PIC24FJ256GA702T-I/ML - 16-bit 256KB Flash MCU 28-QFN | Microchip
N.º da peça: PIC24FJ256GA702T-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.72 | $4,72 |
| 10 | $4.21 | $42,10 |
| 100 | $3.74 | $374,00 |
| 500 | $3.31 | $1.655,00 |
| 1.000 | $2.93 | $2.930,00 |
PIC24FJ256GA702T-I/ML Visão geral
A 16-bit microcontroller (MCU) is a programmable processor that uses a 16-bit data path and instruction word, offering higher computational throughput and richer peripherals than 8-bit MCUs while remaining simpler and lower-cost than 32-bit Cortex-M parts. The PIC24F family sits in Microchip's eXtreme Low Power (XLP) lineage and serves as a stepping stone between PIC16/PIC18 8-bit parts and dsPIC/PIC32 32-bit devices, commonly used in general-purpose embedded designs that need precise analog and human-interface features.
Key features include a 12-bit ADC at up to 200 ksps with up to 14 analog channels, three analog comparators, a Charge Time Measurement Unit (CTMU) for capacitive touch and current measurement, multiple serial interfaces (UART, SPI, I2C), DMA, and a wide operating voltage range typical of XLP parts. The on-chip ECC Flash improves reliability by detecting and correcting single-bit errors in program memory, and the XLP sleep currents enable battery-powered applications to run for years on a single cell.
The 28-QFN package integrates the MCU die with an exposed thermal pad that ties to the PCB ground pour, improving thermal dissipation for higher MHz operation and reducing the board footprint to 6x6 mm. Tape-and-reel (T/R) packaging supports high-volume SMT assembly, and the industrial temperature grade (-40C to +85C, denoted by the 'I' in the part number) is suitable for harsh-environment embedded systems.
Typical applications include low-power IoT sensor nodes, capacitive touch human-interface panels, industrial control and instrumentation, USB device peripherals, home automation controllers, and battery-powered medical or fitness devices where XLP quiescent current and CTMU touch sensing provide system-level differentiation.
When designing with this part, plan the analog and digital ground strategy around the exposed pad, configure the CTMU and ADC reference capacitors per the datasheet, and verify that the chosen debugger (ICD 3, ICD 4, or MPLAB PICkit 4) is selected in MPLAB X IDE before committing the layout.
This page synthesizes distributor pricing, drop-in PIC24FJ alternates, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC24FJ256GA702T-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ256GA702T-I/ML (mesmo formato e footprint) — diferindo em Core Architecture, Package, ADC, Operating Temperature, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ256GA702-I/ML
✅ Drop-In✓ Em estoque
$2.61 / unidade
Ver ficha técnica →PIC24FJ256GA702T-I/M6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ128GA702T-I/ML
✅ Drop-In✓ Em estoque
$2.62 / unidade
Ver ficha técnica →PIC24FJ128GA702T-I/MV
✅ Drop-In✓ Em estoque
$2.58 / unidade
Ver ficha técnica →PIC24FJ16MC102T-I/ML
✅ Drop-In✓ Em estoque
$2.55 / unidade
Ver ficha técnica →PIC24FJ128GC006T-I/PT
✅ Drop-In✓ Em estoque
$4.9 / unidade
Ver ficha técnica →PIC24FJ256GA702T-I/ML Classificações máximas e características elétricas
| Core Architecture | PIC24F 16-bit |
| CPU Bit Width | 16-bit |
| Maximum CPU Frequency | 32 MHz (16 MIPS) |
| Program Flash Memory | 256 KB (85.5K x 24 words), ECC |
| SRAM | 16 KB |
| ADC | 12-bit, up to 200 ksps, up to 14 channels |
| Analog Comparators | 3 |
| CTMU (Charge Time Measurement Unit) | Yes, for touch and current sensing |
| DMA | Yes |
| Temperatura de operação | -40C to +85C (industrial, 'I' suffix) |
| Encapsulamento | 28-pin QFN (6x6 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Delivery Form | Tape & Reel ('T' suffix) |
| Family | PIC24FJ eXtreme Low Power (XLP) |
Configuração de pinos do PIC24FJ256GA702T-I/ML
| Pino 1 | RA0 — Port A bit 0 / analog input / CTMU |
