZCD), complementary waveform generator (CWG), and serial interfaces including I2C, SPI, and EUSART with LIN support. Functional Safety features include hardware windowed watchdog, CRC/SCAN, and HLT (Hardware Limit Timer) for ASIL-ready applications. The eXtreme Low Power (XLP) technology achieves nanoWatt sleep currents with multiple IDLE and DOZE modes for battery-powered duty-cycled designs.
The device combines an enhanced mid-range 8-bit pipeline with hardware multiplier and a 14-bit instruction word. The 56KB Flash is mapped as 32K words of 14-bit instructions, and the memory architecture supports self-programmability, bootloader operation via UPDI, and table read/write. The 28-QFN (6x6 mm) package provides ample GPIO and a low thermal resistance path through the exposed pad.
Typical applications include industrial sensor nodes, home appliance user interfaces, LED lighting controllers, low-power IoT endpoints, automotive body electronics (LIN slaves), and battery-powered instrumentation. The combination of CIPs and integrated 10-bit ADC allows closed-loop control without external analog components.
When designing with this device, ensure the UPDI/debug pin has the correct pull-up configuration for in-circuit programming and that the exposed pad is soldered to the ground plane for thermal and electrical performance. The PIC16F18857T-E/MLVAO is the Extended Temp / VAO variant for harsh environments. This page combines distributor pricing, verified same-package drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho PIC16F18857T-I/ML — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với PIC16F18857T-I/ML (cùng hình factor và footprint) — khác nhau ở Package, ADC, Program Memory (Flash), Operating Temperature, Communication.
PIC16F18855-I/ML
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Xem tài liệu →PIC16F18856T-I/SSVAO
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Xem tài liệu →PIC16F18857-I/ML
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Xem tài liệu →PIC16F18855T-I/ML
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Xem tài liệu →PIC16F18857T-I/ML Tỷ lệ tối đa & tính chất điện
| Core Architecture | PIC16 8-bit Enhanced Mid-Range |
| Program Memory (Flash) | 56 KB (32K x 14 words) |
| RAM | 4 KB |
| EEPROM | 256 B |
| Maximum CPU Frequency | 32 MHz |
| Hộp | 28-QFN (6x6 mm) |
| Operating Voltage (VDD) | 1.8 V to 5.5 V |
| Nhiệt độ hoạt động | -40 C to +85 C (Industrial) |
| ADC | 10-bit with computation |
| Communication | I2C, SPI, EUSART (LIN) |
| Core Independent Peripherals | CLC, ZCD, CWG, CRC/SCAN, HLT |
| Low Power Feature | eXtreme Low Power (XLP) |
| Programming/Debug | UPDI (single-wire) |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
Cấu hình chân PIC16F18857T-I/ML
| Chân 1 | RA5 — Bidirectional I/O, analog-capable, also ICSP/UPDI |
| Chân 2 | RA4 — Bidirectional I/O, analog-capable |
| Chân 3 | RA3 — Bidirectional I/O, analog-capable |
| Chân 4 | RA2 — Bidirectional I/O, analog-capable |
| Chân 5 | RA1 — Bidirectional I/O, analog-capable |
| Chân 6 | RA0 — Bidirectional I/O, analog-capable |
| Chân 7 | VSS — Ground reference |
| Chân 8 | VDD — Positive power supply |
| Chân 9 | RA7 — Bidirectional I/O, analog-capable |
| Chân 10 | RA6 — Bidirectional I/O, analog-capable |
| Chân 11 | RC0 — Bidirectional I/O, analog-capable |
| Chân 12 | RC1 — Bidirectional I/O, analog-capable |
| Chân 13 | RC2 — Bidirectional I/O, analog-capable |
| Chân 14 | RC3 — Bidirectional I/O, analog-capable |
| Chân 15 | RC4 — Bidirectional I/O, analog-capable |
| Chân 16 | RC5 — Bidirectional I/O, analog-capable |
| Chân 17 | RC6 — Bidirectional I/O, analog-capable |
| Chân 18 | RC7 — Bidirectional I/O, analog-capable |
| Chân 19 | VSS — Ground reference |
| Chân 20 | VDD — Positive power supply |
| Chân 21 | RB0 — Bidirectional I/O, analog-capable |
| Chân 22 | RB1 — Bidirectional I/O, analog-capable |
| Chân 23 | RB2 — Bidirectional I/O, analog-capable |
| Chân 24 | RB3 — Bidirectional I/O, analog-capable |
| Chân 25 | RB4 — Bidirectional I/O, analog-capable |
| Chân 26 | RB5 — Bidirectional I/O, analog-capable |
| Chân 27 | RB6 — Bidirectional I/O, analog-capable |
| Chân 28 | RB7 — Bidirectional I/O, analog-capable |
Ứng dụng tiêu biểu
PIC16F18857T-I/ML phù hợp cho 6 Áp dụngs: Industrial Sensor Node with LIN Bus, Battery-Powered IoT Endpoint, LED Lighting Controller, Home Appliance User Interface, Automotive Body Electronics (LIN Slave), Portable Health / Wellness Device.
Industrial Sensor Node with LIN Bus
The PIC16F18857T-I/ML is well matched to industrial sensor nodes that aggregate analog inputs and report over LIN or UART. Its 10-bit ADC with computation offloads sensor linearization and averaging from the CPU, while the EUSART with LIN auto-baud handles the bus protocol in hardware. With 56 KB Flash it can host a Modbus/LIN slave stack plus calibration tables, and the XLP nanoWatt sleep keeps battery duty-cycled nodes alive for years on a single primary cell.