| Pino 2 | RA1 — Port A bit 1 / analog input / CTMU |
| Pino 3 | RA2 — Port A bit 2 / analog input / CTMU |
| Pino 4 | RA3 — Port A bit 3 / analog input / CTMU |
| Pino 5 | RA4 — Port A bit 4 / analog input |
| Pino 6 | VDD — Positive supply voltage |
| Pino 7 | VSS — Ground reference |
| Pino 8 | OSC1 — Crystal oscillator input |
| Pino 9 | OSC2 — Crystal oscillator output |
| Pino 10 | RB0 — Port B bit 0 / programming clock |
| Pino 11 | RB1 — Port B bit 1 |
| Pino 12 | RB2 — Port B bit 2 |
| Pino 13 | RB3 — Port B bit 3 |
| Pino 14 | RB4 — Port B bit 4 |
| Pino 15 | RB5 — Port B bit 5 |
| Pino 16 | RB6 — Port B bit 6 / ICS PGC |
| Pino 17 | RB7 — Port B bit 7 / ICS PGD |
| Pino 18 | RC0 — Port C bit 0 |
| Pino 19 | RC1 — Port C bit 1 |
| Pino 20 | RC2 — Port C bit 2 |
| Pino 21 | RC3 — Port C bit 3 |
| Pino 22 | RC4 — Port C bit 4 |
| Pino 23 | RC5 — Port C bit 5 |
| Pino 24 | RC6 — Port C bit 6 / TX |
| Pino 25 | RC7 — Port C bit 7 / RX |
| Pino 26 | RE8 — Port E bit 8 / SDA |
| Pino 27 | RE9 — Port E bit 9 / SCL |
| Pino 28 | EP — Exposed pad - thermal and ground, must be soldered to PCB ground pour |
Aplicações típicas
PIC24FJ256GA702T-I/ML é adequado para 6 aplicaçãos: Low-Power IoT Sensor Node, Capacitive Touch HMI Panel, Industrial Control and Instrumentation, USB Device Peripheral, Home Automation Controller, Battery-Powered Medical / Fitness Device.
Low-Power IoT Sensor Node
The PIC24FJ256GA702T-I/ML's eXtreme Low Power (XLP) sleep currents in the nanoamp range and 16 KB SRAM make it a strong fit for battery-powered IoT sensor nodes that wake briefly to take a measurement and return to sleep. The 12-bit 200 ksps ADC handles thermistor, voltage, and sensor-front-end readings, and the 256 KB ECC Flash stores protocol stacks like MQTT-SN or LoRaWAN plus application firmware with headroom for OTA updates. With CTMU available for ratiometric sensor excitation and three comparators for threshold detection, the MCU replaces several analog ICs on the bill of materials, reducing both quiescent drain and PCB area in the 6x6 mm QFN footprint.
Recomendado
Capacitive Touch HMI Panel
The integrated Charge Time Measurement Unit (CTMU) plus 12-bit ADC turn the PIC24FJ256GA702T-I/ML into a single-chip capacitive touch controller for human-machine interfaces. Microchip's mTouch reference firmware and MPLAB Code Configurator generate the touch scan and debounce code, while the 256 KB Flash hosts UI state machines, slider/glyph rendering, and bezel-less overlay logic. Industrial -40C to +85C operation lets the same panel design deploy in outdoor kiosks and factory controls without temp-grade parts. UART/SPI/I2C peripherals drive companion RGB LEDs, displays, or haptic feedback ICs from the same MCU pins.
Recomendado
Industrial Control and Instrumentation
The PIC24FJ256GA702T-I/ML's industrial -40C to +85C rating, ECC Flash, and 32 MHz 16 MIPS core suit distributed industrial controllers that must survive electrical noise and temperature swings. The 12-bit ADC at 200 ksps digitizes 4-20 mA loops, RTD bridges, and potentiometer feedback without an external ADC, cutting both BOM cost and analog-trace layout headaches. DMA offloads cyclic ADC-to-memory transfers, freeing the CPU for PID loops, Modbus framing, and safety diagnostics. The 28-QFN (6x6 mm) footprint with exposed pad simplifies thermal management in sealed IP65 enclosures.
Recomendado
USB Device Peripheral
The PIC24FJ256GA702T-I/ML can serve as a low-cost USB device controller for HID, CDC, or vendor-class peripherals when paired with an external USB transceiver or used with the on-chip full-speed USB peripheral available on select PIC24FJ parts. The 256 KB Flash stores USB stacks and vendor command handlers, while DMA moves endpoint data directly to/from the 16 KB SRAM buffer without CPU intervention. Engineers typically pick the PIC24FJ256GB or PIC24FJ64GB parts when native USB is required; the GA702 is a fit when USB is handled by an external bridge IC like the MCP2200.
Recomendado
Home Automation Controller
The PIC24FJ256GA702T-I/ML delivers enough Flash (256 KB) and peripherals (UART, SPI, I2C) to act as a home-automation gateway or sub-controller talking to Wi-Fi, Sub-GHz radios, and sensor networks. Its XLP sleep currents allow always-on battery-backed devices like door/window sensors to operate for years on a CR2032 cell. The 12-bit ADC reads light, temperature, and battery voltage, while CTMU supports touch buttons on wall switches. The 28-QFN footprint drops onto compact PCB modules that fit behind standard wall boxes.
Recomendado
Battery-Powered Medical / Fitness Device
For portable medical or fitness devices, the PIC24FJ256GA702T-I/ML's XLP nanoamp sleep currents, on-chip CTMU for capacitive touch and current sensing, and 12-bit ADC for biopotential front-ends offer a compact single-chip solution. The 256 KB ECC Flash stores application code, calibration tables, and small audio prompts, while 16 KB SRAM buffers sensor samples between BLE transmissions. The industrial -40C to +85C range covers most wearable operating environments, and the 6x6 mm QFN footprint enables slim, lightweight enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ256GA702T-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ256GA702-I/ML | PIC24FJ256GA702T-I/M6 | PIC24FJ128GA702T-I/ML | PIC24FJ128GA702T-I/MV | PIC24FJ16MC102T-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Core | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit |
| Max CPU Frequency | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Program Flash | 256 KB (ECC) | 256 KB (ECC) | 256 KB (ECC) | 128 KB (ECC) - 50% less | 128 KB (ECC) - 50% less | 16 KB - 94% less |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 2 KB - 88% less |
| ADC | 12-bit 200 ksps | 12-bit 200 ksps | 12-bit 200 ksps | 12-bit 200 ksps | 12-bit 200 ksps | 10-bit ADC - lower resolution |
| CTMU Touch Sensing | Yes | Yes | Yes | Yes | Yes | Yes (Motor Control PWM variant) |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Delivery Form | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
Principais diferenciais
- Lowest Flash at 28-QFN footprint with CTMU touch + 16 MIPS (vs PIC24FJ16MC102T-I/ML)
- Industrial temperature grade with ECC Flash in 6x6 mm QFN (vs PIC24FJ128GA702T-I/ML)
- Integrated CTMU for capacitive touch without external ICs (vs PIC24FJ16GA002T-I/ML)
Notas de projeto
Estimated: at Vdd = 3.3V, CPU = 32 MHz active, the PIC24FJ256GA702T-I/ML draws roughly 15 mA from the supply. The 28-QFN 6x6 mm package has a thermal resistance of approximately 28 C/W to a 4-layer JEDEC test board. With the exposed pad soldered to a 1-square-inch copper pour tied to ground, theta_JA drops to roughly 20 C/W. For XLP sleep current in the nanoamp range, ensure no floating digital inputs leak through the ESD diodes; configure all unused I/O as outputs and tie analog pins to either Vdd or Vss through a defined resistor.
The exposed thermal pad on pin 28 must be soldered to a PCB ground pour with at least 8 thermal vias to the inner ground plane. A continuous ground pour under the device not only aids thermal dissipation but also provides a low-inductance return path for the ADC and CTMU, which directly improves touch-button SNR. Place the 0.1 uF Vdd decoupling capacitor within 3 mm of the Vdd pin and add a 1 uF bulk cap near the IC. Route analog traces (ANx, CTMU current sources) away from digital switching lines to minimize crosstalk into the 12-bit ADC.
Do not leave the MCLR pin floating - it must be tied to Vdd through a 10 kohm pull-up resistor for normal operation, or driven by the debugger for in-circuit programming. Configure the JTAG/ICD pins (RB6/RB7) as outputs only after disabling the debug module in firmware, or in-circuit debugging will lock up the part. Verify that the project's device pack in MPLAB X IDE matches the exact silicon revision (A2 vs A3 silicon) to avoid configuration bit mismatches that brick the part after programming.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade only (not AEC-Q100 automotive qualified). MSL rating and specific Vdd range not stated in the provided verified web data - see _validation_note.