Được đề xuất
Battery-Powered IoT Endpoint
For remote IoT endpoints that sleep most of the time, the PIC16F18857T-I/ML's eXtreme Low Power (XLP) technology delivers nanoAmpere-class sleep current, waking on an RTCC or interrupt to read a sensor and transmit. The 32 MHz core provides enough bandwidth for AES-128 firmware and small LoRa-/BLE-passthrough stacks. Its 1.8 V minimum VDD enables direct operation from a single alkaline or primary lithium cell without a boost converter.
Được đề xuất
LED Lighting Controller
The PIC16F18857T-I/ML drives LED lighting strings with hardware PWM and the Complementary Waveform Generator (CWG), producing center-aligned, dead-band-controlled switching waveforms at frequencies that minimize audible noise. The configurable logic cells (CLC) combine PWM, ZCD, and comparator events in hardware to implement phase-angle dimming without CPU overhead, leaving firmware free for DMX-512 or DALI command parsing.
Được đề xuất
Home Appliance User Interface
The PIC16F18857T-I/ML integrates the human-machine interface (HMI) of a white-good appliance: capacitive touch via the Peripheral Touch Controller (PTC), 10-bit ADC for thermistor sensing, PWM for buzzer/speaker feedback, and UART for the main controller link. With 4 KB RAM it can hold a full UI state machine and message buffers, and the industrial -40 C to +85 C temperature grade covers the appliance operating envelope.
Được đề xuất
Automotive Body Electronics (LIN Slave)
For body-electronics modules such as seat controllers, mirror adjusters, or HVAC flaps, the PIC16F18857T-I/ML provides the LIN 2.x slave protocol with auto-baud detection, combined with 56 KB Flash for the LIN 2.x/SAE J2602 stack and application logic. The Functional Safety features (hardware windowed WDT, CRC/SCAN, HLT) support ASIL classification work, and the PIC16F18857-E/MLVAO automotive-qualified variant is the preferred part for under-hood or harsh-environment ECUs.
Được đề xuất
Portable Health / Wellness Device
The PIC16F18857T-I/ML serves wearable or handheld health/wellness devices that combine a small battery, a single analog sensor (heart-rate, SpO2, temperature), and a low-power display or BLE link. Its nanoAmpere sleep current, fast wake-up from Sleep via peripheral interrupts, and 56 KB Flash let the firmware host a Bluetooth Low Energy GATT profile and a sensor-fusion state machine. The 1.8 V minimum VDD enables direct coin-cell operation.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho PIC16F18857T-I/ML — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | PIC16F18855-I/ML | PIC16F18856T-I/SSVAO | PIC16F18857-I/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Flash | 56 KB | 32 KB | 28 KB | 56 KB |
| RAM | 4 KB | 2 KB | 2 KB | 4 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Temperature Range | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C (VAO) | -40 C to +85 C |
| Core Independent Peripherals | CLC, ZCD, CWG, CRC/SCAN, HLT, NCO, PTC | Same CIPs | Same CIPs | Same CIPs |
Bảo phân biệt quan trọng
- Largest Flash memory in the 28-QFN PIC16F1885X/7X drop-in family (vsPIC16F18855-I/ML)
- Higher RAM headroom for protocol stacks (vsPIC16F18856T-I/SSVAO)
- Industrial grade on tape-and-reel for SMT production (vsPIC16F18857-I/ML)
Ghi chú thiết kế
Place a 0.1 µF ceramic decoupling capacitor on each VDD/VSS pin pair within 4 mm of the package, and a bulk 4.7–10 µF tantalum or ceramic capacitor on the main VDD rail. The PIC16F18857T-I/ML has two VDD pins (8 and 20) and two VSS pins (7 and 19) - both pairs must be decoupled. For battery applications, route the UPDI/RA5 programming pin to a test-point or header, and add a 10 kΩ pull-up to VDD to prevent unwanted reset during sleep.
Solder the 28-QFN exposed pad (EP) to a continuous copper ground pour to provide the lowest thermal resistance path. With typical XLP sleep currents in the nanoAmpere range and active currents under 5 mA at 32 MHz / 3.3 V, the die dissipates under 20 mW and thermal rise above ambient is negligible even in fully enclosed plastic enclosures. The exposed pad is the ground reference - avoid using a 'daisy-chain' via pattern that would create ground bounce.
Do not confuse the PIC16F18857T-I/ML (industrial -40 to +85 C, tape-and-reel) with the PIC16F18857T-E/MLVAO (extended -40 to +125 C, Very Automotive Quality). For automotive LIN-sensor applications the VAO variant is mandatory. Also note: PIC16F18855 ('55) has 32 KB Flash / 2 KB RAM and is pin-compatible but NOT firmware-compatible for memory size. Verify that your linker script and ICD file target the correct derivative before mass production.
Route the UPDI/ICSP pin (RA5 on PIC16F18857 in 28-QFN) away from switching signals and PWM outputs to prevent capacitive coupling that breaks in-circuit programming. Keep analog input traces (ADC, comparators) short and guarded with a ground polygon on both sides. The QFN package has an internal die-attached paddle - do not allow signal traces to pass under the package body unless they are part of the ground pour.
Thông tin tuân thủ
RoHS and lead-free per Microchip product page and DigiKey/Mouser listing. The industrial 'I' grade is -40 C to +85 C - not AEC-Q100 qualified; use PIC16F18857-E/MLVAO for automotive.
